CN209764117U - Sensor and vehicle - Google Patents
Sensor and vehicle Download PDFInfo
- Publication number
- CN209764117U CN209764117U CN201920484931.1U CN201920484931U CN209764117U CN 209764117 U CN209764117 U CN 209764117U CN 201920484931 U CN201920484931 U CN 201920484931U CN 209764117 U CN209764117 U CN 209764117U
- Authority
- CN
- China
- Prior art keywords
- signal acquisition
- sensor
- processing system
- processing systems
- plug
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Arrangements For Transmission Of Measured Signals (AREA)
Abstract
The present disclosure relates to a sensor and a vehicle. The sensor includes: the sensor comprises a sensor shell and a circuit system, wherein the circuit system is arranged in the sensor shell and comprises a plurality of groups of signal acquisition and processing systems. The signal acquisition and processing systems are connected with each other and used for determining the signal acquisition and processing system to be conducted from the signal acquisition and processing systems in the normal state when the signal acquisition and processing systems in the conduction state are abnormal, and controlling the signal acquisition and processing system to be conducted to collect parameter changes corresponding to the sensor and form related signals. Therefore, when one group of signal acquisition and processing systems in the sensor fails, other signal acquisition and processing systems in a normal state can be adopted to acquire related signals so as to realize redundancy control. When the signal acquisition and processing system breaks down, other signal acquisition and processing systems in normal states are automatically controlled to acquire related signals, and the intelligent degree of the sensor is improved.
Description
Technical Field
The present disclosure relates to the field of vehicle technology, and in particular, to a sensor and a vehicle.
Background
With global attention to autonomous vehicles, automotive autonomous driving technology is competing with a number of research and development agencies for pre-research. According to the definition of the automatic driving level accepted in the market, the chassis of the automatic driving vehicle above the L3 level must have the redundant function of electric control so as to ensure that the vehicle can execute the chassis control or partial control function after the main electric control system fails, so that the vehicle can be safely driven to a safe area, and the safety accident of the vehicle can be avoided to the greatest extent. For a chassis electronic control system, a wheel speed sensor is particularly important, for example, an engine, a transmission, a brake system, a steering system and other electronic control systems need to perform a corresponding algorithm according to a wheel speed signal detected by the wheel speed sensor to obtain a required parameter, and operate according to the parameter, but the current sensor (e.g., the wheel speed sensor) does not have a redundant function.
SUMMERY OF THE UTILITY MODEL
To overcome the problems in the prior art, embodiments of the present disclosure provide a sensor and a vehicle.
in order to achieve the above object, a first aspect of the present disclosure provides a sensor including: the circuit system is arranged in the sensor shell and comprises a plurality of groups of signal acquisition and processing systems;
The signal acquisition and processing systems are connected with each other and used for determining the signal acquisition and processing system to be conducted from the signal acquisition and processing systems in the normal state when the signal acquisition and processing systems in the conduction state are abnormal, and controlling the signal acquisition and processing system to be conducted so as to enable the signal acquisition and processing system to be conducted to acquire parameter changes corresponding to the sensor and form related signals.
Optionally, if the signal acquisition and processing systems in the normal state are multiple groups, when the signal acquisition and processing systems in the conducting state are abnormal, determining the signal acquisition and processing system to be conducted from the signal acquisition and processing systems in the normal state according to a preset rule, and controlling the signal acquisition and processing system to be conducted so that the signal acquisition and processing system to be conducted acquires parameter changes corresponding to the sensor and forms related signals.
Optionally, each of the signal acquisition processing systems in the plurality of sets of signal acquisition processing systems includes: a control chip, a collection chip, a power supply anode plug-in terminal, a power supply cathode plug-in terminal, a CAN _ H plug-in terminal and a CAN _ L plug-in terminal,
The control chip is respectively connected with the acquisition chip, the power supply positive electrode plug terminal, the power supply negative electrode plug terminal, the CAN _ H plug terminal and the CAN _ L plug terminal;
And a plurality of control chips in the plurality of groups of signal acquisition and processing systems are mutually connected.
Optionally, the collecting chip is a hall chip, and is configured to sense a change in a magnetic field outside the sensor and collect the change to form a related signal.
Optionally, the multiple sets of signal acquisition and processing systems include a first signal acquisition and processing system and a second signal acquisition and processing system, where the first signal acquisition and processing system is a master system, and the second signal acquisition and processing system is a slave system.
Optionally, the sensor housing comprises: a plug-in part, a mounting surface, a first induction head and a second induction head,
the mounting surface is used for providing mounting support for the sensor when the sensor is mounted on a part;
The insertion part is arranged on the first surface of the mounting surface and comprises a plurality of insertion grooves, the plurality of insertion grooves correspond to the insertion terminals in the first signal acquisition processing system and the second signal acquisition processing system respectively, and form two groups of external insertion ports with the insertion terminals in the first signal acquisition processing system and the second signal acquisition processing system so as to be connected with an external wiring harness;
The first induction head and the second induction head are arranged on a second surface of the mounting surface;
The acquisition chip of the first signal acquisition and processing system is arranged in the first induction head, and the acquisition chip of the second signal acquisition and processing system is arranged in the second induction head.
Optionally, a mounting hole is provided in the mounting surface, and the mounting hole is used for fixing the sensor to the component.
Optionally, the sensor housing further comprises: and the sealing ring is sleeved and pressed on the upper parts of the first induction head and the second induction head and used for sealing gaps among the first induction head, the second induction head and surrounding holes and preventing liquid from flowing into the first induction head and the second induction head.
Optionally, the sensor further comprises: an alarm device is arranged on the base plate,
The alarm device is connected with the multiple groups of signal acquisition and processing systems and is used for outputting alarm information when any one group of signal acquisition and processing system in the multiple groups of signal acquisition and processing systems is abnormal.
A second aspect of the present disclosure provides a vehicle including: the sensor provided by the first aspect of the present disclosure.
The present disclosure provides a sensor comprising: the sensor comprises a sensor shell and a circuit system, wherein the circuit system is arranged in the sensor shell and comprises a plurality of groups of signal acquisition and processing systems. The signal acquisition and processing systems are connected with each other and used for determining the signal acquisition and processing system to be conducted from the signal acquisition and processing systems in the normal state when the signal acquisition and processing systems in the conduction state are abnormal and controlling the signal acquisition and processing system to be conducted so as to enable the signal acquisition and processing system to be conducted to acquire parameter changes corresponding to the sensor and form related signals. Therefore, when one group of signal acquisition and processing systems in the sensor fails, other signal acquisition and processing systems in a normal state can be adopted to acquire related signals so as to realize redundant control. And when the signal acquisition processing system breaks down, other signal acquisition processing systems in normal state can be automatically controlled to acquire related signals, so that the automation of the sensor is improved.
Additional features and advantages of the disclosure will be set forth in the detailed description which follows.
Drawings
The accompanying drawings, which are included to provide a further understanding of the disclosure and are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the description serve to explain the disclosure without limiting the disclosure. In the drawings:
FIG. 1 is a block diagram illustrating a sensor in accordance with an exemplary embodiment.
Fig. 2 is a schematic diagram illustrating a signal acquisition processing system according to an exemplary embodiment.
FIG. 3 is a schematic diagram illustrating a circuit system in accordance with an example embodiment.
FIG. 4A is a schematic view of a sensor housing at an angle shown in accordance with an exemplary embodiment.
FIG. 4B is a schematic diagram of a sensor housing at another angle shown in accordance with an exemplary embodiment.
FIG. 5 is a block diagram illustrating a sensor in accordance with another exemplary embodiment.
Description of the reference numerals
1 sensor housing 2 circuitry
21 signal acquisition processing system 211 control chip
212 acquisition chip 213 power supply anode plug terminal
214 power supply negative plug terminal 215 CAN _ H plug terminal
216 CAN _ L plug terminal 217 circuit accessory
11 inserting part 111 inserting groove
12 mounting surface 121 mounting hole
13 first induction head 14 second induction head
15 sealing ring
Detailed Description
the following detailed description of specific embodiments of the present disclosure is provided in connection with the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present disclosure, are given by way of illustration and explanation only, not limitation.
in the present disclosure, unless otherwise specified, use of directional terms such as "upper" and "lower" generally means that the terms "inner" and "outer" refer to the inner and outer of the respective component outlines, and furthermore, the terms "first" and "second" and the like are used in the present disclosure to distinguish one element from another without order or importance, and in addition, when the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated.
Referring to fig. 1, fig. 1 is a block diagram illustrating a sensor according to an exemplary embodiment. As shown in fig. 1, the sensor includes a sensor housing 1 and a circuit system 2, the circuit system 2 is disposed in the sensor housing 1, and the circuit system 2 may include a plurality of sets of signal acquisition and processing systems 21.
in the embodiment of the present disclosure, the multiple sets of signal collecting and processing systems 21 may collect the parameter variation corresponding to the sensor in the on state and in the normal state, and form the related signal. In order to ensure that when any one group of signal acquisition and processing systems 21 fails to acquire the change of the relevant parameters, the signal acquisition and processing systems 21 of other groups in the normal working state can be automatically controlled to be switched on to acquire the change of the relevant parameters, so that the sensor works normally, therefore, the multiple groups of signal acquisition and processing systems 21 can be connected with each other, and are used for determining the signal acquisition and processing system 21 to be switched on from the signal acquisition and processing system 21 in the normal state when the signal acquisition and processing system 21 in the switched-on state is abnormal, and controlling the signal acquisition and processing system 21 to be switched on so that the signal acquisition and processing system 21 to be switched on acquires the change of the parameters corresponding to the sensor and forms the relevant signals.
In the present disclosure, the parameter variation and the formed related signal acquired by the signal acquisition processing system 21 are related to the type of the sensor, for example, the sensor is a wheel speed sensor, and the parameter variation corresponding to the sensor is a wheel speed variation, and the formed related signal is a wheel speed related signal. If the sensor is a pressure sensor, the parameter change corresponding to the sensor is a pressure change, and the formed related signal is a pressure related signal, and so on.
Specifically, each group of signal acquisition and processing systems 21 has a self-checking function to detect whether the group of signal acquisition and processing systems 21 has a fault, and when detecting that the group of signal acquisition and processing systems 21 has a fault, the fault information may be sent to other signal acquisition and processing systems 21 in a normal state. If the signal collection processing system 21 in the normal state is only one group, the signal collection processing system 21 in the normal state is controlled to be turned on. If there are multiple groups of signal acquisition and processing systems 21 in the normal state, the signal acquisition and processing system 21 to be turned on may be determined from the multiple groups of signal acquisition and processing systems 21 in the normal state according to a preset rule, and the signal acquisition and processing system 21 to be turned on is controlled to be turned on.
In the present disclosure, the priority of the connection may be determined according to the service life of the signal acquisition processing system 21, for example, the connection is preferentially conducted with a long service life. The priority of the conduction may also be determined according to the installation position of the signal acquisition processing system 21, for example, the conduction is performed sequentially from left to right according to the installation position, and so on.
Therefore, when one group of signal acquisition processing systems 21 in the sensor fails, other signal acquisition processing systems 21 in a normal state can be adopted to acquire related signals, so as to realize redundant control. And when the signal acquisition processing system 21 breaks down, other signal acquisition processing systems 21 in normal state can be automatically controlled to acquire relevant signals, so that the intelligent degree of the sensor is improved.
As shown in fig. 2, each of the signal acquisition processing systems 21 in the multiple sets of signal acquisition processing systems 21 provided by the present disclosure may include: the power supply comprises a control chip 211, an acquisition chip 212, a power supply positive plug terminal 213, a power supply negative plug terminal 214, a CAN _ H plug terminal 215 and a CAN _ L plug terminal 216. The control chip 211 is connected to the acquisition chip 212, the power supply positive plug terminal 213, the power supply negative plug terminal 214, the CAN _ H plug terminal 215, and the CAN _ L plug terminal 216, respectively, and is configured to control the acquisition chip 212 to acquire a parameter change corresponding to the sensor when an external power supply is turned on, form a related signal, and send the related signal to a vehicle-mounted CAN bus (Controller Area Network). In addition, the plurality of control chips 211 in the plurality of sets of signal acquisition processing systems 21 are connected to each other, so as to realize the interconnection of the plurality of sets of signal acquisition processing systems 21. Wherein, the collecting chip 212 may be a hall chip for sensing the magnetic field change outside the sensor and collecting the change to form the related signal.
For convenience of description, the multiple sets of signal acquisition processing systems 21 are taken as two sets in this disclosure. As shown in FIG. 3, the multi-group signal acquisition and processing system 21 comprises a first signal acquisition and processing system 211And a second signal acquisition processing system 212Wherein the first signal acquisition processing system 211As a primary system, a second signal acquisition processing system 212is a slave system. First signal acquisition processing system 211Comprises a control chip 2111And an acquisition chip 2121And a power supply positive electrode socket terminal 2131Power supply negative plug terminal 2141CAN _ H plug terminal 2151And CAN _ L jack terminal 2161. Second signal acquisition and processing system 212Comprises a control chip 2112And an acquisition chip 2122And a power supply positive electrode socket terminal 2132Power supply negative plug terminal 2142CAN _ H plug terminal 2152And CAN _ L jack terminal 2162. Where subscript 1 and subscript 2 are used merely to distinguish whether a component is located within a first signal acquisition processing system or a second signal acquisition processing system.
In addition, it should be noted that, in order to ensure the safety of the components in the signal acquisition processing system 21, as shown in fig. 2, the signal acquisition processing system 21 may further include a circuit accessory 217. The circuit accessories 217 may be current limiting resistors, voltage limiting resistors, capacitors, or the like. The circuit accessory 217 may be connected between the plug terminal and the control chip 211, or between the plug terminal and the acquisition chip 212. In fig. 2, circuit accessory 217 is illustrated as being connected between the jack terminals and capture chip 212.
Specifically, referring to fig. 3, since the plurality of sets of signal acquisition processing systems 21 include the first signal acquisition processing system 211And a second signal acquisition processing system 212Likewise, the circuit accessory 217 may include a circuit accessory 2171And circuit accessory 2172. Wherein, the first signal collecting system 211Including circuit accessories 2171Second signal acquisition processing system 212Including circuit accessories 2172。
In addition, in order to facilitate assembling the two sets of signal acquisition and processing systems 21, the present disclosure also provides a structure of the sensor housing 1 matched with the two sets of signal acquisition and processing systems 21. FIG. 4A is a schematic view of a sensor housing at an angle shown in accordance with an exemplary embodiment. FIG. 4B is a schematic diagram of a sensor housing at another angle shown in accordance with an exemplary embodiment. As shown in fig. 4A, the sensor housing 1 may include: plug part 11, installation face 12, first inductive head 13 and second inductive head 14.
The mounting surface 12 is used to provide mounting support for the sensor when the sensor is mounted on a component. Further, in order to fasten the sensor to the component, in the present disclosure, a mounting hole 121 is provided through the mounting surface 12, and the sensor can be fixed to the component through the mounting hole 121. The number of the mounting holes 12 may be one or more, and is not particularly limited in the present disclosure. Further, the mounting hole may be a screw hole to fix the sensor to the component by a bolt.
The inserting part 11 is disposed on a first surface of the mounting surface 12, and includes a plurality of inserting grooves 111, and the inserting grooves 111 are respectively connected with the first signal collecting and processing system 211A second signal acquisition and processing system 212Each plug-in terminal in the first and second plug-in terminals corresponds to the first plug-in terminalA signal acquisition processing system 211A second signal acquisition and processing system 212Each plug-in terminal in the connector comprises two groups of external plug-in interfaces to be connected with an external wire harness. Wherein, this outside pencil includes: the power supply comprises a power supply anode, a power supply cathode, CAN _ H and CAN _ L.
Specifically, as shown in fig. 4A and 4B, the insertion part 11 includes 8 insertion grooves 111, which are respectively: insertion groove 1111And an insertion groove 1112And an insertion groove 1113and an insertion groove 1114And an insertion groove 1115And an insertion groove 1116And an insertion groove 1117And an insertion groove 1118Wherein the first signal acquisition processing system 211middle power supply positive plug terminal 2131Power supply negative plug terminal 2141CAN _ H plug terminal 2151And CAN _ L jack terminal 2161Are respectively arranged in the inserting grooves 1111And an insertion groove 1114And an insertion groove 1112And a socket 1113And a group of external interfaces are formed and connected with an external wiring harness.
Second signal acquisition and processing system 212Middle power supply positive plug terminal 2132Power supply negative plug terminal 2142CAN _ H plug terminal 2152And CAN _ L jack terminal 2162Are respectively arranged in the inserting grooves 1115And an insertion groove 1118And an insertion groove 1116And a socket 1117And another group of external interfaces are formed and connected with the external wiring harness.
Further, a plug groove 1111And an insertion groove 1115Respectively connected with the power supply anode of the external wiring harness, and a plug-in groove 1114And an insertion groove 1118Respectively connected to the negative electrode of the power supply of the external harness, a plug-in groove 1112And an insertion groove 1116Respectively connected with CAN _ H of external wire harness, and insertion groove 1113And an insertion groove 1117Respectively connected with the CAN _ L of the external wire harness.
As shown in fig. 4A, the first sensor head 13 and the second sensor head 14 are disposed on the second surface of the mounting surface 12, and the first signal collecting and processing system 211collecting chip 212 of1Arranged in the first induction head 13Second signal acquisition processing system 212collecting chip 212 of2Is arranged in the second inductive head 14.
In addition, in order to prevent the acquisition chips 212 disposed in the first sensor head 13 and the second sensor head 14 from being soaked by the liquid level, as shown in fig. 4A, the sensor housing 1 may further include a sealing ring 15, where the sealing ring 15 is pressed on the upper portions of the first sensor head 13 and the second sensor head 14 to seal the gap between the first sensor head 13 and the second sensor head 14 and the surrounding hole, so as to prevent the liquid from flowing into the first sensor head 13 and the second sensor head 14 and damaging the acquisition chips 212 mounted in the first sensor head 13 and the second sensor head 14. In this way, the lifetime of the acquisition chip 212 may be extended.
It should be noted that the number of the groups of the signal acquisition processing system 21 may be larger than two. In addition, the number of the insertion grooves 111 included in the insertion portion 11 of the sensor housing 1 may be four times the number of the groups of the signal acquisition and processing systems 21, and thus each group of the signal acquisition and processing systems 21 may individually correspond to a group of external insertion ports, and further each group of the signal acquisition and processing systems 21 may individually be connected to a group of external harnesses. The number of the insertion grooves 111 may also be four times smaller than the number of the sets of the signal collection processing systems 21, so that the plurality of sets of the signal collection processing systems 21 correspond to a set of external insertion ports, and further, the plurality of sets of the signal collection processing systems 21 are connected to a set of external wire harnesses. However, if a plurality of signal collection processing systems 21 share a set of external interface, when the external wiring harness fails, none of the plurality of signal collection processing systems 21 can normally operate, and therefore, in order to ensure that at least one set of signal collection processing system 21 can operate, in the present disclosure, it is preferable that each set of signal collection processing system 21 is separately connected to a set of external wiring harness.
The first signal acquisition processing system 21 is arranged as described above1And a second signal acquisition processing system 212And the sensor with the redundant function can be formed by assembling the sensor in the sensor shell 1. When the sensor is used for detecting signals, firstly, the first induction head 13 and the second induction head 14 are inserted into relevant measuring holes, the mounting surface 12 is ensured to be attached to the plane of a part, and if the mounting hole 121 is a threaded holethe sensor can be further fixed to the external component by using bolts. At the same time, the inserting slot 111 in the inserting part 11 is connected with the first signal collecting and processing system 211A second signal acquisition and processing system 212Two groups of external interfaces formed by the plug terminals are respectively plugged with external wiring harnesses.
After the sensors are installed on the parts, the sensors are powered on and initially, the first signal acquisition and processing system 211The control chip 211 in1Control acquisition chip 2121On, while the second signal acquisition processing system 212The control chip 211 in2Control acquisition chip 2122And conducting, and at the moment, carrying out self-checking on the sensor. During self-checking, the sensor receives a self-checking signal sent by an external control program to detect the first signal acquisition processing system 211And a second signal acquisition processing system 212Whether it is normal or not. In a possible embodiment, if the two sets of signal collecting and processing systems 21 are normal, the control chip 211 is used to control the two sets of signal collecting and processing systems 211And a control chip 2112The mutual check is carried out thanks to the above definition of the first signal acquisition processing system 211As a primary system, a second signal acquisition processing system 212Is a slave system, and therefore, is in the control chip 2111And a control chip 2112After performing mutual verification, the control chip 211 in the slave system2Control acquisition chip 2122Disconnect, retain acquisition chip 2111And the operation is continued.
In another possible embodiment, at the beginning of power-on, if one of the two sets of signal acquisition and processing systems 21 has a fault, the control chip 211 in the faulty signal acquisition and processing system 21 controls the acquisition chip 212 corresponding to the faulty signal acquisition and processing system to be turned off, and sends a fault signal to the signal acquisition and processing system 21 in the normal state, so that the control chip 211 in the signal acquisition and processing system 21 in the normal state controls the acquisition chip 212 corresponding to the faulty signal acquisition and processing system to be turned on.
By adopting the technical scheme, only one group of signal acquisition processing system 21 is ensured to acquire signals at the same time, so that the reliability of signal acquisition can be ensured, and the electric quantity can be saved.
During the operation of the sensor, if the first signal acquisition and processing system 21 is in operation1In case of failure, the first signal acquisition and processing system 211The control chip 211 in1Can send fault signals to the second signal acquisition and processing system 212The control chip 211 in2And disconnect the acquisition chip 2111and, at the same time, a second signal acquisition processing system 212The control chip 211 in2Control acquisition chip 2122Is conducted to enable the second signal acquisition and processing system 212The parameter changes corresponding to the sensors are collected and correlated signals are formed.
In addition, in order to facilitate the user to know the fault condition of the signal acquisition processing system 21, as shown in fig. 5, the sensor provided by the present disclosure may further include an alarm device 3, where the alarm device 3 is connected to the multiple sets of signal acquisition processing systems 21, and is configured to output alarm information when any one set of signal acquisition processing system 21 in the multiple sets of signal acquisition processing systems 21 is faulty, so that the user can know the fault condition of the signal acquisition processing system 21.
The alarm device 3 may be at least one of a light emitting device and a sound emitting device.
One embodiment is as follows: the alarm device 3 may be a sound device, such as a buzzer, a speaker, etc., which can give a prompt by sound so that the user or the surrounding people can obtain the alarm information of the fault audibly.
In another embodiment: the alarm device 3 may be a Light Emitting device, which may be an LED (Light-Emitting Diode) lamp bead, a flashing indicator Light, etc., and it may prompt through Light, so that the user or surrounding people can visually obtain the alarm information of the fault.
There is an embodiment: the alarm device 3 can be a sound generating device and a light emitting device at the same time, so that a user or surrounding people can simultaneously obtain fault alarm information from the sense of hearing and vision.
Moreover, the alarm information output by the alarm device 3 may be a default sound or light thereof, or a sound or light preset in the alarm device 3 by a user, where the preset sound may be a cartoon sound, or a sound of another person, and is not limited in this embodiment of the disclosure.
By adopting the above mode, the sensor can have a redundancy control function, and a user can know the fault condition of the signal acquisition processing system 21 through the alarm information when the signal acquisition processing system 21 fails.
Based on the same inventive concept, the present disclosure also provides a vehicle including the sensor provided by the present disclosure.
The preferred embodiments of the present disclosure are described in detail with reference to the accompanying drawings, however, the present disclosure is not limited to the specific details of the above embodiments, and various simple modifications may be made to the technical solution of the present disclosure within the technical idea of the present disclosure, and these simple modifications all belong to the protection scope of the present disclosure.
It should be noted that the various features described in the above embodiments may be combined in any suitable manner without departing from the scope of the invention. In order to avoid unnecessary repetition, various possible combinations will not be separately described in this disclosure.
In addition, any combination of various embodiments of the present disclosure may be made, and the same should be considered as the disclosure of the present disclosure, as long as it does not depart from the spirit of the present disclosure.
Claims (10)
1. A sensor, comprising: the sensor comprises a sensor shell (1) and a circuit system (2), wherein the circuit system (2) is arranged in the sensor shell (1), and the circuit system (2) comprises a plurality of groups of signal acquisition and processing systems (21);
The multiple groups of signal acquisition and processing systems (21) are connected with each other and used for determining the signal acquisition and processing system (21) to be conducted from the signal acquisition and processing system (21) in the normal state when the signal acquisition and processing system (21) in the conduction state is abnormal, and controlling the signal acquisition and processing system (21) to be conducted, so that the signal acquisition and processing system (21) to be conducted acquires parameter changes corresponding to the sensor and forms related signals.
2. The sensor according to claim 1, wherein if the signal acquisition and processing systems (21) in the normal state are multiple sets, when the signal acquisition and processing systems (21) in the conducting state are abnormal, the signal acquisition and processing system (21) to be conducted is determined from the signal acquisition and processing systems (21) in the normal state according to a preset rule, and the signal acquisition and processing system (21) to be conducted is controlled to be conducted, so that the signal acquisition and processing system (21) to be conducted acquires parameter changes corresponding to the sensor and forms a related signal.
3. The sensor according to claim 1, wherein each signal acquisition and processing system (21) of said plurality of sets of signal acquisition and processing systems (21) comprises: a control chip (211), an acquisition chip (212), a power supply anode plug-in terminal (213), a power supply cathode plug-in terminal (214), a CAN _ H plug-in terminal (215) and a CAN _ L plug-in terminal (216),
The control chip (211) is respectively connected with the acquisition chip (212), the power supply positive plug terminal (213), the power supply negative plug terminal (214), the CAN _ H plug terminal (215) and the CAN _ L plug terminal (216);
The plurality of control chips (211) in the plurality of groups of signal acquisition and processing systems (21) are connected with each other.
4. A sensor according to claim 3, characterized in that the pick-up chip (212) is a hall chip for sensing changes in the magnetic field outside the sensor and picking up the changes to form the relevant signal.
5. A sensor according to claim 3, characterized in that said plurality of sets of signal acquisition and processing systems (21) comprises a first signal acquisition and processing system (21)1) And a second signal acquisition processing system (21)2) Wherein the first signal acquisition processing system (21)1) As a master system, the second signal acquisition processing system (21)2) Is a slave system.
6. Sensor according to claim 5, characterized in that the sensor housing (1) comprises: a plug-in part (11), a mounting surface (12), a first induction head (13) and a second induction head (14),
The mounting surface (12) is used for providing mounting support for the sensor when the sensor is mounted on a part;
The insertion part (11) is arranged on the first surface of the mounting surface (12) and comprises a plurality of insertion grooves (111), and the plurality of insertion grooves (111) are respectively connected with the first signal acquisition processing system (21)1) The second signal acquisition and processing system (21)2) Corresponds to each plug-in terminal and is connected with the first signal acquisition processing system (21)1) The second signal acquisition and processing system (21)2) Each plug-in terminal in the socket forms two groups of external plug-in ports to be connected with an external wiring harness;
The first induction head (13) and the second induction head (14) are arranged on a second surface of the mounting surface (12);
The first signal acquisition processing system (21)1) Is collected on the chip (212)1) Arranged in the first induction head (13), and the second signal acquisition and processing system (21)2) Is collected on the chip (212)2) Is arranged in the second induction head (14).
7. Sensor according to claim 6, characterized in that mounting holes (121) are provided through the mounting surface (12), said mounting holes (121) being used to fix the sensor to the component.
8. The sensor according to claim 6, wherein the sensor housing (1) further comprises: and the sealing ring (15) is sleeved and pressed on the upper parts of the first induction head (13) and the second induction head (14) and used for sealing the gaps between the first induction head (13) and the second induction head (14) and surrounding holes and preventing liquid from flowing into the first induction head (13) and the second induction head (14).
9. The sensor of any one of claims 1-8, further comprising: an alarm device (3) is arranged on the base,
the alarm device (3) is connected with the multiple groups of signal acquisition and processing systems (21) and is used for outputting alarm information when any one group of signal acquisition and processing system (21) in the multiple groups of signal acquisition and processing systems (21) is abnormal.
10. A vehicle, characterized by comprising: the sensor of any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920484931.1U CN209764117U (en) | 2019-04-10 | 2019-04-10 | Sensor and vehicle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920484931.1U CN209764117U (en) | 2019-04-10 | 2019-04-10 | Sensor and vehicle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209764117U true CN209764117U (en) | 2019-12-10 |
Family
ID=68758749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920484931.1U Active CN209764117U (en) | 2019-04-10 | 2019-04-10 | Sensor and vehicle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209764117U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111366192A (en) * | 2020-03-16 | 2020-07-03 | 华为技术有限公司 | Information acquisition method and device |
-
2019
- 2019-04-10 CN CN201920484931.1U patent/CN209764117U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111366192A (en) * | 2020-03-16 | 2020-07-03 | 华为技术有限公司 | Information acquisition method and device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7463139B2 (en) | Method and system for driving a vehicle trailer tow connector | |
| US10451664B2 (en) | Interconnect device for detecting whether a vehicle on-board diagnostics (OBD) data port includes circuitry which prevents back feeding of power through the OBD data port | |
| JP6452724B2 (en) | Energy transmission device and on-board power supply system | |
| JP2003509258A (en) | Integrated digital control system and control method for electric equipment for automobile | |
| CN109923011B (en) | Switching circuit, fault detection method thereof and control device | |
| CN209764117U (en) | Sensor and vehicle | |
| KR20140104978A (en) | Method for determining the absence of voltage in an electrical high-voltage system, and electrical high-voltage system | |
| KR100993587B1 (en) | Junction box of vehicle having failure diagnostic system | |
| CN111016658A (en) | High-voltage interlocking loop, fault detection method and vehicle | |
| KR101413429B1 (en) | Junction box and method of diagnosing the junction box | |
| KR20070000339A (en) | A connection unit for the connection of electrical components to a motor vehicle battery | |
| KR20150031226A (en) | Sensor arrangement for an electric/electronic architecture and associated electric/electronic architecture for a vehicle | |
| US20090153143A1 (en) | Sensor array for detecting the state of a battery | |
| KR101826076B1 (en) | Wiring harness structure tester system for smart vehicle | |
| JP3904500B2 (en) | Anti-theft device | |
| KR200208418Y1 (en) | Disconnection checking complex system | |
| US11613319B2 (en) | Trailer lighting activation device | |
| EP4389531A1 (en) | Electronic device for power consumption monitoring | |
| KR19990007452U (en) | Car audio wiring checker | |
| JP7489304B2 (en) | Electronic Control Unit | |
| CN220933132U (en) | Circuit and system for fault positioning of electric engineering machinery | |
| CN216083054U (en) | Automobile battery power supply inlet detector | |
| CN211979071U (en) | Vehicle-mounted terminal | |
| CN114148268B (en) | Car lamp power supply management system and method thereof, car lamp system and vehicle | |
| NZ779350A (en) | Brake controller with a housing or a loom |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |