CN209520454U - Device chip being welded on pcb board - Google Patents

Device chip being welded on pcb board Download PDF

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Publication number
CN209520454U
CN209520454U CN201821621240.3U CN201821621240U CN209520454U CN 209520454 U CN209520454 U CN 209520454U CN 201821621240 U CN201821621240 U CN 201821621240U CN 209520454 U CN209520454 U CN 209520454U
Authority
CN
China
Prior art keywords
pcb board
straight line
platform
mould group
line mould
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201821621240.3U
Other languages
Chinese (zh)
Inventor
刘艳伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Wide-Sighted Intelligent Technology Co Ltd
Original Assignee
Suzhou Wide-Sighted Intelligent Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Wide-Sighted Intelligent Technology Co Ltd filed Critical Suzhou Wide-Sighted Intelligent Technology Co Ltd
Priority to CN201821621240.3U priority Critical patent/CN209520454U/en
Application granted granted Critical
Publication of CN209520454U publication Critical patent/CN209520454U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of devices that chip is welded on pcb board, including cabinet body and platform, mounting groove is provided on platform, platform side is equipped with dust removal assembly, destatic component, except water assembly, column there are two being set on platform, it is connected at the top of two columns by crossbeam, it is transversely equipped with by motor-driven first straight line mould group on crossbeam, inverted L-shaped connecting plate is fixed on the sliding block of straight line mould group, have along longitudinal direction on L shape connecting plate by motor-driven second straight line mould group, being arranged side by side on the sliding block of second straight line mould group has grasping mechanism, Shua Xi mechanism and welding mechanism.The utility model using dust removal assembly, destatic component, except water assembly removes water pcb board, dedusting, the processing such as destatics, using Shua Xi mechanism to the solder joint brush tin cream of pcb board, using grasping mechanism grab chips and it is placed on reasonable position, pcb board and chip are welded together using welding mechanism, worker is replaced using machine, it eliminates worker to bend over to weld, improves production efficiency.

Description

Device chip being welded on pcb board
Technical field
The utility model relates to a kind of devices that chip is welded on pcb board.
Background technique
The operation of the existing chip on pcb board is by manually having been manually done, due to very high to precision, so worker It needs curved waist closer to stare at, therefore can feel the soreness of waist for a long time, be easy to obtain prolapse of lumbar intervertebral disc, while worker's welding production Low efficiency.
Utility model content
To overcome disadvantages mentioned above, can be automatic the purpose of this utility model is to provide one kind and efficiently chip be welded on Device on pcb board.
In order to reach the goals above, the technical solution adopted in the utility model is: a kind of that chip is welded on PCB plate Device, including cabinet body, the interior of the cabinet is equipped with platform, the mounting groove for fixing pcb board is provided on the platform, The platform side is equipped with dust removal assembly, destatics component, except water assembly, sets that there are two columns on the platform, described in two It is connected at the top of column by crossbeam, is transversely equipped with by motor-driven first straight line mould group, the straight line mould on the crossbeam It is fixed with inverted L-shaped connecting plate on the sliding block of group, is had along longitudinal direction on the L shape connecting plate by motor-driven second straight line mould group, Being arranged side by side on the sliding block of the second straight line mould group has grasping mechanism, Shua Xi mechanism, is additionally provided with bonding machine on the platform Structure.The utility model has the beneficial effects that determine the position of pcb board using mounting groove, using dust removal assembly, destatics component, removes Water assembly removes water pcb board, dedusting, the processing such as destatics and uses using Shua Xi mechanism to the solder joint brush tin cream of pcb board Grasping mechanism grab chips are simultaneously placed on reasonable position, are welded together pcb board and chip using welding mechanism, are adopted Worker is replaced with machine, worker is eliminated and bends over to weld, improve production efficiency.
Preferably, the dust removal assembly includes the first cylinder on a platform for being fixed on mounting groove side, first gas Cylinder is horizontally disposed, and U-bracket is fixed on the telescopic rod of first cylinder, is provided in the two side walls of the U-bracket Shaft, the shaft outer cover is equipped with roller, and its both ends is rotatablely connected with U-bracket two side walls respectively.
Preferably, the component that destatics includes ion blower.
Preferably, described except water assembly includes the second cylinder on a platform for being fixed on mounting groove side, second gas Sponge is fixed on the telescopic rod of cylinder.
Preferably, the grasping mechanism includes the clamping jaw cylinder being set on the sliding block of the second straight line mould group.
Preferably, the Shua Xi mechanism includes the brush being set on the sliding block of the second straight line mould group.
Preferably, the welding mechanism includes the third straight line mould group being set on platform, the third straight line mould group Third cylinder is provided on sliding block, the telescopic rod of the third cylinder is connected with electric iron, and the electric iron is connected with power supply, institute It states third cylinder side and is equipped with annular placement section, the telescopic rod of the third cylinder drives the electric iron to pass through the ring when stretching out Shape placement section.
Preferably, the material of the annular placement section uses refractory ceramics, can prevent the high temperature in heated condition Electric iron by annular placement section thermal deformation, extend the service life of annular placement section.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model.
Specific embodiment
The preferred embodiment of the utility model is described in detail with reference to the accompanying drawing, so that the advantages of the utility model It can be easier to be readily appreciated by one skilled in the art with feature, to make the protection scope of the utility model apparent clear Define.
Referring to figure 1, chip is welded on the device on pcb board, including cabinet body 1, institute by one of the present embodiment It states and is equipped with platform 2 inside cabinet body 1, the mounting groove 4 for fixing pcb board 3 is provided on the platform 2,2 side of platform is set There is dust removal assembly, destatic component, except water assembly, set on the platform there are two column 5, is passed through at the top of two columns 5 Crossbeam 6 is connected, and is transversely equipped on the crossbeam 6 by motor-driven first straight line mould group 7, the first straight line mould group 7 It is fixed with inverted L-shaped connecting plate 8 on sliding block, has along longitudinal direction on the L shape connecting plate 8 by motor-driven second straight line mould group 9, institute It states to be arranged side by side on the sliding block of second straight line mould group 9 and has grasping mechanism, Shua Xi mechanism, be additionally provided with bonding machine on the platform 2 Structure.
Specifically, the dust removal assembly includes the first cylinder 10 on a platform 2 for being fixed on 4 side of mounting groove, described One cylinder 10 is horizontally disposed, is fixed with U-bracket 11 on the telescopic rod of first cylinder 10, and two of the U-bracket 11 Be provided with shaft 12 on side wall, 12 outer cover of shaft is equipped with roller 13, and its both ends respectively with 11 two side walls of U-bracket Rotation connection.
The component that destatics includes ion blower 14.
The water assembly that removes includes the second cylinder on a platform 2 for being fixed on 4 side of mounting groove, and second cylinder is stretched Sponge is fixed on contracting bar.
The grasping mechanism includes the clamping jaw cylinder 15 being set on the sliding block 91 of the second straight line mould group 9, the clamping jaw Cylinder 15 is fixed on inverted T-shaped fixed frame 19 by a connecting column, which is fixed on second straight line mould group 9 On sliding block 91.
The Shua Xi mechanism includes the brush 16 being fixed on inverted T-shaped fixed frame 19, which is fixed by inverted T-shaped Frame 19 is connected with the sliding block 91 of second straight line mould group 9.
The welding mechanism includes the third straight line mould group 22 being set on platform, the cunning of the third straight line mould group 22 Third cylinder 21 is provided on block, the telescopic rod of the third cylinder 21 is connected with electric iron 18, the electric iron 18 and power supply It is connected, 21 side of third cylinder is equipped with annular placement section 17, when the telescopic rod of the third cylinder 21 stretches out described in drive Electric iron 18 passes through the annular placement section 17.In order to extend the service life of annular placement section 17, the annular placement section 17 Material uses refractory ceramics.
Working cavities are equipped with inside cabinet body 1, the front of cabinet body 1 is equipped with the sliding door that can be moved up and down, which uses cylinder It pushes, for the prior art, details are not described herein for this.1 inner top of cabinet body is equipped with the pipeline being connected with exhaust fan, is equipped in the pipeline Strainer and molecular sieve (strainer and molecular sieve be that details are not described herein for the prior art), can remove the wind that exhaust fan is pumped in In the moisture and dust that have, to input clean and dry wind into cabinet body 1.
Working principle:
Pcb board 3 is placed in mounting groove 4, opens the second cylinder, and under the drive back and forth of the second cylinder, sponge is by pcb board The water on 3 surfaces is removed, and after removing water, opens the first cylinder 10, and under the drive of the first cylinder 10, roller 13 is by 3 table of pcb board The dust in face is removed, and after dedusting, is opened ion blower 14, is removed the electrostatic on 3 surface of pcb board, electric motor starting, first straight line The sliding block of mould group 7 moves left and right so that brush 16 is moved on desktop the surface for being placed with the position of tin cream, electric motor starting, and Sliding block in two straight line mould groups 9 declines so that brush 16 dips tin cream, on the sliding block after dipping in second straight line mould group 9 It moving, the sliding block of first straight line mould group 7 moves left and right so that brush 16 reaches pcb board 3 and needs to put right above the position of chip, and second Sliding block in straight line mould group 9 decline so that brush 16 by tin cream brush on the solder joint on pcb board 3, the sliding block of first straight line mould group 7 It moves left and right so that brush 16 is removed, the clamping jaw cylinder 15 for accompanying chip 20 is moved to pcb board 3 and needs to put at the position of chip 20 So that pin is on solder joint, while making the heating of electric iron 18 that it be made to reach required temperature, and put weldering in 18 end of electric iron Tin, by the pin of chip 20 and tin cream with the tip of electric iron 18 gently by allowing enough tin to flow to after solder joint rapidly on solder joint Electric iron 18 is taken away, electric iron 18 again decontrols clamping jaw cylinder 15 after taking away after equal tin cooling is fixed.
Embodiment of above is only to illustrate the technical ideas and features of the present invention, and its object is to allow be familiar with this skill The people of art understands the content of the utility model and is implemented, and does not limit the protection scope of the present invention, and all According to the equivalent change or modification that the spirit of the present invention is substantially done, should all cover within the protection scope of the present utility model.

Claims (8)

1. a kind of device being welded on chip on pcb board, it is characterised in that: including cabinet body, the interior of the cabinet is equipped with platform, The mounting groove for fixing pcb board is provided on the platform, the platform side is equipped with dust removal assembly, destatics component, removes Water assembly is set on the platform there are two column, is connected at the top of two columns by crossbeam, is transversely set on the crossbeam Have by motor-driven first straight line mould group, inverted L-shaped connecting plate, the L shape connection are fixed on the sliding block of the straight line mould group Have along longitudinal direction on plate by motor-driven second straight line mould group, being arranged side by side on the sliding block of the second straight line mould group has gripper Structure, Shua Xi mechanism are additionally provided with welding mechanism on the platform.
2. the device according to claim 1 being welded on chip on pcb board, it is characterised in that: the dust removal assembly packet The first cylinder on the platform that one is fixed on mounting groove side is included, first cylinder is horizontally disposed, and first cylinder stretches It is fixed with U-bracket on bar, shaft is provided in the two side walls of the U-bracket, the shaft outer cover is equipped with roller, and Its both ends is rotatablely connected with U-bracket two side walls respectively.
3. the device according to claim 1 being welded on chip on pcb board, it is characterised in that: described to destatic component Including ion blower.
4. the device according to claim 1 being welded on chip on pcb board, it is characterised in that: the grasping mechanism packet Include the clamping jaw cylinder being set on the sliding block of the second straight line mould group.
5. the device according to claim 1 being welded on chip on pcb board, it is characterised in that: described to remove water assembly packet The second cylinder on the platform that one is fixed on mounting groove side is included, is fixed with sponge on the telescopic rod of second cylinder.
6. the device according to claim 1 being welded on chip on pcb board, it is characterised in that: Shua Xi mechanism packet Include the brush being set on the sliding block of the second straight line mould group.
7. the device according to claim 1 being welded on chip on pcb board, it is characterised in that: the welding mechanism packet The third straight line mould group being set on platform is included, is provided with third cylinder, the third on the sliding block of the third straight line mould group The telescopic rod of cylinder is connected with electric iron, and the electric iron is connected with power supply, and third cylinder side is equipped with annular placement section, The telescopic rod of the third cylinder drives the electric iron to pass through the annular placement section when stretching out.
8. the device according to claim 7 being welded on chip on pcb board, it is characterised in that: the annular placement section Material use refractory ceramics.
CN201821621240.3U 2018-09-30 2018-09-30 Device chip being welded on pcb board Expired - Fee Related CN209520454U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821621240.3U CN209520454U (en) 2018-09-30 2018-09-30 Device chip being welded on pcb board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821621240.3U CN209520454U (en) 2018-09-30 2018-09-30 Device chip being welded on pcb board

Publications (1)

Publication Number Publication Date
CN209520454U true CN209520454U (en) 2019-10-22

Family

ID=68211331

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201821621240.3U Expired - Fee Related CN209520454U (en) 2018-09-30 2018-09-30 Device chip being welded on pcb board

Country Status (1)

Country Link
CN (1) CN209520454U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111799641A (en) * 2020-06-24 2020-10-20 武汉锐科光纤激光技术股份有限公司 Automatic equipment for welding pump source

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111799641A (en) * 2020-06-24 2020-10-20 武汉锐科光纤激光技术股份有限公司 Automatic equipment for welding pump source

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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20191022