CN209626049U - A kind of high current volumetric ratio water-cooling type capacitance module - Google Patents
A kind of high current volumetric ratio water-cooling type capacitance module Download PDFInfo
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- CN209626049U CN209626049U CN201920395902.8U CN201920395902U CN209626049U CN 209626049 U CN209626049 U CN 209626049U CN 201920395902 U CN201920395902 U CN 201920395902U CN 209626049 U CN209626049 U CN 209626049U
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- water
- cooling
- heat sink
- high current
- volumetric ratio
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Abstract
The utility model belongs to thin film capacitor technical field, and in particular to a kind of high current volumetric ratio water-cooling type capacitance module.It includes capacitor ontology, and capacitor ontology periphery is provided with heat sink, and radiator is equipped in the heat sink, and the side middle and lower part of the capacitor ontology is provided with temperature sensor.In identical voltage and capacitance grade, 30%~40% or more current carrying capability can effectively be promoted using the two-sided water-cooling project of the utility model, volume of current ratio can be promoted from 0.25A/ μ F to 0.35A/ μ F;The radiator of the utility model is made of spaced snakelike water cooling transverse tube and water cooling vertical tube, extend residence time of the water flow on heat sink in a limited space, greatly improves heat dissipation effect, and structure is simple, production cost is few, convenient for being widely used to promote.
Description
Technical field
The utility model belongs to thin film capacitor technical field, and in particular to a kind of high current volumetric ratio water-cooling type capacitor mould
Block.
Background technique
Metallic film capacitor is one of electronic equipment primary element, be mainly used in blocking, bypass, coupling, filtering,
The fields such as energy conversion, resonant tank and control circuit.Since the development trend that new energy electricity drives electric-control system power device is
Using the IGBT of SiC, junction temperature can rise 50 DEG C or so compared to the power device of silicon substrate, due to improving operating voltage, use
Support Capacitor capacity can decline instead, but capacitor bear electric current will not decline too much, needed for thin-film capacitor
It greatly improves volume of current Bizet and is able to satisfy requirement.
The capacitor using PP film of mainstream 169 DEG C of fusing point or so, can not be resistant to due to its intrinsic material characteristic at present
It is promoted in temperature, corresponding measure can only be considered on radiating mode.Fuse is often by multiple in DC support capacitor
Fuse composes in parallel, and since PP material is anisotropy, interlayer thermal coefficient often only has 0.1W/MK, leads to fuse and fuse
Between heat transfer efficiency it is very low.At present the cooling method of mainstream be using single side water cooling, but because each main engine plants use substantially calmly
Contour structures processed, so the heat that frequently can lead to top can not be transmitted quickly on the higher capacitance structure of dimensional height
To bottom surface, cause the temperature difference of capacitive head bottom larger, the service life that hot localised points may also lead to capacitor greatly shortens.
Authorization Notice No. are as follows: the utility model of 202172018 U of CN, the radiator structure of thin film capacitor, the utility model
On the basis of guaranteeing the full size of thin film capacitor, internal busbar is extended, make it through insulating paper contacted with coldplate it is scattered
Heat completely solves the heat dissipation problem of thin film capacitor, and then extend to considerably reduce the thermal resistance of thin film capacitor
Its service life.However its structure is complex, the part used is more, higher operating costs, is unfavorable for being widely used to promote.
Utility model content
The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide a kind of high current volumetric ratio
Water-cooling type capacitance module.
The technical solution that the utility model solves above-mentioned technical problem is as follows: a kind of high current volumetric ratio water-cooling type capacitor mould
Block, including capacitor ontology, capacitor ontology periphery are provided with heat sink, and radiator is equipped in the heat sink, described
The side middle and lower part of capacitor ontology is provided with temperature sensor.
Further, the radiator is made of the water cooling transverse tube and water cooling vertical tube being connected, the water cooling transverse tube and
Water cooling vertical tube is alternatively arranged, and one end close to the water cooling transverse tube of the heat sink left-hand end is provided with water filling port.
Further, the water cooling transverse tube is snakelike water cooling transverse tube.
Further, the water filling port of the heat sink above the capacitor ontology is communicated with water supply device.
Further, the water supply device includes water tank, and the side of the water tank is provided with water inlet, and the other side is provided with
Water outlet, the water inlet are equipped with water pump, the water filling of the water outlet and the heat sink being located above the capacitor ontology
Mouth is connected.
The beneficial effects of the utility model are:
1, it in identical voltage and capacitance grade, can effectively be mentioned using the two-sided water-cooling project of the utility model
30%~40% or more current carrying capability is risen, volume of current ratio can be promoted from 0.25A/ μ F to 0.35A/ μ F;
2, the radiator of the utility model is made of spaced snakelike water cooling transverse tube and water cooling vertical tube, limited
Extend residence time of the water flow on heat sink in space, greatly improves heat dissipation effect, and structure is simple, production cost
It is few, convenient for being widely used to promote.
Detailed description of the invention
It, below will be right in order to illustrate more clearly of specific embodiment of the present invention or technical solution in the prior art
Specific embodiment or attached drawing needed to be used in the description of the prior art are briefly described, it should be apparent that, it is described below
In attached drawing be that some embodiments of the utility model are not paying creativeness for those of ordinary skill in the art
Under the premise of labour, it is also possible to obtain other drawings based on these drawings.
Fig. 1 shows for a kind of structure of high current volumetric ratio water-cooling type capacitance module described in the utility model specific embodiment
It is intended to;
Fig. 2 is the structural schematic diagram of heat sink in Fig. 1;
Fig. 3 is the heat dissipation emulation experiment figure of traditional approach;
Fig. 4 is the heat dissipation emulation experiment figure of single side water cooling;
Fig. 5 is the heat dissipation emulation experiment figure of the two-sided water cooling of the utility model.
Appended drawing reference:
1- capacitor ontology;2- heat sink;3- radiator;31- water cooling transverse tube;32- water filling port;33- water cooling vertical tube;4- is supplied
Water installations;41- water tank;42- water pump;43- water inlet;44- water outlet;5- temperature sensor.
Specific embodiment
It is described in detail below in conjunction with embodiment of the attached drawing to technical solutions of the utility model.Following embodiment is only
For clearly illustrating the technical solution of the utility model, therefore it is only used as example, and it is originally practical to cannot be used as a limitation limitation
Novel protection scope.
It should be noted that unless otherwise indicated, technical term or scientific term used in this application should be this reality
The ordinary meaning understood with novel one of ordinary skill in the art.
In the description of the present application, it is to be understood that term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise ", " axial direction ", " radial direction ", " circumferential direction " be orientation based on the figure or
Positional relationship is merely for convenience of describing the present invention and simplifying the description, rather than the device or member of indication or suggestion meaning
Part must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as limiting the present invention.
In this application unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc.
Term shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral;It can be mechanical connect
It connects, is also possible to be electrically connected;It can be directly connected, can also can be in two elements indirectly connected through an intermediary
The interaction relationship of the connection in portion or two elements.It for the ordinary skill in the art, can be according to specific feelings
Condition understands the concrete meaning of above-mentioned term in the present invention.
Embodiment
As shown in Figs. 1-2, a kind of high current volumetric ratio water-cooling type capacitance module provided by the utility model, including capacitor
Ontology 1,1 periphery of capacitor ontology are provided with heat sink 2, and radiator 3, the capacitor sheet are equipped in the heat sink 2
The side middle and lower part of body 1 is provided with temperature sensor 5, and temperature sensor 5 is sequentially electrically connected with external processor and display screen,
The temperature for the capacitor ontology 1 that display screen real-time display temperature sensor monitors, when the temperature of capacitor ontology 1 is more than in processor
When the threshold value of portion's setting, radiator 3 is started to work;When lower than set threshold value, radiator 3 does not need work, so
Reduce energy consumption, energy conservation and environmental protection.
Further, the radiator 3 is made of the water cooling transverse tube 31 and water cooling vertical tube 33 being connected, and the water cooling is horizontal
Pipe 31 and water cooling vertical tube 32 are alternatively arranged, and one end close to the water cooling transverse tube of 2 left-hand end of heat sink is provided with water filling port 32,
Water filling port positioned at the heat sink on 1 surface of capacitor ontology is water filling import, and water filling inlet communication has water supply device 4, is located at
The water filling port of the heat sink of 1 bottom surface of capacitor ontology is filling outlet;Close to one end of the water cooling transverse tube of 1 right-hand end of heat sink
Water cooling vertical tube is connected, other end connection is located at the radiator in the heat sink of 1 bottom surface of capacitor ontology, is located at capacitor ontology
It is respectively provided with a connecting pipe (being not marked in figure) in the heat sink of 1 left and right ends, is located at 1 surface of capacitor ontology for connecting
Radiator in heat sink and the radiator in the heat sink of 1 bottom surface of capacitor ontology.
Further, the water cooling transverse tube 31 is snakelike water cooling transverse tube, in the space of limited heat sink 2, greatly
The time that water flow passes through radiator 3 is improved, heat dissipation effect is improved.
Further, the water supply device 4 includes water tank 41, and the side of the water tank 41 is provided with water inlet 43, another
Side is provided with water outlet 44, is equipped with water pump 42 at the water inlet 43, the water outlet 44 be located at 2 surface of heat sink
The water filling port of heat sink be connected.
As in Figure 3-5, when specifically used, it is upper that the heat sink that capacitor ontology periphery is arranged in, which mainly plays heat spreading function,
The water-cooling plate on lower two sides, the utility model constructs the radiator structure of two-sided water cooling, and carries out to the two sides of capacitor ontology
Water-cooled cooling.When emulation experiment, set environment temperature is 85 DEG C, Non-water-cooled heat dissipation, single side water cooling and this Shen of traditional approach
The heat dissipation result of two-sided water cooling please compares, as a result as shown in the table:
Finally, it should be noted that the above various embodiments is only to illustrate the technical solution of the utility model, rather than it is limited
System;Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should
Understand: it is still possible to modify the technical solutions described in the foregoing embodiments, or to some or all of
Technical characteristic is equivalently replaced;And these are modified or replaceed, it does not separate the essence of the corresponding technical solution, and this is practical new
The range of each embodiment technical solution of type.
Claims (5)
1. a kind of high current volumetric ratio water-cooling type capacitance module, it is characterised in that: including capacitor ontology, the capacitor ontology periphery
It is provided with heat sink, radiator is installed in the heat sink, the side middle and lower part of the capacitor ontology is provided with temperature biography
Sensor.
2. a kind of high current volumetric ratio water-cooling type capacitance module according to claim 1, it is characterised in that: the heat dissipation dress
It sets water cooling transverse tube and water cooling vertical tube by being connected to form, the water cooling transverse tube and water cooling vertical tube are alternatively arranged, and are dissipated close to described
One end of the water cooling transverse tube of hot plate left-hand end is provided with water filling port.
3. a kind of high current volumetric ratio water-cooling type capacitance module according to claim 2, it is characterised in that: the water cooling is horizontal
Pipe is snakelike water cooling transverse tube.
4. according to a kind of described in any item high current volumetric ratio water-cooling type capacitance modules of Claims 2 or 3, it is characterised in that:
The water filling port of heat sink above the capacitor ontology is communicated with water supply device.
5. a kind of high current volumetric ratio water-cooling type capacitance module according to claim 4, it is characterised in that: the water supply dress
It sets including water tank, the side of the water tank is provided with water inlet, and the other side is provided with water outlet, and the water inlet is equipped with water
Pump, the water outlet are connected with the water filling port for the heat sink being located above the capacitor ontology.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201920395902.8U CN209626049U (en) | 2019-03-26 | 2019-03-26 | A kind of high current volumetric ratio water-cooling type capacitance module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201920395902.8U CN209626049U (en) | 2019-03-26 | 2019-03-26 | A kind of high current volumetric ratio water-cooling type capacitance module |
Publications (1)
Publication Number | Publication Date |
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CN209626049U true CN209626049U (en) | 2019-11-12 |
Family
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CN201920395902.8U Active CN209626049U (en) | 2019-03-26 | 2019-03-26 | A kind of high current volumetric ratio water-cooling type capacitance module |
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CN (1) | CN209626049U (en) |
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2019
- 2019-03-26 CN CN201920395902.8U patent/CN209626049U/en active Active
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