CN209590345U - Optical transmitting and receiving component and Connectorized fiber optic cabling module - Google Patents
Optical transmitting and receiving component and Connectorized fiber optic cabling module Download PDFInfo
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- CN209590345U CN209590345U CN201920339416.4U CN201920339416U CN209590345U CN 209590345 U CN209590345 U CN 209590345U CN 201920339416 U CN201920339416 U CN 201920339416U CN 209590345 U CN209590345 U CN 209590345U
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- light emitting
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Abstract
The utility model provides a kind of optical transmitting and receiving component and Connectorized fiber optic cabling module.Optical transmitting and receiving component includes substrate, light-receiving sub-assembly and multiple light emitting sub-assemblies.Light-receiving sub-assembly is set on substrate, and multiple light emitting sub-assemblies are connected to the substrate, wherein the multiple light emitting sub-assembly is to be staggered.Connectorized fiber optic cabling module includes optical transmitting and receiving component and Connectorized fiber optic cabling.The utility model can realize the miniaturization of optical module.
Description
Technical field
The utility model relates to technical field of optical fiber communication, in particular to a kind of optical transmitting and receiving component and Connectorized fiber optic cabling mould
Block.
Background technique
In the application of Fibre Optical Communication Technology, need electric signal being converted to light by light emitting sub-assembly (such as laser)
Then optical signal is coupled into the optical fiber of conduction optical signal by signal.
Currently, the demand for computing device persistently rises, reach the demand of superior performance also even for computing device
In promotion.However, traditional electrical I/O (input/output) signal transmits and expection can be with need increased for performance invariably
It asks, the expectation especially for the following high-performance calculation is gone forward side by side in step.Now, I/O signal be by circuit board from processor come
Ground is gone back to electrically to transmit and be delivered to peripheral device outward.Electrical signals must pass through solder joints, cable and other electrical conductors.
Therefore, electrical I/O signal rate can be limited by the electric characteristics of electric connector.
Traditional telecommunication transmission systems are gradually replaced fibre-optic transmission system (FOTS).Fibre-optic transmission system (FOTS) due to and do not have band
Tolerance system, has many advantages, such as high-speed transfer, transmission range length, material not by Electromagnetic Interference, therefore, electronic industry mostly court at present
It is researched and developed in the direction of optical fiber transmission.
However, in recent years, it is desirable that the further miniaturization of the optical modules such as optical transceiver, it is therefore desirable to be transmitted to optical fiber
The structure of system optimizes.
Utility model content
To solve existing issue, the utility model proposes a kind of optical transmitting and receiving components, reduce optical transmitting and receiving component to realize
Complexity, realize optical transmitting and receiving assembly volume miniaturization.
To achieve the above object, the utility model proposes a kind of optical transmitting and receiving components, comprising:
Shell；
Substrate is arranged in the shell；
Light-receiving sub-assembly, setting is on the substrate；
Multiple light emitting sub-assemblies, are connected to the substrate, wherein the multiple light emitting sub-assembly is to be staggered, institute
It states between the light direction of multiple light emitting sub-assemblies with one between 90 degree of angles between 180 degree.
Optionally, the multiple light emitting sub-assembly is located at the upper and lower two sides of the substrate, and is staggered.
Optionally, the multiple light emitting sub-assembly is located at the same side of the substrate, and is staggered.
Optionally, the multiple light emitting sub-assembly is two or more light emitting sub-assemblies, and is intertwined.
It optionally, further include connecting plate, the light emitting sub-assembly is that the substrate is connected to by the connecting plate.
Optionally, the connecting plate includes the first connecting plate and the second connecting plate.
Optionally, one end of first connecting plate is connected to the first surface of the substrate, second connecting plate
One end is connected to the second surface of the substrate.
Optionally, first connecting plate and second connecting plate have different length.
Optionally, the substrate includes at least one protrusion and at least one recess portion, and the recess portion is formed at described convex
At least side in portion, the light emitting sub-assembly are arranged in the recess portion of the substrate.
The utility model also provides a kind of Connectorized fiber optic cabling module comprising:
Connectorized fiber optic cabling；
Optical transmitting and receiving component；The optical transmitting and receiving component includes:
Shell；
Substrate is arranged in the shell；
Light-receiving sub-assembly, setting is on the substrate；
Multiple light emitting sub-assemblies, are connected to the substrate, wherein the multiple light emitting sub-assembly is to be staggered, institute
It states between the light direction of multiple light emitting sub-assemblies with one between 90 degree of angles between 180 degree.
The utility model proposes a kind of optical transmitting and receiving components, realize optical transmitting and receiving assembly volume small compact
(compact design), efficiently utilizes the inner space of optical transmitting and receiving component, at the same the utility model proposes optics
Transmitting-receiving subassembly structure is simple, easily fabricated.
Detailed description of the invention
Fig. 1 is the block diagram using an embodiment of a system of the utility model Connectorized fiber optic cabling module；
Fig. 2 to Fig. 4 is the schematic diagram of an embodiment of the utility model optical transmitting and receiving component；
Fig. 5 A to Fig. 5 B is the schematic diagram of the different embodiments of the utility model substrate；
Fig. 6 to Fig. 7 is the schematic diagram of the different embodiments of the utility model light emitting sub-assembly and substrate；
Fig. 8 is the schematic diagram of an embodiment of the utility model light emitting sub-assembly.
Specific embodiment
The utility model is described in further detail in the following with reference to the drawings and specific embodiments, so that those skilled in the art
The utility model can be better understood and can be practiced, but illustrated embodiment is not as the restriction to the utility model.
Referring to Fig. 1, the present embodiment proposes a kind of Connectorized fiber optic cabling module 100, Fig. 1 is to use the Connectorized fiber optic cabling module
100 flow chart, the Connectorized fiber optic cabling module 100 include optical transmitting and receiving component 110, Connectorized fiber optic cabling 130 and electronic device 101.
The electronic device 101 can be any one of many operations or display device comprising but be not limited to data center,
Desktop or laptop computer, laptop, ultrathin notebook, tablet computer, notebook or other operations dress
It sets.Other than arithmetic unit, it is understood that, many other types of electronic device 101 may include one or more
The optical transmitting and receiving component 110 being described in the utility model and/or matching port 102, and be described in the utility model
Embodiment can equally apply on these electronic devices.The example of these other electronic devices 101 may include electric vehicle, hand
Held device, smartphone, media apparatus, personal digital assistant (PDA), portable personal computer, mobile phone, more matchmakers
Body device, memory device, camera, recorder, I/O device, server, set-top box, printer, scanning machine, monitor, TV
Mechanical, electrical sub- billboard, projector, amusement control unit, portable music player, digital camera, Internet device, game are set
Standby, game host or it is any may include the optical transmitting and receiving component 110 and/or it is described matching port 102 other electronics dress
Set 101.In other embodiments, the electronic device 101 can be the electronic device of any other processing data or image.
As shown in Figure 1, the Connectorized fiber optic cabling 130 is to be connected to the optical transmitting and receiving component 110, it is used for transmission optics letter
Number.The Connectorized fiber optic cabling 130 may include at least one or more fiber cores, for allowing optical signalling to transmit in fiber cores.
Referring to Fig. 1, the electronic device 101 may include processor 103, any kind of processing can be represented electrically
And/or the processing component of optics I/O signal.It will be appreciated that the processor 103 can be a single treatment device, or more
A separated device.The processor 103 may include or can be a microprocessor, can program logic device or array, miniature
Controller, signal processor or certain combinations.
Fig. 2-Fig. 4 is please referred to, is the schematic diagram of an embodiment of the utility model optical transmitting and receiving component.The present embodiment mentions
Optical transmitting and receiving component 110 out may include substrate 111, processor 112, light emitting sub-assembly 113, light-receiving sub-assembly 114, connect
Connect device 115, shell 116, connecting plate 117 and fixator 118.Substrate 111 can have opposite first surface 111a and the second table
Face 111b, substrate 111 is, for example, printed circuit board (PCB) or ceramic substrate, and may include such as pin or connected ball, for being situated between
It is connected to an external device (ED).Processor 112 is to be connected to substrate 111, and processor 112 can be any kind of processor crystal grain or light
IC is learned, rather than is limited to any specific processor type.Light emitting sub-assembly 113 and light-receiving sub-assembly 114 are to be connected to
Processor 112 on substrate 111 is respectively used to emit and receive optical signal.Light emitting sub-assembly 113 and light-receiving sub-assembly
114 may include transmitting the transmit circuit of electronic signal and receiving circuit, more specifically, being the e-mail for handling corresponding optical signal
Number timing or other agreements in terms of item.Shell 116 can have inner space, to be installed with substrate 111, processor 112,
Light emitting sub-assembly 113, light-receiving sub-assembly 114, connector 115, connecting plate 117 and fixator 118.Connecting plate 117 is to connect
It is connected between substrate 111 and light emitting sub-assembly 113, fixator 118 can be used for setting for positioning and fixing light emitting sub-assembly 113
It sets, to maintain the performance losses engaged between optical-fibre channel and optical transceiver module and reliability.
Fig. 4, Fig. 5 A, Fig. 5 B are please referred to, the substrate 111 is arranged in the shell 116, and the substrate 111 can wrap
At least one protrusion 111c and at least one recess portion 111d are included, protrusion 111c is to protrude from substrate 111, and recess portion 111d is formed at
At least side of protrusion 111c.Wherein, light emitting sub-assembly 113 can be located in recess portion 111d.Also that is, light emitting sub-assembly
113 may be disposed at at least side of protrusion 111c.Being worth noting is, circuit or IC chip can also be formed in the protrusion of substrate 111
On the surface 111c, to increase the setting area of circuit.
In addition, in some embodiments, the opposite first surface 111a and second surface 111b of substrate 111 all may be provided with
Different circuit, for the circuit, chip or component of different function to be arranged.For example, light-receiving sub-assembly 114 may be disposed at
On the first surface 111a of substrate 111, and processor 112 and IC chip (such as, but not limited to LDD, PA, CDR, dsp chip etc.)
It may be disposed on the second surface 111b of substrate 111.In this way, the installation space of circuit or chip can be increased, and reduction can be corresponded to
The size of substrate 111.In some embodiments, light-receiving sub-assembly 114 can also pass through chip direct package (chip on
Board) mode is fixed on the first surface 111a of substrate 111.
As shown in figure 4, one or more light emitting sub-assemblies 113 can be connected to the substrate by connecting plate 117
111, and multiple light emitting sub-assemblies 113 can be staggered.Wherein, the light direction of multiple light emitting sub-assemblies 113 is (i.e.
The injection direction of optical signal) between have an angle, this angle be, for example, between 90 degree between 180 degree, that is, multiple light hair
Arrangement can be arranged with being staggered front to back by penetrating between sub-assembly 113.When between multiple light emitting sub-assemblies 113 be front and back interlacedly
When setting arrangement, the light direction of multiple light emitting sub-assemblies 113 can be about mutually opposite or mutually different, i.e., multiple light hairs
The angle penetrated between the light direction of sub-assembly 113 is about 180 degree.
In different embodiments, the diameter or width of closed type shell 113b is greater than the diameter or width of tubular element 113c
Degree.In this way, allowing multiple light emitting sub-assemblies 113 more by being staggered front to back arrangement between multiple light emitting sub-assemblies 113
It is closely aligned configuration, to reduce the configuration space of multiple light emitting sub-assemblies 113, thus can be by more light emitting sub-assemblies
113 configure and are packaged in a small-sized optical transmitting and receiving component 110, realize the miniaturization of optical transmitting and receiving component.
As shown in fig. 6, in various embodiments, multiple light emitting sub-assemblies 113 can be located separately the upper and lower of substrate 111
Two sides, and be staggered, thus realize multiple being staggered in the two sides up and down of substrate 111 of light emitting sub-assembly 113.
As shown in fig. 6, in various embodiments, multiple light emitting sub-assemblies 113 can be located separately the same of substrate 111
Side, and be staggered, thus realize multiple being staggered in the same side of substrate 111 of light emitting sub-assembly 113.
As shown in fig. 7, in various embodiments, two or more (such as three or more) light emitting sub-assemblies
113 can be intertwined, to realize being staggered for more light emitting sub-assemblies 113.
In the embodiments of the present invention, as shown in figure 4, multiple light emitting sub-assemblies 113 can also be staggered up and down,
And it is obliquely installed simultaneously.At this point, the front and back end size due to light emitting sub-assembly 113 is different, thus it can more closely arrange and match
It is placed in optical transmitting and receiving component 110, the miniaturization of optical transceiver module is better achieved.
Referring to Fig. 8, in various embodiments, each light emitting sub-assembly 113 may also include temperature control unit
119, the temperature control unit 119 may be provided in closed type shell 113b.In some embodiments, the temperature control is single
Member 119 may include that thermistor 119a and thermoelectric cooler 119b, the thermistor 119a are fixed on the optical transmitting set
On the pedestal of 113a, the thermoelectric cooler 119b can be for example fixed in the closed type shell 113b and close to optical transmitting set
113a, the thermistor 119a and the thermoelectric cooler 119b are electrically connected.In the present embodiment, pass through the light emitting
The temperature height of device 113a changes the resistance value size of the thermistor 119a, therefore by the thermistor 119a, it can detect
To the temperature of the optical transmitting set 113a.Then, by controlling the current direction of the thermoelectric cooler 119b, light hair can be cooled down
The temperature of emitter 113a is worked within a reasonable temperature range (such as in 40-50 degree) with controlling the optical transmitting set 113a, is subtracted
There is a phenomenon where wave length shifts by the optical transmitting set 113a caused by lacking because of temperature change.Furthermore since light emitting sub-assembly 113 is whole
The heat load of body can be greatly reduced, thus can reduce the power consumption of light emitting sub-assembly 113.For example, the single light hair
The power consumption range for penetrating sub-assembly 113 can be reduced in 0.1-0.2W, such as the power consumption of four light emitting sub-assemblies 113
Range can then be reduced in 0.4-0.8W.In the present embodiment, the thermistor 119a and thermoelectric cooler 119b can be such as
It is fixed on by heat-conducting glue on the pedestal of optical transmitting set 113a.
As shown in figure 3, outer housing 116 is for protection and assembling substrates 111, processor 112, multiple light emitting sub-assemblies
113, light-receiving sub-assembly 114 and connecting plate 117.In other embodiments, optical transmitting and receiving component 110 may also include planar light-
Wave chip (PLC) and modulator.Planar light-wave chip can for light transmission and its be converted into electronic signal the whole of one plane be provided
Seaming element, vice versa.It is understood that planar light-wave chip (PLC) function can also be integrated in connector 115
In.In the present embodiment, the shell 116 may include upper housing 116a and lower case 116b, upper housing 116a and lower case
116b is combined into one, and can form inner space, to be installed with substrate 111, processor 112, multiple light emitting sub-assemblies
113, light-receiving sub-assembly 114 and connecting plate 117.In some embodiments, the shell 116 can be for example made of metal, with
With not only can electrical shielding package circuit wherein and also can also by electronic circuit generate heat be effectively dissipated it is described
The function of 116 outside of shell.
As shown in figure 4, connecting plate 117 is connected between substrate 111 and light emitting sub-assembly 113, to determine light
Emit sub-assembly 113, and light emitting sub-assembly 113 is allowed to be electrically connected on substrate 111.Also that is, by connecting plate 117, base
Signal can be mutually transmitted between plate 111 and light emitting sub-assembly 113.Specifically, connecting plate 117 can be for example including flexible circuit board
Or flexible printed wiring board (FPC), to transmit signal between substrate 111 and light emitting sub-assembly 113.
Also, as shown in figure 4, allowing light emitting sub-assembly 113 to be arranged at the recess portion of substrate 111 by connecting plate 117
In 111d.Specifically, connecting plate 117 may be disposed in the recess portion 111d of substrate 111, and be connected to substrate 111.And light emitting time
Component 113 may be disposed on connecting plate 117, and be connected to connecting plate 117.Therefore, pass through connecting plate 117, light emitting sub-assembly
113 are arranged in the recess portion 111d of substrate 111, and are electrically connected at substrate 111.
Also, as shown in figure 4, connecting plate 117 may include the first connecting plate 117a and the second connecting plate 117b.In some implementations
In example, one end of the first connecting plate 117a may connect to the first surface 111a of substrate 111, and one end of the second connecting plate 117b can
It is connected to the second surface 111b of substrate 111.Therefore, pass through the first connecting plate 117a and the second connecting plate 117b, multiple light hairs
The circuit that sub-assembly 113 can be electrically connected on the opposite sides surface of substrate 111 is penetrated, and staggeredly matching for upper and lower position can be formed
It sets, thus multiple closed type light emitting sub-assemblies 113 can be configured and be packaged in a more small-sized optical transmitting and receiving component 110,
Realize the miniaturization of optical transceiver module.
So without being limited thereto, in some embodiments, the first connecting plate 117a and the second connecting plate 117b also may connect to base
On the same side surface (first surface 111a or second surface 111b) of plate 111.
As shown in figure 4, the first connecting plate 117a and the second connecting plate 117b can have different length.Specifically, one
In a little embodiments, the length of the second connecting plate 117b can be greater than the length of the first connecting plate 117a.Therefore, pass through the first connecting plate
The different length of 117a and the second connecting plate 117b, multiple light emitting sub-assemblies 113 can form the interconnected of front-rear position, because
And can multiple light emitting sub-assemblies 113 be configured and be packaged in a more small-sized optical transmitting and receiving component 110 simultaneously, realize optics
The miniaturization of transceiver module.
Also, as shown in figure 4, one end of connecting plate 117 can have bending structure, and it is connected to light emitting sub-assembly 113, this
Tilt angle, position or other arrangements that bending structure (not indicating) can correspond to light emitting sub-assembly 113 bend to be formed, with
Corresponding to being arranged for light emitting sub-assembly 113.
Furthermore when the IC on the substrate of optical transmitting and receiving component 110 111 is when carrying out high speed operation, can generate biggish
Power consumption and heat.At this point, by connecting plate 117, can appropriate separating base plate 111 and light emitting sub-assembly 113, avoid heat direct
Light emitting sub-assembly 113 is reached, thus power consumption and the optical transmitting and receiving component 110 of temperature control unit 119 can be effectively reduced
Whole power consumption.
In different embodiments, pass through the setting arrangement and/or the design of substrate 111 of light emitting sub-assembly 113, substrate
111 size can be to meet QSFP28, the design of the requirement of QSFP+ or Micro QSFP+.For example, in some embodiments,
The width of substrate 111 is about 11 ~ 18mm, and in some embodiments, the length of substrate 111 is about 58 ~ 73mm, to meet
The requirement of QSFP+ or QSFP28.Therefore, it by the setting arrangement and/or the design of substrate 111 of light emitting sub-assembly 113, can incite somebody to action
Multiple light emitting sub-assemblies 113 are configured and are packaged in a small-sized optical transceiver module 110, realize the small of optical transceiver module
Type.
The optical transceiver module of the utility model it is configurable and encapsulate multiple light emitting sub-assemblies and light-receiving sub-assembly in
In one small-sized optical transceiver module, the miniaturization of optical transceiver module is realized.
Embodiment described above is only preferred embodiments for fully illustrating the utility model, the utility model
Protection scope it is without being limited thereto.Those skilled in the art made equivalent substitute or change on the basis of the utility model
It changes, both is within the protection scope of the present invention.The protection scope of the utility model is subject to claims.
Claims (10)
1. a kind of optical transmitting and receiving component characterized by comprising
Shell；
Substrate is arranged in the shell；
Light-receiving sub-assembly, setting is on the substrate；
Multiple light emitting sub-assemblies, are connected to the substrate, wherein the multiple light emitting sub-assembly is to be staggered, it is described more
With one between 90 degree of angles between 180 degree between the light direction of a light emitting sub-assembly.
2. optical transmitting and receiving component according to claim 1, it is characterised in that: the multiple light emitting sub-assembly is located at
The upper and lower two sides of the substrate, and be staggered.
3. optical transmitting and receiving component according to claim 1, it is characterised in that: the multiple light emitting sub-assembly is located at
The same side of the substrate, and be staggered.
4. optical transmitting and receiving component according to claim 1, it is characterised in that: the multiple light emitting sub-assembly be two with
On light emitting sub-assembly, and be intertwined.
5. optical transmitting and receiving component according to claim 1, it is characterised in that: it further include connecting plate, the light emitting time group
Part is that the substrate is connected to by the connecting plate.
6. optical transmitting and receiving component according to claim 5, it is characterised in that: the connecting plate includes the first connecting plate and the
Two connecting plates.
7. optical transmitting and receiving component according to claim 6, it is characterised in that: one end of first connecting plate is connected to institute
The first surface of substrate is stated, one end of second connecting plate is connected to the second surface of the substrate.
8. optical transmitting and receiving component according to claim 6, it is characterised in that: first connecting plate and second connection
Plate has different length.
9. optical transmitting and receiving component according to claim 5, it is characterised in that: the substrate includes at least one protrusion and extremely
A few recess portion, the recess portion are formed at at least side of the protrusion, and the light emitting sub-assembly is arranged at the base
In the recess portion of plate.
10. a kind of Connectorized fiber optic cabling module, it is characterised in that: include:
Connectorized fiber optic cabling；
Optical transmitting and receiving component；The optical transmitting and receiving component includes:
Shell；
Substrate is arranged in the shell；
Light-receiving sub-assembly, setting is on the substrate；
Multiple light emitting sub-assemblies, are connected to the substrate, wherein the multiple light emitting sub-assembly is to be staggered, it is described more
With one between 90 degree of angles between 180 degree between the light direction of a light emitting sub-assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920339416.4U CN209590345U (en) | 2019-03-18 | 2019-03-18 | Optical transmitting and receiving component and Connectorized fiber optic cabling module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920339416.4U CN209590345U (en) | 2019-03-18 | 2019-03-18 | Optical transmitting and receiving component and Connectorized fiber optic cabling module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209590345U true CN209590345U (en) | 2019-11-05 |
Family
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|---|---|---|---|
| CN201920339416.4U Expired - Fee Related CN209590345U (en) | 2019-03-18 | 2019-03-18 | Optical transmitting and receiving component and Connectorized fiber optic cabling module |
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| CN (1) | CN209590345U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020187034A1 (en) * | 2019-03-18 | 2020-09-24 | 佑胜光电股份有限公司 | Optical transceiver module and optical fiber cable module |
| WO2021164669A1 (en) * | 2020-02-21 | 2021-08-26 | 佑胜光电股份有限公司 | Optical transceiver module and optical fiber cable module |
-
2019
- 2019-03-18 CN CN201920339416.4U patent/CN209590345U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020187034A1 (en) * | 2019-03-18 | 2020-09-24 | 佑胜光电股份有限公司 | Optical transceiver module and optical fiber cable module |
| WO2021164669A1 (en) * | 2020-02-21 | 2021-08-26 | 佑胜光电股份有限公司 | Optical transceiver module and optical fiber cable module |
| CN113544563A (en) * | 2020-02-21 | 2021-10-22 | 佑胜光电股份有限公司 | Optical transceiver module and optical fiber cable module |
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