CN209461416U - A kind of Testing board for testing semiconductor - Google Patents
A kind of Testing board for testing semiconductor Download PDFInfo
- Publication number
- CN209461416U CN209461416U CN201920249257.9U CN201920249257U CN209461416U CN 209461416 U CN209461416 U CN 209461416U CN 201920249257 U CN201920249257 U CN 201920249257U CN 209461416 U CN209461416 U CN 209461416U
- Authority
- CN
- China
- Prior art keywords
- plate body
- testing
- spring
- connector sleeve
- card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model discloses a kind of Testing board for testing semiconductor, including plate body, folding rod and the first spring, connector sleeve is fixedly installed with above the plate body, and the surface of plate body offers sliding slot, folding rod is installed on the inside of the connector sleeve, and the first spring is fixed between folding rod, and the side of folding rod is connected with fixed plate, connecting card is connected on the left of the plate body, and the two sides up and down of connecting card open up it is fluted, the right side opening of the plate body is equipped with connection card slot, connecting rod is connected on the right side of the plate body, and fixing head is fixed with below connecting rod, and second spring is connected on the outside of connecting rod, the surface of the plate body offers heat release hole.The Testing board for testing semiconductor, it is provided with fixed plate, 2 fixed plates can be made to carry out extruding fixation to the element under test of insertion between folding rod under the action of the first spring, facilitate and fix element under test, improves the test board to the fixed effect of element under test.
Description
Technical field
The utility model relates to semiconductor test technical field, specially a kind of Testing board for testing semiconductor.
Background technique
Semiconductor manufacturing process is formed by testing after wafer manufacture, wafer test, chip package and encapsulation, is surveyed in semiconductor
It needs for element under test to be mounted on test board when examination, and for existing test board, or there is very big a part
Problem, just such as:
1, existing test board is in test, it has not been convenient to which the fixation of element under test causes to be easy to appear when test crooked de-
The phenomenon that falling influences the side view effect of semiconductor；
2, existing test board has a single function, and does not have and splices function, the problem for causing the using effect of test board poor,
Therefore it is proposed that a kind of Testing board for testing semiconductor, so as to solve the problems, such as it is above-mentioned proposed in.
Utility model content
The purpose of this utility model is to provide a kind of Testing board for testing semiconductor, are proposed with solving above-mentioned background technique
When existing test, it has not been convenient to which the fixation of element under test causes to be easy to appear the phenomenon that skew falls off when test, influences semiconductor
Side view effect, and test board has a single function, and does not have splicing function, the problem that causes the using effect of test board poor.
To achieve the above object, the utility model provides the following technical solutions: a kind of Testing board for testing semiconductor, including
Plate body, folding rod and the first spring are fixedly installed with connector sleeve above the plate body, and the surface of plate body offers sliding slot,
Folding rod is installed on the inside of the connector sleeve, and is fixed with the first spring between folding rod, and the side of folding rod and solid
Fixed board is connected, and connecting card is connected on the left of the plate body, and the two sides up and down of connecting card open up fluted, the plate
The right side opening of body is equipped with connection card slot, is connected with connecting rod on the right side of the plate body, and fixing head is fixed with below connecting rod,
And second spring is connected on the outside of connecting rod, the surface of the plate body offers heat release hole.
Preferably, the trapezoidal structure of the connector sleeve, and connector sleeve is to be flexibly connected, and connector sleeve is located at folding rod
The center of plate body.
Preferably, the fixed plate and sliding slot are the slide construction being connected together, and axis of the fixed plate about connector sleeve
Line is symmetrically arranged with 2.
Preferably, the connecting card is fixedly connected with the connection type of plate body, and there are two connecting card settings, and
And connecting card is to be connected together with card slot is connect.
Preferably, the connecting rod constitutes elastic construction by second spring and plate body, and connecting rod and fixing head are one
Body structure, and connecting rod is symmetrically arranged with 2, while fixing head and connecting card surface about the central axes of connection card slot
Groove matches.
Preferably, the heat release hole is evenly distributed in the surface of plate body.
Compared with prior art, the utility model has the beneficial effects that the Testing board for testing semiconductor,
(1) it is provided with fixed plate, 2 fixed plates can be made to insertion between folding rod under the action of the first spring
Element under test carries out extruding fixation, facilitates and fixes element under test, improves the test board to the fixed effect of element under test；
(2) it is provided with connecting card and connection card slot, it is right that the connecting card on the left of the plate body can be stuck in another plate body
On the connection card slot of side, make groove phase of the fixing head of connection card rooved face under the action of second spring with connecting card surface
In conjunction with facilitating and the engaging of two plate bodys be stitched together, improve the use function of the test board.
Detailed description of the invention
Fig. 1 is the utility model formal structure schematic diagram；
Fig. 2 is the utility model overlooking structure diagram；
Fig. 3 is structural schematic diagram at A in the utility model Fig. 1；
Fig. 4 is the utility model plate body splicing construction schematic diagram.
In figure: 1, plate body；2, connector sleeve；3, sliding slot；4, folding rod；5, the first spring；6, fixed plate；7, connecting card；
8, groove；9, card slot is connected；10, fixing head；11, connecting rod；12, second spring；13, heat release hole.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-4 is please referred to, the utility model provides a kind of technical solution: a kind of Testing board for testing semiconductor, including plate
Body 1, connector sleeve 2, sliding slot 3, folding rod 4, the first spring 5, fixed plate 6, connecting card 7, groove 8, connection card slot 9, fixing head
10, connecting rod 11, second spring 12 and heat release hole 13, the top of plate body 1 is fixedly installed with connector sleeve 2, and the surface of plate body 1 is opened
Equipped with sliding slot 3, the inside of connector sleeve 2 is equipped with folding rod 4, and the first spring 5 is fixed between folding rod 4, and folding rod 4
Side be connected with fixed plate 6, the left side of plate body 1 is connected with connecting card 7, and the two sides up and down of connecting card 7 offer
Groove 8, the right side opening of plate body 1 are equipped with connection card slot 9, and the right side of plate body 1 is connected with connecting rod 11, and the lower section of connecting rod 11 is solid
Surely there is fixing head 10, and the outside of connecting rod 11 is connected with second spring 12, the surface of plate body 1 offers heat release hole 13.
The trapezoidal structure of connector sleeve 2, and connector sleeve 2 is to be flexibly connected, and connector sleeve 2 is located at plate body 1 with folding rod 4
Center can facilitate element under test to be inserted into the inside of connector sleeve 2.
Fixed plate 6 and sliding slot 3 are the slide construction being connected together, and fixed plate 6 is symmetrically set about the central axes of connector sleeve 2
2 are equipped with, element under test can be fixed, mentioned by 2 fixed plates 6 under the action of 4 the first spring 5 of middle part of folding rod
The using effect of the high device.
Connecting card 7 is fixedly connected with the connection type of plate body 1, and there are two the settings of connecting card 7, and connection card
Piece 7 is to be connected together with card slot 9 is connect, and the connecting card 7 by 1 left side of plate body is facilitated to be inserted into the connection card on 1 right side of another plate body
On slot 9, the splicing of test board is facilitated.
Connecting rod 11 constitutes elastic construction by second spring 12 and plate body 1, and connecting rod 11 is integrated with fixing head 10
Structure, and connecting rod 11 is symmetrically arranged with 2, while fixing head 10 and 7 table of connecting card about the central axes of connection card slot 9
The groove 8 in face matches, can be by the fixing head 10 of 9 inside of connection card slot under the action of second spring 12, by connection card
The groove 8 on 7 surface of piece blocks, and improves spliced stability.
Heat release hole 13 is evenly distributed in the surface of plate body 1, and can be shed device to test generation by heat release hole 13
Heat.
Working principle: firstly, according to Fig. 1-4, when in use, which, which is placed on, needs place to be used, when
When needing to detect, by the connector sleeve 2 on one end insertion 1 surface of plate body of element under test, make consolidating on 2 folded inside bar 4 of connector sleeve
Fixed board 6 fixes element under test under the action of the first spring 5, and then facilitates the fixation of element under test, improves the test
The connecting card 7 on 1 surface of plate body when test, when needing to splice plate body 1, is inserted into another 1 surface of plate body by the using effect of plate
Connection card slot 9 in, make connect card slot 9 on fixing head 10 7 surface of connecting card is sticked under the action of second spring 12
In groove 8, and then facilitate and splice the engaging of 2 plate bodys 1, facilitates the splicing of test board, the heat release hole 13 on 1 surface of plate body,
The heat that the test board work that can effectively shed generates, improves the using effect of the test board, does not make in this specification in detail
The content carefully described belongs to the prior art well known to professional and technical personnel in the field.
Although the utility model is described in detail with reference to the foregoing embodiments, come for those skilled in the art
Say, it is still possible to modify the technical solutions described in the foregoing embodiments, or to part of technical characteristic into
Row equivalent replacement, within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on should all
It is included within the scope of protection of this utility model.
Claims (6)
1. a kind of Testing board for testing semiconductor, including plate body (1), folding rod (4) and the first spring (5), it is characterised in that: institute
It states and is fixedly installed with above plate body (1) connector sleeve (2), and the surface of plate body (1) offers sliding slot (3), the connector sleeve (2)
Inside be equipped with folding rod (4), and the first spring (5) are fixed between folding rod (4), and the side of folding rod (4) with
Fixed plate (6) is connected, and is connected with connecting card (7) on the left of the plate body (1), and the two sides up and down of connecting card (7) are opened
Equipped with groove (8), the right side opening of the plate body (1) is equipped with connection card slot (9), is connected with connecting rod on the right side of the plate body (1)
(11), it and below connecting rod (11) is fixed with fixing head (10), and is connected with second spring on the outside of connecting rod (11)
(12), the surface of the plate body (1) offers heat release hole (13).
2. a kind of Testing board for testing semiconductor according to claim 1, it is characterised in that: the connector sleeve (2) is in ladder
Shape structure, and connector sleeve (2) is to be flexibly connected, and connector sleeve (2) is located at the center of plate body (1) with folding rod (4).
3. a kind of Testing board for testing semiconductor according to claim 1, it is characterised in that: the fixed plate (6) and cunning
Slot (3) is the slide construction being connected together, and fixed plate (6) is symmetrically arranged with 2 about the central axes of connector sleeve (2).
4. a kind of Testing board for testing semiconductor according to claim 1, it is characterised in that: the connecting card (7) with
The connection type of plate body (1) be fixedly connected, and connecting card (7) setting there are two, and connecting card (7) with connect card slot
It (9) is to be connected together.
5. a kind of Testing board for testing semiconductor according to claim 1, it is characterised in that: the connecting rod (11) passes through
Second spring (12) and plate body (1) constitute elastic construction, and connecting rod (11) is structure as a whole with fixing head (10), and connects
Bar (11) is symmetrically arranged with 2, while fixing head (10) and connecting card (7) surface about the central axes of connection card slot (9)
Groove (8) matches.
6. a kind of Testing board for testing semiconductor according to claim 1, it is characterised in that: the heat release hole (13) is uniform
The surface for being distributed in plate body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920249257.9U CN209461416U (en) | 2019-02-27 | 2019-02-27 | A kind of Testing board for testing semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920249257.9U CN209461416U (en) | 2019-02-27 | 2019-02-27 | A kind of Testing board for testing semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209461416U true CN209461416U (en) | 2019-10-01 |
Family
ID=68046912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920249257.9U Expired - Fee Related CN209461416U (en) | 2019-02-27 | 2019-02-27 | A kind of Testing board for testing semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209461416U (en) |
-
2019
- 2019-02-27 CN CN201920249257.9U patent/CN209461416U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A semiconductor test board Effective date of registration: 20200730 Granted publication date: 20191001 Pledgee: Jiangsu Credit Financing Guarantee Co.,Ltd. Pledgor: NANTONG JIEJING SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Registration number: Y2020980004557 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20211008 Granted publication date: 20191001 Pledgee: Jiangsu Credit Financing Guarantee Co.,Ltd. Pledgor: NANTONG JIEJING SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Registration number: Y2020980004557 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191001 Termination date: 20210227 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |