CN209491016U - A kind of sol evenning machine for disc type silicon wafer - Google Patents
A kind of sol evenning machine for disc type silicon wafer Download PDFInfo
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- CN209491016U CN209491016U CN201822230894.XU CN201822230894U CN209491016U CN 209491016 U CN209491016 U CN 209491016U CN 201822230894 U CN201822230894 U CN 201822230894U CN 209491016 U CN209491016 U CN 209491016U
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- silicon wafer
- disc type
- sol evenning
- type silicon
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Abstract
The utility model discloses a kind of sol evenning machines for disc type silicon wafer, belong to equipment for evenly dividing glue technical field.The sol evenning machine of the utility model, including shell and the lid being articulated on shell；Vertical centrifugation motor is installed, the upper surface for being centrifuged motor is fixedly installed with spin coating disk in shell；By being centrifuged motor driven spin coating disc spins；Spin coating disk includes the silicon wafer pallet that position among spin coating disk is arranged in, and connects lacquer disk(-sc) with what silicon wafer pallet was coaxially disposed；The silicon wafer pallet is equipped with burr；The silicon wafer pallet is attached with negative-pressure pipeline；Silicon wafer pallet includes that the negative pressure being attached with negative-pressure pipeline connects port, outer ring closed annular burr and the not closed annular burr enclosed on the inside of closed annular burr outside is arranged, and closed annular burr is not several.The sol evenning machine good damping effect of the utility model has many advantages, such as that starting is rapid, is switched fast revolving speed and stabilization of speed, and can guarantee the consistency and uniformity of film thickness.
Description
Technical field
The utility model relates to a kind of sol evenning machines for disc type silicon wafer, belong to equipment for evenly dividing glue technical field.
Background technique
Sol evenning machine is a kind of centrifugal force generated using rotation, and glue is uniformly thrown away, and the machinery of material surface is arrived in tiling
Device has the experiment or manufacturing field of strict demand, such as spin coating applied to all kinds of uniformities for material surface coating
Machine is suitable for semi-conductor silicon chip, glass slide, chip, substrate, the works such as semiconductor technology, plate-making and surface coating of ITO conduction glass
Skill.
In equipment running process, the revolving speed in high speed whirl coating is very high, up to 4500rpm.So high revolving speed meeting
Carry out serious vibration problems to equipment belt, if taking no action to absorb, reducing vibration, frequently can lead to device damage or instrument
It is out of service.Existing sol evenning machine can not be in high revolving speed due to not can be well solved the vibration problems in centrifugal process
Under smoothly run.
Utility model content
In order to solve the above technical problems, the utility model provides a kind of sol evenning machine for disc type silicon wafer, the sol evenning machine
Good damping effect has many advantages, such as that starting is rapid, is switched fast revolving speed and stabilization of speed, and can guarantee the consistency of film thickness
And uniformity.
First purpose of the utility model is to provide a kind of sol evenning machine for disc type silicon wafer, including shell and hinged
In the lid on shell；
Vertical centrifugation motor is installed, the upper surface for being centrifuged motor is fixedly installed with spin coating disk in the shell；Pass through
It is centrifuged motor driven spin coating disc spins；
The spin coating disk includes the silicon wafer pallet that position among spin coating disk is arranged in, and is connect with what silicon wafer pallet was coaxially disposed
Lacquer disk(-sc)；The silicon wafer pallet is equipped with burr；The silicon wafer pallet is attached with negative-pressure pipeline；When silicon wafer pallet accesses negative pressure
When, the burr on silicon wafer pallet is bonded with disc type silicon wafer, forms negative pressure, disc type silicon wafer is sucked；
The silicon wafer pallet include the negative pressure being attached with negative-pressure pipeline connect port, outer ring closed annular burr and
The not closed annular burr enclosed on the inside of closed annular burr outside is set, and closed annular burr is not several.Outer ring close ring
Shape burr is used to be bonded with disc type silicon wafer with not closed annular burr, what several not closed annular burrs of inside were formed
Not close passage is used to form negative pressure cavity.Such design, can allow disc type silicon wafer it is even closer be adsorbed on silicon wafer support
On disk.
Further, the shaft of the centrifugation motor is fixedly connected by shaft joint and silicon wafer pallet, described
It is equipped with outer ring baffle, overhead gage and lower baffle plate on the outside of shaft joint, is centrifuged the shaft and shaft joint, outer ring baffle, overhead gage of motor
Cavity is formed between lower baffle plate, the shaft joint is axially provided with through-hole, and the cavity connects port by through-hole and negative pressure
It is connected to, the cavity is also connected with negative-pressure pipeline.By the setting of cavity, the utility model can be realized to be revolved in high speed
When turning, additionally it is possible to which the fixed silicon wafer by the way of negative-pressure adsorption locking, this locking mechanism is very for high speed centrifugation spin coating
It is necessary, it is able to achieve noiseless steady high speed centrifugation, guarantees the homogeneity of spin coating.
Further, the overhead gage and lower baffle plate are prepared using wear-resistant material, between shaft or shaft joint
Zero clearance fitting rotation.
Further, it is equipped with spring between the lower baffle plate and centrifugation motor, is used to support lower baffle plate and outer ring baffle
Fitting.When negative-pressure pipeline accesses negative pressure, overhead gage, lower baffle plate are adsorbed by negative pressure, form negative pressure cavity；When not accessing
When negative pressure, lower baffle plate is bonded by spring supporting with outer ring baffle.
Further, the top of the shell is equipped with opening, is successively arranged and subtracts positioned at opening lower section on the bottom plate of shell
Shake pad and metal plate, the resilient cushion and metal plate are fixed on Housing Base by fixing piece, and the centrifugation motor is fixed
Installation is on a metal plate.
Further, the resilient cushion is silicagel pad, rubber pad or plastic pad or other can be used to the material of damping.
Further, the housing bottom is equipped with multiple shock-absorbing foot pads.Further, shock-absorbing foot pad is four, respectively
Set on the four corners of housing bottom.Shock-absorbing foot pad is preferably rubber mat, can also be made certainly of other materials.
Further, the shell is equipped with power interface, and the bottom plate of shell is equipped with to be electrically connected with the power interface
Switching Power Supply, governor, relay, circuit board and the capacitor connect.Wherein, relay is used for the conducting of control circuit, circuit
Plate is used to control the rotation of centrifugation motor.
Further, touch display frequency is installed on the shell.By the way of touch screen control, in speed-changing
Shi Gengjia is steady, realizes the functions such as start and stop are controllable, and revolving speed is observed in real time, revolving speed can toggle.
Further, the lid is equipped with protective switch.When the protective switch shuts lid not, instrument does not allow
Starting, when apparatus working, upper cover is in close state, once upper cover is opened, trigger protection is switched immediately, and instrument is out of service,
It plays a protective role.
Further, the opening is corresponded on the lid is equipped with transparent window, it is existing in the case where being centrifuged spin coating state
Man-machine defencive function, and the spin coating state of photoresist on silicon wafer can be observed in real time.
Further, the lacquer disk(-sc) that connects is stainless steel material.The design for connecing lacquer disk(-sc) may be implemented during spin coating,
Extra photoresist can only be got rid of in spin coating room, and later period cleaning residual photoresist is convenient.
Further, the bottom plate of the shell is carbon steel sheet material.
The beneficial effects of the utility model are:
The sol evenning machine for disc type silicon wafer of the utility model is designed and uses specifically for disc type silicon wafer, fits
Spin coating is carried out for 7 inches of silicon wafers below, good damping effect has starting is rapid, is switched fast revolving speed and stabilization of speed etc.
Advantage may be implemented stage process control centrifugal rotational speed and process control speed-raising and reduction of speed frequency, and can guarantee glue film thickness
The consistency and uniformity of degree.Application effect is preferable in a semiconductor material.
Detailed description of the invention
Fig. 1 is overall schematic of the utility model for the sol evenning machine of disc type silicon wafer；
Fig. 2 is the sol evenning machine schematic diagram of internal structure that the utility model is used for disc type silicon wafer；
Fig. 3 is the structural schematic diagram of the utility model silicon wafer pallet；
Fig. 4 is the structural schematic diagram of the utility model negative-pressure sealing structure.
Specific embodiment
The utility model is described in further detail in the following with reference to the drawings and specific embodiments, so that those skilled in the art
The utility model may be better understood and can be practiced, but illustrated embodiment is not as the restriction to the utility model.
Embodiment 1:
In conjunction with attached drawing, the sol evenning machine for disc type silicon wafer of the utility model including shell 1 and is articulated on shell
Lid 2；The top of shell 1 is equipped with opening 3, and opening lower section is located on the bottom plate of shell 1 and is successively arranged resilient cushion 4 and metal plate 5,
Resilient cushion 4 and metal plate 5 are fixed on Housing Base by fixing piece；Vertical centrifugation electricity is fixedly installed on metal plate 5
The upper surface of machine 6, centrifugation motor 6 is fixedly installed with spin coating disk 7；Spin coating disk 7 is driven to rotate by centrifugation motor 6；Spin coating Pan7Bao
The silicon wafer pallet 71 that position among spin coating disk is set is included, and connects lacquer disk(-sc) 72 with what silicon wafer pallet was coaxially disposed；Silicon wafer pallet 71
It is equipped with burr；Silicon wafer pallet 71 is attached with negative-pressure pipeline 12；When silicon wafer pallet 71 accesses negative pressure, on silicon wafer pallet
Burr is bonded with disc type silicon wafer, forms negative pressure, disc type silicon wafer is sucked.The specific structure of the pallet 71 of the utility model is such as
Shown in Fig. 3, including connecing port 711 with the negative pressure that negative-pressure pipeline is attached, outer ring closed annular burr 712, being arranged in outer ring
The not closed annular burr 713 of 712 inside of closed annular burr, closed annular burr 713 is not several, wherein outer trap
Cyclization shape burr 712 is used to be bonded with disc type silicon wafer with not closed annular burr 713, several not closed annulars of inside
The not close passage that burr 713 is formed, is used to form negative pressure cavity, such design can allow disc type silicon wafer even closer
Be adsorbed on silicon wafer pallet, this locking mechanism is very important for high speed centrifugation spin coating, is able to achieve noiseless steady
High speed centrifugation guarantees the homogeneity of spin coating.
In the utility model, the shaft of centrifugation motor 6 is fixedly connected by shaft joint 61 with silicon wafer pallet 71, connecting shaft
Outer ring baffle 611, overhead gage 612 and lower baffle plate 613 are equipped on the outside of device 61, the shaft and shaft joint 61, outer ring for being centrifuged motor 6 are kept off
Cavity is formed between plate 611, overhead gage 612 and lower baffle plate 613, shaft joint 61 is axial to be provided with through-hole, is centrifuged the shaft of motor 6
The cavity formed between shaft joint 61, outer ring baffle 611, overhead gage 612 and lower baffle plate 613 connects port by through-hole and negative pressure
711 are connected to, and cavity is also connected with negative-pressure pipeline 12.And the overhead gage 612 of the utility model and lower baffle plate 613 use
Wear-resistant material is prepared, and zero clearance is bonded rotation between shaft or shaft joint.It is set between lower baffle plate 613 and centrifugation motor 6
There is spring, is used to support lower baffle plate 613 and is bonded with outer ring baffle 611.It, will be upper by negative pressure when negative-pressure pipeline 12 accesses negative pressure
Baffle 612, lower baffle plate 613 adsorb, and form negative pressure cavity；When not accessing negative pressure, lower baffle plate 613 passes through spring supporting, with
Outer ring baffle 611 is bonded.By design above, the utility model be can be realized when rotating at high speed, additionally it is possible to use negative pressure
The fixed silicon wafer of the mode of absorption locking, this locking mechanism are very important for high speed centrifugation spin coating, are able to achieve noiseless
Steady high speed centrifugation guarantees the homogeneity of spin coating.
Resilient cushion in the utility model using silicagel pad, rubber pad or other can be used to the material of damping.
1 bottom of shell is equipped with multiple shock-absorbing foot pads.In the present embodiment, shock-absorbing foot pad is four, is respectively arranged on housing bottom
Four corners.Shock-absorbing foot pad is rubber mat, can also be made certainly of other materials, and instrument vibration is further decreased.
Shell 1 is equipped with power interface 8, and the bottom plate of shell is equipped with the Switching Power Supply being electrically connected with power interface, speed regulation
Device, relay, circuit board and capacitor.Wherein, the control signal passed on relay circuit board for receiving, for controlling electricity
The conducting on road；Circuit board is used to control the rotation of centrifugation motor；Governor is used to adjust the revolving speed of centrifugation motor.
Touch display frequency 9 is installed on shell 1.It is more steady in speed-changing using touch screen, realize that start and stop can
Control, the functions such as revolving speed is observed in real time, revolving speed can toggle.
Lid 2 is equipped with protective switch 10.When the protective switch shuts lid not, instrument does not allow to start, instrument
When operating, upper cover is in close state, once upper cover is opened, trigger protection is switched immediately, and instrument is out of service, is played protection and is made
With.
The opening is corresponded on lid 2 equipped with transparent window 11, facilitates the situation of observation spin coating.
When the utility model at work, disc type silicon wafer is placed on chip tray, connect negative pressure, disc type silicon wafer with
The fitting of silicon wafer pallet, disc type silicon wafer is sucked, and then starting centrifugation motor, the sol evenning machine of the utility model can be carried out directly
Low speed spin coating, high speed spin coating, or first carry out low speed spin coating and carry out high speed whirl coating again, it can arbitrarily switch under different rotating speeds,
And switching is steady.Such as first carry out spin coating under the low speed, be then switched under high-speed condition and carry out whirl coating, revolving speed and time according to
Actual conditions are adjusted respectively.
Embodiment described above is only preferred embodiments for fully illustrating the utility model, the utility model
Protection scope it is without being limited thereto.Those skilled in the art made equivalent substitute or change on the basis of the utility model
It changes, both is within the protection scope of the present invention.The protection scope of the utility model is subject to claims.
Claims (10)
1. a kind of sol evenning machine for disc type silicon wafer, which is characterized in that including shell and the lid being articulated on shell；
Vertical centrifugation motor is installed, the upper surface for being centrifuged motor is fixedly installed with spin coating disk in the shell；Pass through centrifugation
Motor driven spin coating disc spins；
The spin coating disk includes the silicon wafer pallet that position among spin coating disk is arranged in, and connects glue with what silicon wafer pallet was coaxially disposed
Disk；The silicon wafer pallet is equipped with burr；The silicon wafer pallet is attached with negative-pressure pipeline；
The silicon wafer pallet includes that the negative pressure being attached with negative-pressure pipeline connects port, outer ring closed annular burr and setting
The not closed annular burr on the inside of closed annular burr is enclosed outside, and closed annular burr is not several.
2. a kind of sol evenning machine for disc type silicon wafer according to claim 1, which is characterized in that the centrifugation motor
Shaft be fixedly connected by shaft joint and silicon wafer pallet, be equipped on the outside of the shaft joint outer ring baffle, overhead gage and
Lower baffle plate is centrifuged between the shaft of motor and shaft joint, outer ring baffle, overhead gage and lower baffle plate and forms cavity, the connecting shaft
Device is axially provided with through-hole, and the cavity connects port with negative pressure by through-hole and is connected to, the cavity also with negative-pressure pipeline phase
Connection.
3. a kind of sol evenning machine for disc type silicon wafer according to claim 2, which is characterized in that the overhead gage and
Lower baffle plate is prepared using wear-resistant material.
4. a kind of sol evenning machine for disc type silicon wafer according to claim 1, which is characterized in that the top of the shell
Portion is equipped with opening, and opening lower section is located on the bottom plate of shell and is successively arranged resilient cushion and metal plate, the resilient cushion and metal plate
It is fixed on Housing Base by fixing piece, the centrifugation motor is fixedly mounted on a metal plate.
5. a kind of sol evenning machine for disc type silicon wafer according to claim 4, which is characterized in that the resilient cushion is
Silicagel pad, rubber pad or plastic pad.
6. a kind of sol evenning machine for disc type silicon wafer according to claim 1, which is characterized in that the housing bottom
Equipped with multiple shock-absorbing foot pads.
7. a kind of sol evenning machine for disc type silicon wafer according to claim 1, which is characterized in that set on the shell
There is power interface, the bottom plate of shell is equipped with the Switching Power Supply being electrically connected with the power interface, governor, relay, circuit
Plate and capacitor.
8. a kind of sol evenning machine for disc type silicon wafer according to claim 1, which is characterized in that pacify on the shell
Frequency is shown equipped with touching.
9. a kind of sol evenning machine for disc type silicon wafer according to claim 1, which is characterized in that the lid is equipped with
Protective switch.
10. a kind of sol evenning machine for disc type silicon wafer according to claim 4, which is characterized in that on the lid
The corresponding opening is equipped with transparent window.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822230894.XU CN209491016U (en) | 2018-12-28 | 2018-12-28 | A kind of sol evenning machine for disc type silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822230894.XU CN209491016U (en) | 2018-12-28 | 2018-12-28 | A kind of sol evenning machine for disc type silicon wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209491016U true CN209491016U (en) | 2019-10-15 |
Family
ID=68154067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822230894.XU Active CN209491016U (en) | 2018-12-28 | 2018-12-28 | A kind of sol evenning machine for disc type silicon wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209491016U (en) |
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2018
- 2018-12-28 CN CN201822230894.XU patent/CN209491016U/en active Active
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