CN209497118U - Power cabinet - Google Patents

Abstract

The utility model provides a kind of electric power cabinet, cavity is equipped with inside the electric power cabinet, air inlet hole and vent are respectively equipped on the electric power cabinet, the cavity inner wall corresponds to the air inlet hole and the vent is respectively equipped with the first water absorber and the second water absorber, the cavity inner wall is equipped with condensing unit, the condensing unit includes semiconductor chilling plate, cold house and water tank, the cold end of the semiconductor chilling plate is arranged in the cold house, the lower end of the cold house is arranged in the water tank, water is stored in the water tank, the water tank is connected to the cold house, the first heat-conducting block is equipped in the cold house, the cold connection of first heat-conducting block and the semiconductor chilling plate, the lower end of first heat-conducting block is immersed in the water of the water tank, water tank is equipped with below the water tank, the water tank is equipped with the first opening towards the water tank.The utility model proposes electric power cabinet, be avoided that inside electric power cabinet the phenomenon that condensation occur, eliminate electric power cabinet in security risk.

Description

Power cabinet

technical field

The utility model relates to the field of electric equipment, in particular to an electric cabinet.

Background technique

The invention and application of electricity set off the second upsurge of industrialization and became one of the three scientific and technological revolutions in the world since the modern history of mankind. Especially in today's Internet era, with the development of mobile phones, computers and intelligence, electricity has become an irreplaceable necessity for human beings.

Power cabinets, also known as power safety cabinets, are widely used in substations, centralized control stations and power companies of various voltage levels, and play an important role in the normal operation of various equipment.

However, when the air humidity of the existing power cabinet is high, condensation is likely to occur inside the power cabinet. Condensation will cause corrosion of the terminals of the power equipment, reduce insulation performance and cause short circuits, resulting in undue power outages and losses. There are security risks.

Utility model content

Based on this, the purpose of this utility model is to solve the problem that the existing power cabinet is prone to condensation phenomenon inside the power cabinet when the air humidity is high, and there are potential safety hazards.

The utility model provides a power cabinet. The inside of the power cabinet is provided with a cavity. The power cabinet is respectively provided with an air inlet hole and an air exhaust hole. The inner wall of the cavity corresponds to the air inlet hole and the air exhaust hole. The holes are respectively provided with a first water absorbing device and a second water absorbing device, and the inner wall of the cavity is provided with a condensing device, and the condensing device includes a semiconductor cooling chip, a cold room and a water tank, and the cold room is arranged on the semiconductor cooling chip The cold end, the water tank is arranged at the lower end of the cold room, water is stored in the water tank, the water tank communicates with the cold room, a first heat conduction block is arranged in the cold room, and the first heat conduction block With the cold connection of the semiconductor cooling chip, the lower end of the first heat conduction block is immersed in the water of the water tank, a water storage tank is provided under the water tank, and the water storage tank is provided with a first opening facing the water tank .

The beneficial effects of the utility model: when the air enters from the air inlet hole or the air outlet hole and enters into the power cabinet through the first water absorption device or the second water absorption device, the first water absorption device or the second water absorption device will remove this part The moisture in the air is filtered to reduce the humidity in the power cabinet; at the same time, since the cold end of the semiconductor cooling chip is connected to the water tank through the first heat conduction block, the cold end of the semiconductor cooling chip exchanges heat with the water in the water tank, making the temperature of the water tank Reduce, when the water vapor in the air meets the low-temperature water tank, it condenses into water droplets and drips into the water storage tank, further reducing the moisture content in the power cabinet, and avoiding circuit failures caused by condensation in the power cabinet.

Further, the hot end of the semiconductive cooling sheet is provided with a thermal chamber, the hot end of the semiconductive cooling sheet is provided with a thermal chamber, and the thermal chamber includes a second heat conducting block, a cooling fin and a cooling fan, and the second heat conducting The block is arranged on the hot end of the semiconductor cooling sheet, the heat sink is arranged on the second heat conduction block, and the cooling fan is arranged on the inner wall of the heat chamber away from the semiconductor cooling sheet. The second heat conduction block transfers the heat from the hot end of the semiconductor cooling fin to the heat sink, and the heat sink dissipates the heat into the heat chamber, while the heat dissipation fan discharges the heat in the heat chamber.

Further, the heat chamber is provided with a duct corresponding to the cooling fan, and the duct is used to draw out the heat in the heat chamber.

Further, the first water absorbing device and the second water absorbing device both include a casing and absorbent cotton, the casing is arranged on the inner wall of the cavity, the casing corresponds to the air inlet hole and the The exhaust holes are all provided with through holes, and the water-absorbing cotton is arranged in the housing, and the water-absorbing cotton is used to absorb water.

Further, the first water absorbing device is provided with an exhaust fan on the side away from the inner wall of the cavity, and the second water absorbing device is provided with an exhaust fan on the side far from the inner wall of the cavity, and the exhaust fan and the exhaust fan are used In order to accelerate the air convection in the power cabinet, it is convenient to dissipate heat from the power cabinet.

Further, the conduit extends between the exhaust fan and the second water absorbing device, and the conduit is provided with cooling holes corresponding to the through holes, and the conduit is used for the cooling of the second water absorbing device. The absorbent cotton is heated and dried to prolong the service life of the absorbent cotton.

Further, a second opening is provided on the side of the housing, and the opening facilitates the replacement of the absorbent cotton.

Further, a sealing ring is provided between the first heat conduction block and the water tank, and the sealing ring is used to prevent the water in the water tank from seeping out of the water tank.

Further, the lower end of the water tank is an inclined plane, and the inclined plane is convenient for the condensed water drops to drip from the water tank.

Further, the lower end of the water tank is provided with a guide rod, the lower end of the guide rod is placed in the water storage tank, and the guide rod is used to introduce the water droplets on the water tank into the water storage tank middle.

Additional aspects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

Description of drawings

Fig. 1 is the sectional view of the power cabinet proposed by the first embodiment of the utility model;

Fig. 2 is a sectional view of the condensing device in the power cabinet proposed by the first embodiment of the utility model;

Fig. 3 is a cross-sectional view of the second water absorbing device and exhaust fan in the power cabinet proposed by the first embodiment of the present invention;

Fig. 4 is a perspective view of the second water absorbing device in the power cabinet proposed by the first embodiment of the utility model.

Power cabinet 10 cavity 11 Air inlet 12 Exhaust hole 13 first water absorbing device 20 exhaust fan twenty one Second water absorption device 30 case 301 through hole 302 absorbent cotton 303 second opening 304 exhaust fan 31 Condenser 40 semiconductor cooler 41 cold room 42 first heat conduction block 421 sealing ring 422 water tank 43 Water tank 44 first opening 441 Diversion rod 442 hot cell 45 Second thermal block 451 heat sink 452 cooling fan 453 catheter 46 Vents 461

Detailed ways

In order to facilitate the understanding of the utility model, the utility model will be described more fully below with reference to the relevant drawings. Preferred embodiments of the present utility model are provided in the accompanying drawings. However, the invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing this embodiment is to make the disclosure of the present utility model more thorough and comprehensive.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of this invention. The terminology used in the description of the utility model herein is only for the purpose of describing specific embodiments, and is not intended to limit the utility model. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

When the air humidity of the existing power cabinet is high, condensation is likely to occur inside the power cabinet. Condensation will cause corrosion of the terminals of the power equipment, reduce insulation performance and cause short circuits, resulting in undue power outages and losses. Hidden danger.

In order to solve this technical problem, the first embodiment of the present invention provides a power cabinet 10 , please refer to FIG. 1 and FIG. 2 . The direction of the arrow in the figure is the airflow direction.

The inside of the power cabinet 10 is provided with a cavity 11, and the power cabinet 10 is respectively provided with an air inlet 12 and an air exhaust hole 13, and the inner wall of the cavity 11 is respectively provided with a first water absorbing device 20 and an air outlet 12 corresponding to the air inlet 12 and the air outlet 13 The second water absorbing device 30, the cavity 11 inner wall is provided with condensing device 40, and condensing device 40 comprises semiconductor cooling chip 41, cold room 42 and water tank 43, and cold room 41 is arranged on the cold end of semiconductor cooling chip 40, and water tank 43 is arranged on the cold end At the lower end of the chamber 42, water is stored in the water tank 43, and the water tank 43 communicates with the cold room 42. The cold room 42 is provided with a first heat conduction block 421, and the first heat conduction block 421 is connected with the semiconductor refrigeration sheet 41. The first heat conduction block 421 The lower end is soaked in the water of the water tank 43 , and the water storage tank 44 is provided under the water tank 43 , and the water storage tank 44 is provided with a first opening 441 facing the water tank 43 .

When the air enters from the air inlet hole 12 or the air outlet hole 13, and enters into the power cabinet 10 through the first water absorbing device 20 or the second water absorbing device 30, the first water absorbing device 20 or the second water absorbing device 30 will take this part Moisture in the air is filtered to reduce its water content; meanwhile, since the cold end of the semiconductor refrigeration sheet 41 is connected with the water tank 43 through the first heat conduction block 421, the cold end of the semiconductor refrigeration sheet 41 exchanges heat with the water in the water tank 43, The temperature of the water tank 43 is lowered, and when the water vapor in the air encounters the low-temperature water tank 43, the water vapor contained in it condenses and condenses into water droplets and drips into the water storage tank 44, further reducing the moisture content in the power cabinet 10 , to avoid circuit failures caused by condensation in the power cabinet. In addition, in order to better realize the effect of the condensing device, the cold room is made of thermal insulation material to improve the cooling effect of the water in the water tank 43;

As shown in Figure 2, the hot end of the semiconductor cooling plate 41 is provided with a heat chamber 45, and the heat chamber 45 includes a second heat conduction block 451, a heat sink 452 and a cooling fan 453, and the second heat conduction block 451 is arranged on the heat of the semiconductor refrigeration plate 41. At the end, the cooling fin 452 is arranged on the second heat conducting block 451 , the cooling fan 453 is arranged on the inner wall of the hot chamber 45 away from the semiconductor cooling sheet 41 , and the hot chamber 45 is provided with a duct 46 corresponding to the cooling fan 453 .

The second heat conduction block 451 transfers the heat from the hot end of the semiconductor cooling fin 41 to the heat sink 452 , the heat sink 452 dissipates the heat into the heat chamber 45 , and the heat dissipation fan 453 discharges the heat in the heat chamber along the conduit 46 . In addition, both the heat chamber 45 and the conduit 46 can be made of thermal insulation materials to reduce the heat generated by the hot end of the semiconductor cooling plate 41 from dissipating into the power cabinet 10 and reduce the risk of damage to electronic components in the power cabinet 10 due to high temperature.

A sealing ring 422 is provided between the first heat conducting block 421 and the water tank 43, and the sealing ring 422 is used to prevent the water in the water tank 43 from seeping out of the water tank 43. The lower end of the water tank 43 is a slope, and the water drops that are convenient to condense on the slope drip from the water tank 43. In addition, the lower end of the water tank 43 can also be set to be curved or tapered.

The lower end of the water tank 43 is provided with a guide rod 442 , the lower end of the guide rod 442 is placed in the water storage tank 44 , and the guide rod 441 is used to introduce the water droplets on the water tank 43 into the water storage tank 44 .

As shown in Figure 3, the first water absorbing device 20 is provided with an exhaust fan 21 on the side far away from the inner wall of the cavity 11, and the second water absorbing device 30 is provided with an exhaust fan 31 on the side far away from the inner wall of the cavity 11, and the exhaust fan 21 is used to clean the power cabinet. 10 Outside air is sucked into the power cabinet 10, and the exhaust fan 31 is used to discharge the air in the power cabinet 10 out of the power cabinet 10, so as to accelerate the air convection in the power cabinet 10 and facilitate the power cabinet 10 to dissipate heat.

Both the first water absorbing device 20 and the second water absorbing device 30 include a housing 301 and absorbent cotton 303, the housing 301 is arranged on the inner wall of the cavity 11, and the housing 301 is provided with through holes corresponding to the air inlet 12 and the air outlet 13 302, the absorbent cotton 303 is arranged in the housing 31, and the absorbent cotton 303 is used to absorb water.

The conduit 46 extends between the exhaust fan 31 and the second water suction device 30, and the conduit 46 is provided with a cooling hole 461 corresponding to the through hole 303. The heat in the hot chamber 45 is dissipated into the conduit 46 by the cooling fan 453, and then the hot air in the conduit 46 passes through The radiating holes 461 radiate out, and the exhaust fan 31 blows this part of the hot air onto the absorbent cotton 303 in the second absorbent device 30 , which can realize heating and drying of the absorbent cotton 303 and prolong the service life of the absorbent cotton 303 .

As shown in FIG. 4 , a second opening 304 is provided on the vertical side where the casing 301 intersects with the inner wall of the cavity 11 , and the second opening 304 facilitates the replacement of the absorbent cotton 303 .

The above embodiment only expresses one implementation mode of the utility model, and its description is more specific and detailed, but it should not be understood as a limitation to the patent scope of the utility model. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the scope of protection of the utility model patent should be based on the appended claims.

Claims (10)

1. A power cabinet, characterized in that: the inside of the power cabinet is provided with a cavity, and the power cabinet is respectively provided with an air inlet and an exhaust hole, and the inner wall of the cavity corresponds to the air inlet and the air outlet. The exhaust holes are respectively provided with a first water absorption device and a second water absorption device. The inner wall of the cavity is provided with a condensation device. The cold end of the sheet, the water tank is arranged at the lower end of the cold room, water is stored in the water tank, the water tank communicates with the cold room, a first heat conduction block is arranged in the cold room, and the first The cold connection between the heat conduction block and the semiconductor cooling chip, the lower end of the first heat conduction block is immersed in the water of the water tank, a water storage tank is provided under the water tank, and a second water storage tank is provided facing the water tank. Open your mouth. 2. The power cabinet according to claim 1, characterized in that: the hot end of the semiconductor refrigeration sheet is provided with a heat chamber, the heat chamber includes a second heat conduction block, a heat sink and a heat dissipation fan, and the second heat conduction The block is arranged on the hot end of the semiconductor cooling sheet, the heat sink is arranged on the second heat conduction block, and the cooling fan is arranged on the inner wall of the heat chamber away from the semiconductor cooling sheet. 3 . The power cabinet according to claim 2 , wherein a duct is provided in the heat chamber corresponding to the cooling fan. 4 . 4. The power cabinet according to claim 3, wherein the first water absorbing device and the second water absorbing device both include a shell and water absorbing cotton, and the shell is arranged on the inner wall of the cavity, The housing is provided with through holes corresponding to the air inlet hole and the air exhaust hole, and the absorbent cotton is arranged in the housing. 5. The power cabinet according to claim 4, characterized in that: the side of the first water absorbing device away from the inner wall of the cavity is provided with an exhaust fan, and the side of the second water absorbing device far away from the inner wall of the cavity Features an extractor fan. 6 . The power cabinet according to claim 5 , wherein the duct extends between the exhaust fan and the second water suction device, and the duct is provided with cooling holes corresponding to the through holes. 6 . 7 . The power cabinet according to claim 6 , wherein a second opening is provided on a vertical side of the casing intersecting with the inner wall of the cavity. 7 . 8. The power cabinet according to claim 1, wherein a sealing ring is provided between the first heat conducting block and the water tank. 9. The power cabinet according to claim 1, characterized in that: the lower end of the water tank is an inclined plane. 10. The power cabinet according to claim 1, wherein a guide rod is provided at the lower end of the water tank, and the lower end of the guide rod is placed in the water storage tank.