CN209625118U - A kind of embedded computer motherboard structure - Google Patents

A kind of embedded computer motherboard structure Download PDF

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Publication number
CN209625118U
CN209625118U CN201920369797.0U CN201920369797U CN209625118U CN 209625118 U CN209625118 U CN 209625118U CN 201920369797 U CN201920369797 U CN 201920369797U CN 209625118 U CN209625118 U CN 209625118U
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CN
China
Prior art keywords
heat
enclosing
conducting substrate
rotation
computer motherboard
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Expired - Fee Related
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CN201920369797.0U
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Chinese (zh)
Inventor
罗秀娟
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Heze University
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Heze University
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Priority to CN201920369797.0U priority Critical patent/CN209625118U/en
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Publication of CN209625118U publication Critical patent/CN209625118U/en
Expired - Fee Related legal-status Critical Current
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Abstract

The utility model discloses a kind of embedded computer motherboard structures, heat-conducting substrate including matching setting with cabinet lower end installing port, it is connected and fixed between the heat-conducting substrate and cabinet by clip assembly, the heat-conducting substrate upper end is also detachably equipped with the mainboard ontology for installing electric elements, it is additionally provided on the heat-conducting substrate for covering mainboard ontology and providing the cover structure of mainboard ontology heat dissipation effect, the utility model is improved for the shortcomings that existing apparatus, in actual use, the rotation of sliding tooth wheel is driven by driving motor, gear is driven to pass through the dynamic rotation enclosing rotation of driven tooth annulus, the blade for rotating enclosing upper port in this way can rotate, and then the hot-air of mainboard body surface is taken away, outside air can then pass through the first air inlet and the second air inlet, and then mainboard ontology is blowed to from all quarter, to make Mainboard ontology heat dissipation effect is obtained rapidly to improve.

Description

A kind of embedded computer motherboard structure
Technical field
The utility model relates to computer equipment technical field, specifically a kind of embedded computer motherboard structure.
Background technique
Integrated circuit is largely used in machine element, it is well known that cause the heat of high temperature to be not from outside computer, But computer-internal, or perhaps IC interior, most radiators pass through and the contact of heat generating components surface, absorb heat It measures, then transfers heat to by various methods at a distance, for example in the air in cabinet, then cabinet passes to these hot-airs Outside cabinet, the heat dissipation of computer is completed, existing computer radiator is mainly to be driven by fan, and fan is in long time running In be easy to bring dust into fan from wire netting, the operational efficiency that the accumulation of dust will lead to radiator declines, while also holding Easily influence the working efficiency of computer.
In view of the above-mentioned problems, a kind of mainboard structure of patent disclosure that existing patent announcement number is CN207123802U, this The cover of gear dust is arranged in design, on mainboard surface in kind mainboard structure, in order to guarantee the ventilatory effect of mainboard, in cover side Blowing structure is arranged in face, but the heat dissipation area that this single blowing method is related to is too small, and heat dissipation limitation is larger.
The shortcomings that for existing apparatus, there is presently provided a kind of better computer motherboard structure of heat dissipation effect.
Utility model content
The purpose of this utility model is to provide a kind of embedded computer motherboard structures, to solve in above-mentioned background technique The problem of proposition.
To achieve the above object, the utility model provides the following technical solutions:
A kind of embedded computer motherboard structure, the heat-conducting substrate including matching setting with cabinet lower end installing port, institute It states and is connected and fixed between heat-conducting substrate and cabinet by clip assembly, the heat-conducting substrate upper end is also detachably equipped with for installing The mainboard ontology of electric elements is additionally provided with for covering mainboard ontology and providing mainboard ontology heat dissipation effect on the heat-conducting substrate Cover structure.
As a further solution of the present invention: the cover structure includes the thermally conductive base that mainboard outer body is arranged in The fixation enclosing of plate upper surface, the fixed enclosing upper end are rotatably connected to rotation enclosing by runner assembly, and the rotation is enclosed Gear outside is equipped with driven ring gear, and the heat-conducting substrate upper end is equipped with driving motor, the output end of the driving motor be equipped with The driving gear that driven ring gear matches, the rotation enclosing upper port middle position are equipped with circular block, the circular block and rotation Turn to be equipped with several blades for being used to take away fixed enclosing inner air, the rotation enclosing outboard array point between enclosing inner wall It is furnished with several the first air inlets corresponding with the second air inlet.
As a further solution of the present invention: being designed with filter screen at first air inlet and the second air inlet.
As a further solution of the present invention: the runner assembly includes that setting is used to hold on the inside of fixed enclosing Rotate the first bracer of enclosing, the second ball that first bracer upper surface is equipped with ball grooves and is arranged in ball grooves, institute It states fixed enclosing upper end and is equipped with the limiting slot matched with the second bracer of rotation enclosing outside, second bracer upper end is equipped with rolling Pearl slot and the first ball being arranged in inside ball grooves, the fixed enclosing top side detachable are equipped with for resisting the first ball Cover board.
As a further solution of the present invention: the clip assembly includes the fixing card that heat-conducting substrate two sides are arranged in Block and the screw hole that screws that cabinet side is arranged in, described screw in screw hole cooperate equipped with fastening bolt, the fastening bolt inner end Portion's rotation is equipped with active fastening block, and the fastening bolt outer end is equipped with knob, and the fixed fixture block upper surface is that the low inside in outside is high Inclined-plane, the active fastening block is equipped with the inclined-plane matched with fixed fixture block.
As a further solution of the present invention: being equipped with inside the heat-conducting substrate for holding the thermally conductive of heat-conducting liquid Chamber.
As a further solution of the present invention: heat-conducting substrate surface is embedded with the metal plate flushed with cabinet lower end surface Material.
Compared with prior art, the utility model has the beneficial effects that the utility model be directed to existing apparatus the shortcomings that into Row improves, and in actual use, drives the rotation of sliding tooth wheel by driving motor, driving gear passes through the dynamic rotation of driven tooth annulus The blade of enclosing rotation, in this way rotation enclosing upper port can rotate, and then the hot-air of mainboard body surface is taken away, extraneous empty Gas can then pass through the first air inlet and the second air inlet, and then blow to mainboard ontology from all quarter, so that mainboard ontology Heat dissipation effect rapidly improves, and the thermal conductive cavity for holding heat-conducting liquid is in addition equipped with inside the heat-conducting substrate, thus may be used With, by heat absorption, the heat-conducting substrate surface flushed with cabinet lower end surface is embedded with gold the characteristics of specific heat capacity big using heat-conducting liquid The characteristics of belonging to plate, thus can use sheet metal low specific heat capacity radiates, and good heat dissipation effect is practical.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model.
Fig. 2 is the structural schematic diagram of runner assembly in the utility model.
Fig. 3 is the structural schematic diagram of clip assembly in the utility model.
Wherein: cabinet 1, heat-conducting substrate 2, thermal conductive cavity 3, mainboard ontology 4, rotation enclosing 5, the first air inlet 6, runner assembly 7, clip assembly 8, circular block 9, blade 10, driven ring gear 11, the second air inlet 12, driving gear 13, driving motor 14, installation Mouthfuls 15, cover board 71, the first ball 72, the second ball 73, the first bracer 74, limiting slot 75, the second bracer 76, fastening bolt 81, Knob 82, fixed fixture block 83, active fastening block 84.
Specific embodiment
In the description of the present invention, it should be understood that term " center ", " longitudinal direction ", " transverse direction ", "upper", "lower", The orientation or positional relationship of the instructions such as "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside" is It is based on the orientation or positional relationship shown in the drawings, is merely for convenience of describing the present invention and simplifying the description, rather than indicate Or imply that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore cannot understand For limitations of the present invention.In addition, term " first ", " second " etc. are used for description purposes only, and should not be understood as indicating Or it implies relative importance or implicitly indicates the quantity of indicated technical characteristic." first ", " second " etc. are defined as a result, Feature can explicitly or implicitly include one or more of the features.It is in the description of the present invention, unless another It is described, the meaning of " plurality " is two or more.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " is pacified Dress ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integrally Connection;It can be mechanical connection, be also possible to be electrically connected;Can be directly connected, can also indirectly connected through an intermediary, It can be the connection inside two elements.For the ordinary skill in the art, on being understood by concrete condition State the concrete meaning of term in the present invention.
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work Every other embodiment obtained, fall within the protection scope of the utility model.
Embodiment 1
Please refer to Fig. 1-3, in the utility model embodiment, a kind of embedded computer motherboard structure, including under cabinet 1 End installing port 15 matches the heat-conducting substrate 2 of setting, solid by the connection of clip assembly 8 between the heat-conducting substrate 2 and cabinet 1 Fixed, 2 upper end of heat-conducting substrate is also detachably equipped with the mainboard ontology 4 for installing electric elements, goes back on the heat-conducting substrate 2 Equipped with for covering mainboard ontology 4 and providing the cover structure of 4 heat dissipation effect of mainboard ontology.
The cover structure includes the fixation enclosing that 2 upper surface of heat-conducting substrate in 4 outside of mainboard ontology is arranged in, described solid Determine enclosing upper end and rotation enclosing 5 is rotatably connected to by runner assembly 7, is equipped with driven ring gear 11, institute on the outside of the rotation enclosing 5 It states 2 upper end of heat-conducting substrate and driving motor 14 is installed, the output end of the driving motor 14 is equipped with to be matched with driven ring gear 11 Driving gear 13, the 5 upper port middle position of rotation enclosing is equipped with circular block 9, the circular block 9 in rotation enclosing 5 Several blades 10 for being used to take away fixed enclosing inner air are equipped between wall, 5 outboard array of rotation enclosing is distributed with Several first air inlets 6 corresponding with the second air inlet 12 drive sliding tooth by driving motor 14 in actual use 13 rotation of wheel, driving gear 13 drive rotation enclosing 5 to rotate, rotate the blade of 5 upper port of enclosing in this way by driven ring gear 11 10 can rotate, and then the hot-air on 4 surface of mainboard ontology is taken away, and outside air can then pass through the first air inlet and the second air inlet Mouthful, and then mainboard ontology 4 is blowed to from all quarter, so that 4 heat dissipation effect of mainboard ontology rapidly improves.
The runner assembly includes being arranged in for holding the first bracer 74 of rotation enclosing 5 on the inside of fixed enclosing, described First bracer, 74 upper surface is equipped with ball grooves and the second ball 73 for being arranged in ball grooves, the fixed enclosing upper end be equipped with The limiting slot 75 that 5 the second bracer 76 of outside of rotation enclosing matches, 76 upper end of the second bracer is equipped with ball grooves and setting exists The first ball 72 inside ball grooves, the fixed enclosing top side detachable are equipped with the cover board 71 for resisting the first ball 72, By the setting of the first ball and the second ball 73 and ball grooves, the rotation between rotation enclosing 5 and fixed enclosing is realized Connection.
Filter screen is designed at first air inlet 6 and the second air inlet 12.
The clip assembly 8 includes the fixation fixture block 83 that 2 two sides of heat-conducting substrate are arranged in and the rotation that 1 side of cabinet is arranged in Tight screw hole, described screw cooperate in screw hole equipped with fastening bolt 81, and 81 inner end of the fastening bolt rotation is equipped with active fastening block 84,81 outer end of fastening bolt is equipped with knob 82, and fixed 83 upper surface of fixture block is the high inclined-plane in the low inside in outside, described Active fastening block 84 is equipped with the inclined-plane matched with fixed fixture block 83, drives fastening bolt 81 and active fastening block 84 by knob 82 It relatively rotates, and then active fastening block 84 is pushed to resist fixed fixture block 84, fixed fixture block 84 is pressed on cabinet 1 to generate Compaction forces, to complete to be clamped.
Embodiment 2
Referring to Fig. 1, being distinguished with embodiment 1: being equipped with inside the heat-conducting substrate 2 for holding heat-conducting liquid Thermal conductive cavity 3, the characteristics of thus can use heat-conducting liquid big specific heat capacity, by heat absorption, lead with what 1 lower end surface of cabinet flushed The characteristics of 2 surface of hot substrate is embedded with sheet metal, thus can use sheet metal low specific heat capacity is radiated, heat dissipation effect Fruit is good.
It is obvious to a person skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and And without departing substantially from the spirit or essential attributes of the utility model, it can realize that this is practical new in other specific forms Type.Therefore, in all respects, the present embodiments are to be considered as illustrative and not restrictive, this is practical new The range of type is indicated by the appended claims rather than the foregoing description, it is intended that containing for the equivalent requirements of the claims will be fallen in All changes in justice and range are embraced therein.It should not treat any reference in the claims as limiting Related claim.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art The other embodiments being understood that.

Claims (7)

1. a kind of embedded computer motherboard structure, the thermally conductive base including matching setting with cabinet (1) lower end installing port (15) Plate (2) is connected and fixed between the heat-conducting substrate (2) and cabinet (1) by clip assembly (8), heat-conducting substrate (2) upper end The also detachable mainboard ontology (4) being equipped with for installing electric elements;
It is dissipated it is characterized in that, being additionally provided on the heat-conducting substrate (2) for covering mainboard ontology (4) and providing mainboard ontology (4) The cover structure of thermal effect.
2. embedded computer motherboard structure according to claim 1, which is characterized in that the cover structure includes setting The fixation enclosing of heat-conducting substrate (2) upper surface on the outside of mainboard ontology (4), the fixed enclosing upper end pass through runner assembly (7) it is rotatably connected to rotation enclosing (5), is equipped with driven ring gear (11) on the outside of the rotation enclosing (5), the heat-conducting substrate (2) Upper end is equipped with driving motor (14), and the output end of the driving motor (14) is equipped with the driving matched with driven ring gear (11) Gear (13), rotation enclosing (5) the upper port middle position are equipped with circular block (9), the circular block (9) and rotation enclosing (5) several blades (10) for being used to take away fixed enclosing inner air, battle array on the outside of the rotation enclosing (5) are equipped between inner wall Column distribution has several the first air inlets (6) corresponding with the second air inlet (12).
3. embedded computer motherboard structure according to claim 2, which is characterized in that first air inlet (6) and Second air inlet is designed with filter screen at (12).
4. embedded computer motherboard structure according to claim 2, which is characterized in that the runner assembly includes setting For holding the first bracer (74) of rotation enclosing (5) on the inside of fixed enclosing, the first bracer (74) upper surface is equipped with rolling Pearl slot and the second ball (73) being arranged in ball grooves, the fixed enclosing upper end are equipped with and rotation enclosing (5) outside second The limiting slot (75) that bracer (76) matches, the second bracer (76) upper end are equipped with ball grooves and are arranged in inside ball grooves First ball (72), the fixed enclosing top side detachable are equipped with the cover board (71) for resisting the first ball (72).
5. embedded computer motherboard structure according to claim 1, which is characterized in that the clip assembly (8) includes Be arranged heat-conducting substrate (2) two sides fixation fixture block (83) and setting cabinet (1) side the screw hole that screws, it is described to screw screw hole Middle cooperation is equipped with fastening bolt (81), and fastening bolt (81) the inner end rotation is equipped with active fastening block (84), the fastening spiral shell Bolt (81) outer end is equipped with knob (82), and fixed fixture block (83) upper surface is the high inclined-plane in the low inside in outside, the active card Block (84) is equipped with the inclined-plane matched with fixed fixture block (83).
6. -5 any embedded computer motherboard structure according to claim 1, which is characterized in that the heat-conducting substrate (2) the internal thermal conductive cavity (3) being equipped with for holding heat-conducting liquid.
7. embedded computer motherboard structure according to claim 6, which is characterized in that heat-conducting substrate (2) surface It is embedded with the sheet metal flushed with cabinet (1) lower end surface.
CN201920369797.0U 2019-03-22 2019-03-22 A kind of embedded computer motherboard structure Expired - Fee Related CN209625118U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920369797.0U CN209625118U (en) 2019-03-22 2019-03-22 A kind of embedded computer motherboard structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920369797.0U CN209625118U (en) 2019-03-22 2019-03-22 A kind of embedded computer motherboard structure

Publications (1)

Publication Number Publication Date
CN209625118U true CN209625118U (en) 2019-11-12

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Application Number Title Priority Date Filing Date
CN201920369797.0U Expired - Fee Related CN209625118U (en) 2019-03-22 2019-03-22 A kind of embedded computer motherboard structure

Country Status (1)

Country Link
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111372146A (en) * 2020-03-02 2020-07-03 姚向映 Wireless router with novel heat radiation structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111372146A (en) * 2020-03-02 2020-07-03 姚向映 Wireless router with novel heat radiation structure
CN111372146B (en) * 2020-03-02 2022-01-18 小黄蜂人工智能(深圳)有限公司 Wireless router with heat radiation structure

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20191112

Termination date: 20200322

CF01 Termination of patent right due to non-payment of annual fee