CN209572227U - A kind of large scale Through-hole reflow connects the welding structure of device - Google Patents
A kind of large scale Through-hole reflow connects the welding structure of device Download PDFInfo
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- CN209572227U CN209572227U CN201920007224.3U CN201920007224U CN209572227U CN 209572227 U CN209572227 U CN 209572227U CN 201920007224 U CN201920007224 U CN 201920007224U CN 209572227 U CN209572227 U CN 209572227U
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- leg
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Abstract
The utility model discloses the welding structures that a kind of large scale Through-hole reflow connects device, including PCB and the HTR device for being set to the face PCBT, the HTR device leads to several legs, accordingly, the PCB offers several leg through-holes, the face B of the PCB is additionally provided with a fixture, hollow out setting in position among the fixture, the fixture are also extended with several support molten tin baths towards hollow out position, and the support molten tin bath corresponds to leg setting.Implement the utility model to pass through in the face T of PCB, it will be in the corresponding leg through-hole in each leg insertion position of HTR device, and use Through-hole reflow connection technology, the HTR device is integrated with PCB, and holding the tin cream for flowing down or forcing down and with support molten tin bath prevents tin cream to be lost or pollute, meet and weld stanniferous amount inside and out leg through-hole, save and artificially add tin, reduces artificial investment.
Description
Technical field
The utility model relates to the welding technology fields of grafting device, relate more specifically to a kind of large scale Through-hole reflow
Connect the welding structure of device.
Background technique
Electronic product connects (HTRough-hole Reflow, abbreviation HTR) device using Through-hole reflow more and more,
Common HTR device is generally provided with several legs at its back side, by the way that the leg of HTR device is welded in printed circuit board
On the corresponding Through-hole reflow foot porose disc of (Printed Circuit Board, abbreviation PCB), HTR device is set to PCB
On.In general, setting the one side that HTR device is arranged on PCB as front, also known as the face T (TOP)；Corresponding, the another side of PCB is
The back side, the also referred to as face B (BOT).
Currently, large scale through-hole is directed to, because tin cream has certain fluidity to stop one in large scale through-hole after print solder paste
Can to flowing down, because device leg is inserted into after patch plug-in unit, cause in through-hole only more remaining tin cream by device insertion downwards
It falls, causes the loss of tin amount that tin amount is caused not enough to lack phenomena such as tin degree is inadequate thoroughly in tin and through-hole.In addition, the tin cream fallen can be dirty
Printer platform and work top connection platform etc. are contaminated, needs 100% manually to add tin using soldering iron when the saturating tin of tin is not up to standard less, adds
It is checked and is cleaned again after complete tin, waste of time.
Utility model content
In order to solve the deficiencies in the prior art, it is logical that the utility model provides a kind of large scale for preventing tin cream to be lost
The welding structure of hole reflow soldering device.
The utility model technical effect to be achieved passes through following scheme and realizes: a kind of large scale Through-hole reflow connects device
The welding structure of part, including PCB and the HTR device for being set to the face PCBT, the HTR device leads to several legs, corresponding
Ground, the PCB offer several leg through-holes, and the face B of the PCB is additionally provided with a fixture, and position is engraved among the fixture
Sky setting, the fixture are also extended with several support molten tin baths towards hollow out position, and the support molten tin bath corresponds to leg setting.
Preferably, the diameter of the leg through-hole of the PCB is in 3mm or more.
Preferably, the leg of the HTR device is pierced by the distance for also exceeding PCB2mm after the leg through-hole of PCB.
Preferably, the depth of the support molten tin bath is 1.2mm, and holding in the palm the hanging spacing between molten tin bath and PCB is 1.1mm.
Preferably, the support molten tin bath is anti-welding material.
Preferably, before HTR device and PCB welding, the face B of the PCB is also formed with the around the leg through-hole
One tin cream, the face T of the PCB, the covering leg through-hole are also formed with the second tin cream.
The utility model has the advantage that
The utility model is in the face T of PCB, by the corresponding leg through-hole in each leg insertion position of HTR device, and
And use Through-hole reflow connection technology, the HTR device is integrated with PCB, and with hold in the palm molten tin bath hold flow down or
Forcing down next tin cream prevents tin cream to be lost or pollute, and meets and welds stanniferous amount inside and out leg through-hole, saves artificial add
Tin reduces artificial investment.
Detailed description of the invention
Fig. 1 connects the welded detonation configuration signal of device for large scale Through-hole reflow a kind of in the utility model
Figure；
Fig. 2 is the schematic perspective view of fixture display support molten tin bath in Fig. 1；
Fig. 3 is the welded partial profile structure of the utility model；
Fig. 4 is that the planar structure schematic diagram of the first tin cream is arranged in the leg through-hole in the face PCBB in the utility model；
Fig. 5 is that the planar structure schematic diagram of the second tin cream is arranged in the leg through-hole in the face PCBT in the utility model.
Specific embodiment
The utility model is described in detail with reference to the accompanying drawings and examples, the examples of the embodiments are in attached drawing
In show, in which the same or similar labels are throughly indicated same or similar elements or with the same or similar functions
Element.The embodiments described below with reference to the accompanying drawings are exemplary, it is intended to for explaining the utility model, and cannot understand
For limitations of the present invention.
In the description of the present invention, it should be understood that term " length ", " width ", "upper", "lower", " preceding ",
The orientation or positional relationship of the instructions such as " rear ", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside" be based on
Orientation or positional relationship shown in the drawings, is merely for convenience of describing the present invention and simplifying the description, rather than instruction or dark
Show that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as pair
The limitation of the utility model.
In addition, term " first ", " second ", " third " are used for description purposes only, it is not understood to indicate or imply phase
To importance or implicitly indicate the quantity of indicated technical characteristic." first ", " second ", " third " are defined as a result,
Feature can explicitly or implicitly include one or more this feature." multiple " contain in the description of the present invention,
Justice is two or more, unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " Gu
Calmly ", the terms such as " setting " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；
It can be mechanical connection, be also possible to be electrically connected；It can be directly connected, can also may be used also indirectly connected through an intermediary
To be the interaction relationship of connection or two elements inside two elements.For the ordinary skill in the art,
The concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
In conjunction with shown in Fig. 1-Fig. 3, the utility model embodiment provides the welding that a kind of large scale Through-hole reflow connects device
Structure, including PCB100 and the HTR device 200 for being set to the face PCB100T, the HTR device 200 leads to several legs
210, accordingly, the PCB100 offer several leg through-holes 110, the leg 210 passes through the leg through-hole 110 simultaneously
Pass through solder bond.Occur tin cream loss, few abnormal problems such as tin and saturating tin in order to prevent, the face B of the PCB100 is also set up
There is a fixture 300, the intermediate position hollow out setting of the fixture 300, the fixture 300 is also extended with several towards hollow out position
A support molten tin bath 310, the corresponding leg 210 of the support molten tin bath 310 are arranged.
The effect of the leg 210 of HTR device described in the utility model 200 predominantly reinforcement HTR device and PCB100
Between fixation in general may be provided with more than two even number legs 210 on HTR device, it is assumed that the utility model is real
The HTR device tool in example is applied there are two leg 210, in order to enable HTR device can be firmly secured on PCB100, PCB100
There are two upper settings for accommodating and welding the leg through-hole 110 of the leg 210, is then correspondingly provided with two on fixture 300
A support molten tin bath 310.In the face T of PCB100, by each corresponding leg through-hole 110 in 210 insertion position of leg of HTR device
In, and Through-hole reflow connection technology is used, the HTR device is integrated with PCB100, and with support 310 support of molten tin bath
Firmly flow down or forcing down the tin cream come prevents tin cream to be lost or pollute, meets welding inside and out leg through-hole 110 and contain
Tin amount saves and artificially adds tin, reduces artificial investment.
Large scale through-hole described in the utility model refers to the 110 diameter D1 of leg through-hole of PCB100 in 3mm or more.Its
In, the leg 210 of the HTR device should also exceed the distance of PCB100 2mm after the leg through-hole 110 of PCB100, described
The depth for holding in the palm molten tin bath 310 is preferably 1.2mm, and holding in the palm the hanging spacing between molten tin bath 310 and PCB100 is preferably 1.1mm, can be made
The smooth thermally equivalent of Reflow Soldering heat energy, avoids cold welding or does not melt tin, reach welding standard.
The support molten tin bath 310 of the utility model should select anti-welding material, such as alloy, be conducive to tin cream is allowed sufficiently to absorb heat, at
Type.The intermediate position hollow out of the fixture 300 is arranged also for making the heat of Reflow Soldering be easier to distribute, be conducive to tin cream at
Type.
It should be understood that the cross-sectional shape of the leg 210, leg through-hole 110 and the inner cross sectional of support molten tin bath 310
Face shape is not limited to shape as shown in the figure, is also possible to the other shapes such as rectangular or triangle.
The leg through-hole 110 of the middle PCB100 of the utility model is also formed with as a further improvement of the utility model,
Orifice ring (dotted dash area in Fig. 3), usual orifice ring is made using metal, when in order to avoid the reflux of leg through-hole 110, hole
Ring eats up a certain amount of tin, as illustrated in figures 4-5, before HTR device 200 and PCB100 welding, the face B of the PCB100, ring
Being also formed with the first tin cream around the leg through-hole 110, (diagonal line hatches part, wherein dot-hatched part is face shared by orifice ring
Product), the face T of the PCB100, the covering leg through-hole 110 are also formed with the second tin cream (diagonal line hatches part, wherein dotted
Dash area is orifice ring occupied area), it can make to eat tin inside and out leg through-hole 110 full.First tin cream and
Second tin cream can be made by steel mesh opening, be routine techniques, do not repeated.
The welding structure of the utility model is compared with structure before, without manually adding tin, one-pass molding.According to needing in the past
Manually plus the welding technique of tin monthly to press the budget of 2K order, every pcs flows back 2 legs 210 totally there are two large scale through-hole
(when on PCB100 there are two HTR device 200, then the quantity of leg 210 is four, and acquired results are then double) calculates, often
A pin foot adds tin/inspection/scavenging period to be 30s/pcs, then 2000*2pcs*30s/3600s*28rmb/h=930rmb, amounts to
* 12 months=11160 yuan/year of expense=930 yuan.Therefore, it using the welding structure of the utility model, can substantially save
The cost of 11160 yuan/year.
Finally, it should be noted that above embodiments be only to illustrate the technical solution of the embodiment of the present invention rather than to its into
Row limitation, although the embodiment of the present invention is described in detail referring to preferred embodiment, those skilled in the art
It should be understood that the technical solution of the embodiment of the present invention can be still modified or replaced equivalently, and these are modified or wait
The range of modified technical solution disengaging technical solution of the embodiment of the present invention cannot also be made with replacement.
Claims (6)
1. a kind of large scale Through-hole reflow connects the welding structure of device, including PCB and the HTR device for being set to the face PCBT, institute
State HTR device and lead to several legs, accordingly, the PCB offer several leg through-holes, which is characterized in that it is described
The face B of PCB is additionally provided with a fixture, and the setting of position hollow out, the fixture are also extended with towards hollow out position among the fixture
Several support molten tin baths, the support molten tin bath correspond to leg setting.
2. the welding structure that a kind of large scale Through-hole reflow as described in claim 1 connects device, which is characterized in that described
The diameter of the leg through-hole of PCB is in 3mm or more.
3. the welding structure that a kind of large scale Through-hole reflow as claimed in claim 2 connects device, which is characterized in that described
The leg of HTR device is pierced by the distance for also exceeding PCB2mm after the leg through-hole of PCB.
4. the welding structure that a kind of large scale Through-hole reflow as claimed in claim 3 connects device, which is characterized in that the support
The depth of molten tin bath is 1.2mm, and holding in the palm the hanging spacing between molten tin bath and PCB is 1.1mm.
5. a kind of large scale Through-hole reflow according to any one of claims 1-4 connects the welding structure of device, feature exists
In the support molten tin bath is anti-welding material.
6. the welding structure that a kind of large scale Through-hole reflow as described in claim 1 connects device, which is characterized in that in HTR
Before device and PCB welding, the face B of the PCB is also formed with the first tin cream around the leg through-hole, the face T of the PCB,
It covers the leg through-hole and is also formed with the second tin cream.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920007224.3U CN209572227U (en) | 2019-01-03 | 2019-01-03 | A kind of large scale Through-hole reflow connects the welding structure of device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920007224.3U CN209572227U (en) | 2019-01-03 | 2019-01-03 | A kind of large scale Through-hole reflow connects the welding structure of device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209572227U true CN209572227U (en) | 2019-11-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920007224.3U Active CN209572227U (en) | 2019-01-03 | 2019-01-03 | A kind of large scale Through-hole reflow connects the welding structure of device |
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| CN (1) | CN209572227U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111315152A (en) * | 2019-11-27 | 2020-06-19 | 浪潮商用机器有限公司 | Welding method of PIH (plasma enhanced H) element |
| CN115066108A (en) * | 2022-06-21 | 2022-09-16 | 中国电子科技集团公司第四十三研究所 | Assembling process of input/output pins of microcircuit module |
-
2019
- 2019-01-03 CN CN201920007224.3U patent/CN209572227U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111315152A (en) * | 2019-11-27 | 2020-06-19 | 浪潮商用机器有限公司 | Welding method of PIH (plasma enhanced H) element |
| CN115066108A (en) * | 2022-06-21 | 2022-09-16 | 中国电子科技集团公司第四十三研究所 | Assembling process of input/output pins of microcircuit module |
| CN115066108B (en) * | 2022-06-21 | 2024-03-22 | 中国电子科技集团公司第四十三研究所 | Assembling process for input/output pins of microcircuit module |
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