CN209454376U - A kind of reparation chip - Google Patents
A kind of reparation chip Download PDFInfo
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- CN209454376U CN209454376U CN201822051597.9U CN201822051597U CN209454376U CN 209454376 U CN209454376 U CN 209454376U CN 201822051597 U CN201822051597 U CN 201822051597U CN 209454376 U CN209454376 U CN 209454376U
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- reparation
- substrate
- repairing
- wafer
- chip
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Abstract
The utility model provides a kind of reparation chip, comprising: is removed former wafer treated the repairing substrate with storage unit and the new wafer for being provided with storage unit；Repairing substrate and the binding connection of new wafer are formed and repair chip, the chip of repairing further includes for marking the reparation mark for repairing chip status.The utility model can be while realizing that chip recycles, and formation is used to mark the reparation mark for repairing chip status to allow users to distinguish the reparation chip and old consumable chip after reparation, avoids user from generating and obscures.
Description
Technical field
The utility model relates to the technical field of imaging device more particularly to a kind of reparation chips.
Background technique
The printing consumables that can be replaced, such as cartridge, print cartridge etc. are installed in imaging device.It is filled in printing consumables
For the toner of imaging, such as ink is filled in cartridge filled with carbon dust, in print cartridge.In order to record printing consumables
In Toner allowance and printing consumables characteristic, consumable chip is additionally provided in printing consumables.Consumable chip is provided with
Memory, for recording Toner allowance and being communicated with imaging device.After the toner in printing consumables is depleted,
Printer can be written in consumable chip indicates that Toner allowance is empty data, indicates that the printing consumables service life is over, needs
Replace printing consumables.The printing consumables of end-of-life is usually abandoned by user, and the consumable chip on printing consumables is arranged in
It can be dropped, for environmentally protective requirement, need to carry out recycling repairing and reusing to consumable chip.
It is open in Chinese patent application publication number CN201820155695.4 aiming at the problem that original-pack consumable chip recycles
A kind of regeneration chip by the way of partial replacement retains the PCB design of original-pack consumable chip and the logic device of peripheral circuit
Part is constant, replaces with regeneration wafer, regeneration wafer by the interface unit and peripheral logic device of waste chips and printer into
Row communication.With the former wafer that new wafer replacement is original directly on original-pack consumable chip, the reclaiming of chip, but this are realized
Kind regeneration chip is easy so that user's generation is obscured, it is difficult to which chip used in distinguishing is original-pack chip or regeneration chip, is made
At trouble unnecessary in use process, furthermore when being recycled to different types of chip, require with corresponding wafer
It replaces former wafer, increases production cost.
Utility model content
Reparation chip provided by the utility model, can be while realizing that chip recycles, and formation is used to mark
The reparation mark for repairing chip status allows users to distinguish the reparation chip and old consumable chip after reparation, and user is avoided to produce
Life is obscured.
In a first aspect, the utility model provides a kind of reparation chip, comprising: removed at the former wafer with storage unit
Repairing substrate after reason and the new wafer for being provided with storage unit；Repairing substrate and the binding connection of new wafer are formed and repaired
Chip, the chip of repairing includes for marking the reparation mark for repairing chip status.
Optionally, described to repair the mark formed after the primary business men information identified be on removal repairing substrate.
Optionally, the reparation is identified as the coating being arranged at the primary business men information of repairing substrate；
Alternatively, the reparation is identified as the friction marks after ultrasonic wave or physical friction wear primary business men information
Mark；
Alternatively, the reparation is identified as the increased new flag information at primary business men information.
Optionally, described to be removed that have former wafer treated the repairing substrate of storage unit be through removal sealing and original
The original substrate of wafer and the pad being set in original substrate after clearing up.
Optionally, the repairing substrate is the repairing substrate of heated removal sealing or laser ablation sealing.
Optionally, the pad being set in original substrate after clearing up be using chemical agents such as circuit board cleaning agents or
Person's ultrasonic wave cleans the oxide layer or impurity of pad, makes it possible to be reused for bind the pad of wafer.
Optionally, multiple connecting terminals are provided on the substrate, the multiple connecting terminal is used for and imaging device is logical
Letter, and be arranged with substrate pads in different sides.
Optionally, it is provided with M solder joint in the new wafer, the N connecting with former wafer is provided on the repairing substrate
A solder joint is bound N number of solder joint on the M solder joint and substrate in the new wafer so that new wafer replaces former wafer shape
At reparation chip, wherein M >=N.
Optionally, M solder joint in the new wafer is arranged in a row or more.
Reparation chip provided by the embodiment of the utility model can form one and be used for while realizing that chip recycles
The reparation mark that label repairs chip status allows users to distinguish the manufacturer of reparation chip and old consumable chip after repairing,
It avoids user from generating to obscure；And new wafer pad correspond to the quantity of solder joint and corresponds to the quantity of solder joint more than substrate pads, facilitates pair
While wafer is tested, enables new wafer to be used for different substrates, and then increase the versatility of wafer, reduce regeneration
Production cost.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of old consumable chip substrate back in the utility model；
Fig. 2 is the structural schematic diagram of old consumable chip substrate front side in the utility model；
Fig. 3 is the structural schematic diagram at the repairing substrate back side of the utility model through removal sealing and former wafer；
Fig. 4 is the structural schematic diagram that an embodiment of the present invention binds the substrate back after new wafer；
Fig. 5 is the structural schematic diagram that another embodiment of the utility model binds the substrate back after new wafer；
Fig. 6 is the structural schematic diagram that another embodiment of the utility model binds the substrate back after new wafer；
Fig. 7 is the structural schematic diagram that another embodiment of the utility model binds the substrate back after new wafer；
Fig. 8 is the structural schematic diagram that an embodiment of the present invention carries out the sealing metacoxal plate back side to new wafer；
Fig. 9 is that an embodiment of the present invention is formed with the structural schematic diagram for repairing the reparation chip of mark；
Figure 10 is that another embodiment of the utility model is formed with the structural schematic diagram for repairing the reparation chip of mark；
Figure 11 is that another embodiment of the utility model is formed with the structural schematic diagram for repairing the reparation chip of mark.
Specific embodiment
It is practical new below in conjunction with this to keep the objectives, technical solutions, and advantages of the embodiments of the present invention clearer
Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that is retouched
The embodiment stated is only the utility model a part of the embodiment, instead of all the embodiments.Based in the utility model
Embodiment, every other embodiment obtained by those of ordinary skill in the art without making creative efforts, all
Belong to the range of the utility model protection.
The utility model embodiment provides a kind of reparation chip, as shown in figure 4, the reparation chip includes: to have through removal
There is former wafer treated the repairing substrate 11 of storage unit and is provided with the new wafer 7 of storage unit；By repairing substrate 11
Connection is bound by wiring with new wafer 7 and forms reparation chip, as shown in Figures 9 to 11, the reparation chip includes for marking
Note repairs the reparation mark 10 of chip status.
Reparation chip provided by the embodiment of the utility model is mainly while realizing that chip recycles, for marking
The reparation mark 10 for repairing chip status allows users to distinguish the reparation chip and old consumable chip after reparation, avoids user
Generation is obscured.
Optionally, described to repair after mark is the primary business men information removed on repairing substrate such as Fig. 9 and to shown in Figure 11
The mark of formation.
Optionally, as shown in figure 9, the mark 10 of repairing is the covering of the setting at the primary business men information of repairing substrate
Layer；
Alternatively, as shown in Figure 10, the reparation mark 10 is to grind primary business men information through ultrasonic wave or physical friction
Wear trace after damage；
Alternatively, as shown in figure 11, the reparation mark 10 is the direct increased new flag information at primary business men information.
Optionally, as shown in Figure 1 to Figure 3, former wafer treated the repairing substrate through removing with storage unit
11 be the original substrate through removal sealing 2 and former wafer (in the inside of sealing 2, being not shown in the figure) and the setting after clearing up
In the pad 5 in original substrate.
Optionally, as shown in figs. 1 and 3, the repairing substrate is heated removal sealing 2 or laser ablation sealing 2
Repairing substrate.
Optionally, the pad being set in original substrate after clearing up be using chemical agents such as circuit board cleaning agents or
Person's ultrasonic wave cleans the oxide layer or impurity of pad, makes it possible to be reused for bind the pad of wafer.
Optionally, as shown in Figures 2 and 3, multiple connecting terminals 3, the multiple company are provided on the repairing substrate 11
Contact point 3 is used for and imaging device communication, and is arranged with the substrate pads of repairing substrate 5 in different sides.
Optionally, as shown in Figures 4 to 7, it is provided with M solder joint 8 in the new wafer 7, be arranged on the repairing substrate
There is the N number of solder joint 5 connecting with former wafer, M solder joint in the new wafer 7 is tied up with N number of solder joint on repairing substrate
Determine so that new wafer, which replaces former wafer, forms reparation chip, wherein M >=N.
Optionally, as shown in Figures 4 to 7, M solder joint in the new wafer 7 is arranged in a row or more.
Specifically, reparation chip described in the present embodiment is by by the N of the M pad 8 of the new wafer 7 and repairing substrate
A pad 5 is bound so that new wafer replaces the reparation chip that former wafer is formed, i.e., the quantity of pad is greater than in new wafer
Or the quantity equal to pad on repairing substrate, when the quantity of new wafer pad is greater than the quantity of the substrate pads of repairing substrate,
It while conveniently test new wafer, and then also can increase the versatility of new wafer, new wafer be used for different
On substrate, the unnecessary cost in regeneration production is reduced.
In conclusion as shown in figs. 1-11, reparation chip described in the present embodiment will be provided with original substrate 1 and former wafer
Old consumable chip carries out repairing the reparation chip that is formed and can be reused, and the storage unit being arranged in former wafer is for storing number
According to and and printer communication, the data stored in former wafer include consumptive material model, consumptive material color, consumable items allowance, number of print pages, life
Produce the information such as date, production firm.It is additionally provided with the pad for connecting with substrate circuit in former wafer, is also set up in original substrate
There is circuit, in order to allow former wafer that can be provided with substrate pads 5 in original substrate with the circuit connection in original substrate.Former wafer with
It is communicated after substrate pads binding with printer.Covering 2 is also covered in former wafer, such as sealing；It is also set up in original substrate
There is primary business men information 4, primary business men information includes the trademark information of manufacturer, the character information of mark manufacturer, production batch
Amount information and patent No. information etc..
Therefore, reparation chip described in the present embodiment includes repairing substrate 11, and the new wafer 7 on repairing substrate 11 is arranged in,
And the repairing substrate contact contact 3 on repairing substrate another side is set.Repairing substrate 11 is handled by old consumable chip
It obtains；Quantity in new wafer 7 for the pad 8 of binding is more than or equal to the quantity of the substrate pads 5 on repairing substrate；It repairs
11 upper surface of complex radical plate is formed with reparation mark 10.
Specifically, being heated first to the sealing 2 on old consumable chip, after being heated to sealing 1 and softening, by sealing
1 and sealing below former wafer remove together, laser ablation sealing and former wafer can also be used here, expose binding wafer
Substrate pads 5, at this moment, using chemical agents such as circuit board cleaning agents or using ultrasonic wave to the oxide layers of substrate pads 5 or
Person's impurity cleans, and substrate pads 5 is enabled to be reused for binding wafer；Repairing substrate 11 is just obtained at this time, such as Fig. 3 institute
Show, old consumable chip handled after obtaining repairing substrate 11, as shown in figure 4, by wiring 6 by new wafer 7 pad 8 with
Pad 5 on repairing substrate is bound, and the number of pads of new wafer 7 can be equal to the number of pads of repairing substrate.For side
Just test and burning are carried out to new wafer, increases the versatility of new wafer, enabled new wafer to be used for different substrates, may be used also
It is bound with the new wafer for the substrate pads quantity for selecting number of pads to be greater than repairing substrate with repairing substrate, and new wafer
Number of pads can be arranged in a row or multiple rows of, as shown in Figures 4 to 7, after new wafer 7 has been bound, one layer be covered in new wafer
New wafer 7 is encapsulated on repairing substrate, protects to new wafer by covering 9, and covering 9 can be sealing.Removal is repaired
Primary business men information 4 on substrate 11 can directly add one layer of coating as mark 10 is repaired at primary business men information, will
Primary business men information 4 on repairing substrate 11 is covered, is covered, as shown in Figure 9；It can also be rubbed by ultrasonic wave or physics
It wipes, primary business men information is worn, the wear trace after abrasion is as mark 10 is repaired, as shown in Figure 10；Alternatively, by original production
The abrasion of quotient's information is arranged a new flag information and marks as reparation after thoroughly removing primary business men information 4 from repairing substrate 11
Know 10, or increases new mark of repairing as mark 10 is repaired, as shown in figure 11 directly in primary business men information 4.
In turn, chip is repaired described in the present embodiment, while realizing that chip recycles, eliminated on former consumable chip
Primary business men information, allow users to distinguish repair after reparation chip and old consumable chip manufacturer, avoid user from producing
Life is obscured；And the quantity of new wafer pad is more than the quantity of substrate pads, while conveniently test new wafer, so that newly
Wafer can be used for different substrates, and then increase the versatility of wafer, reduce regeneration production cost.
Above description is only a specific implementation of the present invention, but the protection scope of the utility model is not limited to
In this, anyone skilled in the art within the technical scope disclosed by the utility model, the change that can be readily occurred in
Change or replace, should be covered within the scope of the utility model.Therefore, the protection scope of the utility model should be with power
Subject to the protection scope that benefit requires.
Claims (9)
1. a kind of reparation chip characterized by comprising through remove have storage unit former wafer treated repair base
Plate and the new wafer for being provided with storage unit；Repairing substrate and the binding connection of new wafer are formed and repair chip, the reparation
Chip includes for marking the reparation mark for repairing chip status.
2. reparation chip according to claim 1, which is characterized in that the mark of repairing is the original removed on repairing substrate
The mark formed after manufacturer's information.
3. reparation chip according to claim 2, which is characterized in that the reparation is identified as the original production in repairing substrate
The coating being arranged at quotient's information；
Alternatively, the reparation is identified as the wear trace after ultrasonic wave or physical friction wear primary business men information；
Alternatively, the reparation is identified as the increased new flag information at primary business men information.
4. reparation chip according to claim 1, which is characterized in that described to be removed at the former wafer with storage unit
Repairing substrate after reason includes the original substrate for being removed sealing and former wafer and the weldering being set in original substrate after clearing up
Disk.
5. reparation chip according to claim 4, which is characterized in that the repairing substrate be heated removal sealing or
The repairing substrate of laser ablation sealing.
6. reparation chip according to claim 4, which is characterized in that the repairing substrate is set to former base after clearing up
Pad on plate is to be cleaned using circuit board cleaning agent or ultrasonic wave to the oxide layer or impurity of pad, is made it possible to
It is reused for the pad of binding wafer.
7. reparation chip according to claim 2, which is characterized in that be provided with multiple connection touchings on the repairing substrate
Point, the multiple connecting terminal is used for and imaging device communication, and is arranged with substrate pads in different sides.
8. reparation chip according to any one of claims 1 to 7, which is characterized in that be provided with M weldering in the new wafer
Point is provided with N number of solder joint connect with former wafer on the repairing substrate, by the new wafer M solder joint on substrate
N number of solder joint bound so that new wafer is replaced former wafer and formed and repairs chip, wherein M >=N.
9. reparation chip according to claim 7, which is characterized in that M solder joint in the new wafer is arranged in a row
Or it is multiple rows of.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822051597.9U CN209454376U (en) | 2018-12-07 | 2018-12-07 | A kind of reparation chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822051597.9U CN209454376U (en) | 2018-12-07 | 2018-12-07 | A kind of reparation chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209454376U true CN209454376U (en) | 2019-10-01 |
Family
ID=68040210
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822051597.9U Active CN209454376U (en) | 2018-12-07 | 2018-12-07 | A kind of reparation chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209454376U (en) |
-
2018
- 2018-12-07 CN CN201822051597.9U patent/CN209454376U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 519060 1st floor, 3rd floor, 4th floor, 5th floor, 6th floor, 7th floor, 8th floor, building 01, 83 Guangwan street, Xiangzhou District, Zhuhai City, Guangdong Province Patentee after: Jihai Microelectronics Co.,Ltd. Address before: 519060 1st floor, 3rd floor, 4th floor, 5th floor, 6th floor, 7th floor, 8th floor, building 01, 83 Guangwan street, Xiangzhou District, Zhuhai City, Guangdong Province Patentee before: APEX MICROELECTRONICS Co.,Ltd. |