CN209625178U - A kind of winding displacement concentration heat dissipation type touch screen - Google Patents
A kind of winding displacement concentration heat dissipation type touch screen Download PDFInfo
- Publication number
- CN209625178U CN209625178U CN201920628910.2U CN201920628910U CN209625178U CN 209625178 U CN209625178 U CN 209625178U CN 201920628910 U CN201920628910 U CN 201920628910U CN 209625178 U CN209625178 U CN 209625178U
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- China
- Prior art keywords
- winding displacement
- touch screen
- heat dissipation
- casing
- radiator portion
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Abstract
The utility model relates to a kind of winding displacements to concentrate heat dissipation type touch screen, it includes touch screen body, winding displacement and casing, the winding displacement includes binding part, concentrate radiator portion and coupling part, heat dissipation fixed plate is connected in the concentration radiator portion, the heat dissipation fixed plate includes interior connecting plate, exposed plate and buck plate, the heat dissipation fixed plate is integrally attached on the casing by the utility model, since several chip concentrated settings are in chip concentrated setting area, it is transmitted to outside the casing so the heat dissipation fixed plate can concentrate heat caused by chip, to reduce operating temperature, in addition, the winding displacement can be integrally attached in the casing by the utility model by the heat dissipation fixed plate, to reach fixed winding displacement, the case where avoiding winding displacement position mobile and being damaged.
Description
Technical field
The utility model relates to a kind of touch screen, the winding displacement for particularly relating to a kind of touch screen can concentrate the touch of heat dissipation
Screen.
Background technique
It is well known that being equipped with touch screen with the development of touch screen technology on many industrial products at present, utilizing touching
The typings of data can be facilitated by touching screen, and using more convenient intuitive, the winding displacement of touch screen is connected between touch screen and mainboard
The component of electric current, signal transmitting is carried out, but it is all non-fixed set in touch screen for general cable structure
, position is not fixed, and is easier the case where being broken, and in addition the winding displacement of touch screen does not all have radiator structure generally,
So work in the event of high temperatures will be greatly reduced the service life of integral product for a long time, and this is the master for traditional technology
Want disadvantage.
Utility model content
The technology employed by the present utility model is a kind of winding displacement concentrates heat dissipation type touch screen comprising touch screen body,
Winding displacement and casing, the winding displacement one end are bundled in the touch screen body side, which is fixedly connected on the casing, specific real
When applying, which includes cover board and ito film, which is bonded on the cover board bottom surface, the winding displacement and the ITO
Film electrical connection.
The winding displacement includes binding part, concentrates radiator portion and coupling part, wherein the concentration radiator portion is connected to
Between the binding part and the coupling part, which is bundled in the touch screen body side, the binding part it is another
Outer one end is connected with the concentration radiator portion, and the coupling part one end concentration radiator portion is connected, the coupling part
Other end is connected on the mainboard of touch screen, and the binding part, the concentration radiator portion and the coupling part are all flexible
Winding displacement.
The concentration radiator portion includes medial surface and lateral surface, which is disposed longitudinally in the casing,
The concentration radiator portion is vertical with the touch screen body, forms a chip concentrated setting area by the medial surface, sets in several chipsets
It sets in the chip concentrated setting area, heat dissipation fixed plate is connected on the lateral surface, if being offered in the concentration radiator portion
Dry perforation, each perforation connection are arranged between the medial surface and the lateral surface, are both provided in each perforation
Heating column, each heating column are correspondingly connected between the chip and the heat dissipation fixed plate, which can be
Metal heat-conducting column or silica gel heating column.
The heat dissipation fixed plate includes interior connecting plate, exposed plate and buck plate, corresponding with the buck plate to open in the casing
Equipped with mounting hole, which is arranged in the mounting hole, which is integrally attached on the casing, the assembly
Plate is connected between the interior connecting plate and the exposed plate, wherein the interior connecting plate is connected to the outside of the concentration radiator portion
On face, which is exposed to outside the casing, when specific implementation, is provided between the interior connecting plate and the lateral surface
Heat-conducting glue layer, when specific implementation, which is arranged on the side wall of the casing.
The utility model has the following beneficial effects: the utility model is when in use, the heat dissipation is consolidated by the mounting hole
Fixed board is integrally attached on the casing, since several chip concentrated settings are in the chip concentrated setting area, so the heat dissipation
Heat caused by chip can be concentrated and is transmitted to outside the casing by fixed plate, to reduce operating temperature, in addition, this is practical new
The winding displacement can be integrally attached in the casing by type by the heat dissipation fixed plate, to reach fixed winding displacement, avoid winding displacement position
The case where moving and being damaged.
Detailed description of the invention
Fig. 1 is the main view of the utility model.
Fig. 2 is the schematic diagram of the section structure of the utility model.
Specific embodiment
As shown in Fig. 1 to 2, a kind of winding displacement concentration heat dissipation type touch screen comprising touch screen body 10, winding displacement 20 and casing
30, which is bundled in 10 side of touch screen body, which is fixedly connected on the casing 30.
When specific implementation, which includes cover board and ito film, which is bonded in the cover board bottom
On face, which is electrically connected with the ito film.
The winding displacement 20 includes binding part 40, concentrates radiator portion 50 and coupling part 60, wherein the concentration radiating part
50 are divided to be connected between the binding part 40 and the coupling part 60, which is bundled in the touch screen body 10 1
Side, the other end of the binding part 40 are connected with the concentration radiator portion 50,60 one end of coupling part concentration heat dissipation
Part 50 is connected, and the other end of the coupling part 60 is connected on the mainboard of touch screen.
The binding part 40, the concentration radiator portion 50 and the coupling part 60 are all flexible winding displacement.
The concentration radiator portion 50 includes medial surface 51 and lateral surface 52, which is disposed longitudinally on this
In casing 30, the concentration radiator portion 50 is vertical with the touch screen body 10, forms a chip concentrated setting area by the medial surface 51,
Several 511 concentrated settings of chip are connected with heat dissipation fixed plate 70 in the chip concentrated setting area on the lateral surface 52.
Several perforation 53 are offered in the concentration radiator portion 50, each perforation 53 connection is arranged on the inside of this
Between face 51 and the lateral surface 52, it is both provided with heating column 54 in each perforation 53, each heating column 54 is corresponding
It is connected between the chip 511 and the heat dissipation fixed plate 70, which can lead for metal heat-conducting column or silica gel
Plume.
The heat dissipation fixed plate 70 includes interior connecting plate 71, exposed plate 72 and buck plate 73, corresponding with the buck plate 73
Mounting hole 31 is offered in the casing 30, which is arranged in the mounting hole 31, and the heat dissipation fixed plate 70 is whole
It is fixed on the casing 30, which is connected between the interior connecting plate 71 and the exposed plate 72, wherein the interior connecting plate
71 are connected on the lateral surface 52 of the concentration radiator portion 50, which is exposed to outside the casing 30.
When specific implementation, heat-conducting glue layer is provided between the interior connecting plate 71 and the lateral surface 52.
When specific implementation, which is arranged on the side wall 32 of the casing 30.
The heat dissipation fixed plate 70 is integrally attached to the casing when in use, by the mounting hole 31 by the utility model
On 30, since several 511 concentrated settings of chip are in the chip concentrated setting area, so the heat dissipation fixed plate 70 can be by core
The concentration of heat caused by piece is transmitted to outside the casing 30, to reduce operating temperature, in addition, the utility model passes through the heat dissipation
The winding displacement 20 can be integrally attached in the casing 30 by fixed plate 70, to reach fixed winding displacement, avoid winding displacement position mobile and
The case where being damaged.
Claims (5)
1. a kind of winding displacement concentrates heat dissipation type touch screen comprising touch screen body, winding displacement and casing, the winding displacement one end are bundled in this
Touch screen body side, the winding displacement are fixedly connected on the casing, it is characterised in that:
The winding displacement includes binding part, concentrates radiator portion and coupling part, wherein the concentration radiator portion is connected to this and ties up
Between fixed part and the coupling part, which is bundled in the touch screen body side, and other the one of the binding part
End is connected with the concentration radiator portion, and the coupling part one end concentration radiator portion is connected, and the coupling part is in addition
One end is connected on the mainboard of touch screen, and the binding part, the concentration radiator portion and the coupling part are all flexible winding displacement,
The concentration radiator portion includes medial surface and lateral surface, which is disposed longitudinally in the casing, the collection
Middle radiator portion is vertical with the touch screen body, forms a chip concentrated setting area by the medial surface, several chip concentrated settings exist
In the chip concentrated setting area, heat dissipation fixed plate is connected on the lateral surface,
Several perforation are offered in the concentration radiator portion, each perforation connection setting is on the outside of the medial surface and this
Between face, it is both provided with heating column in each perforation, each heating column is correspondingly connected in the chip and is somebody's turn to do
Between the fixed plate that radiates,
The heat dissipation fixed plate includes interior connecting plate, exposed plate and buck plate, corresponding with the buck plate to offer in the casing
Mounting hole, the buck plate are arranged in the mounting hole, which are integrally attached on the casing, which connects
It connecing between the interior connecting plate and the exposed plate, wherein the interior connecting plate is connected on the lateral surface of the concentration radiator portion,
The exposed plate is exposed to outside the casing.
2. a kind of winding displacement as described in claim 1 concentrates heat dissipation type touch screen, it is characterised in that: the interior connecting plate and the outside
Heat-conducting glue layer is provided between face.
3. a kind of winding displacement as described in claim 1 concentrates heat dissipation type touch screen, it is characterised in that: the mounting hole is arranged in the machine
On the side wall of shell.
4. a kind of winding displacement as described in claim 1 concentrates heat dissipation type touch screen, it is characterised in that: the heating column is metal heat-conducting
Column.
5. a kind of winding displacement as described in claim 1 concentrates heat dissipation type touch screen, it is characterised in that: the touch screen body includes cover board
And ito film, the ito film are bonded on the cover board bottom surface, which is electrically connected with the ito film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920628910.2U CN209625178U (en) | 2019-05-05 | 2019-05-05 | A kind of winding displacement concentration heat dissipation type touch screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920628910.2U CN209625178U (en) | 2019-05-05 | 2019-05-05 | A kind of winding displacement concentration heat dissipation type touch screen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209625178U true CN209625178U (en) | 2019-11-12 |
Family
ID=68459411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920628910.2U Active CN209625178U (en) | 2019-05-05 | 2019-05-05 | A kind of winding displacement concentration heat dissipation type touch screen |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209625178U (en) |
-
2019
- 2019-05-05 CN CN201920628910.2U patent/CN209625178U/en active Active
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