CN209709015U - A kind of SMD light emitting diode - Google Patents
A kind of SMD light emitting diode Download PDFInfo
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- CN209709015U CN209709015U CN201920662876.0U CN201920662876U CN209709015U CN 209709015 U CN209709015 U CN 209709015U CN 201920662876 U CN201920662876 U CN 201920662876U CN 209709015 U CN209709015 U CN 209709015U
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- smd
- elastic filament
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- bracket
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Abstract
The utility model discloses a kind of SMD light emitting diodes, including bracket, the top of bracket has an installation cavity, SMD patch is packed into installation cavity, the SMD patch includes mirror surface substrate and the chip that is built in mirror surface substrate, chip has an electrode line and a negative line, the top side of bracket is provided with positive terminal, the other side is provided with negative terminals, chip connects positive terminal by electrode line, negative terminals are connected by negative line, the bottom of the SMD patch passes through one or more elastic filament connecting bracket, elastic filament is inserted into bracket and extends towards stent outer end.The SMD patch of the utility model has extraordinary heat dissipation performance, and has top anti-pressure ability well, can chip inside effective protection, increase the service life of chip, can be applied in more complicated environment.
Description
Technical field
The utility model relates to a kind of diodes, and in particular to a kind of SMD light emitting diode.
Background technique
Light emitting diode is due to the heavy metals such as mercury-free itself, lead, the characteristics such as power saving, service life length, vibration resistance, cold light source, mesh
Preceding increasingly widespread diversification.Light emitting diode can be divided into direct insertion and patch type (SMD), and wherein patch type is relative to direct insertion
Have many advantages, such as that small in size, angle of scattering is big, uniformity of luminance is good and becomes development trend.Existing SMD light emitting diode is more
Using encapsulation mode, but SMD patch is fixed on bracket generally by epoxy resin, transparent adhesive tape etc., this structure due to
SMD patch is exposed, and when being under pressure, chip can directly bear pressure, leads to internal wafer damage, anti-pressure ability compared with
Difference, and due to totally enclosed attachment, cause chip bottom to be closed, heat dissipation performance is deteriorated.
Utility model content
Technical problem to be solved in the utility model is a kind of SMD light emitting diode, using the structure of bottom hollow out, is increased
Add heat dissipation performance and increase anti-pressure ability, effectively solves many deficiencies in the prior art.
The utility model is achieved through the following technical solutions: a kind of SMD light emitting diode, including bracket, bracket
Top there is an installation cavity, be packed into SMD patch in installation cavity, the SMD patch includes mirror surface substrate and is built in mirror
There is an electrode line and a negative line, the top side of bracket to be provided with positive terminal for chip in the substrate of face, chip
End, the other side are provided with negative terminals, and chip connects positive terminal by electrode line, connects negative terminal by negative line
End, the bottom of the SMD patch pass through one or more elastic filament connecting bracket, elastic filament be inserted into bracket and towards
Stent outer end extends.
A spatia is formed between the SMD patch outside wall surface and installation cavity inner wall as a preferred technical solution,
The spacing of the spatia is 1-2mm, the bottom hollow out of SMD patch.
One end of the elastic filament forms a bending part, bending part and elastic filament as a preferred technical solution,
Inside there is the heat dissipation channel of a both ends open, the outboard end of heat dissipation channel is concordant with stent outer face, and the side of bending part is inserted
Enter the lower end surface of mirror surface substrate and gluing hydropexis, elastic filament is inserted in mirror surface substrate, the electrode line of chip and negative
Polar curve is respectively protruding into heat dissipation channel and stretches out connection positive and negative anodes terminals at the top of elastic filament.
An incoming line is opened up on the one side of the bending part as a preferred technical solution, positive and negative polar curve is worn respectively
It crosses incoming line to be inserted into heat dissipation channel, the position that positive and negative electrode terminals are faced at the top of elastic filament is provided with line outlet.
The elastic filament is all made of elastic metallic yarn as a preferred technical solution,.
The beneficial effects of the utility model are: the SMD patch bottom of the utility model passes through one or more elastic filament
Suspension connecting bracket, can guide heat after the hollow out of bottom by hollow elastic filament, inside positive and negative polar curve own elasticity filament
Cabling connection, it is reasonable in design, and using the elastic anchorage force of elastic filament, increase top anti-pressure ability.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is the overall structure diagram of the utility model；
Fig. 2 is the structural schematic diagram of the elastic filament of the utility model.
Specific embodiment
All features disclosed in this specification or disclosed all methods or in the process the step of, in addition to mutually exclusive
Feature and/or step other than, can combine in any way.
Any feature disclosed in this specification (including any accessory claim, abstract and attached drawing), except non-specifically chatting
It states, can be replaced by other alternative features that are equivalent or have similar purpose.That is, unless specifically stated, each feature is only
It is an example in a series of equivalent or similar characteristics.
In the description of the present invention, it should be understood that term " one end ", " other end ", " outside ", "upper", " interior
The orientation or positional relationship of the instructions such as side ", "horizontal", " coaxial ", " center ", " end ", " length ", " outer end " is based on attached drawing
Shown in orientation or positional relationship, be merely for convenience of describing the present invention and simplifying the description, rather than indication or suggestion institute
The device or element of finger must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as to this reality
With novel limitation.
In addition, in the description of the present invention, the meaning of " plurality " is at least two, such as two, three etc., unless
Separately there is clearly specific restriction.
The term for the representation space relative position such as "upper", " top ", "lower", " lower section " that the utility model uses is
A unit as shown in the drawings or feature are described for the purpose convenient for explanation relative to another unit or feature
Relationship.The term of relative space position can be intended to include equipment in use or work other than orientation as shown in the figure not
Same orientation.For example, being described as being located at other units or feature " below " or " under " if the equipment in figure overturn
Unit will be located at other units or feature " top ".Therefore, exemplary term " lower section " can include above and below both
Orientation.Equipment can otherwise be directed (be rotated by 90 ° or other directions), and be interpreted accordingly it is used herein with it is empty
Between relevant description language.
In the present invention unless specifically defined or limited otherwise, term " setting ", " connection ", " passes through at " socket "
Wear ", the terms such as " grafting " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；
It can be mechanical connection, be also possible to be electrically connected；It can be directly connected, can also indirectly connected through an intermediary, it can be with
It is the interaction relationship of the connection or two elements inside two elements, unless otherwise restricted clearly.For this field
For those of ordinary skill, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
As shown in Figure 1, including bracket 2, the top of bracket 2 has an installation cavity 9, is packed into SMD patch in installation cavity 9,
SMD patch includes mirror surface substrate 4 and the chip being built in mirror surface substrate 46, and chip 6 has an electrode line 5 and one
Negative line 7, the top side of bracket 2 are provided with positive terminal 1, and the other side is provided with negative terminals 8, and chip 6 is by just
Polar curve 5 connects positive terminal 1, connects negative terminals 8 by negative line 7, the bottom of SMD patch passes through one or more bullet
Property 5 connecting bracket 2 of filament, elastic filament 5 is inserted into bracket 2 and extends towards 2 outboard end of bracket.
Wherein, a spatia 21 is formed between SMD patch outside wall surface and installation cavity inner wall, the spacing of spatia 21 is
The bottom hollow out of 1-2mm, SMD patch, preferred 1mm in the present embodiment reduce spacing, keep its monnolithic case more beautiful.
As shown in Fig. 2, one end of elastic filament 11 forms a bending part 3, have one in bending part 3 and elastic filament 11
The outboard end of the heat dissipation channel 12 of a both ends open, heat dissipation channel 12 is concordant with 2 lateral surface of bracket, the side insertion of bending part 3
In the lower end surface of mirror surface substrate 4 and gluing hydropexis, elastic filament 11 are inserted in mirror surface substrate, the electrode line of chip 6 and
Negative line is respectively protruding into heat dissipation channel 12 and stretches out connection positive and negative anodes terminals at the top of elastic filament 11.Bending part 3
An incoming line 13 is opened up on one side, positive and negative polar curve is each passed through incoming line and is inserted into heat dissipation channel 12, elastic filament 11
Top face the positions of positive and negative electrode terminals and be provided with line outlet (not shown), using elastic filament as internal cabling,
Overhanging positive and negative polar curve is protected well.
Wherein, elastic filament 11 is all made of elastic metallic yarn, using elastic filament 11, it can be achieved that the guidance to heat dissipates
Heat, and entire SMD patch have good shock resistance and anti-pressure ability, for the chip inside SMD have one very
Good protection.
The beneficial effects of the utility model are: the SMD patch bottom of the utility model passes through one or more elastic filament
Suspension connecting bracket, can guide heat after the hollow out of bottom by hollow elastic filament, inside positive and negative polar curve own elasticity filament
Cabling connection, it is reasonable in design, and using the elastic anchorage force of elastic filament, increase top anti-pressure ability.
Above description is only a specific implementation of the present invention, but the protection scope of the utility model is not limited to
In this, any change or replacement expected without creative work be should be covered within the scope of the utility model.
Therefore, the protection scope of the utility model should be determined by the scope of protection defined in the claims.
Claims (5)
1. a kind of SMD light emitting diode, it is characterised in that: including bracket, the top of bracket has an installation cavity, in installation cavity
Be packed into SMD patch, the SMD patch includes mirror surface substrate and the chip that is built in mirror surface substrate, chip have one just
Polar curve and a negative line, the top side of bracket are provided with positive terminal, and the other side is provided with negative terminals, chip
Connect positive terminal by electrode line, negative terminals connected by negative line, the bottom of the SMD patch by one with
On elastic filament connecting bracket, elastic filament is inserted into bracket and extends towards stent outer end.
2. SMD light emitting diode as described in claim 1, it is characterised in that: the SMD patch outside wall surface and installation cavity wall
A spatia is formed between face, the spacing of the spatia is 1-2mm, the bottom hollow out of SMD patch.
3. SMD light emitting diode as described in claim 1, it is characterised in that: one end of the elastic filament forms a bending
With the heat dissipation channel of a both ends open, the outboard end and stent outer of heat dissipation channel in portion, bending part and elastic filament
Face is concordant, and the side of bending part is inserted in the lower end surface of mirror surface substrate and gluing hydropexis, and elastic filament is inserted in mirror surface substrate
In, the electrode line and negative line of chip are respectively protruding into heat dissipation channel and stretch out connection positive and negative anodes at the top of elastic filament and connect
Line end.
4. SMD light emitting diode as claimed in claim 3, it is characterised in that: open up one on the one side of the bending part
Incoming line, positive and negative polar curve are each passed through incoming line and are inserted into heat dissipation channel, and positive and negative electrode is faced at the top of elastic filament and is connect
The position of line end is provided with line outlet.
5. SMD light emitting diode as described in claim 1, it is characterised in that: the elastic filament is all made of elastic metallic yarn.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920662876.0U CN209709015U (en) | 2019-05-10 | 2019-05-10 | A kind of SMD light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920662876.0U CN209709015U (en) | 2019-05-10 | 2019-05-10 | A kind of SMD light emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209709015U true CN209709015U (en) | 2019-11-29 |
Family
ID=68650799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920662876.0U Active CN209709015U (en) | 2019-05-10 | 2019-05-10 | A kind of SMD light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209709015U (en) |
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2019
- 2019-05-10 CN CN201920662876.0U patent/CN209709015U/en active Active
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