CN209690212U - A kind of measuring device of solid material heat conductivity - Google Patents

A kind of measuring device of solid material heat conductivity Download PDF

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Publication number
CN209690212U
CN209690212U CN201920345108.2U CN201920345108U CN209690212U CN 209690212 U CN209690212 U CN 209690212U CN 201920345108 U CN201920345108 U CN 201920345108U CN 209690212 U CN209690212 U CN 209690212U
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measurement
solid material
measuring device
sample block
material sample
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沈永�
周逸
孙毅
潘永杲
杭强
庄燕忠
闵琪涛
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Beijing West Moss Metrology Equipment Co Ltd
Changzhou Inspection And Testing Standard Accreditation Institute
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Beijing West Moss Metrology Equipment Co Ltd
Changzhou Inspection And Testing Standard Accreditation Institute
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Abstract

The utility model relates to a kind of measuring devices of solid material heat conductivity, including measurement host;Core measurement sensor pinboard encapsulating shell is connected with the measurement host;Core measurement sensor is connect with the core measurement sensor pinboard encapsulating shell;Homothermal Proof Box provides the experimental situation of constant temperature for measurement;The the first solid material sample block and the second solid material sample block being set in Homothermal Proof Box;Auxiliary tool on the first solid material sample block and the second solid material sample block.The measuring device may be implemented to greater than predetermined size, solid material of the thermal coefficient in 0.01~100W/ (mK) range simultaneously, measuring within the temperature range of 10~60 DEG C, thermal conductivity measurement deviation are less than ± 5%, and repeatability is better than 2%.

Description

A kind of measuring device of solid material heat conductivity
Technical field
The utility model relates to a kind of measuring devices, and in particular to a kind of measuring device of solid material heat conductivity.
Background technique
The thermal physical property parameter one of mostly important as material of thermal coefficient, is material in heat preservation, heat dissipation and energy conservation etc. The direct performance indicator of field application, therefore be very necessary for the accurate measurement of material thermal conductivity.At present for leading The test method of hot coefficient is broadly divided into two classes, steady state method and cold store enclosure.
It is a kind of standard side of putative thermal conductivity measurement at present to protect hot plate method as main representative in steady state method Method is primarily directed to the thermal coefficients such as thermal insulation material and measures in 1W/ (mK) material below, accuracy of measurement Height is used by national measurement institute, various countries, thermal conductivity measurement standard apparatus is established as standard method.However steady state method its survey It is longer the time required to amount, it is unable to satisfy the large batch of testing requirement of local material thermal coefficient detection unit and enterprise.Make For the test method of cold store enclosure, wherein Transient Method is with its more quick time of measuring and accurate measurement result It is widely studied, has developed more transient heat conduct coefficient testing method, such as: laser flash method, plane heat source method, hot line Method, Hot-strip Method and 3 ω methods etc..It is wherein commercialized preferably plane heat source method, nineteen ninety-five, Gustafsson uses Hot Disk method, that is, plane heat source method, to construction material, the extruded polystyrene and organic glass (PMMA) and height of low thermal conductivity are led The stainless steel and aluminium of hot coefficient have carried out the measurement of thermal coefficient and thermal diffusion coefficient, the identical property with standard material value in the world Preferably, heat conducting coefficient measuring accuracy is within ± 5%, and thermal diffusion coefficient is in accuracy within ± 10%.The same year, Hot Disk Co., Ltd Sweden Uppsala establishment, with its exclusive Adsorbent By Using Transient Plane Source Technique (TPS) patented technology in hot object Property testing field become leading market, by the development of more than ten years, Hot Disk passed through in 2007 ISO international standard committee throw Ticket has simultaneously issued international standard ISO-CD22007-2.2, " the measurement of plastics thermal coefficient and thermal diffusivity-transient state flat heat source Method (Hot Disk) ".
Similar with Adsorbent By Using Transient Plane Source Technique principle, transient state Hot-strip Method (THS) is also to be taken the lead in proposing to go forward side by side by Gustafsson Row research, on the basis of heat-pole method, establish the temperature change in the torrid zone and the relational expression of bulk.German physical technique The Hammerschmidt of research institute (PTB) is to transient state Hot-strip Method (THS) and transient hot wire technique (THW) heat conducting coefficient measuring and heat The principle and uncertainty of diffusion coefficient have carried out detailed analysis and evaluation, and are improved, and use THS and TWS pairs Water and ice have carried out the test of thermal coefficient, and proposing THS not is to measure the best selection of liquid thermal conductivity factor, and THW method is to survey Quantity of fluid and Measurement of Gas Thermal Conductivity preferably select, and country colleges and universities and scientific research institutions etc. are to gas, liquid and solid conductive heat at present The measuring study of coefficient is mainly developed on the basis of THS and THW, establishes laboratory test device.
However, lacking at present easy to operate, measurement result is reliable, advantage of lower cost, while more light material is led Hot coefficient measuring device.
Utility model content
The purpose of the utility model is to provide a kind of easy to operate, measurement result is reliable, while more light material is led Hot coefficient measuring device is also applied for the rapid survey of material in situ suitable for detecting under the steady temperature of laboratory.
The utility model provides a kind of measuring device of solid material heat conductivity comprising: measurement host;Core is surveyed Quantity sensor pinboard encapsulating shell is connected with the measurement host;Core measurement sensor is measured with the core and is passed The connection of sensor pinboard encapsulating shell;Homothermal Proof Box provides the experimental situation of constant temperature for measurement;It is set in Homothermal Proof Box First solid material sample block and the second solid material sample block;On the first solid material sample block and the second solid material sample block Auxiliary tool.
Wherein, the auxiliary tool is standard test weight.
Wherein, further comprise RTD temperature transducer, be used to monitor the temperature in Homothermal Proof Box in real time.
Wherein, the measurement host is attached by USB-B connecting line with PC machine.
It wherein, further comprise core measurement sensor protective shell, independently of measurement host.
Wherein, there is display touch operation screen and multiple Wiring ports in the case surface of the measurement host.
Wherein, the measurement host includes constant current source module, high speed voltage acquisition card module, analog/digital signal Processing module and temperature-measuring module.
The utility model is used constant current source module, high speed voltage acquisition module, digital signal processing module and thermometric mould Block etc. is integrated in measurement host, and is equipped with Homothermal Proof Box to guarantee the stabilization of thermometric environment, is measured using transient state heat bridge method Sensor measures the thermal coefficient of the solid material of two pieces of same materials, and is equipped with and is loaded with based on the establishment of labVIEW platform The PC machine of data storage, analysis and processing software.The measuring device may be implemented to predetermined size is greater than, while thermal coefficient exists Solid material in 0.01~100W/ (mK) range, measuring within the temperature range of 10~60 DEG C, thermal coefficient are surveyed It measures deviation and is less than ± 5%, repeatability is better than 2%.The material thermal conductivity measurement apparatus of the utility model is easy to operate, measurement knot Fruit is reliable, advantage of lower cost, while more light.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the measuring device of the solid material heat conductivity of the utility model;
Fig. 2 is the structural schematic diagram of the back shroud of the measurement host of the utility model;
Fig. 3 is the decomposition texture schematic diagram of the measurement host of the utility model;
Fig. 4 is the enlarged structure signal of the protective shell of the core measurement sensor of the utility model and the encapsulating shell of pinboard Figure;
Fig. 5 is wheatstone bridge circuits schematic diagram;
Fig. 6 is the equivalent heat bridge plan view constructed according to favour stone equivalent circuit of the utility model.
Specific embodiment
The embodiments of the present invention are illustrated with reference to the accompanying drawing for the ease of understanding the utility model, ability Field technique personnel should be appreciated that following explanations only to facilitate explaining to utility model, and not as to its range Specific restriction.
It is as shown in Figure 1 the structural schematic diagram of the measuring device of the solid material heat conductivity of the utility model.The survey Amount device includes: measurement host 1, has display touch operation screen and multiple terminals in the case surface of the measurement host 1 Mouthful, the measurement host 1 including constant current source module, high speed voltage acquisition card module, analog/digital signal processing module and Temperature-measuring module;Core measurement sensor protective shell 2 provides placement space, in the placement space there is core to survey Quantity sensor, for the core measurement sensor protective shell 2 independently of measurement host 1, its main function is for placing core Measurement sensor;Core measurement sensor pinboard encapsulating shell 3 is connected with the measurement host 1;Core measurement sensing Device 5 is connect with the core measurement sensor pinboard encapsulating shell 3, and the core measurement sensor 5 passes through PCB trace electricity Road plate is fixed to the core measurement sensor pinboard encapsulating shell 3, the first solid material sample block 4 and the second solid material sample block 6, auxiliary tool 7, the preferably auxiliary tool 7 are 5kg standard test weight;Homothermal Proof Box 8 provides the experimental ring of constant temperature for measurement Border;RTD temperature transducer 9 is used to monitor the temperature in Homothermal Proof Box 8 in real time, the RTD temperature transducer 9 It is attached with the temperature-measuring module of the measurement host 1;PC machine 10 is led by USB-B connecting line 11 and the measurement Machine 1 is attached, and realizes the acquisition, interaction and control of signal.
Fig. 2 show the structural schematic diagram of the back shroud of the measurement host of the utility model.Multiple connectivity port settings exist On the rear end face, as shown in Fig. 2, USB-B socket 2-1, is attached by USB-B connecting line 11 with PC machine 10;Core Sensor converting interface 2-2, preferably four-wire system connector, two-way are constant current input terminal, and two-way is voltage measurement receiving terminal;Electricity Source switch 2-3 is used for the switch to measurement host 1;220V power cord jack 2-4 provides power supply for measurement host 1; The jack-plug socket 2-5 of RTD temperature transducer 9.The position of specific port as shown in Fig. 2 is intended only as referring to, and is not intended as only One restriction can carry out adjustment appropriate to its specific setting distance and the position with respect between.
Fig. 3 show the decomposition texture schematic diagram of measurement host.The measurement host 1 includes: host shell of top cover 3-1, position Built-in handle 3-2 on the side wall of the host shell of top cover 3-1, for convenience of carrying, lid shell 3-1 on the host A built-in handle 3-2 is each provided in left and right side walls;Heat release hole 3-3, on the arranged on left and right sides wall of the measurement host 1 Three groups are each provided with, is used to radiate, the position for corresponding to heat release hole 3-3 in host shell of top cover 3-1 to improve heat dissipation effect is set It is equipped with exhaust fan, for exporting the heat measured inside host by soft white hands heat release hole;Base tray 3-7 is located at the bottom Power transformer 3-4, single phase poaer supply filter 3-5 and the double-deck PCB circuit board 3-8 on receptacle disk 3-7;Host rear cover Panel 3-6;The display touch operation screen 3-9 of host.Test command can be directly assigned by measuring host touch screen, it is to be tested Progress bar terminates, and the thermal conductivity measurement result of surveyed solid material can be shown on screen.
Fig. 4 is the enlarged structure schematic diagram of the protective shell of core measurement sensor and the encapsulating shell of pinboard.Such as Fig. 4 institute Show, core measurement sensor protective shell 4-1 is the shell for protecting core sensor, can renovate opening, the core Sensor 5 is preferably the core sensor 4-5 of film-type, and the core sensor 4-5 is laid flat in the inner, play when not in use and To the protective effect of core sensor when carrying;PCB cabling circuit board 4-2 is connected with the core sensor 4-5, described Core sensor 4-5 is fixed on PCB trace circuit board 4-2 by solder joint, is then welded again by PCB trace circuit board 4-2 Sensor connecting wire, the first pcb board encapsulating shell 4-3 and the second pcb board encapsulating shell 4-4 pass through in PCB trace circuit board 4-2 PCB trace circuit board is fixed between two encapsulating shells by the circular hole of the heart, plays insulation, moisture-proof and dust-proof effect, wherein the One pcb board encapsulating shell 4-3 and the second pcb board encapsulating shell 4-4 together form core measurement sensor pinboard encapsulating shell.
The first solid material sample block 4 and the second solid material sample block 6 are preferably that material is identical, and size is identical solid in Fig. 1 Body material, further preferably its size are not less than 150 × 100 × 20mm, surface smoothness better than 0.1mm be it is best, it is smooth Slightly poor material is spent, thermal conductivity measurement result can be obvious relatively low compared with practical.
Fig. 5 show wheatstone bridge circuits schematic diagram.The core sensor of the core measurement sensor 5 or film-type 4-5, by parallel hot wire structure of connecting, to construct wheatstone bridge circuits as shown in Figure 5, the bridge circuit includes electricity Stream source 5-1, current divider 5-2, voltmeter 5-3, long external resistance 5-4, short external resistance 5-5;Short interior resistance 5-6;Resistance 5-7 in long, Wherein, the end A, D is current input terminal, and B, C-terminal are voltage measuring terminal.
Fig. 6 show the equivalent heat bridge plan view constructed according to favour stone equivalent circuit of the utility model.Wherein each portion Point size indicates that wherein a is the spacing of interior band and tyre with letter respectively, and general size is greater than 15mm, i.e., the temperature in the inside and outside torrid zone Rising will not interfere with;B is to be greater than 10mm when being commonly designed at a distance from boundary wire in addition, and tyre temperature rise is hardly to boundary Conducting wire has an impact;C is the length of the equivalent heat band of long external resistance 4 in Fig. 5, and d is the equivalent heat band of Fig. 5 middle-end external resistance 5, is led to Often the ratio of the two length is 2:1 or 3:1, and e is the length that long resistance heat band adds short resistance heat band, usually 100mm, can also With longer size;N is the width for constituting the narrowband of long and short resistance heat band, usually 0.2 ± 0.1mm, and k is between two narrowbands Gap is usually 0.1 ± 0.05mm, and it is the value of 2n+k that m, which is the width in the outer torrid zone, usually 0.5mm, and the width p of same interior band is The width of 4n+3k, usually 1mm, certainly, on the basis of this structure, moreover it is possible to increase in addition and the width of interior band;K be it is long, The gap of short resistance heat band can be ignored the overall length e of inside and outside band;G and f is the width of boundary wire, usually big In 10mm, with the same thickness of inside and outside resistance heat band, resistance value can be ignored.In addition the end A, D is electric current input End, B, C-terminal are voltage measuring terminal, and resistance heat band shown in fig. 6 and wide conducting wire are made of alloy, preferably all using nickel alloy come Building, thickness is about 0.02mm, then respectively sets a Kapton above and below in circuit and is sealed compacting, and such one It can play the role of insulation, while also can be carried out effective heat transfer, integral thickness is about 0.1mm.The end B can pass through The nickel alloy of same thickness leads to A, C and D with holding, is welded on PCB adapter plate for circuit as conducting wire.
The auxiliary tool 7 is preferably the M1 grade standard counterweight of 5kg, for heat-insulation material, due to excessively light, such as figure Structure shown in 1, when core measurement sensor 5 is placed between the first solid material sample block 4 and the second solid material sample block 6, meeting Cause core measurement sensor 5 not fix effectively, therefore need to be assisted using constant pressure, therefore, using standard 5kg counterweight give certain pressure to the second solid material sample block 6 so that the first solid material sample block 4 and second solid It is bonded even closer between body material sample block 6, core sensor 5 is allowed to carry out efficient heat transfer.
The Homothermal Proof Box 8, temperature deviation is less than ± 0.2 DEG C in 10~60 DEG C of temperature ranges, by the first solid material Material sample block 4 and the second solid material sample block 6 and core measurement sensor 5, auxiliary tool 7 are placed in Homothermal Proof Box 8, are setting Determine after stablizing 30min at temperature, measures.The RTD thermistor temperature sensor 9, to constant temperature test the temperature inside the box into The result measured is passed in measurement host 1 by row measurement, and for calculating, and is shown on host display curtain.PC machine 10, It is connected by USB-B connecting line 11 with measurement host 01, the software based on the establishment of labVIEW platform, In is loaded in PC machine 10 Host 01 can carry out the transmission and storage of real-time data while measurement, and can draw out real-time curve, and can Carry out data process&analysis.
The measuring device of the solid material heat conductivity of the utility model is to be based on transient state heat bridge method (THB) measuring principle, Wherein, transient state heat bridge method measuring principle is the favour stone equivalent resistance circuit based on Fig. 5, and the generation in the inside and outside length torrid zone is not Same temperature rise causes resistance value to change, and generates potential difference so as to cause B, C-terminal, it is as follows to change over time formula;
Wherein IAFor the constant current of the end A, D load, unit is ampere;αTFor temperature-coefficient of electrical resistance, 1/ DEG C;
ΔTI(t) and Δ TO(t) the respectively temperature rise in the inside and outside torrid zone in real time, unit are DEG C;Δ T (t) be in real time in, The difference in the outer torrid zone, unit are DEG C;WithThe resistance value of length resistance respectively under initial situation, Ω;ΔR0For initial situation The difference of lower length resistance, unit Ω.
In above formula, RL(20 DEG C) and RS(20 DEG C) are expressed as, the resistance value of long and short resistance at 20 DEG C, unit Ω;
T0When to measure, temperature in Homothermal Proof Box, unit is DEG C, can be by Homothermal Proof Box in Fig. 1 08 carries out temperature setting, and measurement host 01 measures temperature by RTD thermistor, substitutes into data and calculates.
Mean temperature on the torrid zone relational expression that changes with time is as follows;
In above formula, D is tropical width, and inside and outside torrid zone width is respectively m and p in Fig. 6, unit mm;
Φ is the power on the inside and outside torrid zone, and W, the power of interior band is approximately 2 times of tyre;
L is the length in the inside and outside torrid zone, is e, unit mm in Fig. 6;
The thermal coefficient that λ is in sample block, that is, Fig. 1 04 and 06, unit are W/ (mK);
The thermal diffusion coefficient that a is in sample block, that is, Fig. 1 04 and 06, unit mm2/s;
The temperature rise difference in the inside and outside torrid zone can simplify are as follows:
In above formula, Φ is the power in the outer torrid zone, W;β is the ratio in the interior torrid zone and the outer torrid zone;DoFor outer bandwidth, as scheme P in 6, mm;γ is Euler's constant 0.577215665 ...;
B, the potential difference of C-terminal can be further represented as;
It is not difficult to find that B, C-terminal voltage are therefore can be with lnt linear change by above formula abbreviation
UBC(t)=mInt+n
In above formula, m and n respectively indicate slope and intercept;
The thermal coefficient of measured and monitored the growth of standing timber material can be calculated with the slope of lnt according to the curve of B, C-terminal output voltage;
During the measuring device stated in use measures, measured using following steps:
Step 1 gets out the identical first solid material sample block 4 of material and the second solid material sample block 6, checks different block Between whether can fit closely;Core measurement sensor 5 in Fig. 1 is taken out from core sensor protective shell 2, the core Sensor 5 is fixed on PCB trace circuit board, and the first pcb board encapsulating shell and the second pcb board encapsulating shell pass through PCB trace circuit PCB trace circuit board is fixed between two encapsulating shells by the circular hole at plate center.
The first solid material sample block 4 and the second solid material sample block 6 are put into Homothermal Proof Box 8 by step 2, and Core measurement sensor 5 is placed among the first solid material sample block 4 and the second solid material sample block 6, is ajusted and using auxiliary 5kg standard test weight is placed on the second solid material sample block 6, core measurement sensor 5 is compressed by tool 7;And by RTD Thermistor 9 is placed in Homothermal Proof Box 8;
Step 3, be arranged Homothermal Proof Box 8 temperature, in 10~60 DEG C of temperature ranges, temperature deviation less than 0.2 DEG C, 8 temperature of Homothermal Proof Box can be used standard platinum resistance and be modified, and wait 20min after temperature in Homothermal Proof Box 8 is stablized, Measurement host 1 is opened simultaneously to be preheated;
Step 4 will measure host 1 and PC machine 10 using USB-B connecting line 11 and be attached, and open mating in PC machine 10 Program, and port connection is set, and runs program;
Step 5, the touch button that brings into operation for pressing measurement host 1, start to measure, time of measuring is about 120s, to be measured Amount progress bar terminates, and measures the thermally conductive system that the first solid material sample block 4 and the second solid material sample block 6 are shown on 01 screen of host Number;
Cooling time 10min or 15min is set in step 6, measurement host 1;Countdown to be cooled terminates, and is surveyed again Amount, duplicate measurements is three times;Program in PC machine 10 will automatically save the lower initial data for measuring host and measuring, and can be surveyed Measure the analysis and processing of data;
Step 7, measurement terminate, and stop the operation program in PC machine 10, close the power supply of measurement host 1, close constant temperature examination Tryoff power supply successively takes out standard 5kg counterweight, core measurement sensor 5, the second solid material sample block 6 and the first solid material Sample block 4, and core measurement sensor 5 is put into core sensor protective shell 2.
Deviation using the reference value of some materials and theory of utility model device systematic survey is as shown in the table;
Although above-described embodiment is not it is understood that the utility model has been disclosed in the preferred embodiments as above To limit the utility model.For any person skilled in the art, the utility model technical side is not being departed from Under case ambit, many possible variations all are made to technical solutions of the utility model using the technology contents of the disclosure above And modification or equivalent example modified to equivalent change.Therefore, all contents without departing from technical solutions of the utility model, According to the technical essence of the utility model any simple modifications, equivalents, and modifications made to the above embodiment, still belong to In the range of technical solutions of the utility model protection.

Claims (7)

1. a kind of measuring device of solid material heat conductivity comprising: measurement host;The encapsulation of core measurement sensor pinboard Shell is connected with the measurement host;Core measurement sensor connects with the core measurement sensor pinboard encapsulating shell It connects;Homothermal Proof Box provides the experimental situation of constant temperature for measurement;It is characterized by: first be set in Homothermal Proof Box is solid Body material sample block and the second solid material sample block;Auxiliary on the first solid material sample block and the second solid material sample block Tool.
2. measuring device as described in claim 1, it is characterised in that: the auxiliary tool is standard test weight.
3. measuring device as described in claim 1, it is characterised in that: further comprise RTD temperature transducer, be used for perseverance Temperature in temperature test box is monitored in real time.
4. measuring device as described in claim 1, it is characterised in that: the measurement host passes through USB-B connecting line and PC machine It is attached.
5. measuring device as described in claim 1, it is characterised in that: it further comprise core measurement sensor protective shell, Independently of measurement host.
6. measuring device as described in claim 1, it is characterised in that: there is display touching in the case surface of the measurement host Touch operator control panel and multiple Wiring ports.
7. measuring device as described in claim 1, it is characterised in that: the measurement host includes constant current source module, height Fast voltage acquisition card module, analog/digital signal processing module and temperature-measuring module.
CN201920345108.2U 2019-03-19 2019-03-19 A kind of measuring device of solid material heat conductivity Active CN209690212U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109738485A (en) * 2019-03-19 2019-05-10 常州检验检测标准认证研究院 A kind of measuring device and its method of solid material heat conductivity

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109738485A (en) * 2019-03-19 2019-05-10 常州检验检测标准认证研究院 A kind of measuring device and its method of solid material heat conductivity

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