CN209675250U - A kind of semiconductor packaging device component shift collision warning mechanism - Google Patents
A kind of semiconductor packaging device component shift collision warning mechanism Download PDFInfo
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- CN209675250U CN209675250U CN201920456775.8U CN201920456775U CN209675250U CN 209675250 U CN209675250 U CN 209675250U CN 201920456775 U CN201920456775 U CN 201920456775U CN 209675250 U CN209675250 U CN 209675250U
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Abstract
The utility model discloses a kind of semiconductor packaging device component shift collision warning mechanisms, including pedestal, sensor chip is fixedly installed on front side of the upper side wall of loose collar, the lateral wall of right sensor bracket is fixedly installed with first sensor device, the lateral wall of left sensor bracket is fixedly installed with second sensor device, the lateral wall of forward right side sensor stand is fixedly installed with 3rd sensor device, the lateral wall of front left side sensor stand is fixedly installed with the 4th sensor device, part is placed in sleeve by the utility model, when component shift, band moving sleeve, loose collar and sensor chip offset, at this time by four sensor devices can offset to sensor chip and direction incude, pass through the work of ambient controller arrestment and sounds an alarm, part is enabled to reset by tension spring simultaneously, it can be precisely to small Offset is detected, and saves manpower, can be improved working efficiency.
Description
Technical field
The utility model relates to technical field of semiconductor encapsulation, specially a kind of semiconductor packaging device is touched with component shift
Hit alarm mechanism.
Background technique
In semiconductor packaging device, it is often necessary to guarantee that mechanical device cannot shift, but the mistake of personnel sometimes
A possibility that operation will lead to the generation of collision, and wherein the inadequate employee of proficiency collides when in use is relatively high, exists
Safety in production hidden danger, and artificial power-off protection is needed after colliding, employee's burden has been aggravated, has been had to production efficiency bad
Influence, it is therefore desirable to a warning device come guarantee occur maloperation first time protected, but existing equipment without
This function, Xu Rao personnel re-start adjustment after colliding, and process is more troublesome, if it is possible to design a kind of in part generation
When offset collisions, the device of detection alarm can be carried out immediately, so that it may problems are solved, for this purpose, it is proposed that a kind of half
Conductor sealed in unit component shift collision warning mechanism.
Summary of the invention
The purpose of this utility model is to provide a kind of semiconductor packaging device component shift collision warning mechanisms, with solution
Certainly the problems mentioned above in the background art.
To achieve the above object, the utility model provides the following technical solutions: a kind of semiconductor packaging device part is inclined
Collision warning mechanism, including pedestal are moved, is fixedly installed with fixed ring, the inside of the fixed ring on rear side of the upper side wall of the pedestal
Wall is uniformly fixedly installed with one end of tension spring, and the other end of the tension spring is fixedly installed with loose collar, the inside of the loose collar
Wall is fixedly installed with sleeve, and through slot is offered on front side of the lateral wall of the fixed ring, is fixed on front side of the upper side wall of the loose collar
Sensor chip is installed, and sensor chip runs through through slot, the upper side wall right side of the pedestal, left side, forward right side and front left side are equal
It is fixedly installed with sensor stand, the lateral wall of the right side sensor stand is fixedly installed with first sensor device, left side
The lateral wall of the sensor stand is fixedly installed with second sensor device, and the lateral wall of sensor stand described in forward right side is solid
Dingan County is equipped with 3rd sensor device, and the lateral wall of sensor stand described in front left side is fixedly installed with the 4th sensor device,
And the front end of sensor chip is located at first sensor device, second sensor device, 3rd sensor device and the 4th and passes
In sensor arrangement.
Preferably, the first sensor device and second sensor device, 3rd sensor device and the 4th sensor
The internal structure of device is identical, and the first sensor device includes fixed block, and fixed block is fixedly installed in sensor stand
Lateral wall, the left side wall of the fixed block offers the first rectangular channel, and is located at the first rectangle on the right side of the front end of sensor chip
In slot, the inner cavity lower wall of first rectangular channel offers the second rectangular channel, the fixed peace of the inner sidewall of second rectangular channel
Equipped with load cell, and load cell is wired to ambient controller, and the inner sidewall of second rectangular channel is inserted
It is connected to induction rod, and the left side wall of induction rod fits in the right side wall of load cell, the fixed peace of the right side wall of the fixed block
Equipped with connecting line, one end of the connecting line is connected to load cell, and the other end of connecting line is connected to external power supply.
Preferably, the front side wall right side opening of the sensor chip is equipped with groove, and the inner sidewall of groove fits in third biography
The lateral wall of the induction rod of sensor arrangement, right side, left side and the front left side of the upper side wall of the sensor chip offer rectangle
Hole, and the induction rod of first sensor device, second sensor device and the 4th sensor device is plugged in respectively described in three
In rectangular opening.
Preferably, the upper side wall of the fixed ring is fixedly installed with baffle.
Compared with prior art, the utility model has the beneficial effects that the utility model passes through fixed ring, tension spring, activity
Ring, sleeve, sensor chip, first sensor device, second sensor device, 3rd sensor device and the 4th sensor device
Part is placed in sleeve by structure, and when component shift, band moving sleeve, loose collar and sensor chip offset pass through four at this time
Sensor device can offset to sensor chip and direction incude, the work by ambient controller arrestment is concurrent
Alarm out, while enabling part reset by tension spring, precisely minor shifts can be detected, and save manpower, be can be improved
Working efficiency.
Detailed description of the invention
Fig. 1 is the main view of the utility model.
Fig. 2 is the left view of the utility model.
Fig. 3 is the top view of the utility model.
Fig. 4 is the top view of the utility model sensor chip.
Fig. 5 is the main view cross-sectional view of the utility model first sensor device.
In figure: 1, pedestal, 2, fixed ring, 3, tension spring, 4, loose collar, 5, sleeve, 6, through slot, 7, sensor chip, 8, sensing
Device bracket, 9, first sensor device, 91, fixed block, the 92, first rectangular channel, the 93, second rectangular channel, 94, load cell,
95, induction rod, 96, connecting line, 10, second sensor device, 11,3rd sensor device, the 12, the 4th sensor device, 13,
Groove, 14, rectangular opening, 15, baffle.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1, Fig. 2, Fig. 3, Fig. 4 and Fig. 5 are please referred to, the utility model provides a kind of technical solution: a kind of semiconductor packages
The upper side wall rear side of equipment component shift collision warning mechanism, including pedestal 1, pedestal 1 is fixedly installed with fixed ring 2, fixed
The position of ring 2 is fixed, and the inner sidewall of fixed ring 2 is uniformly fixedly installed with one end of tension spring 3, tension spring 3 altogether there are three, and model,
Length and coefficient of elasticity are identical, are in hexagonal angle between two neighboring tension spring 3, as shown in figure 3, three tension springs 3 are to elongate at this time
State, and three elongation of tension springs 3 length are identical, the other end of tension spring 3 is fixedly installed with loose collar 4, and the inner sidewall of loose collar 4 is solid
Dingan County is equipped with sleeve 5, places part in sleeve 5, when part shifts, will drive sleeve 5 and loose collar 4 together partially
It moves, through slot 6 is offered on front side of the lateral wall of fixed ring 2, the width of through slot 6 is greater than the width of sensor chip 7, enables sensor chip 7
It can be realized the movement of left and right directions, be fixedly installed with sensor chip 7, the left view of sensor chip 7 on front side of the upper side wall of loose collar 4
Figure is zigzag, by sensor chip 7 and first sensor device 9, second sensor device 10,3rd sensor device 11 and
The induction of the offset to part is realized in the cooperation of 4th sensor device 12, and sensor chip 7 runs through through slot 6, the upper side wall of pedestal 1
Right side, left side, forward right side and front left side are fixedly installed with sensor stand 8, the fixed peace of the lateral wall of right sensor bracket 8
Equipped with first sensor device 9, the lateral wall of left sensor bracket 8 is fixedly installed with second sensor device 10, forward right side
The lateral wall of sensor stand 8 is fixedly installed with 3rd sensor device 11, the fixed peace of the lateral wall of front left side sensor stand 8
Equipped with the 4th sensor device 12, as shown in Figure 3, it is known that the position and direction of four sensor stands 8, and then enable the first sensing
Device device 9 and second sensor device 10 are to be transversely mounted, and it is vertical for enabling 3rd sensor device 11 and the 4th sensor device 12
First sensor device 9, second sensor device 10,3rd sensor dress are located to the front end of installation, and sensor chip 7
11 and the 4th are set in sensor device 12, when part deviates to the left, drives sensor chip 7 to deviate to the left, and then pass through sensing
Device piece 7 enables the signal of load cell 94 in first sensor device 9 change with the cooperation of first sensor device 9, at this time
The work of ambient controller arrestment can be passed through and alarmed, in addition, second sensor device 10 for detect part to
The offset on the right side, 3rd sensor device 11 are used to detect part for detecting the forward offset of part, the 4th sensor device 12
Offset backward.
Specifically, first sensor device 9 and second sensor device 10,3rd sensor device 11 and the 4th sensing
The internal structure of device device 12 is identical, following mainly to describe to the internal structure of first sensor device 9, first sensor
Device 9 includes fixed block 91, and fixed block 91 is fixedly installed in the lateral wall of sensor stand 8, and fixed block 91 is solid by screw
It is scheduled on sensor stand 8, the left side wall of fixed block 91 offers the first rectangular channel 92, and the front end right lateral position of sensor chip 7
In in the first rectangular channel 92, the inner cavity lower wall of the first rectangular channel 92 offers the second rectangular channel 93, the second rectangular channel 93 it is interior
Side wall is fixedly installed with load cell 94, the model L10A of load cell 94, and load cell 94 and is connected by conducting wire
It is connected to ambient controller, ambient controller is used to control the operation of semiconductor packaging device, while having warning function, the second square
The inner sidewall of shape slot 93 is plugged with induction rod 95, and the left side wall of induction rod 95 fits in the right side wall of load cell 94, when
When sensor chip 7 shifts, induction rod 95 can be touched, and then induction rod 95 can be changed to the pressure of load cell 94,
The numerical value change for the power for enabling load cell 94 measure, this information can be transmitted at ambient controller, enable equipment out of service simultaneously
It sounding an alarm, the right side wall of fixed block 91 is fixedly installed with connecting line 96, and one end of connecting line 96 is connected to load cell 94,
And the other end of connecting line 96 is connected to external power supply, connecting line is used to power to load cell 94.
Specifically, the front side wall right side opening of sensor chip 7 is equipped with groove 13, and the inner sidewall of groove 13 fits in third
The lateral wall of the induction rod 95 of sensor device 11, therefore when 7 biased forwards of sensor chip, it can be to 3rd sensor device 11
95 applied force of induction rod, the power that the load cell 94 of 3rd sensor device 11 can be enabled to measure are reduced, the upside of sensor chip 7
Right side, left side and the front left side of wall offer rectangular opening 14, and the length of rectangular opening 14 is longer than the width of induction rod 95, and first
The induction rod 95 of sensor device 9, second sensor device 10 and the 4th sensor device 12 is plugged in three squares respectively
In shape hole 14, the right side wall of the induction rod 95 of first sensor device 9 is bonded with the inner cavity right side wall of corresponding rectangular opening 14, the
The left side wall of the induction rod 95 of two sensor devices 10 is bonded with the inner cavity left side wall of corresponding rectangular opening 14, the 4th sensor device
The inner cavity front side wall of the front side wall of 12 induction rod 95 and corresponding rectangular opening 14 is bonded, thus when sensor chip 7 occur to the left, to
When right or offset backward, the dynamometry of first sensor device 9, second sensor device 10 and the 4th sensor device 12 can be enabled
The power that sensor 94 measures increases.
Specifically, the upper side wall of fixed ring 2 is fixedly installed with baffle 15, loose collar 4 is limited.
Working principle: part is placed in sleeve 5 by this semiconductor packaging device component shift collision warning mechanism, and
It can guarantee the center that part initial position is located in fixed ring 2 under the action of three tension spring 3, when part shifts
When, it will drive sleeve 5, loose collar 4 and sensor chip 7 and shift, when sensor chip 7 deviates to the left, on sensor chip 7
The rectangular opening 14 on right side can touch the induction rod on first sensor device 9, so change that load cell 94 measures its
Change with the pressure between induction rod 95, this power can be transmitted at ambient controller, and control equipment stops working concurrent responding
Report, simultaneously as the length of rectangular opening 14 is longer than the width of induction rod 95, therefore the induction rod 95 at second sensor device 10
It will not be contacted with corresponding rectangular opening 14, therefore can accurately learn the direction of offset, correspondingly, working as sensor chip 7 to the right
When side, front side or rear side offset, second sensor device 10,3rd sensor device 11 and the 4th sensor dress can be changed respectively
The size for the power that the load cell 94 in 12 measures is set, and then realizes that equipment stops and the sending of alarm is being drawn after offset
It can enable under the action of spring 3 and be resetted at loose collar 4, part is enabled to be restored to specified position, be carried out convenient for work next time, pass through this
Device can precisely detect minor shifts, and save manpower, can be improved working efficiency.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (4)
1. a kind of semiconductor packaging device component shift collision warning mechanism, it is characterised in that: including pedestal (1), the bottom
It is fixedly installed with fixed ring (2) on rear side of the upper side wall of seat (1), the inner sidewall of the fixed ring (2) is uniformly fixedly installed with tension spring
(3) other end of one end, the tension spring (3) is fixedly installed with loose collar (4), the fixed peace of the inner sidewall of the loose collar (4)
It equipped with sleeve (5), is offered through slot (6) on front side of the lateral wall of the fixed ring (2), on front side of the upper side wall of the loose collar (4)
Be fixedly installed with sensor chip (7), and sensor chip (7) runs through through slot (6), the upper side wall right side of the pedestal (1), left side,
Forward right side and front left side are fixedly installed with sensor stand (8), and the lateral wall of the right side sensor stand (8) is fixedly mounted
Have first sensor device (9), the lateral wall of the left side sensor stand (8) is fixedly installed with second sensor device
(10), the lateral wall of sensor stand described in forward right side (8) is fixedly installed with 3rd sensor device (11), is passed described in front left side
The lateral wall of sensor bracket (8) is fixedly installed with the 4th sensor device (12), and the front end of sensor chip (7) is located at
In one sensor device (9), second sensor device (10), 3rd sensor device (11) and the 4th sensor device (12).
2. a kind of semiconductor packaging device according to claim 1 component shift collision warning mechanism, it is characterised in that:
The first sensor device (9) and second sensor device (10), 3rd sensor device (11) and the 4th sensor device
(12) internal structure is identical, and the first sensor device (9) includes fixed block (91), and fixed block (91) is fixedly installed in
The left side wall of the lateral wall of sensor stand (8), the fixed block (91) offers the first rectangular channel (92), and sensor chip
(7) it is located in the first rectangular channel (92) on the right side of front end, the inner cavity lower wall of first rectangular channel (92) offers the second square
The inner sidewall of shape slot (93), second rectangular channel (93) is fixedly installed with load cell (94), and load cell (94)
It is wired to ambient controller, the inner sidewall of second rectangular channel (93) is plugged with induction rod (95), and induction rod
(95) left side wall fits in the right side wall of load cell (94), and the right side wall of the fixed block (91) is fixedly installed with connection
One end of line (96), the connecting line (96) is connected to load cell (94), and the other end of connecting line (96) is connected to outside
Connect power supply.
3. a kind of semiconductor packaging device according to claim 1 component shift collision warning mechanism, it is characterised in that:
The front side wall right side opening of the sensor chip (7) is equipped with groove (13), and the inner sidewall of groove (13) fits in 3rd sensor
The lateral wall of the induction rod (95) of device (11), right side, left side and the front left side of the upper side wall of the sensor chip (7) open up
Have rectangular opening (14), and the induction of first sensor device (9), second sensor device (10) and the 4th sensor device (12)
Bar (95) is plugged in respectively in three rectangular openings (14).
4. a kind of semiconductor packaging device according to claim 1 component shift collision warning mechanism, it is characterised in that:
The upper side wall of the fixed ring (2) is fixedly installed with baffle (15).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201920456775.8U CN209675250U (en) | 2019-04-07 | 2019-04-07 | A kind of semiconductor packaging device component shift collision warning mechanism |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201920456775.8U CN209675250U (en) | 2019-04-07 | 2019-04-07 | A kind of semiconductor packaging device component shift collision warning mechanism |
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CN209675250U true CN209675250U (en) | 2019-11-22 |
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CN201920456775.8U Active CN209675250U (en) | 2019-04-07 | 2019-04-07 | A kind of semiconductor packaging device component shift collision warning mechanism |
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2019
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Legal Events
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address |
Address after: 214135 fourth floor, building 30, zone B, HUanPu International Industrial Park, No. 15, Hanjiang Road, Xinwu District, Wuxi City, Jiangsu Province Patentee after: Yilong semiconductor equipment (Wuxi) Co.,Ltd. Address before: 116600 95-2 Tieshan East Road, Jinzhou District, Dalian City, Liaoning Province Patentee before: WING LOONG EQUIPMENT (DALIAN) CO.,LTD. |
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CP03 | Change of name, title or address |