CN209593981U - A kind of ball-planting device for pcb board welding - Google Patents

A kind of ball-planting device for pcb board welding Download PDF

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Publication number
CN209593981U
CN209593981U CN201821937033.9U CN201821937033U CN209593981U CN 209593981 U CN209593981 U CN 209593981U CN 201821937033 U CN201821937033 U CN 201821937033U CN 209593981 U CN209593981 U CN 209593981U
Authority
CN
China
Prior art keywords
ball
pcb board
frame
plant
planting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201821937033.9U
Other languages
Chinese (zh)
Inventor
郑亮辉
郑芳芳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Fu Yu Electronics Co Ltd
Original Assignee
Shenzhen Fu Yu Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Fu Yu Electronics Co Ltd filed Critical Shenzhen Fu Yu Electronics Co Ltd
Priority to CN201821937033.9U priority Critical patent/CN209593981U/en
Application granted granted Critical
Publication of CN209593981U publication Critical patent/CN209593981U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of ball-planting devices for pcb board welding, one layer of soldering paste of the uniform oiling in the surface of the pcb board, including planting ball pedestal, it receives box, plant ball frame, the upper surface of ball placement pedestal, which is equipped with, plants ball groove, the pcb board level, which is set to, plants in ball groove, and the side for being coated with soldering paste is arranged upward, ball placement frame and plant ball groove cooperation, plant the top that ball frame is set to pcb board, it plants and is equipped with gap between the lower end surface and pcb board of ball frame, the side of ball placement frame is connect with the side wall for planting ball groove by shaft, the side of ball placement frame is hatch frame, and the side is equipped with kick back, the kick back is connected by hinge with ball frame is planted, the lower end surface of ball placement frame is uniformly provided with leak hole, the side of ball placement pedestal is equipped with box of receiving, the box of receiving is set to the lower section of kick back.Entire ball process of planting is simple and quick, and it is convenient to plant ball, and solving current steel mesh, to plant ball operation difficulty big, expends problem of long duration, improves operating efficiency, avoids the problem of losing.

Description

A kind of ball-planting device for pcb board welding
Technical field
The utility model relates to the welding technology field of pcb board, specially a kind of ball-planting device for pcb board welding.
Background technique
PCB plant ball is the work for needing patience and carefulness, will carefully conscientiously when operation, current plant Ball is that a steel mesh is arranged in the top of pcb board, is then uniformly set to tin ball on steel mesh, is swept into tin ball with hairbrush is careful It in steel mesh hole, operates very time-consuming, efficiency is relatively low, and it is easy to appear showing without tin ball in the steel mesh hole having As.
Utility model content
The utility model provides a kind of plant ball for pcb board welding aiming at deficiencies of the prior art Tin ball is directly placed on and plants in ball frame, stir tin ball, allow tin ball to fall in leak hole, so when carrying out plant ball by device It opens kick back afterwards the propulsion of tin ball is received in box, entire ball process of planting is simple and quick, and plant ball is convenient, solves current steel mesh and plants Ball operation difficulty is big, expends problem of long duration, improves operating efficiency, avoids the problem of losing.
To achieve the above object, utility model provides the following technical solutions:
A kind of ball-planting device for pcb board welding, one layer of soldering paste of the uniform oiling in the surface of the pcb board, including plant ball Pedestal, box of receiving plant ball frame, and the upper surface of ball placement pedestal, which is equipped with, plants ball groove, and the pcb board level, which is set to, plants in ball groove, And the side for being coated with soldering paste is arranged upward, ball placement frame and plant ball groove cooperation plant the top that ball frame is set to pcb board, plant ball frame Lower end surface and pcb board between be equipped with gap, the side of ball placement frame is connect with the side wall of plant ball groove by shaft, the plant The side of ball frame is hatch frame, and the side is equipped with kick back, and the kick back is connected by hinge with ball frame is planted, ball placement The lower end surface of frame is uniformly provided with leak hole, and the side of ball placement pedestal is equipped with box of receiving, and the box of receiving is under kick back Side.
Preferably, the bottom of ball placement slot is uniformly provided with rubber mat, and the rubber mat is rubber material.
Preferably, ball placement slot is structure open at one end, and the open end of plant ball groove and box of receiving are set to ipsilateral, plant ball The side wall of the open end of slot is equipped with butterfly.
Preferably, torsional spring is equipped in the hinge, kick back is by torsional spring and plants ball frame closure.
Preferably, the lower end side of ball placement pedestal is equipped with supporting leg, and the supporting leg is disposed far from the one of box of receiving Side.
Preferably, it the shaft and plants the lateral wall of ball frame and welds, the inner wall of ball placement slot is equipped with axis hole, and described turn The end of axis and shaft hole matching.
Preferably, the lower end surface of ball placement frame is equipped with supporting block, and the lower end of the supporting block and the upper surface of pcb board connect It connects.
Preferably, port lid, the port lid and leak hole grafting are equipped in each leak hole.
Compared with prior art, the beneficial effect of utility model is:
1, tin ball is directly placed on and plants in ball frame, stir tin ball, tin ball is allowed to fall when carrying out plant ball by the utility model In leak hole, then to open kick back and the propulsion of tin ball is received in box, entire ball process of planting is simple and quick, and plant ball is convenient, It is big to solve current steel mesh plant ball operation difficulty, expends problem of long duration, improves operating efficiency, avoid the problem of losing.
2, the bottom that the utility model plants ball groove is uniformly provided with rubber mat, avoids during planting ball, and pcb board is by plant ball frame Pressure and be damaged, protect pcb board using safe, improve the reliability used.
3, butterfly is arranged on planting ball pedestal in the utility model, can be carried out pcb board firmly by butterfly Fixation, prevent during planting ball pcb board to slide, guarantee the accuracy for planting ball, improve welding quality and precision.
4, supporting leg is arranged in the lower end for planting ball pedestal in the utility model, and the side for planting ball pedestal is lifted, can be in order to Extra tin ball is released, it is easy to use, it saves and collects the cumbersome of extra tin ball, improve work express delivery.
5, port lid is arranged in the utility model on leak hole, can be according to the open corresponding leakage in the welding position of different pcb boards Hole makes dispensing more accurate, increases the versatility used.
Detailed description of the invention
Fig. 1 is the overall structure diagram of the utility model;
Fig. 2 is the main view of the utility model;
Fig. 3 is to remove the structural schematic diagram for planting ball frame;
Fig. 4 is the structural schematic diagram for planting ball frame;
Fig. 5 is to plant ball frame to remove the main view after kick back.
In figure: 1- plants ball pedestal;101- axis hole;102- rubber mat;103- plants ball groove;2- receives box;3- butterfly;4- plants Ball frame;401- shaft;402- leak hole;403- kick back;404- supporting block;405- port lid;5- tin ball;6- soldering paste;7-PCB plate; 8- supporting leg.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work Every other embodiment obtained, fall within the protection scope of the utility model.
As shown in Figs. 1-5, a kind of ball-planting device for pcb board welding, one layer of the uniform oiling in the surface of the pcb board 7 Soldering paste 6, including plant ball pedestal 1, box 2 of receiving, plant ball frame 4, the upper surface of ball placement pedestal 1, which is equipped with, plants ball groove 103, described Horizontal be set to of pcb board 7 is planted in ball groove 103, and the side for being coated with soldering paste 6 is arranged upward, and ball placement frame 4 is matched with ball groove 103 is planted It closes, plants the top that ball frame 4 is set to pcb board 7, plant and be equipped with gap between the lower end surface and pcb board 7 of ball frame 4, ball placement frame 4 Side is connect with the side wall for planting ball groove 103 by shaft 401, and the side of ball placement frame 4 is hatch frame, and the side is equipped with gear Ball plate 403, the kick back 403 are connected by hinge with ball frame 4 is planted, and the lower end surface of ball placement frame 4 is uniformly provided with leak hole 402, the side of ball placement pedestal 1 is equipped with box 2 of receiving, and the box 2 of receiving is set to the lower section of kick back 403.
The bottom of ball placement slot 103 is uniformly provided with rubber mat 102, and the rubber mat 102 is rubber material.It avoids planting ball mistake Cheng Zhong, pcb board are damaged by the pressure for planting ball frame, protect pcb board using safe, improve the reliability used.
Ball placement slot 103 is structure open at one end, and the open end of plant ball groove 103 and box 2 of receiving are set to ipsilateral, plant ball The side wall of the open end of slot 103 is equipped with butterfly 3, can firmly fix pcb board by butterfly, prevent Pcb board slides during planting ball, guarantees the accuracy for planting ball, improves welding quality and precision.
Torsional spring is equipped in the hinge, kick back 403 is by torsional spring and plants the closure of ball frame 4.
The lower end side of ball placement pedestal 1 is equipped with supporting leg 8, and the supporting leg 8 is disposed far from the side for box 2 of receiving, Supporting leg is set in the lower end for planting ball pedestal, the side for planting ball pedestal is lifted, can be used in order to release extra tin ball It is convenient, it saves and collects the cumbersome of extra tin ball, improve work express delivery.
The shaft and the lateral wall for planting ball frame 4 weld, and the inner wall of ball placement slot 103 is equipped with axis hole 101, and described turn The end of axis 401 and axis hole 101 cooperate.
The lower end surface of ball placement frame 4 is equipped with supporting block 404, the lower end of the supporting block 404 and the upper surface of pcb board 7 Connection.
Port lid 405, the port lid 405 and 402 grafting of leak hole are equipped in each leak hole 402, it can be according to difference The open corresponding leak hole in the welding position of pcb board, makes dispensing more accurate, increases the versatility used.
In use, spreading soldering paste 6 for uniformly applying on pcb board 7, then pcb board 7 is placed on and is planted in ball groove 103, rotation rotation Turn baffle 3, pcb board 7 carried out by barrier by butterfly 3, then buckles and plants ball frame 4, open the port lid 405 of corresponding position, Tin ball 5 is poured into tin ball frame 4, tin ball 5 is then stirred, falls into tin ball 5 in leak hole 402, then opens kick back 403, tin Ball 5 is rolled into automatically and is received in box 2, is opened the plant taking-up pcb board 7 of ball frame 4 and is welded, when carrying out plant ball, is directly put tin ball It sets and is planting in ball frame, stir tin ball, tin ball is allowed to fall in leak hole, then open kick back for tin ball and promote box of receiving Interior, entire ball process of planting is simple and quick, and it is convenient to plant ball, and solving current steel mesh, to plant ball operation difficulty big, expends of long duration ask Topic, improves operating efficiency, avoids the problem of losing.
Obviously, it is practical without departing from this can to carry out various modification and variations to the utility model by those skilled in the art Novel spirit and scope.If in this way, these modifications and variations of the present invention belong to the utility model claims and Within the scope of its equivalent technologies, then the utility model is also intended to include these modifications and variations.

Claims (8)

1. a kind of ball-planting device for pcb board welding, one layer of soldering paste (6) of the uniform oiling in surface of the pcb board (7) is special Sign is: including planting ball pedestal (1), box of receiving (2), planting ball frame (4), the upper surface of ball placement pedestal (1), which is equipped with, plants ball groove (103), horizontal be set to of the pcb board (7) is planted in ball groove (103), and the side for being coated with soldering paste (6) is arranged upward, ball placement Frame (4) and plant ball groove (103) cooperation, plant the top that ball frame (4) are set to pcb board (7), plant lower end surface and the pcb board of ball frame (4) (7) gap is equipped between, the side of ball placement frame (4) is connect with the side wall for planting ball groove (103) by shaft (401), described The side for planting ball frame (4) is hatch frame, and the side is equipped with kick back (403), and the kick back (403) and plant ball frame (4) are logical Hinge connection is crossed, the lower end surface of ball placement frame (4) is uniformly provided with leak hole (402), and the side of ball placement pedestal (1), which is equipped with, to be connect Ball case (2), the box of receiving (2) are set to the lower section of kick back (403).
2. a kind of ball-planting device for pcb board welding as described in claim 1, it is characterised in that: ball placement slot (103) Bottom be uniformly provided with rubber mat (102), the rubber mat (102) be rubber material.
3. a kind of ball-planting device for pcb board welding as described in claim 1, it is characterised in that: ball placement slot (103) For structure open at one end, and plant the open end of ball groove (103) and box of receiving (2) be set to it is ipsilateral, the open end of plant ball groove (103) Side wall is equipped with butterfly (3).
4. a kind of ball-planting device for pcb board welding as described in claim 1, it is characterised in that: be equipped in the hinge Torsional spring, kick back (403) is by torsional spring and plants ball frame (4) closure.
5. a kind of ball-planting device for pcb board welding as described in claim 1, it is characterised in that: ball placement pedestal (1) Lower end side be equipped with supporting leg (8), the supporting leg (8) is disposed far from the side of box of receiving (2).
6. a kind of ball-planting device for pcb board welding as described in claim 1, it is characterised in that: the shaft and plant ball The lateral wall of frame (4) welds, and the inner wall of ball placement slot (103) is equipped with axis hole (101), the end of the shaft (401) with Axis hole (101) cooperation.
7. a kind of ball-planting device for pcb board welding as described in claim 1, it is characterised in that: ball placement frame (4) Lower end surface is equipped with supporting block (404), and the lower end of the supporting block (404) is connect with the upper surface of pcb board (7).
8. a kind of ball-planting device for pcb board welding as described in claim 1, it is characterised in that: each leak hole (402) it is equipped with port lid (405) in, the port lid (405) and leak hole (402) grafting.
CN201821937033.9U 2018-11-23 2018-11-23 A kind of ball-planting device for pcb board welding Expired - Fee Related CN209593981U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821937033.9U CN209593981U (en) 2018-11-23 2018-11-23 A kind of ball-planting device for pcb board welding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821937033.9U CN209593981U (en) 2018-11-23 2018-11-23 A kind of ball-planting device for pcb board welding

Publications (1)

Publication Number Publication Date
CN209593981U true CN209593981U (en) 2019-11-05

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ID=68377212

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201821937033.9U Expired - Fee Related CN209593981U (en) 2018-11-23 2018-11-23 A kind of ball-planting device for pcb board welding

Country Status (1)

Country Link
CN (1) CN209593981U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114378745A (en) * 2022-02-08 2022-04-22 湖南越摩先进半导体有限公司 Ball planting device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114378745A (en) * 2022-02-08 2022-04-22 湖南越摩先进半导体有限公司 Ball planting device
CN114378745B (en) * 2022-02-08 2023-05-05 湖南越摩先进半导体有限公司 Ball planting device

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CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20191105

Termination date: 20201123