CN209640802U - Wind-lead-cover structure - Google Patents
Wind-lead-cover structure Download PDFInfo
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- CN209640802U CN209640802U CN201920505375.1U CN201920505375U CN209640802U CN 209640802 U CN209640802 U CN 209640802U CN 201920505375 U CN201920505375 U CN 201920505375U CN 209640802 U CN209640802 U CN 209640802U
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- Prior art keywords
- wind
- buckle arm
- fan housing
- lead
- cover structure
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Abstract
The utility model discloses a kind of wind-lead-cover structure, and to be fixed on motherboard, motherboard has channel connector and main radiator, and wind-lead-cover structure includes: fan housing ontology and buckle arm component.Fan housing ontology corresponds to channel connector the cover;Buckle arm component includes the first buckle arm and the second buckle arm for being connected to fan housing ontology, and the first buckle arm and the second buckle arm respectively correspond the fastener of channel connector and the fixing seat buckle of main radiator and fix.Whereby, wind-lead-cover structure can be fixed on motherboard in the case where not using the attachment member such as screw, to reach time saving, labour-saving convenience effect.
Description
Technical field
The utility model relates to the heat dissipation of electronic device, a kind of wind-lead-cover structure for server radiating is particularly related to.
Background technique
Electronic device about such as server or work station etc. all has a motherboard, and a large amount of electricity are configured on motherboard
Subcomponent, these electronic components (such as arithmetic element, expansion board and other electronics other than arithmetic element and expansion board
Element etc.) running when will generate different heat, it is therefore necessary to particular for main pyrotoxin (such as arithmetic element) carry out
Heat dissipation design.
The existing radiator structure particular for designed by main pyrotoxin out is wind scooper, will come from by wind scooper
It guides in the main air quantity of fan to main pyrotoxin, remaining air quantity then distributes to other fevers other than main pyrotoxin
Source (such as expansion board and other electron component etc.), to promote the heat dissipation effect for main pyrotoxin.
However, existing wind scooper is due to that additionally can just must be fixed in motherboard by attachment member (such as screw etc.)
On, obvious trouble and there is inconvenient missing.
Utility model content
The purpose of this utility model is to provide a kind of wind-lead-cover structures, can not use the attachment member such as screw
In the case where fixing, wind-lead-cover structure is completed to fix by the existing component being snapped on motherboard.
In order to achieve the above objectives, the utility model provides a kind of wind-lead-cover structure, is fixed on motherboard, motherboard tool
There is channel connector and be set to the main radiator of arithmetic element, which includes: an at least fan housing ontology, corresponding institute
State channel connector the cover;And an at least buckle arm component, the buckle arm component include to be both connected to the one first of the fan housing ontology
Buckle arm and one second buckle arm, first buckle arm and second buckle arm respectively correspond fastener on the channel connector and described
Fixing seat in main radiator is buckled and is fixed.
Wherein, the fan housing ontology and the buckle arm component are all two settings, and respectively the buckle arm component is connected to respectively
The fan housing ontology, the two fan housings ontology are spaced each other main in forming one on the motherboard, between the two fan housings ontology side by side
Air duct is configured with the main radiator in the main air duct.
Wherein, each fan housing ontology all has an air inlet port, an outlet port and corresponding outlet port configuration
One block body, respectively the block body protrudes from the main air duct, and the distance between two block body in the main air duct is less than two air inlet
The distance between port.
Wherein, a secondary air duct is formed in the fan housing ontology, which has Two-port netwerk, which is connected to
Between the Two-port netwerk.
Wherein, the Two-port netwerk of the fan housing ontology includes an air inlet port, which passes through relative to the secondary air duct
It is staggered by bending, the air inlet port and the secondary air duct are not on the same line.
Wherein, which has a top plate, and the Two-port netwerk of the fan housing ontology includes an outlet port, the top plate from
A side corresponding to the outlet port is extended at least block body being downwardly inclined, which pushes guiding and go out from this
Wind port output wind and brush the motherboard downwards.
Wherein, at least a buckle arm component is all mylar film material to an at least fan housing ontology with this, and an at least fan housing
Ontology and an at least buckle arm component molding integral with one another.
Wherein, which is located between each fastener of two channel connectors of same row and has 2 first to lack
Mouthful, which respectively corresponds the lug buckle of each fastener and fixes.
Wherein, which is located between each fixing seat of adjacent two main radiator and has 2 second notches,
2 second notch respectively corresponds the side buckle of each fixing seat and fixes.
Wherein, which has a top plate and bends two sides of simultaneously drawdown from top plate dual side-edge relative to each other
Plate, first buckle arm and second buckle arm are connected to two side plate of the fan housing ontology.
Wherein, first buckle arm and second buckle arm integrally extend from the bottom edge of two side plate respectively and upward reflexed at
Type.
Compared to the prior art, the utility model has effects that following: by the first buckle arm and the second buckle arm is right respectively
The existing member clasp on motherboard is answered, can consolidate wind-lead-cover structure in the case where not using the attachment member such as screw
Due to motherboard, therefore there is time saving, labour-saving convenience effect.
The utility model is described in detail below in conjunction with the drawings and specific embodiments, but not as to the utility model
Restriction.
Detailed description of the invention
Fig. 1 is the stereogram exploded view of the utility model wind-lead-cover structure and motherboard.
Fig. 2 is the elevational schematic view of the utility model wind-lead-cover structure.
Fig. 3 is three-dimensional combination figure of the utility model according to Fig. 1.
Fig. 4 is three-dimensional combination figure of the utility model according to Fig. 1 after rotating 180 degree.
Fig. 5 is the partial enlarged view that the utility model wind-lead-cover structure is fixed on motherboard by the first buckle arm.
Fig. 6 is the partial enlarged view that the utility model wind-lead-cover structure is fixed on motherboard by the second buckle arm.
Fig. 7 is wind-guiding status diagram of the utility model according to Fig. 3 when overlooking.
Wherein, appended drawing reference:
100 ... wind-lead-cover structures
1 ... fan housing ontology
11 ... top plates
11a, 11b ... block body
111,113 ... sides
12 ... side plates
121 ... bottom edges
14 ... bending segments
15 ... air inlet ports
16 ... outlet ports
2 ... buckle arm components
21 ... first buckle arms
211 ... first notches
22 ... second buckle arms
221 ... second notches
700 ... expansion boards
800 ... motherboards
8 ... channel connectors
81 ... fasteners
811 ... lugs
9 ... main radiators
91 ... fixing seats
D1 ... first distance
D2 ... second distance
The main air duct M ...
The secondary air duct S ...
R ... channel connector group
Specific embodiment
Detailed description and technology contents in relation to the utility model, cooperation schema is described as follows, however institute's accompanying drawings only mention
For reference with illustrate to use, it is non-to limit the utility model.
Such as Fig. 1 simultaneously arranges in pairs or groups shown in Fig. 7, and the utility model provides a kind of wind-lead-cover structure, is mainly used in such as server
Or the motherboard 800 in the electronic devices such as work station (workstation), to guide by wind-lead-cover structure 100 from wind
The wind that fan (not shown) is exported.
Motherboard 800 is electrically configured with many electronic components, such as channel connector 8, main radiator 9, splicing dissipates in main
Arithmetic element (computing device, figure in do not show) under hot device 9 and other electron component in addition to these.
Wherein, channel connector 8 in this present embodiment with DIMM socket (dual in-line memory module,
Dual Inline Memory Module) for be illustrated.Channel connector 8 has existing component below: a pair of of fastener 81, and each
Fastener 81 has a lug 811 (see Fig. 5).Channel connector 8 expands to grafting expansion board 700 (such as DIMM memory)
Card 700 will be buckled by lug 811 after grafting and be positioned.Main radiator 9 has existing component below: fixing seat 91 is (see Fig. 1
And Fig. 7), main radiator 9 is fixed on motherboard 800 by fixing seat 91, then plastic in fixing seat 91 to have such as heat radiating fin
The radiating piece of piece etc..
The utility model does not limit the quantity and its configuration mode of channel connector 8 and main radiator 9, such as can be near
Few two main radiators 9 are set between most channel connectors 8, in this present embodiment then with existing quantity as shown in Figure 1 and
Be illustrated for existing configuration mode: be spaced each other two adjacent main radiators 9 positioned at two channel connector group R it
Between, each channel connector group R includes multiple channel connectors row (non-marked element symbol), and each channel connector row includes
Two adjacent channel connectors 8 are spaced each other along the length direction of channel connector 8, that is: have each other in same row
It is spaced two adjacent channel connectors 8.
As shown in Figures 1 to 4, wind-lead-cover structure 100 includes: an at least fan housing ontology 1 and an at least buckle arm component 2,
Namely the quantity of fan housing ontology 1 and buckle arm component 2 all can be more than one (including one), in this present embodiment then with two
It is illustrated for fan housing ontology 1 and two buckle arm components 2, and each buckle arm component 2 is connected to each fan housing ontology 1.
The corresponding aforementioned each channel connector group R the cover of each fan housing ontology 1, makes each fan housing ontology 1 all the covers have multiple slots
Formula connector row, each channel connector row includes two channel connectors 8.
The utility model does not limit the structure of fan housing ontology 1, in this present embodiment then to have a top plate 11 and two sides
It is illustrated for plate 12, and two side plates 12 are bent from the dual side-edge 111 relative to each other of top plate 11 (long side as shown in Figure 1)
And drawdown forms.Wherein, a secondary air duct S is formed in the fan housing ontology 1 surrounded by top plate 11 and two side plates 12, it is aforementioned each
Partially or fully channel connector 8 in channel connector group R is located in the secondary air duct S of each fan housing ontology 1, and secondary
S connection in air duct is respectively formed between an air inlet port 15 at 1 both ends of fan housing ontology and an outlet port 16.Furthermore two fan housings
Ontology 1 is spaced each other side by side on motherboard 800, to be spaced each other shape between adjacent each side plate 12 in two fan housing ontologies 1
At a main air duct M, aforementioned two main radiator 9 is all configured in main air duct M.
One first buckle arm 21 and one second buckle arm 22 of the buckle arm component 2 comprising being both connected to fan housing ontology 1, and the first buckle arm
21 and second buckle arm 22 respectively correspond channel connector 8 fastener 81 and main radiator 9 fixing seat 91 buckle and fix.
The utility model does not limit the structure of the first buckle arm 21 and the second buckle arm 22, in this present embodiment then with following knots
It is illustrated for structure.First buckle arm 21 and the second buckle arm 22 are separately connected two side plates 12 of fan housing ontology 1, are then preferably
The first buckle arm 21 and the second buckle arm 22 is allowed integrally to extend from the bottom edge 121 (see Fig. 1) of two side plates 12 respectively and reflexed molding upward,
Namely from bottom edge 121 towards 11 direction reflexed of top plate.The utility model does not limit the first buckle arm 21 and the second button after reflexed yet
Arm 22 is by outside in reflexed to fan housing ontology 1 or by reflexed to fan housing ontology 1, in this present embodiment then with reflexed to fan housing sheet
It is illustrated for body 1 is outer, therefore is conducive to user and stirs buckle arm component 2 from outside, and then there is wind-lead-cover structure 100 and be easy to
The effect that group is unloaded.
As shown in Figure 5 and Figure 6, two opposite sides of the first buckle arm 21 are respectively provided with one first notch 211, and the first buckle arm 21
Between each fastener 81 of two channel connectors 8 of same row, 2 first notches 211 is made to respectively correspond the lug of each fastener 81
811 buckle and fix, that is, lug 811 is allowed to be embedded in the first notch 211.Two opposite sides of the second buckle arm 22 are respectively provided with one
Second notch 221, and the second buckle arm 22 is located between each fixing seat 91 of adjacent two main radiator 9, divides 2 second notches 221
The side buckle of each fixing seat 91 is not corresponded to and is fixed, that is, the side of fixing seat 91 is allowed to be embedded in the second notch 221.It borrows
This can have when wind-lead-cover structure 100 to be fixed on motherboard 800 and be not necessary to additionally use the affixed member such as screw
Time saving, the labour-saving convenience effect of part;Moreover, because wind-lead-cover structure 100 is existing on motherboard 800 by being snapped in
Component (referring to: fastener 81 and fixing seat 91) and fix, therefore also have the effect of being not required to completely changing 800 structure of motherboard.
When wind-lead-cover structure 100 to be removed, as long as user stirs the first buckle arm 21 and the second buckle arm 22 respectively towards two
Side plate 12 is close, can release buckle easily and remove wind-lead-cover structure 100.
As shown in fig. 7, when the first buckle arm 21 and the second buckle arm 22 respectively correspond the lug 811 and fixing seat 91 of fastener 81
Side buckle, two fan housing ontologies 1 can be fixed on to the predetermined position on motherboard 800;Then, when fan (not shown)
When 15 position of the air inlet port configuration of corresponding wind-lead-cover structure 100, the main air quantity from fan will be via main air duct M's
Guiding, so that main pyrotoxin: heat caused by arithmetic element carries out heat exchange with main air quantity via main radiator 9;Extremely
In fan remaining air quantity then via the guiding of secondary air duct S so that other pyrotoxins other than main pyrotoxin: expand
Heat caused by electronic component on card 700 and secondary air quantity carry out heat exchange.
It should be noted that as shown in Fig. 2, the air inlet port 15 of each fan housing ontology 1 especially has relative to secondary wind
The design that road S is staggered makes air inlet port 15 and secondary air duct S not on the same line, to further force aforementioned remaining wind
Amount can not be successfully into secondary air duct S, in contrast just can increase aforementioned main air quantity.The utility model does not limit air intake
The staggered arrangement of mouth 15, such as can be staggered via bending, it is then preferably to have additional a bending segment 14 in fan housing ontology 1,
To allow air inlet port 15 to be staggered relative to secondary air duct S by bending segment 14.
As shown in fig. 7, for the radiating efficiency in main air duct M promotion for main radiator 9, between two outlet ports 16
Second distance D2 will be designed to less than the first distance D1 between two air inlet ports 15, to force the stream in main air duct M
Speed, which generates, to be changed and improving heat radiation efficiency.The utility model does not limit second distance D2 how to be allowed to be less than first distance D1,
It is then described as follows for adding block body 11a, 11b in this present embodiment.
As shown in Figure 1, Figure 2 and Figure 7, two fan housing ontologies 1 are respectively provided with the block body 11a that corresponding each outlet port 16 configures
With a block body 11b, block body 11a and block body 11b are protruded from main air duct M so that main air duct M two block body 11a, 11b it
Between second distance D2 less than the first distance D1 between two air inlet ports 15.
Specifically, the top plate 11 of fan housing ontology 1 also have corresponding to outlet port 16 a side 113 (as shown in Figure 1
Short side), top plate 11 is extended with block body 11a, the 11b for being downwardly inclined and blocking to corresponding outlet port 16 from side 113, with energy
It pushes guiding and brushes (the electrically arranging of the aforementioned other electron component on motherboard 800 downwards from the wind that outlet port 16 exports
The left part of motherboard 800 in Fig. 7, and these other electron components are omitted in Fig. 7 and are not drawn).Specifically, to expansion
The electronic component filled on card 700 carried out the aforementioned remaining air quantity of heat exchange, will be when exporting from outlet port 16, by block body
The pushing of 11a, 11b guide and are recycled and carry out heat exchange to other electron component, so reach and make full use of residue
The effect of air quantity.In addition, the quantity of block body 11b also for two and can be respectively provided with different tilt angles, to guide remaining wind
Amount brushes the other electron component positioned at different distances respectively.
Block body 11a, 11b can also integrally protrude out a segment length further along the length direction of side 113, so that block body
11a, 11b are protruded into main air duct M by this section of protruding length, so can allow between aforementioned two outlet port 16 second
Distance D2 is reduced to less than first distance D1.
It should be noted that fan housing ontology 1 and buckle arm component 2 are all mylar film material and molding integral with one another is made, because
This has the effect of light-weight and can insulate with electronic component.
In the other embodiments that schema is not painted, aforementioned first buckle arm 21 and the second buckle arm 22 can also be by reflexeds to fan housing
In ontology 1, and reflexed in fan housing ontology 1 the first buckle arm 21 and the second buckle arm 22 remain to corresponding be located in fan housing ontology 1
Fastener 81 buckle and fix.Furthermore the quantity of fan housing ontology 1 and buckle arm component 2 is not limited to two, can also be all one,
As long as allowing fan housing ontology 1 is adjacent with any wall body interval (namely to change the wherein channel connector group R in Fig. 1 with described
Wall body replace), can interval between them form aforementioned main air duct M;Moreover, even if only one fan housing ontology 1
With a buckle arm component 2, wind-lead-cover structure 100 still can respectively correspond fastener 81 by the first buckle arm 21 and the second buckle arm 22
It buckles and fixes with fixing seat 91.
As described above, only preferable possible embodiments of the utility model, therefore, it does not limit the utility model
The scope of the patents.Certainly, the utility model can also have other various embodiments, without departing substantially from the spirit of the present invention and its essence
In the case where, those skilled in the art can make various corresponding changes and modifications, but these according to the utility model
Corresponding changes and modifications all should belong to the protection scope of the utility model claims.
Claims (11)
1. a kind of wind-lead-cover structure, is fixed on motherboard, motherboard has channel connector and is set to the master of arithmetic element
Radiator, which is characterized in that the wind-lead-cover structure includes:
An at least fan housing ontology, the corresponding channel connector the cover;And
An at least buckle arm component, the buckle arm component include one first buckle arm and one second buckle arm for being both connected to the fan housing ontology,
First buckle arm and second buckle arm respectively correspond the fastener on the channel connector and the fixation in the main radiator
Seat is buckled and is fixed.
2. wind-lead-cover structure according to claim 1, which is characterized in that the fan housing ontology and the buckle arm component are all
Two settings, respectively the buckle arm component is connected to the respectively fan housing ontology, which is spaced each other side by side in the master
On machine plate, a main air duct is formed between the two fan housings ontology, is configured with the main radiator in the main air duct.
3. wind-lead-cover structure according to claim 2, which is characterized in that each fan housing ontology all has an air intake
One block body of mouth, an outlet port and corresponding outlet port configuration, respectively the block body protrudes from the main air duct, the main wind
The distance between two block body in road is less than the distance between two air inlet port.
4. wind-lead-cover structure according to claim 1 or 2, which is characterized in that a secondary air duct is formed in the fan housing ontology,
The fan housing ontology has Two-port netwerk, which is connected between the Two-port netwerk.
5. wind-lead-cover structure according to claim 4, which is characterized in that the Two-port netwerk of the fan housing ontology includes an air inlet
Port, the air inlet port are staggered relative to the secondary air duct via bending, and the air inlet port is with the secondary air duct not same
On straight line.
6. wind-lead-cover structure according to claim 4, which is characterized in that the fan housing ontology has a top plate, the fan housing sheet
The Two-port netwerk of body include an outlet port, the top plate from correspond to the outlet port a side be extended be downwardly inclined to
A few block body, an at least block body push guiding and brush the motherboard downwards from the wind that the outlet port exports.
7. wind-lead-cover structure according to claim 1, which is characterized in that an at least fan housing ontology and an at least buckle arm
Component is all mylar film material, and an at least fan housing ontology and an at least buckle arm component molding integral with one another.
8. wind-lead-cover structure according to claim 1, which is characterized in that first buckle arm is located at two slots of same row
Between each fastener of formula connector and there are 2 first notches, which respectively corresponds the lug buckle of each fastener
And it fixes.
9. wind-lead-cover structure according to claim 1, which is characterized in that second buckle arm is located at the adjacent two main heat dissipation
Between each fixing seat of device and have 2 second notches, 2 second notch respectively correspond each fixing seat side buckle and
It is fixed.
10. wind-lead-cover structure according to claim 1, which is characterized in that the fan housing ontology have a top plate and from this
Two side plates of top plate dual side-edge bending relative to each other and drawdown, first buckle arm and second buckle arm are connected to the fan housing
Two side plate of ontology.
11. wind-lead-cover structure according to claim 10, which is characterized in that first buckle arm and second buckle arm respectively from
The bottom edge of two side plate integrally extends and reflexed forms upward.
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CN201920505375.1U CN209640802U (en) | 2019-04-15 | 2019-04-15 | Wind-lead-cover structure |
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CN201920505375.1U CN209640802U (en) | 2019-04-15 | 2019-04-15 | Wind-lead-cover structure |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111328227A (en) * | 2020-02-27 | 2020-06-23 | 苏州浪潮智能科技有限公司 | Power supply wind scooper structure capable of realizing optional matching |
-
2019
- 2019-04-15 CN CN201920505375.1U patent/CN209640802U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111328227A (en) * | 2020-02-27 | 2020-06-23 | 苏州浪潮智能科技有限公司 | Power supply wind scooper structure capable of realizing optional matching |
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