CN209766608U - Filter - Google Patents
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- CN209766608U CN209766608U CN201920350828.8U CN201920350828U CN209766608U CN 209766608 U CN209766608 U CN 209766608U CN 201920350828 U CN201920350828 U CN 201920350828U CN 209766608 U CN209766608 U CN 209766608U
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Abstract
The utility model is suitable for a microwave transmission technical field provides a filter, including zero gap butt joint's dielectric waveguide and low pass PCB board, low pass PCB board includes first base plate and the second base plate of being made by insulating material, first base plate with zero gap butt joint of dielectric waveguide, be provided with the ground connection thin slice between first base plate and the second base plate, set up first logical groove on the ground connection thin slice; a low-pass main body separated from the grounding thin sheet and a first microstrip transmission line connected with the low-pass main body are arranged in the first through groove; the first substrate is provided with a leakage groove at the low-pass main body, and one side of the low-pass main body is exposed by the leakage groove. The embodiment of the utility model provides a through be located low pass main part department at first base plate and set up the hourglass empty groove, let the first base plate insulating material of low pass main part position leak sky, make low pass main part one side expose to reduce the loss of low pass energy, solve the big problem of low pass main part energy loss.
Description
Technical Field
the utility model belongs to the technical field of the microwave transmission, especially, relate to a filter.
Background
Filters (filters) are devices that Filter waves. Information needs to be propagated by the transmission of waveform signals. The signal may be distorted in every stage of its generation, conversion, transmission due to the environment and the presence of interference, and even in a considerable number of cases, the distortion is so severe that the signal and the information it carries are buried deep in noise, thus requiring a filter to filter the wave.
A microstrip line system is a common microwave transmission system used in a filter, and a microstrip line (microstrip line) is a microwave transmission line formed by a single conductor strip supported on a dielectric substrate. The planar structure transmission line is suitable for manufacturing microwave integrated circuits. Compared with a metal waveguide, the waveguide has the advantages of small volume, light weight, wide use frequency band, high reliability, low manufacturing cost and the like; but the loss is slightly larger and the power capacity is small. In the early 60 s, microwave integrated circuits were formed due to the development of microwave low-loss dielectric materials and microwave semiconductor devices, so that microstrip lines were widely used, and various types of microstrip lines appeared in succession. Typically by thin film processes. The dielectric substrate is made of a material with high dielectric constant and low microwave loss. The conductor should have the characteristics of high conductivity, good stability, strong adhesion with the substrate, and the like.
However, in the commonly used dual-layer substrate microstrip line low pass, because the upper and lower surfaces of the low pass main body are clamped by the substrate insulating materials, the physical size of the low impedance line can only be thinned, after the low impedance line is thinned, the resistance value is increased, the energy loss is aggravated, and the low impedance line is thin and difficult to process.
SUMMERY OF THE UTILITY MODEL
The utility model provides a filter aims at solving the big problem of low pass main part energy loss.
the utility model discloses a realize like this, a wave filter, including zero gap butt joint's dielectric waveguide and low pass PCB board, the low pass PCB board includes first base plate and the second base plate of being made by insulating material, first base plate with zero gap butt joint of dielectric waveguide;
A grounding sheet is arranged between the first substrate and the second substrate, and a first through groove is formed in the grounding sheet;
A low-pass main body separated from the grounding thin sheet and a first microstrip transmission line connected with the low-pass main body are arranged in the first through groove;
The first substrate is provided with a leakage groove at the low-pass main body, and one side of the low-pass main body is exposed by the leakage groove.
Furthermore, the first microstrip transmission line is arranged between the first substrate and the second substrate and is clamped and fixed by the first substrate and the second substrate.
Further, the ground slice is equal to the first microstrip transmission line in thickness.
Furthermore, a first connecting plate is arranged on one side, away from the low-pass main body, of the second substrate, and a first conductive through hole for connecting the first microstrip transmission line and the first connecting plate is formed in the second substrate.
furthermore, a second through groove is formed in the grounding sheet, and a second microstrip transmission line separated from the grounding sheet is arranged in the second through groove.
Furthermore, a second connecting piece is arranged on one side of the second substrate, which is far away from the second microstrip transmission line, and a second conductive through hole for connecting the second microstrip transmission line and the second connecting piece is formed in the second substrate.
Furthermore, an output plate is arranged on one side of the second substrate, which is far away from the low-pass main body.
Still further, the filter further includes a positioning pin connecting the dielectric waveguide and the low pass PCB board.
The embodiment of the utility model provides a through be located low pass main part department at first base plate and set up the hourglass empty groove, let the first base plate insulating material of low pass main part position leak sky, make low pass main part one side expose to reduce the loss of low pass energy, solve the big problem of low pass main part energy loss.
Drawings
Fig. 1 is a schematic perspective view of a filter provided by the present invention;
fig. 2 is a schematic diagram of a local explosion structure of the filter provided by the present invention;
Fig. 3 is an explosion structure diagram of the filter provided by the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
the embodiment of the utility model provides a be located low pass main part department at first base plate and set up the hourglass dead slot, leak the dead slot and make low pass main part one side expose, the embodiment of the utility model provides a through be located low pass main part department at first base plate and set up the hourglass dead slot, let the first base plate insulating material of low pass main part position leak sky, make low pass main part one side expose to reduce the loss of low pass energy, solve the big problem of low pass main part energy loss.
Example one
as shown in fig. 1-3, an embodiment of the present invention provides a filter, including a dielectric waveguide 2 and a low-pass PCB 1, which are zero-gap butted, where the low-pass PCB 1 includes a first substrate 11 and a second substrate 12 made of an insulating material, and the first substrate 11 is zero-gap butted with the dielectric waveguide 2;
A grounding sheet 13 is arranged between the first substrate 11 and the second substrate 12, and a first through groove 131 is formed in the grounding sheet 13;
A low-pass main body 14 separated from the ground sheet 13 and a first microstrip transmission line 141 connected to the low-pass main body 14 are disposed in the first through slot 131; it will be appreciated that the low-pass body 14 and the first microstrip transmission line 141 are both separated from the ground foil 13, and that the low-pass body 14 may also be made of a microstrip line.
The first substrate 11 is provided with a leakage groove 111 at the low pass body 14, and the leakage groove 111 exposes one side of the low pass body 14.
it can be understood that the area of the leak groove 111 is larger than that of the low-pass body 14, and the leak groove 111 does not extend to the edge of the first substrate 11, so that the low-pass body 14 is completely exposed, and further, the dielectric waveguide arranged outside the first substrate 11 is not shielded from the low-pass body 14 by an insulator, thereby reducing the loss of low-pass energy. The hollow leakage groove 111 does not extend to the edge of the first substrate 11, and other parts of the first substrate 11 can ensure that the dielectric waveguide 2 is tightly attached to the first substrate 11, so that zero-gap butt joint of the dielectric waveguide 2 and the low-pass PCB 1 is realized. The outer side surface of the first substrate 11 around the leakage groove 111 is in zero-gap butt joint with the dielectric waveguide 2, and can also form the effect of shielding the low-pass signal without leakage.
Further, in order to fix the low pass body 14, the first microstrip transmission line 141 is disposed between the first substrate 11 and the second substrate 12, and is sandwiched and fixed by the first substrate 11 and the second substrate 12. In order to fix the low-pass body 14 between the first substrate 11 and the second substrate 12, the thickness of the first microstrip transmission line 141 needs to be larger than or equal to the thickness of the ground sheet 13, but when the thickness is larger than the thickness of the ground sheet 13, there is a gap between the first substrate 11, the second substrate 12, and the ground sheet 13, and therefore, it is preferable to set the thicknesses of the ground sheet 13 and the first microstrip transmission line 141 to be equal to each other.
Furthermore, a first connection piece 15 is disposed on a side of the second substrate 12 away from the low pass body 14, and a first conductive via 121 is disposed on the second substrate 12 and connects the first microstrip transmission line 141 and the first connection piece 15. The first microstrip transmission line 141 and the first connection piece 15 are each provided with a via hole at the first conductive through hole 121 for connecting the first microstrip transmission line 141 and the first connection piece 15.
The embodiment of the utility model provides a through be located low pass main part department at first base plate and set up the hourglass empty groove, let the first base plate insulating material of low pass main part position leak sky, make low pass main part one side expose to reduce the loss of low pass energy, solve the big problem of low pass main part energy loss.
Example two
as shown in fig. 3, the embodiment of the present invention provides a filter, including a dielectric waveguide 2 and a low-pass PCB 1, which are in zero-gap butt joint, where the low-pass PCB 1 includes a first substrate 11 and a second substrate 12 made of insulating materials, and the first substrate 11 is in zero-gap butt joint with the dielectric waveguide 2;
A grounding sheet 13 is arranged between the first substrate 11 and the second substrate 12, and a first through groove 131 is formed in the grounding sheet 13;
A low-pass main body 14 separated from the ground sheet 13 and a first microstrip transmission line 141 connected to the low-pass main body 14 are disposed in the first through slot 131;
The first substrate 11 is provided with a leakage groove 111 at the low pass body 14, and the leakage groove 111 exposes one side of the low pass body 14.
Furthermore, a second through slot 132 is formed in the ground slice 13, and a second microstrip transmission line 16 separated from the ground slice 13 is disposed in the second through slot 132. A second connecting piece 17 is arranged on one side of the second substrate 12, which is far away from the second microstrip transmission line 16, and a second conductive through hole 122 for connecting the second microstrip transmission line 16 and the second connecting piece 17 is formed in the second substrate 12. The second microstrip transmission line 16 and the second connecting piece 17 are provided with through holes at the second conductive through hole 122, and are used for connecting the second microstrip transmission line 16 and the second connecting piece 17.
EXAMPLE III
As shown in fig. 3, in addition to the first or second embodiment, the present invention provides a filter, wherein an output plate 18 is disposed on a side of the second substrate 12 away from the low pass body 14. The output plate 18 is provided with a spacing groove 181, and the first connecting piece 15 and the second connecting piece 17 are arranged in the spacing groove 181, so that the output plate 18 is not connected with the first connecting piece 15 and the second connecting piece 17. The output board 18 is made of conductive copper foil, copper sheet or aluminum foil, and is used for connecting other devices, outputting signals, and also can be used for grounding.
Example four
As shown in fig. 1-3, the present invention further provides a filter, further comprising a positioning pin 3 connecting the dielectric waveguide 2 and the low-pass PCB board 1. Specifically, the dielectric waveguide 2 and the low-pass PCB 1 are respectively provided with a positioning hole, the positioning hole on the low-pass PCB 1 is arranged on the first substrate 11, and two ends of the positioning pin 3 are respectively inserted into the positioning holes on the dielectric waveguide 2 and the low-pass PCB 1, so that the dielectric waveguide 2 and the low-pass PCB 1 are fixedly connected. Meanwhile, the area of the leakage groove 111 is larger than that of the low-pass body 14, and the leakage groove 111 does not extend to the edge of the first substrate 11, so that the low-pass body 14 is completely exposed, and further, no insulator is arranged between the dielectric waveguide 2 arranged on the outer side of the first substrate and the low-pass body 14 for shielding, thereby reducing the loss of low-pass energy. The hollow leakage groove 111 does not extend to the edge of the first substrate 11, and other parts of the first substrate 11 can ensure that the dielectric waveguide 2 is tightly attached to the first substrate 11, so that zero-gap butt joint of the dielectric waveguide 2 and the low-pass PCB is realized. The outer side surface of the first substrate 11 around the leakage groove 111 is in zero-gap butt joint with the dielectric waveguide 2, and can also form the effect of shielding the low-pass signal without leakage.
The embodiment of the utility model provides a through be located low pass main part department at first base plate and set up the hourglass empty groove, let the first base plate insulating material of low pass main part position leak sky, make low pass main part one side expose to reduce the loss of low pass energy, solve the big problem of low pass main part energy loss.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (8)
1. A filter comprises a dielectric waveguide and a low-pass PCB board which are in zero-slot butt joint, and is characterized in that the low-pass PCB board comprises a first substrate and a second substrate which are made of insulating materials, and the first substrate is in zero-slot butt joint with the dielectric waveguide;
A grounding sheet is arranged between the first substrate and the second substrate, and a first through groove is formed in the grounding sheet;
A low-pass main body separated from the grounding thin sheet and a first microstrip transmission line connected with the low-pass main body are arranged in the first through groove;
the first substrate is provided with a leakage groove at the low-pass main body, and one side of the low-pass main body is exposed by the leakage groove.
2. the filter of claim 1, wherein the first microstrip transmission line is disposed between and held by the first and second substrates.
3. The filter of claim 1 or 2, wherein the ground foil is of equal thickness to the first microstrip transmission line.
4. The filter according to claim 1 or 2, wherein a first connection piece is disposed on a side of the second substrate away from the low-pass main body, and a first conductive via hole for connecting the first microstrip transmission line and the first connection piece is formed on the second substrate.
5. The filter of claim 1 or 2, wherein the ground slice is provided with a second through slot, and a second microstrip transmission line separated from the ground slice is arranged in the second through slot.
6. The filter of claim 5, wherein a second connecting piece is disposed on a side of the second substrate away from the second microstrip transmission line, and a second conductive through hole is disposed on the second substrate and connects the second microstrip transmission line and the second connecting piece.
7. A filter as claimed in claim 1 or 2, characterized in that the second substrate is provided with an output plate on a side remote from the low-pass body.
8. the filter of claim 1, further comprising alignment pins connecting the dielectric waveguide and the low pass PCB board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920350828.8U CN209766608U (en) | 2019-03-19 | 2019-03-19 | Filter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920350828.8U CN209766608U (en) | 2019-03-19 | 2019-03-19 | Filter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209766608U true CN209766608U (en) | 2019-12-10 |
Family
ID=68755304
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920350828.8U Active CN209766608U (en) | 2019-03-19 | 2019-03-19 | Filter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209766608U (en) |
-
2019
- 2019-03-19 CN CN201920350828.8U patent/CN209766608U/en active Active
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| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 315000 floor 1-2, building 8, 818 Jinyuan Road, Yinzhou District, Ningbo City, Zhejiang Province Patentee after: Ningbo Huaci Communication Technology Co.,Ltd. Address before: 2 / F, building 3, 818 Jinyuan Road, Yinzhou investment and entrepreneurship center, Ningbo, Zhejiang 315000 Patentee before: NINGBO HUACI COMMUNICATION TECHNOLOGY Co.,Ltd. |
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| CP03 | Change of name, title or address |