CN209508129U - A kind of High-temp.-resistant hot-melt adhesive band - Google Patents
A kind of High-temp.-resistant hot-melt adhesive band Download PDFInfo
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- CN209508129U CN209508129U CN201822030627.8U CN201822030627U CN209508129U CN 209508129 U CN209508129 U CN 209508129U CN 201822030627 U CN201822030627 U CN 201822030627U CN 209508129 U CN209508129 U CN 209508129U
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- melt adhesive
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- resistant
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Abstract
The utility model relates to Hot melt adhesive tape technical fields, specially a kind of High-temp.-resistant hot-melt adhesive band, including whole in band-like adhesive tape ontology, the adhesive tape ontology is by high-temperature-resistant layer, first hot melt adhesive layer, fibrous layer, second hot melt adhesive layer and base are successively bonded from top to bottom, the lower surface of the high-temperature-resistant layer is bonded with the upper surface of the first hot melt adhesive layer, the lower surface of first hot melt adhesive layer is bonded with the upper surface of fibrous layer, the lower surface of the fibrous layer is bonded with the upper surface of the second hot melt adhesive layer, the lower surface of second hot melt adhesive layer is bonded with the upper surface of base.So that adhesive tape is can adapt to hot environment, widened the use scope of adhesive tape significantly, increase the integral strength of adhesive tape ontology, there is very strong practicability.
Description
Technical field
The utility model relates to Hot melt adhesive tape technical field, specially a kind of High-temp.-resistant hot-melt adhesive band.
Background technique
Paper and plastics compound bag is the composite plastic woven bag for packaging powdered or granular solid material and Flexible articles,
It is using Polywoven Bag as substrate, after the tape casting is compound made of, be mainly used for pack chemical fertilizer, synthetic material, explosive, grain
Food or minerals etc..In the process of paper and plastics compound bag, it is in paper and plastics compound bag that being sticking, which is one of important process,
It sews on hot melt adhesive the packet paste by the way of heating up and down and securely, achievees the purpose that seal suture needle mouth and material leak-proof in bottom.Currently, row
The Hot melt adhesive tape generally used in the industry mainly includes base and hot melt adhesive layer, and hot melt adhesive layer is using EVA (ethene-vinyl acetate
Copolymer) it is used as adhesives.Since the fusing point of EVA is low, heat resistance is bad, it is only resistant to≤70 DEG C and not environmentally.Therefore,
This Hot melt adhesive tape can not be suitable for high turbid packaging material and environmental protection type packing.For this purpose, it is proposed that a kind of high temperature resistant heats
Adhesive tape.
Utility model content
It is mentioned above in the background art to solve the purpose of this utility model is to provide a kind of High-temp.-resistant hot-melt adhesive band
Problem.
To achieve the above object, the utility model provides the following technical solutions:
A kind of High-temp.-resistant hot-melt adhesive band, including it is whole be in band-like adhesive tape ontology, the adhesive tape ontology be by high-temperature-resistant layer,
First hot melt adhesive layer, fibrous layer, the second hot melt adhesive layer and base are successively bonded from top to bottom, the following table of the high-temperature-resistant layer
Face is bonded with the upper surface of the first hot melt adhesive layer, and the lower surface of first hot melt adhesive layer is bonded with the upper surface of fibrous layer, institute
The lower surface for stating fibrous layer is bonded with the upper surface of the second hot melt adhesive layer, the lower surface of second hot melt adhesive layer and base it is upper
Surface fitting.
Preferably, the high-temperature-resistant layer be epoxy resin layer, high-temperature-resistant layer with a thickness of 0.12-0.18mm.
Preferably, first hot melt adhesive layer and the second hot melt adhesive layer are polyethylene layer, the thickness of the first hot melt adhesive layer
For 0.09-0.12mm, the second hot melt adhesive layer with a thickness of 0.07-0.10mm.
Preferably, the fibrous layer be one of glass layer, PP belt, PET strip, fibrous layer with a thickness of 0.12-
0.15mm。
Preferably, the base be polytetrafluoroethylene ethylene layer, base with a thickness of 0.15-0.18mm.
Preferably, multiple first through hole are offered on the fibrous layer, multiple first through hole are distributed in matrix.
Preferably, multiple second through-holes are offered in the base, multiple second through-holes are distributed in matrix.
Preferably, multiple first through hole of matrix distribution are interspersed with multiple second through-holes that matrix is distributed.
Preferably, the first through hole and the second through-hole are cylindricity through-hole or diamond shape through-hole.
Compared with prior art, the utility model has the beneficial effects that
1, high-temperature-resistant layer selects epoxide resin material, has preferable adhesive strength and chemical-resistance, at 0-180 DEG C
Solidification in temperature range, with good high temperature resistance；
2, the first hot melt adhesive layer and the second hot melt adhesive layer select polythene material, and adhesive strength is high, and fusing point is 140 DEG C,
With stronger high temperature resistance；
3, base selects polytetrafluoroethylene material, and the fusing point of polytetrafluoroethylene (PTFE) is 327 DEG C, itself has high-temperature stability,
So that adhesive tape is can adapt to hot environment, widens the use scope of adhesive tape significantly；
4, in hot pressing, the first hot melt adhesive layer can flow to the first through hole on fibrous layer after melting, and increase fibrous layer
With the bonding firmness of the first hot melt adhesive layer, the second hot melt adhesive layer can flow to the second through-hole in base after melting, and increase base
It is increased with the bonding firmness of the second hot melt adhesive layer simultaneously as multiple first through hole and multiple second through-holes are staggered
The integral strength of adhesive tape ontology has very strong practicability.
Detailed description of the invention
Fig. 1 is the utility model schematic perspective view；
Fig. 2 is the utility model positive structure diagram.
In figure: high-temperature-resistant layer 1, the first hot melt adhesive layer 2, fibrous layer 3, first through hole 31, the second hot melt adhesive layer 4, base 5,
Second through-hole 51.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
The utility model provides a kind of technical solution referring to FIG. 1-2:
A kind of High-temp.-resistant hot-melt adhesive band, including it is whole be in band-like adhesive tape ontology, adhesive tape ontology is by high-temperature-resistant layer 1, the
One hot melt adhesive layer 2, fibrous layer 3, the second hot melt adhesive layer 4 and base 5 are successively bonded from top to bottom, the following table of high-temperature-resistant layer 1
Face is bonded with the upper surface of the first hot melt adhesive layer 2, high-temperature-resistant layer 1 be epoxy resin layer, high-temperature-resistant layer 1 with a thickness of 0.12-
The lower surface of 0.18mm, the first hot melt adhesive layer 2 are bonded with the upper surface of fibrous layer 3, fibrous layer 3 be glass layer, PP belt,
One of PET strip, fibrous layer 3 with a thickness of 0.12-0.15mm, the upper table of the lower surface of fibrous layer 3 and the second hot melt adhesive layer 4
Face paste is closed, and the lower surface of the second hot melt adhesive layer 4 is bonded with the upper surface of base 5, and base 5 is polytetrafluoroethylene ethylene layer, the thickness of base 5
Degree is 0.15-0.18mm, and the first hot melt adhesive layer 2 and the second hot melt adhesive layer 4 are polyethylene layer, the thickness of the first hot melt adhesive layer 2
For 0.09-0.12mm, the second hot melt adhesive layer 4 with a thickness of 0.07-0.10mm.
Multiple first through hole 31 are offered on fibrous layer 3, multiple first through hole 31 are distributed in matrix.It is offered in base 5
Multiple second through-holes 51, multiple second through-holes 51 are distributed in matrix.What the multiple first through hole 31 and matrix of matrix distribution were distributed
Multiple second through-holes 51 are interspersed.First through hole 31 and the second through-hole 51 are cylindricity through-hole or diamond shape through-hole.
This High-temp.-resistant hot-melt adhesive band, high-temperature-resistant layer 1 select epoxide resin material, have preferable adhesive strength and chemically-resistant
Performance solidifies in 0-180 DEG C of temperature range, with good high temperature resistance；First hot melt adhesive layer 2 and the second hot melt
Glue-line 4 selects polythene material, and adhesive strength is high, and fusing point is 140 DEG C, has stronger high temperature resistance；Base 5 selects poly-
Tetrafluoroethene material, the fusing point of polytetrafluoroethylene (PTFE) are 327 DEG C, itself has high-temperature stability, adhesive tape is made to can adapt to high temperature ring
The use scope of adhesive tape has been widened in border significantly；In hot pressing, the first hot melt adhesive layer 2 can flow to the on fibrous layer 3 after melting
One through-hole 31, increases the bonding firmness of fibrous layer 3 with the first hot melt adhesive layer 2, and the second hot melt adhesive layer 4 can flow to base after melting
The second through-hole 51 on layer 5 increases the bonding firmness of base 5 and the second hot melt adhesive layer 4, simultaneously as multiple first through hole 31
It is staggered with multiple second through-holes 51, increases the integral strength of adhesive tape ontology, there is very strong practicability.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (9)
1. a kind of High-temp.-resistant hot-melt adhesive band, including it is whole be in band-like adhesive tape ontology, it is characterised in that: the adhesive tape ontology be by
High-temperature-resistant layer (1), the first hot melt adhesive layer (2), fibrous layer (3), the second hot melt adhesive layer (4) and base (5) successively paste from top to bottom
It closes, the lower surface of the high-temperature-resistant layer (1) is bonded with the upper surface of the first hot melt adhesive layer (2), first hot melt adhesive layer
(2) lower surface is bonded with the upper surface of fibrous layer (3), and the lower surface of the fibrous layer (3) is upper with the second hot melt adhesive layer (4)
Surface fitting, the lower surface of second hot melt adhesive layer (4) is bonded with the upper surface of base (5).
2. a kind of High-temp.-resistant hot-melt adhesive band according to claim 1, it is characterised in that: the high-temperature-resistant layer (1) is epoxy
Resin layer, high-temperature-resistant layer (1) with a thickness of 0.12-0.18mm.
3. a kind of High-temp.-resistant hot-melt adhesive band according to claim 1, it is characterised in that: first hot melt adhesive layer (2) and
Second hot melt adhesive layer (4) is polyethylene layer, the first hot melt adhesive layer (2) with a thickness of 0.09-0.12mm, the second hot melt adhesive layer
(4) with a thickness of 0.07-0.10mm.
4. a kind of High-temp.-resistant hot-melt adhesive band according to claim 1, it is characterised in that: the fibrous layer (3) is glass fibers
Tie up layer, PP belt, one of PET strip, fibrous layer (3) with a thickness of 0.12-0.15mm.
5. a kind of High-temp.-resistant hot-melt adhesive band according to claim 1, it is characterised in that: the base (5) is polytetrafluoroethyl-ne
Alkene layer, base (5) with a thickness of 0.15-0.18mm.
6. a kind of High-temp.-resistant hot-melt adhesive band according to claim 4, it is characterised in that: offered on the fibrous layer (3)
Multiple first through hole (31), multiple first through hole (31) are distributed in matrix.
7. a kind of High-temp.-resistant hot-melt adhesive band according to claim 6, it is characterised in that: offered on the base (5) more
A second through-hole (51), multiple second through-holes (51) are distributed in matrix.
8. a kind of High-temp.-resistant hot-melt adhesive band according to claim 7, it is characterised in that: multiple described the first of matrix distribution
Through-hole (31) is interspersed with multiple second through-holes (51) that matrix is distributed.
9. a kind of High-temp.-resistant hot-melt adhesive band according to claim 8, it is characterised in that: the first through hole (31) and second
Through-hole (51) is cylindricity through-hole or diamond shape through-hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822030627.8U CN209508129U (en) | 2018-12-05 | 2018-12-05 | A kind of High-temp.-resistant hot-melt adhesive band |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822030627.8U CN209508129U (en) | 2018-12-05 | 2018-12-05 | A kind of High-temp.-resistant hot-melt adhesive band |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209508129U true CN209508129U (en) | 2019-10-18 |
Family
ID=68193971
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822030627.8U Active CN209508129U (en) | 2018-12-05 | 2018-12-05 | A kind of High-temp.-resistant hot-melt adhesive band |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209508129U (en) |
-
2018
- 2018-12-05 CN CN201822030627.8U patent/CN209508129U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: High-temperature-resistant hot melt adhesive tape Effective date of registration: 20200407 Granted publication date: 20191018 Pledgee: China Co truction Bank Corp Dongguan branch Pledgor: DONGGUAN AOZON ELECTRONIC MATERIAL Co.,Ltd. Registration number: Y2020980001313 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 523000 No.8, Beihuang Road East, hengjiao, Shijie Town, Dongguan City, Guangdong Province Patentee after: Dongguan aozhongxin Material Technology Co.,Ltd. Address before: 523000 No.8, Beihuang Road East, hengjiao, Shijie Town, Dongguan City, Guangdong Province Patentee before: DONGGUAN AOZON ELECTRONIC MATERIAL Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder |