CN209607763U - A kind of encapsulating structure of HI high impact sensing chip for sensor - Google Patents
A kind of encapsulating structure of HI high impact sensing chip for sensor Download PDFInfo
- Publication number
- CN209607763U CN209607763U CN201920805154.6U CN201920805154U CN209607763U CN 209607763 U CN209607763 U CN 209607763U CN 201920805154 U CN201920805154 U CN 201920805154U CN 209607763 U CN209607763 U CN 209607763U
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- China
- Prior art keywords
- groove
- cover board
- sensitive chip
- hole
- metal shell
- Prior art date
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- 239000002184 metal Substances 0.000 claims abstract description 83
- 229910052751 metal Inorganic materials 0.000 claims abstract description 83
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 15
- 241000826860 Trapezium Species 0.000 claims description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 239000011261 inert gas Substances 0.000 abstract description 3
- 230000014759 maintenance of location Effects 0.000 abstract description 3
- 238000009434 installation Methods 0.000 description 5
- 230000035939 shock Effects 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 208000004141 microcephaly Diseases 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005194 fractionation Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
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- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Abstract
The utility model relates to miniature electronic technical fields, in particular to a kind of encapsulating structure of HI high impact sensing chip for sensor, it include sensitive chip, the encapsulating structure includes the metal shell and metal cover board of rectangular configuration, the middle part setting of the metal shell is fluted, the side of the metal shell, which is provided with, passes through the through-hole being electrically connected with sensitive chip for electric connection line, the through-hole is connected to head end small on the inside of groove, side of the metal cover board far from sensitive chip is concave spherical surface, the metal shell is provided with mounting hole positioned at the two sides of groove on length direction, under the environment for enabling sensitive chip at higher temperature using metal shell, retention property is constant, the air-tightness of metal shell is more preferable, metal cover board and the closed space of groove are full of inert gas, prevent sensitive chip aoxidize or reduce sensitive chip by To the influence of temperature, service life is longer.
Description
Technical field
The utility model relates to miniature electronic technical field, in particular to a kind of encapsulation of HI high impact sensing chip for sensor
Structure.
Background technique
HI high impact sensor is related to the fields such as vibratory impulse measurement, high-speed impact, the measurement of overload course and target identification, also
It can be used as HI high impact procedural test sensor or detecting sensor in industry and civilian production activity to use, the shock transducer
Single shaft, twin shaft, 3-axis acceleration signal can be surveyed, range is in the g of 100g~200,000.
HI high impact sensor has an internal piezo-electric crystal sensing element, and a timing function is used to detect as earthquake intensity
A part.One impact event counter and storage unit are used to record the event for reaching preset amplitude threshold grade, 4~
20mA signal correspond to one be referred to as resetting time preset time window in occur be more than threshold levels impact event
Number.
In the case where sensor completes installation compressor normal work, threshold value setting can be carried out.It is noted that testing
The power supply connection polarity of shock transducer and normal operation mode are exactly opposite under mode.250 Ω resistance are used for electric current
Pulses switch is at voltage pulse, to show on oscillograph.Adjusting work can also be by means of a 6850 hand-held impact
Instrument carries out, which is connected on shock transducer by private jack, and the sensitive chip of existing shock transducer is usually
Got up by glue plastic packaging, when temperature is higher, glue can melt, and have an impact to the sensitivity of sensitive chip, and make
It is not grown with the service life.
Utility model content
The purpose of this utility model is that in view of the deficiencies of the prior art, a kind of HI high impact sensing chip for sensor is provided
Encapsulating structure.
To solve the above problems, the utility model the following technical schemes are provided:
A kind of encapsulating structure of HI high impact sensing chip for sensor, includes sensitive chip, it is characterised in that: the encapsulation
Structure includes the metal shell and metal cover board of rectangular configuration, and the sensitivity for receiving is provided in the middle part of the metal shell
The groove of chip, the groove are trapezium structure, and outwardly, the sensitive chip is mounted on the inside of groove the stub end of the groove
The stub end of groove is arranged in small head end, the metal cover board, and the side of the metal shell is provided with to be passed through for electric connection line
The through-hole being electrically connected with sensitive chip, the through-hole are connected to head end small on the inside of groove, and the metal cover board is far from sensitive core
The side of piece is concave spherical surface, and the metal shell is provided with mounting hole positioned at the two sides of groove on length direction.
Preferably, the metal shell includes the U-shaped mounting portion and cross mounting portion that can mutually splice, the U-shaped
Installation position is provided with the gap for cross mounting portion grafting in the middle section of mounting hole axis, and the middle section of the U-shaped mounting portion is set
It is equipped with the notch for avoiding cross mounting portion, the cross mounting portion includes plugboard and and the grafting for being inserted into gap
The integrally formed splicing block of plate, the splicing block are identical as the size of notch.
Preferably, the middle section of the U-shaped mounting portion is located at the semicolumn slot that indentation, there is provided with trapezium structure, the splicing
The middle section that block is located at plugboard is also equipped with the semicolumn slot of trapezium structure, and two semicolumn slots can be spliced into groove.
Preferably, the metal shell includes the pedestal of rectangular configuration and can be buckled to L shape cover board on the base, institute
The mounting groove being provided on pedestal for accommodating sensitive chip is stated, the mounting hole setting is upper in length direction in pedestal
In the two sides of mounting groove, the L shape cover board is provided with the receiving hole for accommodating metal cover board, and the diameter of the receiving hole is greater than
The diameter of mounting groove, the receiving hole and mounting groove can be spliced into groove.
Preferably, the width of the splicing block is equal to the half of grafting board width, and the structure of the notch and splicing block is equal
For rectangle.
Preferably, the two sides that the L shape cover board is located at receiving hole are also equipped with connecting hole identical with mounting hole size, institute
Having the mounting hole is threaded hole.
The utility model has the advantages that a kind of encapsulating structure of HI high impact sensing chip for sensor of the utility model is with below several
Advantage:
(1) under the environment for using metal shell to enable sensitive chip at higher temperature, retention property is constant, metal shell
Air-tightness is more preferable, and metal cover board and the closed space of groove are full of inert gas, prevents sensitive chip from aoxidizing or reducing sensitive core
Piece is affected by temperature.
(2) metal shell can splice fractionation, when needing repairing, can directly split metal, to sensitive core
After piece is repaired or replaced, the position of sensitive chip and metal cover board can be fixed in advance, it then again will be golden
Belong to shell to splice, be able to solve sensor after maintenance, its accuracy in detection is caused to influence the case where reducing.
Detailed description of the invention
Fig. 1 is the top view of the utility model embodiment one；
Fig. 2 is cross-sectional view of the Fig. 1 along line A-A；
Fig. 3 is the schematic perspective view of the utility model embodiment two；
Fig. 4 is the top view of the utility model embodiment two；
Fig. 5 is cross-sectional view of the Fig. 4 along line B-B；
Fig. 6 is the structural decomposition diagram one of the utility model embodiment two；
Fig. 7 is the structural decomposition diagram two of the utility model embodiment two；
Fig. 8 is the schematic perspective view of the utility model embodiment one；
Fig. 9 is the schematic perspective view of the utility model embodiment three；
Figure 10 is the top view of the utility model embodiment three；
Figure 11 is cross-sectional view of the Figure 10 along line C-C；
Figure 12 is the schematic perspective view of the utility model embodiment three；
Description of symbols: metal shell 1, groove 11, sensitive chip 2, through-hole 21, metal cover board 3, protrusion 31, recessed ball
Face 32, mounting hole 4, U-shaped mounting portion 5, gap 51, notch 52, semicolumn slot 53, cross mounting portion 6, plugboard 61, splicing block
62, pedestal 7, mounting groove 71, L shape cover board 8, receiving hole 81, connecting hole 82.
Specific embodiment
With reference to the accompanying drawings of the specification and embodiment, specific embodiment of the utility model is described in further detail:
Embodiment one:
It include sensitive chip referring to figs. 1 to a kind of encapsulating structure of HI high impact sensing chip for sensor shown in Figure 12
2, the encapsulating structure includes the metal shell 1 and metal cover board 3 of rectangular configuration, and the middle part of the metal shell 1 is provided with
The groove 11 of sensitive chip 2 for receiving, the groove 11 are trapezium structure, and the stub end of the groove 11 is outwardly, described
Sensitive chip 2 is mounted on the small head end in the inside of groove 11, and the metal cover board 3 is arranged in the stub end of groove 11, outside the metal
The side of shell, which is provided with, passes through the through-hole 21 being electrically connected with sensitive chip, the through-hole 21 and 11 inside of groove for electric connection line
The connection of small head end, side of the metal cover board 3 far from sensitive chip 2 is concave spherical surface 32, and the metal shell 1 is in length
Two sides on direction positioned at groove 11 are provided with mounting hole 4, and first sensitive chip 2 is placed in groove 11, then again will be golden
Belong to the stub end that cover board 3 is bonded in groove 11, the bottom of metal cover board 3 is provided with protrusion identical with 11 microcephaly's end section of groove
31, after mounting, protrusion 31 extends into groove 11 metal cover board 3, when dismounting metal cover board 3 every time,
The center of the concave spherical surface 32 of metal cover board 3 always in same position, can volume guarantee metal cover board 3 after mounting, position is begun
It is constant eventually.
Under the environment for enabling sensitive chip at higher temperature using metal shell 1, retention property is constant, metal shell 1
Air-tightness is more preferable, and metal cover board 1 and the closed space of groove 11 are full of inert gas, prevents sensitive chip 2 from aoxidizing or reducing quick
Sense chip 2 is affected by temperature.
Embodiment two:
It include sensitive chip referring to figs. 1 to a kind of encapsulating structure of HI high impact sensing chip for sensor shown in Figure 12
2, the encapsulating structure includes the metal shell 1 and metal cover board 3 of rectangular configuration, and the middle part of the metal shell 1 is provided with
The groove 11 of sensitive chip 2 for receiving, the groove 11 are trapezium structure, and the stub end of the groove 11 is outwardly, described
Sensitive chip 2 is mounted on the small head end in the inside of groove 11, and the metal cover board 3 is arranged in the stub end of groove 11, outside the metal
The side of shell, which is provided with, passes through the through-hole 21 being electrically connected with sensitive chip, the through-hole 21 and 11 inside of groove for electric connection line
The connection of small head end, side of the metal cover board 3 far from sensitive chip 2 is concave spherical surface 32, and the metal shell 1 is in length
Two sides on direction positioned at groove 11 are provided with mounting hole 4, and first sensitive chip 2 is placed in groove 11, then again will be golden
Belong to the stub end that cover board 3 is bonded in groove 11, the bottom of metal cover board 3 is provided with protrusion identical with 11 microcephaly's end section of groove
31, after mounting, protrusion 31 extends into groove 11 metal cover board 3, when dismounting metal cover board 3 every time,
The center of the concave spherical surface 32 of metal cover board 3 always in same position, can volume guarantee metal cover board 3 after mounting, position is begun
It is constant eventually.
The metal shell 1 includes the U-shaped mounting portion 5 and cross mounting portion 6 that can mutually splice, the U-shaped installation
The middle section that portion 5 is located at 4 axis of mounting hole is provided with the gap 51 for 6 grafting of cross mounting portion, the middle section of the U-shaped mounting portion 5
It is provided with the notch 52 for avoiding cross mounting portion 6, the cross mounting portion 6 includes the plugboard for being inserted into gap 51
61 and with the integrally formed splicing block 62 of plugboard 61, the splicing block 62 is identical as the size of notch 52, described to need repairing
When, cross mounting portion 6 is pulled out from the gap of U-shaped mounting portion 5 51 and is come, so that sensitive chip 2 and metal cover board 3
Half is exposed, and while its motionless position, facilitates observation and repairs.
The middle section of the U-shaped mounting portion is located at the semicolumn slot 53 that trapezium structure is provided at notch 52, the splicing block
62 middle sections for being located at plugboard 61 are also equipped with the semicolumn slot 53 of trapezium structure, and two semicolumn slots 53 can be spliced into groove
11, first metal cover board 3 and sensitive chip 2 are pre-installed in one of semicolumn slot 53, U-shaped mounting portion 5 and cross installation
Portion 6 is stitched together, so that another semicolumn slot 53 splices with the semicolumn slot 53 equipped with metal cover board 3 and sensitive chip 2
Come, to guarantee that the position of metal cover board 3 and sensitive chip 2 can be constant always.
The width of the splicing block 62 is equal to the half of 61 width of plugboard, and the structure of the notch 52 and splicing block 62 is equal
For rectangle, metal cover board 3 and sensitive chip 2 are pre-installed in one of semicolumn slot 53 by such structure, and then other one
A semicolumn slot 53 comes to dock more convenient.
Embodiment three:
Referring to figs. 1 to a kind of encapsulating structure of HI high impact sensing chip for sensor shown in Figure 12, the HI high impact sensing
Device includes the metal shell 1, sensitive chip 2 and metal cover board 3 of rectangular configuration, and the middle part setting of the metal shell 1 is useful
In the groove 11 of the sensitive chip 2 of receiving, the groove 11 is trapezium structure, and the stub end of the groove 11 is outwardly, described quick
Sense chip 2 is mounted on the 11 small head end in inside of groove, and the metal cover board 3 is arranged in the stub end of groove 11, sets on sensitive chip 2
It is equipped with through-hole 21, side of the metal cover board 3 far from sensitive chip 2 is concave spherical surface 32, and the metal shell 1 is in length
Two sides on direction positioned at groove 11 are provided with mounting hole 4, and first sensitive chip 2 is placed in groove 11, then again will be golden
Belong to the stub end that cover board 3 is bonded in groove 11, the bottom of metal cover board 3 is provided with protrusion identical with 11 microcephaly's end section of groove
31, after mounting, protrusion 31 extends into groove 11 metal cover board 3, when dismounting metal cover board 3 every time,
The center of the concave spherical surface 32 of metal cover board 3 always in same position, can volume guarantee metal cover board 3 after mounting, position is begun
It is constant eventually.
The metal shell 1 includes the pedestal 7 of rectangular configuration and can tip upside down on the L shape cover board 8 on pedestal 7, described
The mounting groove 71 for accommodating sensitive chip 2 is provided on pedestal 7, the mounting hole 4 is arranged in pedestal 7 in length direction
The upper two sides positioned at mounting groove 71, the L shape cover board 8 are provided with the receiving hole 81 for accommodating metal cover board 3, the receiving hole
81 diameter is greater than the diameter of mounting groove 71, and the receiving hole 81 and mounting groove 71 can be spliced into groove 11, and sensitive chip 2 is pacified
After mounting groove 71, in the port that metal cover board 3 is bonded in mounting groove 71, L shape cover board 8 is then bonded in pedestal 7
On, receiving hole 81 can limit metal cover board 3.
The two sides that the L shape cover board 8 is located at receiving hole 81 are also equipped with connecting hole 82 identical with 4 size of mounting hole, institute
Having the mounting hole 4 is threaded hole, and increase screws intensity, improves the stabilization of the installation of sensor, avoids HI high impact sensor
During detection, occur loosening or shaking situation, so that accuracy in detection is not high.
The above descriptions are merely preferred embodiments of the present invention, not makees to the technical scope of the utility model
Any restrictions out, thus it is any trickle amendment made by the above technical examples according to the technical essence of the present invention, equivalent
Variation and modification, in the range of still falling within the technical solution of the utility model.
Claims (6)
1. a kind of encapsulating structure of HI high impact sensing chip for sensor includes sensitive chip (2), it is characterised in that: the envelope
Assembling structure includes the metal shell (1) and metal cover board (3) of rectangular configuration, and the middle part setting of the metal shell (1) is useful
In the groove (11) of the sensitive chip (2) of receiving, the groove (11) is trapezium structure, the stub end court of the groove (11)
Outside, the sensitive chip (2) is mounted on small head end on the inside of groove (11), and the metal cover board (3) is arranged in the big of groove (11)
Head end, the side of the metal shell, which is provided with, passes through the through-hole (21) being electrically connected with sensitive chip for electric connection line, described
Through-hole (21) is connected to head end small on the inside of groove (11), and side of the metal cover board (3) far from sensitive chip (2) is concave spherical surface
(32), two sides of the metal shell (1) on length direction positioned at groove (11) are provided with mounting hole (4).
2. a kind of encapsulating structure of HI high impact sensing chip for sensor according to claim 1, it is characterised in that: the gold
Belonging to shell (1) includes the U-shaped mounting portion (5) and cross mounting portion (6) that can mutually splice, and the U-shaped mounting portion (5) is located at
The middle section of mounting hole (4) axis is provided with the gap (51) for cross mounting portion (6) grafting, the middle section of the U-shaped mounting portion (5)
It is provided with the notch (52) for avoiding cross mounting portion (6), the cross mounting portion (6) includes to be inserted into gap (51)
Plugboard (61) and with plugboard (61) integrally formed splicing block (62), the size of the splicing block (62) and notch (52)
It is identical.
3. a kind of encapsulating structure of HI high impact sensing chip for sensor according to claim 2, it is characterised in that: the U
The middle section of type mounting portion is located at the semicolumn slot (53) that trapezium structure is provided at notch (52), and the splicing block (62), which is located at, inserts
The middle section of fishplate bar (61) is also equipped with the semicolumn slot (53) of trapezium structure, and two semicolumn slots (53) can be spliced into groove
(11)。
4. a kind of encapsulating structure of HI high impact sensing chip for sensor according to claim 1, it is characterised in that: the gold
Belong to shell (1) to include the pedestal (7) of rectangular configuration and can tip upside down on the L shape cover board (8) on pedestal (7), the pedestal (7)
On be provided with mounting groove (71) for accommodating sensitive chip (2), the mounting hole (4) is arranged in pedestal (7) in length
It is located at the two sides of mounting groove (71) on direction, the L shape cover board (8) is provided with the receiving hole for accommodating metal cover board (3)
(81), the diameter of the receiving hole (81) is greater than the diameter of mounting groove (71), and the receiving hole (81) and mounting groove (71) can
It is spliced into groove (11).
5. a kind of encapsulating structure of HI high impact sensing chip for sensor according to claim 3, it is characterised in that: the spelling
The width for connecing block (62) is equal to the half of plugboard (61) width, and the structure of the notch (52) and splicing block (62) is square
Shape.
6. a kind of encapsulating structure of HI high impact sensing chip for sensor according to claim 4, it is characterised in that: the L
The two sides that shape cover board (8) is located at receiving hole (81) are also equipped with connecting hole (82) identical with mounting hole (4) size, all described
Mounting hole (4) is threaded hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920805154.6U CN209607763U (en) | 2019-05-29 | 2019-05-29 | A kind of encapsulating structure of HI high impact sensing chip for sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920805154.6U CN209607763U (en) | 2019-05-29 | 2019-05-29 | A kind of encapsulating structure of HI high impact sensing chip for sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209607763U true CN209607763U (en) | 2019-11-08 |
Family
ID=68407020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920805154.6U Expired - Fee Related CN209607763U (en) | 2019-05-29 | 2019-05-29 | A kind of encapsulating structure of HI high impact sensing chip for sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209607763U (en) |
-
2019
- 2019-05-29 CN CN201920805154.6U patent/CN209607763U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191108 |
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| CF01 | Termination of patent right due to non-payment of annual fee |