CN209489096U - Anti-interference electronic equipment - Google Patents
Anti-interference electronic equipment Download PDFInfo
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- CN209489096U CN209489096U CN201821642587.6U CN201821642587U CN209489096U CN 209489096 U CN209489096 U CN 209489096U CN 201821642587 U CN201821642587 U CN 201821642587U CN 209489096 U CN209489096 U CN 209489096U
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Abstract
The utility model provides a kind of Anti-interference electronic equipment, including plastic mould, the inner surface of the plastic mould is equipped with anti-interference layer, the anti-interference layer includes electro-conductive lacquer layer, absorbing material layer and epoxy resin layer, the electro-conductive lacquer layer is covered on the inner surface, the absorbing material layer is coated on the electro-conductive lacquer layer, and the epoxy resin layer spraying plating is in the absorbing material layer, and the inner surface, electro-conductive lacquer layer, absorbing material layer and epoxy resin layer successively mutually bond.Not only anti-tampering effect is good for the utility model, and use scope is wide, can be applied to the electronic equipment of most different sizes, and due to having abandoned metallic shield, a large amount of material and manufacturing process thus can be saved, production cost is significantly reduced, improves the production efficiency of product.
Description
Technical field
The utility model relates to electromagnetic radiation technology field, in particular to a kind of Anti-interference electronic equipment.
Background technique
Existing electronic component usually all respectively incorporates high-frequency circuit, digital circuit and analog circuit, these electronics member
Part can generate mutually electromagnetic interference when work.The function of electronic component is not only influenced, but also can be detrimental to health.
Electromagnetic radiation in order to prevent generally can all be located at the metallic shield of a closing ground connection on electronic component
In, the interference source of component, circuit, sub-assembly, cable or whole system is surrounded using shielding case, prevents interference electromagnetism
To external diffusion.
And electronic product is more and more integrated at present and develops towards miniaturization, lightening direction, heat dissipation problem just becomes
It is particularly troublesome, it would be highly desirable to solve, especially the local poor heat radiation of mold, cause die surface respective regions temperature excessively high, touch
There is burning heat sensation, seriously affects customer experience, or even generate security risk.
Utility model content
The main purpose of the utility model is that in view of the deficiency of the prior art, providing a kind of Anti-interference electronic
Equipment, to reduce or eliminate electronic equipment to the electromagnetic interference of extraneous and outer bound pair electronic equipment.
For achieving the above object, the utility model uses following technical scheme.
The utility model provides a kind of Anti-interference electronic equipment, including plastic mould, and the inner surface of the plastic mould is set
There is anti-interference layer, the anti-interference layer includes electro-conductive lacquer layer, absorbing material layer and epoxy resin layer, and the electro-conductive lacquer layer is covered in
On the inner surface, the absorbing material layer is coated on the electro-conductive lacquer layer, and the epoxy resin layer spraying plating is in the suction wave
In material layer, and the inner surface, electro-conductive lacquer layer, absorbing material layer and epoxy resin layer successively mutually bond.
Preferably, the coating thickness of the conductive paint is 0.05~0.15mm.
Preferably, the conductive paint uses conductive copper paint.
Preferably, the coating thickness of the absorbing material is 0.05~0.15mm
The scheme of metallic shield is used compared with the prior art, and not only anti-tampering effect is good for the utility model, uses model
It encloses wide, can be applied to the electronic equipment of most different sizes, and due to having abandoned metallic shield, thus can be with
A large amount of material and manufacturing time are saved, production cost is significantly reduced, improves the production efficiency of product.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of anti-interference layer in the utility model embodiment.
The embodiments will be further described with reference to the accompanying drawings for the realization, functional characteristics and advantage of the utility model aim.
Specific embodiment
The technical solution of the utility model is described in detail below with reference to drawings and the specific embodiments, to become apparent from, directly
See the invention essence that ground understands the utility model.
As shown in Figure 1, the electronic equipment includes plastic mould 10 the present embodiment provides a kind of Anti-interference electronic equipment,
The inner surface of the plastic mould 10 is equipped with anti-interference layer 20, which includes electro-conductive lacquer layer 21,22 and of absorbing material layer
Epoxy resin layer 23, the electro-conductive lacquer layer 21 are covered on the inner surface of plastic mould 10, and the absorbing material layer 22 is coated on
On the electro-conductive lacquer layer 21,23 spraying plating of epoxy resin layer is in the absorbing material layer 22, and the inner surface, conductive paint
Layer 21, absorbing material layer 22 and epoxy resin layer 23 successively mutually bond.
When the plastic mould 10 of electronic equipment includes upper casing and lower casing, then the inner surface of the inner surface of the upper casing and lower casing
It is provided with the anti-interference layer 20.
In the present embodiment, the coating thickness of electro-conductive lacquer layer 21 is preferably 0.05~0.15mm, on the one hand, the thickness value is enough
Achieve the purpose that electromagnetic isolation, on the other hand, electro-conductive lacquer layer 21 can be made thin as far as possible, it is possible to reduce the use of conductive paint, thus to the greatest extent
Amount reduces the integral thickness of plastic mould 10.
The absorbing material of the present embodiment is blent using metal oxide, similarly, the spraying of the absorbing material layer 22
Thickness is preferably 0.05~0.15mm, on the one hand, the thickness value sufficiently achieves the purpose of electromagnetic wave absorption, keeps electromagnetic wave anti-
It is emitted back towards and influences electronic product normal work, on the other hand, keep absorbing material layer 22 thin as far as possible, it is possible to reduce absorbing material
It uses, to reduce the integral thickness of plastic mould 10 as far as possible, reduces the use cost of material.
In the present embodiment Anti-interference electronic equipment, following steps are can be used in the production method of anti-interference layer:
S1: taking the plastic mould of electronic equipment, cleans the inner surface of the plastic mould；
S2: one layer of conductive paint is sprayed in the inner surface of the plastic mould；
S3: after the conductive paint solidification, one layer of absorbing material is sprayed on the conductive paint；
S4: after the absorbing material solidification, one layer of epoxy resin of spraying plating on the absorbing material；
S5: sizing.
When the plastic mould 10 of electronic equipment includes upper casing and lower casing, then all need to the inner surface of the upper casing and lower casing
Inner surface is handled by above step step.
Using the impurity and greasy dirt of conventional method removal 10 inner surface of plastic mould, after cleaning, inner surface is usually humidity
State, therefore, this method can also increase to the withering step of the inner surface, so that the conductive paint sprayed up can jail
Admittedly with inner surface bond.
When spraying conductive paint, the inner surface of plastic mould 10 need to be completely covered in conductive paint, make the interior table of plastic mould 10
Face forms a closed electro-conductive lacquer layer 21, so that electronic product and the extraneous effective electromagnetic isolation of progress are avoided this electronics
Product is influenced by external electromagnetic radiation, or avoids the extraneous influence by electromagnetic radiation caused by this electronic product,
Achieve the effect that prevent electromagnetic radiation and anti-tampering.
In the present embodiment, the coating thickness of electro-conductive lacquer layer 21 is preferably 0.05~0.15mm, on the one hand, the thickness value is enough
Achieve the purpose that electromagnetic isolation, on the other hand, electro-conductive lacquer layer can be made thin as far as possible, it is possible to reduce the use of conductive paint, thus as far as possible
Reduce the integral thickness of plastic mould 10.
Similarly, the absorbing material of the present embodiment is blent using metal oxide, the spraying of the absorbing material layer 22
Thickness is preferably 0.05~0.15mm, on the one hand, the thickness value sufficiently achieves the purpose of electromagnetic wave absorption, keeps electromagnetic wave anti-
It is emitted back towards and influences electronic product normal work, on the other hand, keep absorbing material layer thin as far as possible, it is possible to reduce absorbing material makes
With so that the integral thickness of reduction plastic mould as far as possible, reduces the use cost of material.
Above-mentioned conductive paint and absorbing material spraying after need it is to be dried after just can be carried out the next step, for improve work effect
Rate, the conductive paint of the present embodiment selects conductive copper paint, and solidifies conductive paint and/or absorbing material quickly using oven drying method.
Since conductive copper paint is copper, it can be clearly seen that the position of spraying and substantially thickness.After the completion of spraying, plastics
The inner surface of mold is all covered into copper.Absorbing material, the absorbing material choosing of the present embodiment are sprayed after conductive paint solidification again
With white or black, so as to the position that can be clearly seen that absorbing material spraying and substantially thickness, after the completion of spraying, conductive paint
Upper and whole coverings are at white or black.
Similarly, after absorbing material solidification, continue spraying plating epoxy resin, the thickness of epoxy resin layer 23 can be according to practical need
The thickness of spraying plating is determined, to facilitate the final shaping to be advisable.
After whole coating sprayings finish, sizing is stood.Plastic mould 10 after completing as a result, is just steady with one
Solid anti-interference layer 20, can isolate electromagnetic radiation, prevent electromagnetic interference.
In conclusion not only anti-tampering effect is good for the utility model, use scope is wide, can be applied to most differences
The electronic equipment of size, and due to having abandoned metallic shield, thus a large amount of material and manufacturing process can be saved, have
Production cost is reduced to effect, improves the production efficiency of product.
The above is only the preferred embodiment of the present invention, is not intended to limit its scope of the patents, all to utilize this
Equivalent structure transformation made by utility model specification and accompanying drawing content is directly or indirectly used in other relevant technology necks
Domain is also included in the patent protection scope of the utility model.
Claims (4)
1. a kind of Anti-interference electronic equipment, including plastic mould, it is characterised in that: the inner surface of the plastic mould is equipped with anti-dry
Layer is disturbed, the anti-interference layer includes electro-conductive lacquer layer, absorbing material layer and epoxy resin layer, and the electro-conductive lacquer layer is covered in described
On surface, the absorbing material layer is coated on the electro-conductive lacquer layer, and the epoxy resin layer spraying plating is in the absorbing material layer
On, and the inner surface, electro-conductive lacquer layer, absorbing material layer and epoxy resin layer successively mutually bond.
2. electronic equipment as described in claim 1, it is characterised in that: the coating thickness of the conductive paint be 0.05~
0.15mm。
3. electronic equipment as described in claim 1, it is characterised in that: the conductive paint uses conductive copper paint.
4. electronic equipment as described in claim 1, which is characterized in that the coating thickness of the absorbing material be 0.05~
0.15mm。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821642587.6U CN209489096U (en) | 2018-10-10 | 2018-10-10 | Anti-interference electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821642587.6U CN209489096U (en) | 2018-10-10 | 2018-10-10 | Anti-interference electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209489096U true CN209489096U (en) | 2019-10-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821642587.6U Active CN209489096U (en) | 2018-10-10 | 2018-10-10 | Anti-interference electronic equipment |
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| Country | Link |
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| CN (1) | CN209489096U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109121376A (en) * | 2018-10-10 | 2019-01-01 | 深圳市友华通信技术有限公司 | Electronic equipment anti-interference method and Anti-interference electronic equipment |
-
2018
- 2018-10-10 CN CN201821642587.6U patent/CN209489096U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109121376A (en) * | 2018-10-10 | 2019-01-01 | 深圳市友华通信技术有限公司 | Electronic equipment anti-interference method and Anti-interference electronic equipment |
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