CN209748550U - Full frequency channel collection system - Google Patents
Full frequency channel collection system Download PDFInfo
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- CN209748550U CN209748550U CN201921112849.2U CN201921112849U CN209748550U CN 209748550 U CN209748550 U CN 209748550U CN 201921112849 U CN201921112849 U CN 201921112849U CN 209748550 U CN209748550 U CN 209748550U
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Abstract
The embodiment of the utility model discloses full frequency channel collection system, include: the processing module is used for processing the digital signal; the conversion module is connected with the processing module and is used for converting a digital signal into an analog signal or converting the analog signal into the analog signal; the coupling module is connected with the conversion module and is used for shunting and integrating signals; and the transmission module is connected with the coupling module and used for receiving the analog signals or transmitting the analog signals. The utility model discloses technical scheme has solved among the prior art and has realized the required many technical problem of baseband board quantity of the same carrier number, has realized realizing on the PCB board that the channel is all-round to cover and small, heat dispersion is good, more nimble configuration carrier number's on a baseband board technical effect.
Description
Technical Field
The embodiment of the utility model provides a relate to communication technology, especially, relate to a full frequency channel collection system.
Background
The demand of information acquisition equipment is great especially the small-size equipment that can acquire user terminal information that is used for fields such as security protection, public security, technical investigation, and the market comparatively lacks the product of this type at present. The realization of the existing network 4G channel full coverage on one PCB board has the problems of interference, heat dissipation, large volume and the like. Currently only a few equipment suppliers develop this type of product.
generally, a multi-carrier is generated by combining a plurality of baseband boards, the number of the baseband boards affects the size of the whole machine, and therefore the baseband boards are required to be as small as possible, and the number of the baseband boards required for realizing the same number of carriers is as small as possible.
Because the baseband board is built by the baseband chip and the radio frequency chip with high integration level, an external power amplifier is needed to realize high-power output.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a full frequency channel collection system to realize that the channel all standing is and small, the good technological effect of heat dispersion on the PCB board.
The embodiment of the utility model provides a full frequency channel collection system, include:
the processing module is used for processing the digital signal;
The conversion module is connected with the processing module and is used for converting a digital signal into an analog signal or converting the analog signal into a digital signal;
the coupling module is connected with the conversion module and used for shunting signals;
And the transmission module is connected with the coupling module and used for receiving analog signals or transmitting the analog signals.
Optionally, the processing module includes a baseband chip U1 and a baseband chip U2, and the baseband chip U1 and the baseband chip U2 are configured to process digital signals.
optionally, the conversion module includes a radio frequency chip U3 and a radio frequency chip U4, the radio frequency chip U3 is connected to the baseband chip U1, the radio frequency chip U4 is connected to the baseband chip U2, the radio frequency chip U3 is configured to convert the digital signal transmitted by the processing module into an analog signal and convert the analog signal transmitted by the transmission module into a digital signal, and the radio frequency chip U4 is configured to convert the digital signal transmitted by the processing module into an analog signal and convert the analog signal transmitted by the transmission module into a digital signal.
Optionally, the coupling module includes a coupler C1, a coupler C2, a coupler C3 and a coupler C4, the coupler C1 is connected to the rf chip U3 and the rf chip U4, the coupler C2 is connected to the rf chip U3 and the rf chip U4, the coupler C3 is connected to the rf chip U3 and the rf chip U4, the coupler C4 is connected to the rf chip U3 and the rf chip U4, and the coupler C1, the coupler C2, the coupler C3 and the coupler C4 are used for signal splitting.
Optionally, the transmission module includes transmitting interfaces F1 and F2, the transmitting interface F1 is connected to the coupler C1 for transmitting the analog signal to the outside, and the transmitting interface F2 is connected to the coupler C3 for transmitting the analog signal to the outside.
Optionally, the transmission module further includes a receiving interface S1, a receiving interface S2, a receiving interface S3 and a receiving interface S4, the receiving interface S1 is connected to the coupler C2 for transmitting analog signals to the conversion module, the receiving interface S2 is connected to the rf chip U3 for transmitting analog signals to the conversion module, the receiving interface S3 is connected to the coupler C4 for transmitting analog signals to the conversion module, and the receiving interface S4 is connected to the rf chip U4 for transmitting analog signals to the conversion module.
optionally, the impedance matching device further comprises a matching module, wherein the matching module is connected between the conversion module and the coupling module and is used for matching impedance inside the device.
Optionally, the matching module includes a balun transformer B1, a balun transformer B2, a balun transformer B3 and a balun transformer B4, the balun transformer B1 is connected between the radio frequency chip U3 and the coupler C1, the balun transformer B12 is connected between the radio frequency chip U3 and the coupler C3, the balun transformer B3 is connected between the radio frequency chip U4 and the coupler C3, and the balun transformer B4 is connected between the radio frequency chip U3 and the coupler C1.
Optionally, the apparatus further comprises an amplifying module, wherein the amplifying module is connected between the coupling module and the transmission module, and is configured to amplify the analog signal.
Optionally, the amplifying module includes amplifying devices P1 and P2, the amplifying device P1 is connected between the coupler C1 and the transmitting interface F1, and the amplifying device P2 is connected between the coupler C3 and the transmitting interface F2.
The embodiment of the utility model provides a handle digital signal through processing module, conversion module converts digital signal to analog signal or converts analog signal to analog signal, coupling module is integrated with the signal reposition of redundant personnel, transmission module accepts analog signal or transmission signal, the required many technical problem of baseband board quantity of the same carrier number of realization among the prior art has been solved, realized realizing on the PCB board that present net 4G channel is all-round and small, heat dispersion is good, the technological effect of configuration carrier number more nimble on a baseband board.
drawings
Fig. 1 is a block diagram of a full-band acquisition apparatus according to a first embodiment of the present invention;
fig. 2 is a schematic diagram of a circuit connection relationship of a full-band acquisition device according to a first embodiment of the present invention;
Fig. 3 is a block diagram of a full-band acquisition apparatus according to a second embodiment of the present invention;
Fig. 4 is a schematic diagram of a circuit connection relationship of a full-band acquisition device in a second embodiment of the present invention;
Fig. 5 is a block diagram of a full-band acquisition apparatus according to a third embodiment of the present invention;
Fig. 6 is a schematic diagram of a circuit connection relationship of a full-band acquisition device in the third embodiment of the present invention.
Detailed Description
the present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
Example one
Fig. 1 is the embodiment of the utility model provides a pair of full frequency channel collection system's block diagram, fig. 2 is the utility model provides a full frequency channel collection system circuit connection relation sketch map in the middle of, this embodiment can be applicable to the condition that full frequency channel collection system received and transmitted signal.
Referring to fig. 1, the full-band acquisition apparatus of the present embodiment includes: the device comprises a processing module 1, a conversion module 2, a coupling module 3 and a transmission module 4.
And the processing module 1 is used for processing the digital signal.
And the conversion module 2 is connected with the processing module 1 and is used for converting the digital signal into an analog signal or converting the analog signal into a digital signal.
and the coupling module 3 is connected with the conversion module 2 and is used for splitting and integrating signals.
And the transmission module 4 is connected with the coupling module 4 and used for receiving the analog signals or transmitting the analog signals.
Referring to fig. 2, in an alternative embodiment, the processing module 1 includes a baseband chip U1 and a baseband chip U2, and the baseband chip U1 and the baseband chip U2 are used for processing digital signals.
In this embodiment, the baseband chip U1 and the baseband chip U2 are used to synthesize a digital signal to be transmitted or decode a received digital signal, specifically, when transmitting a signal, an audio signal is encoded into a baseband code for transmission; upon receiving the signal, the received baseband code is interpreted as an audio signal. The baseband chip U1 and the baseband chip U2 can also be responsible for compiling address information (mobile phone numbers, website addresses), text information (short messages, website texts), and picture information.
In an alternative embodiment, the conversion module 2 includes a radio frequency chip U3 and a radio frequency chip U4, the radio frequency chip U3 is connected to the baseband chip U1, the radio frequency chip U4 is connected to the baseband chip U2, the radio frequency chip U3 is configured to convert a digital signal transmitted by the processing module 1 into an analog signal and convert an analog signal transmitted by the transmission module 4 into a digital signal, and the radio frequency chip U4 is configured to convert a digital signal transmitted by the processing module 1 into an analog signal and convert an analog signal transmitted by the transmission module 4 into a digital signal.
In this embodiment, the rf chip U3 may receive the digital signal transmitted from the baseband chip U1, convert the digital signal into an analog signal, perform an up-frequency processing on the analog signal, and transmit the analog signal to the coupling module 3, and the rf chip U3 may also receive the analog signal directly transmitted by the transmission module 4 or transmitted by the coupling module 3, and convert the analog signal into a digital signal after the down-frequency processing on the analog signal, and transmit the digital signal to the processing module 1. The rf chip U4 may receive the digital signal transmitted from the baseband chip U2, convert the digital signal into an analog signal, perform an up-frequency processing on the analog signal, and transmit the analog signal to the coupling module 3, and the rf chip U4 may also receive the analog signal directly transmitted by the transmission module 4 or transmitted by the coupling module 3, perform a down-frequency processing on the analog signal, convert the analog signal into a digital signal, and transmit the digital signal to the processing module 1.
in an alternative embodiment, the coupling module comprises a coupler C1, a coupler C2, a coupler C3 and a coupler C4, the coupler C1 is connected with the radio frequency chip U3 and the radio frequency chip U4, the coupler C2 is connected with the radio frequency chip U3 and the radio frequency chip U4, the coupler C3 is connected with the radio frequency chip U3 and the radio frequency chip U4, the coupler C4 is connected with the radio frequency chip U3 and the radio frequency chip U4, and the coupler C1, the coupler C2, the coupler C3 and the coupler C4 are used for signal shunt rectification.
In this embodiment, the coupler C1, the coupler C2, the coupler C3, and the coupler C4 are duplex couplers, and synthesize signals of different carriers into one path and transmit the path to an antenna for transmission, or send the signals of the antenna to a signal conversion chip to demodulate baseband signals. The coupler C1 is connected to the rf chip U3 and the rf chip U4, integrates analog signals emitted from the rf chip U3 and the rf chip U4, and transmits the integrated analog signals to the transmission module 4. The coupler C2 is connected to the rf chip U3 and the rf chip U4, and shunts the analog signal received from the transmission module 4 to transmit to the rf chip U3 and the rf chip U4, respectively. The coupler C3 is connected to the rf chip U3 and the rf chip U4, integrates analog signals emitted from the rf chip U3 and the rf chip U4, and transmits the integrated analog signals to the transmission module 4. The coupler C4 is connected to the rf chip U3 and the rf chip U4, and shunts the analog signal received from the transmission module 4 to transmit to the rf chip U3 and the rf chip U4, respectively.
In an alternative embodiment, the transmission module 4 comprises transmission interfaces F1 and F2, the transmission interface F1 is connected with the coupler C1 for transmitting analog signals to the outside, and the transmission interface F2 is connected with the coupler C3 for transmitting analog signals to the outside. The transmission module 4 further includes a receiving interface S1, a receiving interface S2, a receiving interface S3 and a receiving interface S4, the receiving interface S1 is connected to the coupler C2 for transmitting analog signals to the conversion module 2, the receiving interface S2 is connected to the rf chip U3 for transmitting analog signals to the conversion module 2, the receiving interface S3 is connected to the coupler C4 for transmitting analog signals to the conversion module 2, and the receiving interface S4 is connected to the rf chip U4 for transmitting analog signals to the conversion module 2.
In this embodiment, the transmitting interface F1 and the transmitting interface F2 may be transmitting antenna interfaces, and the transmitting interface F1 transmits the analog signal transmitted by the coupler C1 to the outside. The transmission interface F2 transmits the analog signal transmitted by the coupler C3 to the outside. The transmission interface S1 and the transmission interface S2 may be receiving antenna interfaces, and the transmission interface S1 transmits an analog signal transmitted from the outside to the coupler C2. The transmission interface S2 transmits the externally transmitted analog signal into the coupler C4. The transmitting interface S3 and the transmitting interface S4 may be receiving antenna interfaces, and the transmitting interface S3 directly transmits the externally transmitted analog signals to the rf chip U3. The transmitting interface S4 directly transmits the externally transmitted analog signal to the radio frequency chip U4.
The embodiment provides a full frequency channel collection system, handle digital signal through processing module, conversion module converts digital signal to analog signal or converts analog signal to analog signal, coupling module divides the reposition of redundant personnel integration with the signal, transmission module accepts analog signal or transmission signal, the required baseband board of the same carrier number in the prior art many technical problem has been solved, realized realizing that the channel covers on the PCB board entirely and small, heat dispersion is good, the more nimble technological effect who disposes the carrier number on a baseband board.
Example two
Fig. 3 is the embodiment of the present invention provides a block diagram of a full-band sampling apparatus, fig. 4 is a schematic diagram of a circuit connection relationship of a power adapter testing apparatus in the embodiment of the present invention, this embodiment can be applied to the condition that the full-band sampling apparatus receives and transmits signals, and impedance matching and stability of the circuit are ensured.
Referring to fig. 3, the present embodiment includes:
And the processing module 1 is used for processing the digital signal.
And the conversion module 2 is connected with the processing module 1 and is used for converting the digital signal into an analog signal or converting the analog signal into a digital signal.
And the coupling module 3 is connected with the conversion module 2 and is used for splitting and integrating signals.
And the transmission module 4 is connected with the coupling module 3 and used for receiving the analog signals or transmitting the analog signals.
And the matching module 5, wherein the matching module 5 is connected between the conversion module 2 and the coupling module 3 and is used for matching the internal impedance of the device.
Referring to fig. 4, in an alternative embodiment, the matching module 5 includes a balun transformer B1, a balun transformer B2, a balun transformer B3 and a balun transformer B4, the balun transformer B1 is connected between the rf chip U3 and the coupler C1, the balun transformer B12 is connected between the rf chip U3 and the coupler C3, the balun transformer B3 is connected between the rf chip U4 and the coupler C3, and the balun transformer B4 is connected between the rf chip U3 and the coupler C1.
In this embodiment, the balun transformer has two functions, impedance transformation and unbalanced-balanced transformation. The reason is that the output impedance of the transmitting unit is matched with the impedance of the antenna, and the mismatch of the two can generate standing waves (the output signal is not transmitted through the antenna and returns to the transmitting unit), thereby affecting the output power, and possibly damaging the transmitting unit in case of serious mismatch.
The embodiment provides a full frequency channel collection system, handles digital signal through processing module, and conversion module converts digital signal into analog signal or converts analog signal into analog signal, and coupling module divides the signal shunting integration, and transmission module accepts analog signal or transmission signal, and matching module is with the inside impedance matching of device. The technical problems that the number of baseband boards required by the same carrier number is large in the prior art and impedance is unmatched in the prior art are solved, and the technical effects that full coverage of channels is achieved on a PCB, the size is small, heat dissipation performance is good, and the carrier number is configured on one baseband board more flexibly are achieved.
EXAMPLE III
fig. 5 is the utility model provides a third module diagram who provides a full frequency channel collection system, fig. 6 is utility model embodiment third well power adapter testing arrangement circuit connection relation sketch map, this embodiment can be applicable to the condition that full frequency channel collection system received and transmitted signal to the stable transmission of signal has been guaranteed.
Referring to fig. 5, the present embodiment includes:
And the processing module 1 is used for processing the digital signal.
And the conversion module 2 is connected with the processing module 1 and is used for converting the digital signal into an analog signal or converting the analog signal into a digital signal.
And the coupling module 3 is connected with the conversion module 2 and is used for splitting and integrating signals.
And the transmission module 4 is connected with the coupling module 3 and used for receiving the analog signals or transmitting the analog signals.
And the matching module 5, wherein the matching module 5 is connected between the conversion module 2 and the coupling module 3 and is used for matching the internal impedance of the device.
And the amplifying module 6 is connected between the coupling module 3 and the transmission module 4, and is used for amplifying the analog signal.
Referring to fig. 6, in an alternative embodiment, the amplifying module 6 includes amplifying devices P1 and P2, the amplifying device P1 is connected between the coupler C1 and the transmitting interface F1, and the amplifying device P2 is connected between the coupler C3 and the transmitting interface F2.
In this embodiment, the amplifying devices P1 and P2 are generally high level amplifiers, and amplify the input weak signal (signal, which refers to changing voltage, current, etc.) to a required amplitude value and a signal consistent with the original input signal change rule, i.e., perform undistorted amplification. The amplifying device P1 amplifies the analog signal output by the coupler C1, transmits the amplified signal to the transmitting interface F1, and transmits the amplified signal to the outside through the transmitting interface F1. The amplifying device P2 amplifies the analog signal output by the coupler C3, transmits the amplified signal to the transmitting interface F2, and transmits the amplified signal to the outside through the transmitting interface F2.
The embodiment provides a full frequency channel collection system, handles digital signal through processing module, and conversion module converts digital signal into analog signal or converts analog signal into analog signal, and coupling module divides the signal shunting integration, and transmission module accepts analog signal or transmission signal, and matching module is with the inside impedance matching of device. The technical problems that the number of baseband boards required for realizing the same carrier number is large, impedance is not matched and a transmitted signal is unstable in the prior art are solved, and the technical effects that the full coverage of a channel is realized on a PCB, the size is small, the heat dissipation performance is good, the carrier number is more flexibly configured on one baseband board, and the transmitted signal is stable are achieved.
It should be noted that the foregoing is only a preferred embodiment of the present invention and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail with reference to the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the scope of the present invention.
Claims (10)
1. A full-band acquisition device, comprising:
The processing module is used for processing the digital signal;
The conversion module is connected with the processing module and is used for converting a digital signal into an analog signal or converting the analog signal into a digital signal;
The coupling module is connected with the conversion module and is used for shunting and integrating signals;
and the transmission module is connected with the coupling module and used for receiving analog signals or transmitting the analog signals.
2. the full band acquisition device as claimed in claim 1, wherein the processing module comprises a baseband chip U1 and a baseband chip U2, and the baseband chip U1 and the baseband chip U2 are configured to process digital signals.
3. The full band acquisition device as claimed in claim 2 wherein the conversion module comprises a rf chip U3 and a rf chip U4, the rf chip U3 is connected to a baseband chip U1, the rf chip U4 is connected to a baseband chip U2, the rf chip U3 is configured to convert the digital signal transmitted by the processing module into an analog signal and convert the analog signal transmitted by the transmission module into a digital signal, and the rf chip U4 is configured to convert the digital signal transmitted by the processing module into an analog signal and convert the analog signal transmitted by the transmission module into a digital signal.
4. The full-band acquisition device as claimed in claim 3 wherein the coupling module comprises a coupler C1, a coupler C2, a coupler C3 and a coupler C4, the coupler C1 is connected with the RF chip U3 and the RF chip U4, the coupler C2 is connected with the RF chip U3 and the RF chip U4, the coupler C3 is connected with the RF chip U3 and the RF chip U4, the coupler C4 is connected with the RF chip U3 and the RF chip U4, and the coupler C1, the coupler C2, the coupler C3 and the coupler C4 are used for signal shunt rectification.
5. the full-band acquisition device as claimed in claim 4, wherein the transmission module comprises transmission interfaces F1 and F2, the transmission interface F1 is connected with the coupler C1 for transmitting the analog signal to the outside, and the transmission interface F2 is connected with the coupler C3 for transmitting the analog signal to the outside.
6. The full band acquisition device as claimed in claim 5 wherein the transmission module further comprises a receiving interface S1, a receiving interface S2, a receiving interface S3 and a receiving interface S4, the receiving interface S1 is connected to the coupler C2 for transmitting analog signals to the conversion module, the receiving interface S2 is connected to the RF chip U3 for transmitting analog signals to the conversion module, the receiving interface S3 is connected to the coupler C4 for transmitting analog signals to the conversion module, and the receiving interface S4 is connected to the RF chip U4 for transmitting analog signals to the conversion module.
7. The full band acquisition device as claimed in claim 1 further comprising a matching module connected between the conversion module and the coupling module for matching internal impedance of the device.
8. The full-band acquisition device according to claim 7, wherein the matching module comprises a balun transformer B1, a balun transformer B2, a balun transformer B3 and a balun transformer B4, the balun transformer B1 is connected between the radio frequency chip U3 and the coupler C1, the balun transformer B12 is connected between the radio frequency chip U3 and the coupler C3, the balun transformer B3 is connected between the radio frequency chip U4 and the coupler C3, and the balun transformer B4 is connected between the radio frequency chip U3 and the coupler C1.
9. The full band acquisition device according to claim 1 further comprising an amplification module connected between the coupling module and the transmission module for amplifying analog signals.
10. The full band acquisition device as claimed in claim 9 wherein the amplification module comprises amplification devices P1 and P2, the amplification device P1 is connected between the coupler C1 and the transmission interface F1, and the amplification device P2 is connected between the coupler C3 and the transmission interface F2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921112849.2U CN209748550U (en) | 2019-07-16 | 2019-07-16 | Full frequency channel collection system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921112849.2U CN209748550U (en) | 2019-07-16 | 2019-07-16 | Full frequency channel collection system |
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| Publication Number | Publication Date |
|---|---|
| CN209748550U true CN209748550U (en) | 2019-12-06 |
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| CN201921112849.2U Active CN209748550U (en) | 2019-07-16 | 2019-07-16 | Full frequency channel collection system |
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| CN (1) | CN209748550U (en) |
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