CN209627796U - A kind of antistatic circuit plate - Google Patents
A kind of antistatic circuit plate Download PDFInfo
- Publication number
- CN209627796U CN209627796U CN201821693583.0U CN201821693583U CN209627796U CN 209627796 U CN209627796 U CN 209627796U CN 201821693583 U CN201821693583 U CN 201821693583U CN 209627796 U CN209627796 U CN 209627796U
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- China
- Prior art keywords
- layer
- antistatic
- slot
- circuit board
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Elimination Of Static Electricity (AREA)
Abstract
The utility model provides a kind of antistatic circuit plate, including circuit board body, circuit board body includes the insulating layer set gradually, antistatic layer A, element layer, line layer, basal layer, it is provided with element on element layer and sets slot, on element layer and it is located at element and sets to be provided with below slot and several set the pin via hole that slot is connected to element, pin via hole is electrically connected with line layer, element, which is set, is provided with electronic component on slot, electronic component includes and the matched pin of pin via hole, pin is plugged in pin via hole and is electrically connected with pin via hole, antistatic layer A is coated on above electronic component, circuit board body outer is coated with and the matched silica gel frame of circuit board body.Insulating layer has obstructed the contact electrostatic between device, and antistatic layer A, which covers electronic component, is effective against electrostatic to the conduction of electronic component side.Its structure is simple, and production cost is low, can simply and effectively promote the antistatic effect of circuit board.
Description
Technical field
The utility model relates to circuit board technology fields, specifically disclose a kind of antistatic circuit plate.
Background technique
Circuit board refers to connecting electronic component to constitute an electronic device for having certain function.Electrostatic is a kind of objective
The mode of existing natural phenomena, generation is varied, such as contact, friction, appliance chamber induction.The characteristics of electrostatic is for a long time
Accumulation, high voltage, low battery, low current and action time short feature.Static discharge is destroyed and is damaged caused by electronic product
Wound has abrupt impairment and two kinds of latent injury, therefore electrostatic often results in electronic product fluctuation of service, or even causes electricity
The damage of sub- product.Structure is complicated for existing antistatic circuit plate, high production cost, it is difficult to promote.
Utility model content
Based on this, it is necessary to it is directed to prior art problem, a kind of antistatic circuit plate is provided, unique structure is set, it can
Simply and effectively promote the antistatic effect of circuit board.
To solve prior art problem, the utility model discloses a kind of antistatic circuit plate, including circuit board body, circuit
Plate ontology includes the insulating layer set gradually from top to bottom, antistatic layer A, element layer, line layer, basal layer, is set on element layer
Be equipped with element and set slot, on element layer and be located at element set be provided with below slot it is several the pin via hole that slot is connected to is set with element, draw
Foot via hole is electrically connected with line layer, and element is set and is provided with electronic component on slot, and electronic component includes and pin via hole is matched draws
Foot, pin are plugged in pin via hole and are electrically connected with pin via hole, and antistatic layer A is coated on above electronic component, circuit board
Ontology outer is coated with and the matched silica gel frame of circuit board body.
Preferably, electronic component further includes package casing, and element sets slot outer wall and package casing interval is arranged, package casing
It is set to element to set in slot, element is set and is perfused with anti-static coatings between slot outer wall and package casing.
Preferably, basal layer bottom is provided with antistatic layer B.
Preferably, circuit board body side is provided through copper guide post, and copper guide post both ends are provided with to be electrically connected with copper guide post
The connector connect.
Preferably, antistatic layer A and antistatic layer B is epoxy resin layer.
The utility model has the following beneficial effects: the utility model discloses a kind of antistatic circuit plate, unique assembly is set
Structure, by insulating layer, antistatic layer A, element layer, line layer, basal layer built-up circuit plate ontology, insulating layer has been obstructed between device
Contact electrostatic, antistatic layer A electronic component is covered is effective against electrostatic to electronic component side conduct, by electronic component
Circuit board whole height can be reduced by being placed in element and setting in slot, reduced electrostatic contact between device, be coated on circuit board body outer
Silica gel frame can prevent electrostatic contact and the conduction at circuit board body edge.Its structure is simple, and production cost is low, can be simple, effective
The antistatic effect of ground promotion circuit board.Element is set by anti-static coatings and is filled between slot and package casing, is avoided
Electrostatic is set gap between slot and package casing by element and is conducted on pin, and electronic component electrostatic resistivity is promoted.In base
Antistatic layer B is arranged in bottom layer bottom, prevents the electrostatic of basal layer bottom from conducting.Connector is connected with ground wire, copper guide post can be effective
Ground is removed by the static guiding in circuit board body.Antistatic layer A and antistatic layer B are disposed as epoxy resin layer, asphalt mixtures modified by epoxy resin
Rouge has excellent antistatic effect, and heating conduction is good, can promote circuit board antistatic effect and heat dissipation performance.
Detailed description of the invention
Fig. 1 is the cross section structure schematic diagram of the utility model circuit board.
Appended drawing reference are as follows: insulating layer 1, antistatic layer A2, element layer 3, element set slot 30, pin via hole 31, line layer 4,
Basal layer 5, electronic component 6, pin 60, package casing 61, silica gel frame 7, antistatic layer B8, copper guide post 9, connector 90.
Specific embodiment
For the feature, technological means and specific purposes achieved, function that can further appreciate that the utility model, below
The utility model is described in further detail in conjunction with attached drawing and specific embodiment.
With reference to Fig. 1.
The utility model embodiment discloses a kind of antistatic circuit plate, including circuit board body, circuit board body include from
On the insulating layer 1, antistatic layer A2, element layer 3, line layer 4, the basal layer 5 that set gradually down, be provided with member on element layer 3
Part sets slot 30, on element layer 3 and be located at element set be provided with below slot 30 it is several the pin via hole 31 that slot 30 is connected to is set with element,
Pin via hole 31 is electrically connected with line layer 4, and element is set and is provided with electronic component 6 on slot 30, and electronic component 6 includes and pin via hole
31 matched pins 60, pin 60 are plugged in pin via hole 31 and are electrically connected with pin via hole 31, and antistatic layer A2 is coated on
6 top of electronic component, circuit board body outer is coated with and the matched silica gel frame 7 of circuit board body.
Concrete principle is, by insulating layer 1, antistatic layer A2, element layer 3, line layer 4,5 built-up circuit plate sheet of basal layer
Body, insulating layer 1 play insulating effect, have obstructed the contact electrostatic between device, and antistatic layer A2 covers electronic component 6, can have
Effect is resisted electrostatic and is conducted to 6 side of electronic component.Circuit board whole height can be reduced by electronic component 6 is placed in element setting in slot 30,
Electrostatic contact between reduction device, the silica gel frame 7 for being coated on circuit board body outer can prevent the electrostatic at circuit board body edge from connecing
Touching and conduction.Its structure is simple, and production cost is low, can simply and effectively promote the antistatic effect of circuit board.
Based on the above embodiment, electronic component 6 further includes package casing 61, and element is set between 30 outer wall of slot and package casing 61
Every setting, package casing 61 is set to element and sets in slot 30, element set be perfused between 30 outer wall of slot and package casing 61 prevent it is quiet
Electrocoating paint.Element is set by anti-static coatings and is filled between slot 30 and package casing 61, electrostatic is avoided to set by element
Gap between slot 30 and package casing 61 is conducted on pin 60, promotes 6 electrostatic resistivity of electronic component.
Based on the above embodiment, 5 bottom of basal layer is provided with antistatic layer B8.In 5 bottom of basal layer, antistatic layer is set
B8 prevents the electrostatic of 5 bottom of basal layer from conducting.
Based on the above embodiment, circuit board body side is provided through copper guide post 9,9 both ends of copper guide post be provided with
The connector 90 that copper guide post 9 is electrically connected.Connector 90 is connected with ground wire, copper guide post 9 can be effectively by the electrostatic in circuit board body
It leads and removes.
Based on the above embodiment, antistatic layer A2 and antistatic layer B8 is epoxy resin layer, and epoxy resin has excellent
Antistatic effect, and heating conduction is good, can promote circuit board antistatic effect and heat dissipation performance.
Above embodiments only express a kind of embodiment of the utility model, and the description thereof is more specific and detailed, but not
Therefore it can be interpreted as that a limitation on the scope of the patent of the present invention.It should be pointed out that for the ordinary skill people of this field
For member, without departing from the concept of the premise utility, various modifications and improvements can be made, these belong to this reality
With novel protection scope.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (5)
1. a kind of antistatic circuit plate, including circuit board body, which is characterized in that the circuit board body include from top to bottom according to
Insulating layer (1), antistatic layer A (2), element layer (3), line layer (4), the basal layer (5) of secondary setting, on the element layer (3)
Element is provided with to set slot (30), on the element layer (3) and be located at the element set be provided with below slot (30) it is several with it is described
Element sets the pin via hole (31) of slot (30) connection, and the pin via hole (31) is electrically connected with the line layer (4), the element
It sets and is provided with electronic component (6) on slot (30), the electronic component (6) includes and the matched pin of the pin via hole (31)
(60), the pin (60) is plugged in the pin via hole (31) and is electrically connected with the pin via hole (31), it is described resist it is quiet
Electric layer A (2) is coated on above the electronic component (6), and the circuit board body outer is coated with and the circuit board body
The silica gel frame (7) matched.
2. a kind of antistatic circuit plate according to claim 1, which is characterized in that the electronic component (6) further includes envelope
Casing (61), the element sets slot (30) outer wall and the package casing (61) interval is arranged, and the package casing (61) sets
It is placed in the element to set in slot (30), the element is set and is perfused with antistatic between slot (30) outer wall and the package casing (61)
Coating.
3. a kind of antistatic circuit plate according to claim 1, which is characterized in that basal layer (5) bottom is provided with
Antistatic layer B (8).
4. a kind of antistatic circuit plate according to claim 1, which is characterized in that the circuit board body side, which is run through, to be set
It is equipped with copper guide post (9), copper guide post (9) both ends are provided with the connector (90) being electrically connected with the copper guide post (9).
5. a kind of antistatic circuit plate according to claim 1, which is characterized in that the antistatic layer A (2) and described anti-
Electrostatic layer B (8) is epoxy resin layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821693583.0U CN209627796U (en) | 2018-10-18 | 2018-10-18 | A kind of antistatic circuit plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821693583.0U CN209627796U (en) | 2018-10-18 | 2018-10-18 | A kind of antistatic circuit plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209627796U true CN209627796U (en) | 2019-11-12 |
Family
ID=68441137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821693583.0U Expired - Fee Related CN209627796U (en) | 2018-10-18 | 2018-10-18 | A kind of antistatic circuit plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209627796U (en) |
-
2018
- 2018-10-18 CN CN201821693583.0U patent/CN209627796U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191112 Termination date: 20211018 |