CN209656844U - A kind of SOT-227 encapsulation metal-oxide-semiconductor cut-in voltage supplemental measurement tool - Google Patents
A kind of SOT-227 encapsulation metal-oxide-semiconductor cut-in voltage supplemental measurement tool Download PDFInfo
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- CN209656844U CN209656844U CN201821903288.3U CN201821903288U CN209656844U CN 209656844 U CN209656844 U CN 209656844U CN 201821903288 U CN201821903288 U CN 201821903288U CN 209656844 U CN209656844 U CN 209656844U
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- threading hole
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Abstract
The utility model discloses a kind of SOT-227 to encapsulate metal-oxide-semiconductor cut-in voltage supplemental measurement tool, including handle, handle end is equipped with lid, lid and handle are integrally formed, cover bottom is equipped with the groove of square, bottom portion of groove is equipped with the first contact in matrix pattern distribution, second contact, third contact and the 4th contact, recess sidewall is equipped with the first threading hole, second threading hole and third threading hole, the first conducting wire connecting with the first contact is equipped in first threading hole, the second conducting wire connecting with the second contact is installed in second threading hole, the privates connecting with third contact is installed in third threading hole.The lid of the utility model is buckled in SOT-227 encapsulation metal-oxide-semiconductor upper surface, and first contact, the second contact, third contact, the 4th contact are respectively aligned to the first spring leaf, second spring piece, third spring leaf, the 4th spring leaf, in conjunction with measuring instrumentss, the quick and precisely measurement of SOT-227 encapsulation metal-oxide-semiconductor cut-in voltage can be realized.
Description
Technical field
The utility model relates to electronic measuring technology field more particularly to a kind of SOT-227 encapsulation metal-oxide-semiconductor cut-in voltage are auxiliary
Help measuring tool.
Background technique
The production of radio-frequency power supply needs to encapsulate metal-oxide-semiconductor using large batch of SOT-227, is subject to processing the influence of precision, out
The indices of factory's metal-oxide-semiconductor can all have certain error range, but for some particular electrical circuit, it is desirable that different metal-oxide-semiconductors
Cut-in voltage as close as, so need to filter out metal-oxide-semiconductor similar in cut-in voltage before installation on same power supply,
Ensure the stability and reliability of power supply.The method of measurement metal-oxide-semiconductor cut-in voltage mainly uses the direct method of measurement at present, has plenty of
Directly be powered on, needed before power-up respectively from D, G, S terminated line at the end D, G, S of metal-oxide-semiconductor, repeatedly wiring take out stitches efficiency too it is low simultaneously
Also the spring leaf of metal-oxide-semiconductor can be caused to damage;Have plenty of for metal-oxide-semiconductor to be placed directly on MOSFET testing cassete and push down measurement with hand,
Human body temperature can be transmitted to metal-oxide-semiconductor in this way, temperature change is affected to metal-oxide-semiconductor cut-in voltage, directly affects the accurate of measurement
Property.
Utility model content
The purpose of the utility model is to provide a kind of SOT-227 to encapsulate metal-oxide-semiconductor cut-in voltage supplemental measurement tool, Neng Goushi
The quick and precisely measurement of existing SOT-227 encapsulation metal-oxide-semiconductor cut-in voltage.
To achieve the above object, the technical solution of the utility model is: a kind of SOT-227 encapsulation metal-oxide-semiconductor cut-in voltage is auxiliary
Help measuring tool, SOT-227 encapsulation metal-oxide-semiconductor upper surface be equipped with the first spring leaf being connect with its grid, with its company of drain electrode
The second spring piece connect, the third spring leaf and the 4th spring leaf that are connect with its source electrode, the first spring leaf, second spring piece,
Three spring leafs and the 4th spring leaf are distributed in matrix pattern, are additionally provided with circular hole and U-shaped mouth, the auxiliary on SOT-227 encapsulation metal-oxide-semiconductor
Measuring tool includes handle, and handle end is equipped with lid, and lid and handle are integrally formed, and cover bottom is equipped with the recessed of square
Slot, bottom portion of groove is equipped with to be set in the first contact of matrix pattern distribution, the second contact, third contact and the 4th contact, recess sidewall
There are the first threading hole, the second threading hole and third threading hole, be equipped with the first weld tabs connecting with the first contact in the first threading hole,
First weld tabs end is connected with the first conducting wire, is equipped with the second weld tabs connecting with the second contact, the second weld tabs in the second threading hole
End is connected with the second conducting wire, and the third weld tabs connecting with third contact, the connection of third weld tabs end are equipped in third threading hole
There is privates.
Further, described lid one end is equipped with U-type groove, and opposite side is equipped with round tube hole.
Further, first contact, the second contact, third contact and the 4th contact are M4 screw.
The beneficial effects of the utility model are: the utility model can be realized the fast of SOT-227 encapsulation metal-oxide-semiconductor cut-in voltage
Fast accurate measurement.
Detailed description of the invention
Fig. 1 is the structural schematic diagram that SOT-227 encapsulates metal-oxide-semiconductor;
Fig. 2 is the front view of the utility model;
Fig. 3 is the left view of the utility model;
Fig. 4 is the bottom view of the utility model;
Fig. 5 is the wiring diagram that the utility model cooperates MOSFET testing cassete to use.
Specific embodiment
Below in conjunction with attached drawing, the technical scheme in the utility model embodiment is clearly and completely described.
As shown in Figs 1-4, a kind of SOT-227 encapsulates metal-oxide-semiconductor cut-in voltage supplemental measurement tool, the SOT-227 encapsulation
Metal-oxide-semiconductor upper surface is equipped with the first spring leaf 101 connect with its grid, the second spring piece 102 for the connection that drains with it and its source
The third spring leaf 103 and the 4th spring leaf 104 of pole connection, the first spring leaf 101, second spring piece 102, third spring leaf
103 and the 4th spring leaf 104 in matrix pattern be distributed, SOT-227 encapsulation metal-oxide-semiconductor on be additionally provided with circular hole 105 and U-shaped mouth 106, it is described
Supplemental measurement tool includes handle 1, and 1 end of handle is equipped with lid 2, and lid 2 and handle 1 are integrally formed, and 2 bottom of lid is equipped with just
Rectangular groove 3,3 bottom of groove are equipped in the first contact 4 of matrix pattern distribution, the second contact 5, third contact 6 and the 4th touching
Point 7,3 side wall of groove are equipped with the first threading hole 8, the second threading hole 9 and third threading hole 10, are equipped in the first threading hole 8 and the
First weld tabs 11 of one contact 4 connection, 11 end of the first weld tabs are connected with the first conducting wire 12, are equipped in the second threading hole 9 and the
Second weld tabs 13 of two contacts 5 connection, 13 end of the second weld tabs are connected with the second conducting wire 14, are equipped in third threading hole 10 and the
The third weld tabs 15 of three contacts 6 connection, 15 end of third weld tabs is connected with privates 16.First contact 4, the second contact
5, third contact 6 and the 4th contact 7 are M4 screw.
As shown in figure 5, only metal-oxide-semiconductor to be measured need to be arranged in a row, the utility model is vertically arranged, one by one in measurement process
It is buckled on metal-oxide-semiconductor to be measured, conjunction measuring instrument, such as MOSFET testing cassete, by " G " wiring of the first conducting wire and MOSFET testing cassete
Column connection, the second conducting wire is connect with " D " binding post of MOSFET testing cassete, by " S " of privates and MOSFET testing cassete
Binding post connection, can accurately measure cut-in voltage.
Described 2 one end of lid is equipped with U-type groove 17, and opposite side is equipped with round tube hole 18.When measurement respectively with the U on metal-oxide-semiconductor
Type mouth, circular hole alignment, convenient for alignment.
The described embodiments are only a part of the embodiments of the utility model, instead of all the embodiments.Based on this
Embodiment in utility model, it is obtained by those of ordinary skill in the art without making creative efforts it is all its
His embodiment, belongs to the scope of the utility model.
Claims (3)
1. a kind of SOT-227 encapsulates metal-oxide-semiconductor cut-in voltage supplemental measurement tool, SOT-227 encapsulation metal-oxide-semiconductor upper surface is equipped with
The first spring leaf for being connect with its grid, the second spring piece for the connection that drains with it, the third spring leaf that is connect with its source electrode and
4th spring leaf, the first spring leaf, second spring piece, third spring leaf and the 4th spring leaf are distributed in matrix pattern, SOT-227 envelope
Circular hole and U-shaped mouth are additionally provided on dress metal-oxide-semiconductor, which is characterized in that the supplemental measurement tool includes handle, and handle end is equipped with lid
Son, lid and handle are integrally formed, and cover bottom is equipped with the groove of square, and bottom portion of groove is equipped with first in matrix pattern distribution
Contact, the second contact, third contact and the 4th contact, recess sidewall are equipped with the first threading hole, the second threading hole and third threading
Hole, the first threading hole is interior to be equipped with the first weld tabs connecting with the first contact, and the first weld tabs end is connected with the first conducting wire, and second wears
The second weld tabs connecting with the second contact is equipped in string holes, the second weld tabs end is connected with the second conducting wire, sets in third threading hole
There is the third weld tabs connecting with third contact, third weld tabs end is connected with privates.
2. a kind of SOT-227 as described in claim 1 encapsulates metal-oxide-semiconductor cut-in voltage supplemental measurement tool, which is characterized in that institute
Lid one end is stated equipped with U-type groove, opposite side is equipped with round tube hole.
3. a kind of SOT-227 as described in claim 1 encapsulates metal-oxide-semiconductor cut-in voltage supplemental measurement tool, which is characterized in that institute
Stating the first contact, the second contact, third contact and the 4th contact is M4 screw.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201821903288.3U CN209656844U (en) | 2018-11-19 | 2018-11-19 | A kind of SOT-227 encapsulation metal-oxide-semiconductor cut-in voltage supplemental measurement tool |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201821903288.3U CN209656844U (en) | 2018-11-19 | 2018-11-19 | A kind of SOT-227 encapsulation metal-oxide-semiconductor cut-in voltage supplemental measurement tool |
Publications (1)
Publication Number | Publication Date |
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CN209656844U true CN209656844U (en) | 2019-11-19 |
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CN201821903288.3U Active CN209656844U (en) | 2018-11-19 | 2018-11-19 | A kind of SOT-227 encapsulation metal-oxide-semiconductor cut-in voltage supplemental measurement tool |
Country Status (1)
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CN (1) | CN209656844U (en) |
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2018
- 2018-11-19 CN CN201821903288.3U patent/CN209656844U/en active Active
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Effective date of registration: 20200430 Address after: 100176 No. 8 Wenchang Avenue, Beijing economic and Technological Development Zone, Beijing, Daxing District Patentee after: BEIJING NAURA MICROELECTRONICS EQUIPMENT Co.,Ltd. Address before: 101300 No. 26, A District, Tianzhu Road, Tianzhu Airport Industrial Zone, Beijing, Shunyi District Patentee before: Beijing BBEF Science & Technology Co.,Ltd. |