CN209489072U

CN209489072U - A kind of heat pipe for ultrathin electronic product

Info

Publication number: CN209489072U
Application number: CN201822039707.XU
Authority: CN
Inventors: 崔健
Original assignee: Kunshan Shemao Electronic Technology Co Ltd
Current assignee: Kunshan Shemao Electronic Technology Co Ltd
Priority date: 2018-12-06
Filing date: 2018-12-06
Publication date: 2019-10-11
Anticipated expiration: 2028-12-06

Abstract

The utility model relates to the radiator accessories of electronic equipment, specifically disclose a kind of heat pipe for ultrathin electronic product, the tube body sealed including both ends, one end of tube body is radiating end, the other end of tube body is heating end, it is bending part between radiating end and the tube body of heating end, tube body medial surface is electroplate with silver layer, and sintering has copper wire layer in silver layer partial inner side；Sintering has the copper mesh layers being in contact with copper wire layer on silver layer in radiating end and heating end, radiating end and heating end with a thickness of 0.5mm to 1.5mm, copper wire layer is as coolant flow carrier, copper wire layer is sintered by the identical copper wire of diameter, ensure that the voidage of coolant flow carrier is uniform, ensure that the thickness of coolant flow carrier is uniform, ensuring when heat pipe is flattened to 1mm thickness will not there is a situation where inner wall of heat pipe and coolant flow carrier mutual extrusion, silver layer accelerates the thermal cycle speed of thermal conductivity tube cavity, improves heat transfer efficiency.

Description

A kind of heat pipe for ultrathin electronic product

Technical field

The utility model relates to the radiator accessories of electronic equipment, and in particular to a kind of thermal conductivity for ultrathin electronic product Pipe.

Background technique

It is used for the heat pipe of ultrathin electronic product now, is all with sintered copper powder layer as coolant flow carrier, Coolant liquid is evaporated to gas after heating end is heated, and gas inside sufficiently entire heat pipe, coagulates rapidly again in radiating end gas Form coolant liquid, the coolant liquid of gas condensation is soaked along sintered copper powder layer to heating end, the cooling for condensing gas Liquid is heated is evaporated to gas again, and by the above process, heat pipe is realized to electronic component radiation processes, and changes electricity The relative position of subassembly and thermal component, to realize the ultrathin of electronic product, wherein with sintered copper powder layer as There are two problems for coolant flow carrier, first is that copper powder layer will form the situation of voidage unevenness, thermally conductive effect during the sintering process Rate is low, and part copper bisque can sinter a lump into when serious, and heat pipe is in bending usually because the lump that copper powder sinters into hinders The underproof phenomenon of existing bending is kept off, waste product is caused；Second is that sintered copper powder layer is in uneven thickness, heat pipe now is only It can flatten to 2mm thickness, when heat pipe to be flattened to the 1mm thickness of market demands by force, it may occur that inner wall of heat pipe and sintering The case where rear copper powder layer mutual extrusion, in specific words, sintered copper powder layer, hurt inner wall of heat pipe, and inner wall of heat pipe can squeeze Pressing sintered copper powder layer deformation occurs reduces the voidage of sintered copper powder layer, under the heat-transfer rate for directly causing heat pipe Drop.

Utility model content

In order to solve the above technical problems, we have proposed a kind of heat pipe for ultrathin electronic product, purpose: cooling The voidage of liquid flowing carrier is uniform, and the thickness of coolant flow carrier is uniform, will not send out when heat pipe is flattened to 1mm thickness The case where heat pipe inner wall and coolant flow carrier mutual extrusion, improves heat transfer efficiency.

In order to achieve the above objectives, the technical solution of the utility model is as follows:

A kind of heat pipe for ultrathin electronic product, including the tube body that both ends seal, one end of tube body is radiating end, The other end of tube body is heating end, is bending part between radiating end and the tube body of heating end, and tube body medial surface is electroplate with silver layer, Sintering has copper wire layer in silver layer partial inner side；

Sintering has the copper mesh layers being in contact with copper wire layer on silver layer in radiating end and heating end；

Radiating end and heating end with a thickness of 0.5mm to 1.5mm.

Preferably, copper wire layer is sintered by the identical copper wire of diameter.

Preferably, radiating end and heating end with a thickness of 1mm.

Through the above technical solutions, copper wire layer and copper mesh, which are in contact, has sintered a coolant flow carrier into, wherein copper Line layer is sintered by the identical copper wire of diameter, it is ensured that the voidage of coolant flow carrier is uniform, it is ensured that cooling liquid stream The thickness of dynamic load body is uniform, it is ensured that inner wall of heat pipe and coolant flow will not occur when heat pipe is flattened to 1mm thickness The case where carrier mutual extrusion, tube body medial surface are electroplate with silver layer, and silver layer accelerates the thermal cycle speed of thermal conductivity tube cavity, Heat transfer efficiency is improved, sintering has copper wire layer in silver layer partial inner side, it is ensured that copper wire layer will not be with the inner wall of heat pipe phase Mutually squeeze.

Detailed description of the invention

In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor Under, it is also possible to obtain other drawings based on these drawings.

Fig. 1 is a kind of schematic top plan view of the heat pipe for ultrathin electronic product disclosed in the utility model；

Fig. 2 is enlarged diagram at the A of Fig. 1；

Fig. 3 is the schematic cross-sectional view of the B-B of Fig. 2；

Fig. 4 is enlarged diagram at the C of Fig. 3.

Number and corresponding component title represented by letter in figure:

1. silver 41. copper wire layer of layer, 42. copper mesh layers of 2. heating end of radiating end, 3. bending part 4..

Specific embodiment

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without creative efforts Every other embodiment obtained, fall within the protection scope of the utility model.

Specific embodiment of the present utility model is described in further detail below with reference to schematic diagram.

As shown in Figure 1, Figure 2, Figure 3 and Figure 4, a kind of heat pipe for ultrathin electronic product, seals including both ends Tube body, one end of tube body are radiating end 1, and it is curved between radiating end 1 and the tube body of heating end 2 that the other end of tube body, which is heating end 2, Folding part 3, bending part 3 can make the heat pipe adapt to the installation of a variety of ultrathin electronic products, can also according to circumstances adjust bending part 3 Shape.

Tube body medial surface is electroplate with silver layer 4, and silver layer 4 accelerates the thermal cycle speed of thermal conductivity tube cavity, improves and lead The thermal efficiency.

Sintering has copper wire layer 41 in silver 4 partial inner side of layer, it is ensured that copper wire layer 41 will not be mutual with the inner wall of heat pipe It squeezes.

Sintering has the copper mesh layers 42 being in contact with copper wire layer 41, copper wire layer on silver layer 4 in radiating end 1 and heating end 2 41 and copper mesh 42 be in contact and sintered a coolant flow carrier into, copper wire layer 41 is burnt by the identical copper wire of 50 six roots of sensation diameters It ties, it is ensured that the voidage of coolant flow carrier is uniform, it is ensured that the thickness of coolant flow carrier is uniform, it is ensured that It will not there is a situation where inner wall of heat pipe and coolant flow carrier mutual extrusion when the heat pipe is flattened to 1mm thickness.

Radiating end 1 and heating end 2 with a thickness of 1mm, so that the heat pipe is met the requirement in market.

It is above exactly the design feature and function and effect of a kind of heat pipe for ultrathin electronic product, advantage: cooling The voidage of liquid flowing carrier is uniform, and the thickness of coolant flow carrier is uniform, will not send out when heat pipe is flattened to 1mm thickness The case where heat pipe inner wall and coolant flow carrier mutual extrusion, improve heat transfer efficiency.

Above-described is only preferred embodiments of the present invention, it is noted that for the ordinary skill of this field For personnel, without departing from the concept of the present invention, various modifications and improvements can be made, these all belong to In the protection scope of the utility model.

Claims

1. a kind of heat pipe for ultrathin electronic product, which is characterized in that including the tube body that both ends seal, one end of tube body For radiating end (1), it is bending part between radiating end (1) and the tube body of heating end (2) that the other end of tube body, which is heating end (2), (3), tube body medial surface is electroplate with silver layer (4), and sintering has copper wire layer (41) in silver layer (4) partial inner side；

Sintering has the copper mesh layers (42) being in contact with copper wire layer (41) on silver layer (4) in radiating end (1) and heating end (2)；

Radiating end (1) and heating end (2) with a thickness of 0.5mm to 1.5mm.

2. a kind of heat pipe for ultrathin electronic product according to claim 1, which is characterized in that copper wire layer (41) by The identical copper wire of diameter is sintered.

3. a kind of heat pipe for ultrathin electronic product according to claim 1, which is characterized in that radiating end (1) and Heating end (2) with a thickness of 1mm.