CN209435546U - A kind of Low ESR multilayer circuit board - Google Patents
A kind of Low ESR multilayer circuit board Download PDFInfo
- Publication number
- CN209435546U CN209435546U CN201821849499.3U CN201821849499U CN209435546U CN 209435546 U CN209435546 U CN 209435546U CN 201821849499 U CN201821849499 U CN 201821849499U CN 209435546 U CN209435546 U CN 209435546U
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- Prior art keywords
- wiring board
- single layer
- wall
- main body
- layer wiring
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- 239000002356 single layer Substances 0.000 claims abstract description 54
- 230000006835 compression Effects 0.000 claims description 16
- 238000007906 compression Methods 0.000 claims description 16
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910021389 graphene Inorganic materials 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 244000144992 flock Species 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 3
- 230000008439 repair process Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
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- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a kind of Low ESR multilayer circuit boards of wiring board technology field, including single layer wiring board main body, outer wall is provided with fixed block at left and right sides of the single layer wiring board bottom part body, outer wall offers the fixing groove to match with fixed block at left and right sides of the single layer wiring board body top, and fixed block bottom end is plugged on the inner cavity of fixing groove, the single layer wiring board main body includes green oil structure sheaf, green oil structure sheaf inner cavity is provided with wiring board, it is connect by fixed block with fixing groove in device, two adjacent groups single layer wiring board main body is separated, single layer wiring board main body is avoided to flock together and cause heat that can not distribute, it prevents that heat is excessively high and wiring board internal driving is caused to increase, guarantee the normal use of multilayer circuit board, the thickness of green oil structure sheaf is rationally controlled simultaneously, to reduce multilayer circuit board Overall impedance, improve multilayer circuit board ontology performance.
Description
Technical field
The utility model relates to wiring board technology field, specially a kind of Low ESR multilayer circuit board.
Background technique
As the application of communications industry and laptop industry is promoted and is developed, the demand of wiring board is continuously increased, existing
When in use, impedance magnitude has a great impact to the use of wiring board to some wiring boards, and wiring board work can generate heat,
The excessively high impedance that will lead to inside wiring board of heat increases, and influences the using effect of wiring board, and wiring board is to pass through bonding
Mode connect, be used for a long time and be easy to loosen, for this purpose, it is proposed that a kind of Low ESR multilayer circuit board.
Utility model content
The purpose of this utility model is to provide a kind of Low ESR multilayer circuit boards, to solve to propose in above-mentioned background technique
The problem of.
To achieve the above object, the utility model provides the following technical solutions: a kind of Low ESR multilayer circuit board, including list
Sandwich circuit board main body, single layer wiring board bottom part body left and right sides outer wall are provided with fixed block, the single layer wiring board
Outer wall offers the fixing groove to match with fixed block at left and right sides of body top, and fixed block bottom end is plugged on fixing groove
Inner cavity, and be flexibly connected by fixed block with fixing groove between two adjacent groups single layer wiring board main body, the single layer wiring board master
Two sides outer wall is evenly arranged with heat sink strip to body up and down, and heat sink strip rectangular array is arranged, and the single layer wiring board main body includes
Green oil structure sheaf, green oil structure sheaf inner cavity are provided with wiring board.
Preferably, the fixed block inner cavity offers mounting groove, and the mounting groove inner cavity top is provided with adjustment spring, institute
It states adjustment spring bottom end and is provided with compression bar, outer wall is provided with pull rod on the left of the compression bar, and the pull rod left end extends to fixed block
Left side outer wall, outer wall offers sliding slot on the left of the fixed block, and pull rod left end is plugged on the inner cavity of sliding slot, the fixed block
Left and right sides bottom outer wall is provided with limited block, and inner wall offers at left and right sides of the fixing groove matches with limited block
Limiting slot, the one end close to each other of limited block described in two groups all extends to the inner cavity of mounting groove, and two groups of limited blocks are close to each other
One end fit respectively with the left and right sides outer wall of compression bar, the connecting portion of the limited block and fixed block offers guiding
Slot, the limited block outer wall is socketed with reset spring, and the inner wall of one end of reset spring and guide groove connects, and reset spring
The other end and limited block outer wall connect.
Preferably, outer wall is evenly arranged with convex block at left and right sides of the single layer wiring board main body, and convex block is heat dissipation convex block,
And convex block rectangular array is arranged.
Preferably, the fixed block bottom outer wall is provided with locating piece, and the fixing groove intracavity bottom is offered and positioned
The locating slot that block matches.
Preferably, the cross section of the heat sink strip is in rectangle, and the number of heat sink strip shares 36 groups, and heat sink strip is
Graphene heat sink strip.
Preferably, the thickness of green oil structure sheaf is identical in the single layer wiring board main body, and with a thickness of two millimeters to three millis
Between rice.
Compared with prior art, the utility model has the beneficial effects that
1. being connect by fixed block with fixing groove in device, two adjacent groups single layer wiring board main body is separated, single layer is avoided
Wiring board main body flocks together and causes heat that can not distribute, and prevents heat excessively high and wiring board internal driving is caused to increase
Greatly, guarantee the normal use of multilayer circuit board, while heat sink strip further increases the efficiency that single layer wiring board main body heat distributes,
Guarantee the using effect of wiring board, and the rationally thickness of control green oil structure sheaf, so that the overall impedance of multilayer circuit board is reduced,
Improve the performance of multilayer circuit board ontology；
2. fixed block is inserted into fixing groove, while adjustment spring is expanded, and is squeezed into compression bar in limiting slot limited block,
Make two adjacent groups single layer wiring board main body connect, be easily installed multilayer circuit board, also make two adjacent groups single layer wiring board main body it
Between stable connection, guarantee the normal use of multilayer circuit board, while pulling up pull rod, move compression bar between two groups of limited blocks
It walks, is shunk by reset spring, remove limited block from limiting slot, separate two adjacent groups single layer wiring board main body, be convenient for
Disassembly multilayer circuit board repairs replacement, to guarantee multilayer circuit board normal use.
Detailed description of the invention
FIG. 1 is a schematic structural view of the utility model；
Fig. 2 is the utility model fixed block and fixing groove attachment structure schematic diagram.
In figure: 1 single layer wiring board main body, 2 fixed blocks, 21 adjustment springs, 22 mounting grooves, 23 compression bars, 24 pull rods, 25 guiding
Slot, 26 reset springs, 27 limited blocks, 3 fixing grooves, 31 limiting slots, 4 convex blocks, 5 heat sink strips, 6 green oil structure sheafs, 7 wiring boards.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
The utility model provides a kind of technical solution referring to FIG. 1-2: a kind of Low ESR multilayer circuit board, including single layer
Wiring board main body 1,1 bottom of single layer wiring board main body left and right sides outer wall are provided with fixed block 2, and single layer wiring board main body 1 is pushed up
Outer wall offers the fixing groove 3 to match with fixed block 2 at left and right sides of portion, and 2 bottom end of fixed block is plugged on the interior of fixing groove 3
Chamber, and being flexibly connected with fixing groove 3 between two adjacent groups single layer wiring board main body 1 by fixed block 2, by fixed block 2 by phase
Adjacent two groups of single layer wiring board main bodys 1 separate, and make to form cavity between two adjacent groups single layer wiring board main body 1, avoid single layer route
Plate main body 1 is installed together and causes heat that can not distribute, and prevents heat excessively high and leads to 1 impedance of single layer wiring board main body
Increase, while being also prevented from that single layer wiring board 1 heat of main body is excessively high and damage, increases the service life of single layer wiring board main body 1, singly
About 1 two sides outer wall of sandwich circuit board main body is evenly arranged with heat sink strip 5, and 5 rectangular array of heat sink strip is arranged, and increases single-layer wire
The emission efficiency of 1 heat of road plate main body prevents heat high and influences the impedance of single layer wiring board main body 1, guarantees single layer wiring board
1 normal use of main body, single layer wiring board main body 1 include green oil structure sheaf 6, and the rationally thickness of control green oil structure sheaf 6, thus
The overall impedance for reducing multilayer circuit board ontology, improves the performance of multilayer circuit board, 6 inner cavity of green oil structure sheaf is provided with wiring board
7。
Wherein, 2 inner cavity of fixed block offers mounting groove 22, and 22 inner cavity top of mounting groove is provided with adjustment spring 21, adjusts
21 bottom end of spring is provided with compression bar 23, and 23 left side outer wall of compression bar is provided with pull rod 24, and 24 left end of pull rod extends to a left side for fixed block 2
Side outer wall, 2 left side outer wall of fixed block offers sliding slot, and 24 left end of pull rod is plugged on the inner cavity of sliding slot, 2 left and right sides of fixed block
Bottom outer wall is provided with limited block 27, and 3 left and right sides inner wall of fixing groove offers the limiting slot to match with limited block 27
31, two groups of one end close to each other of limited block 27 all extend to the inner cavity of mounting groove 22, and two groups of limited blocks 27 are close to each other
One end fits with the left and right sides outer wall of compression bar 23 respectively, and the connecting portion of limited block 27 and fixed block 2 offers guide groove
25,27 outer wall of limited block is socketed with reset spring 26, and one end of reset spring 26 is connect with the inner wall of guide groove 25, and resets
The other end of spring 26 is connect with the outer wall of limited block 27, and fixed block 2 is inserted into fixing groove 3, is expanded, is made by adjustment spring 21
Compression bar 23 moves down, and limited block 27 is squeezed out mounting groove 22, limited block 27 is inserted into limiting slot 31, makes two adjacent groups single-layer wire
Connected between road plate main body 1, convenient for by multilayer circuit board install combine, while also make two adjacent groups single layer wiring board main body 1 it
Between stable connection, guarantee the normal use of multilayer circuit board, pull up pull rod 24, make compression bar 23 between two groups of limited blocks 27
It removes, is shunk by reset spring 26, remove limited block 27 from limiting slot 31, make two adjacent groups single layer wiring board main body 1
It separates, multilayer circuit board easy to disassemble carries out repair and replacement and increases multilayer circuit board to guarantee multilayer circuit board normal use
Service life；
1 left and right sides outer wall of single layer wiring board main body is evenly arranged with convex block 4, and convex block 4 is heat dissipation convex block, and convex block 4
Rectangular array arrangement, increases the contact area of single layer wiring board main body 1 and air, improves the efficiency that heat distributes, prevents list
1 internal heat of sandwich circuit board main body is excessively high and internal driving is excessive；
2 bottom outer wall of fixed block is provided with locating piece, and 3 intracavity bottom of fixing groove offers the positioning to match with locating piece
Locating piece is inserted into locating slot by slot, is made fixed block 2 and 3 connective stability of fixing groove, is prevented fixed block 2 from occurring in fixing groove 3
It is mobile；
The cross section of heat sink strip 5 is in rectangle, increases the contact area of heat sink strip 5 and air, increases radiating efficiency, and radiate
The number of item 5 shares 36 groups, and heat sink strip 5 is graphene heat sink strip, and graphene has good heating conduction, improves single
The efficiency that sandwich circuit board main body 1 radiates；
The thickness of green oil structure sheaf 6 is identical in single layer wiring board main body 1, and with a thickness of between two millimeters to three millimeters, closes
The thickness of reason control green oil structure sheaf 6 improves the property of multilayer circuit board ontology to reduce the overall impedance of multilayer circuit board
Energy.
Working principle: fixed block 2 is inserted into fixing groove 3, is expanded by adjustment spring 21, moves down compression bar 23, will limited
Position block 27 squeezes out mounting groove 22, is inserted into limited block 27 in limiting slot 31, makes to connect between two adjacent groups single layer wiring board main body 1
It connects, is combined convenient for installing multilayer circuit board, while also making stable connection between two adjacent groups single layer wiring board main body 1, guaranteed
The normal use of multilayer circuit board, and fixed block 2 is spaced apart by two adjacent groups single layer wiring board main body 1, makes multilayer line
The heat that plate generates can come out, and single layer wiring board main body 1 is avoided to flock together and cause heat that can not come out,
It prevents that heat is excessively high and multilayer circuit board internal driving is caused to increase, guarantee the normal use of multilayer circuit board, and rationally control
The thickness of green oil structure sheaf 6 improves the performance of multilayer circuit board, radiates simultaneously to reduce the overall impedance of multilayer circuit board
Item 5 further increases the efficiency that 1 heat of single layer wiring board main body distributes, and guarantees the using effect of multilayer circuit board, pulls up
Pull rod 24 is removed compression bar 23 between two groups of limited blocks 27, is shunk by reset spring 26, makes limited block 27 from limiting slot 31
Middle removal separates two adjacent groups single layer wiring board main body 1, and multilayer circuit board easy to disassemble carries out repair and replacement, more to guarantee
Sandwich circuit board normal use increases the service life of multilayer circuit board.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of Low ESR multilayer circuit board, including single layer wiring board main body (1), it is characterised in that: the single layer wiring board master
Outer wall is provided with fixed block (2) at left and right sides of body (1) bottom, left and right sides outer wall at the top of the single layer wiring board main body (1)
The fixing groove (3) to match with fixed block (2) is offered, and fixed block (2) bottom end is plugged on the inner cavity of fixing groove (3), and
It is flexibly connected by fixed block (2) with fixing groove (3) between two adjacent groups single layer wiring board main body (1), the single layer wiring board
Two sides outer wall is evenly arranged with heat sink strip (5) main body (1) up and down, and heat sink strip (5) rectangular array is arranged, the single layer route
Plate main body (1) includes green oil structure sheaf (6), and green oil structure sheaf (6) inner cavity is provided with wiring board (7).
2. a kind of Low ESR multilayer circuit board according to claim 1, it is characterised in that: open fixed block (2) inner cavity
Equipped with mounting groove (22), mounting groove (22) inner cavity top is provided with adjustment spring (21), adjustment spring (21) bottom end
It is provided with compression bar (23), outer wall is provided with pull rod (24) on the left of the compression bar (23), and pull rod (24) left end extends to fixation
The left side outer wall of block (2), fixed block (2) left side outer wall offers sliding slot, and pull rod (24) left end is plugged on the interior of sliding slot
Chamber, fixed block (2) left and right sides bottom outer wall are provided with limited block (27), inner wall at left and right sides of the fixing groove (3)
The limiting slot (31) to match with limited block (27) is offered, limited block described in two groups (27) one end close to each other extends
To the inner cavity of mounting groove (22), and two groups of limited blocks (27) one end close to each other left and right sides outer wall with compression bar (23) respectively
It fits, the connecting portion of the limited block (27) and fixed block (2) offers guide groove (25), limited block (27) outer wall
It is socketed with reset spring (26), and one end of reset spring (26) is connect with the inner wall of guide groove (25), and reset spring (26)
The other end connect with the outer wall of limited block (27).
3. a kind of Low ESR multilayer circuit board according to claim 1, it is characterised in that: the single layer wiring board main body
(1) left and right sides outer wall is evenly arranged with convex block (4), and convex block (4) is heat dissipation convex block, and convex block (4) rectangular array is arranged.
4. a kind of Low ESR multilayer circuit board according to claim 1, it is characterised in that: outside fixed block (2) bottom
Wall is provided with locating piece, and fixing groove (3) intracavity bottom offers the locating slot to match with locating piece.
5. a kind of Low ESR multilayer circuit board according to claim 1, it is characterised in that: the heat sink strip (5) it is transversal
Face is in rectangle, and the number of heat sink strip (5) shares 36 groups, and heat sink strip (5) is graphene heat sink strip.
6. a kind of Low ESR multilayer circuit board according to claim 1, it is characterised in that: the single layer wiring board main body
(1) thickness of green oil structure sheaf (6) is identical in, and with a thickness of between two millimeters to three millimeters.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821849499.3U CN209435546U (en) | 2018-11-06 | 2018-11-06 | A kind of Low ESR multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821849499.3U CN209435546U (en) | 2018-11-06 | 2018-11-06 | A kind of Low ESR multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209435546U true CN209435546U (en) | 2019-09-24 |
Family
ID=67968125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821849499.3U Expired - Fee Related CN209435546U (en) | 2018-11-06 | 2018-11-06 | A kind of Low ESR multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209435546U (en) |
-
2018
- 2018-11-06 CN CN201821849499.3U patent/CN209435546U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200923 Address after: 523690 No.7 Fengming Road, fengdeling village, Fenggang town, Dongguan City, Guangdong Province Patentee after: Dongguan Kaisheng Hardware Plastic Products Co., Ltd Address before: 512200 Xiayanshan Group 16, Daluo Housekeeping Committee, Laoping Shizhen, Lechang City, Guangdong Province Patentee before: Deng Huixiong |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190924 Termination date: 20201106 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |