CN209420222U - cooling system - Google Patents
cooling system Download PDFInfo
- Publication number
- CN209420222U CN209420222U CN201821962085.1U CN201821962085U CN209420222U CN 209420222 U CN209420222 U CN 209420222U CN 201821962085 U CN201821962085 U CN 201821962085U CN 209420222 U CN209420222 U CN 209420222U
- Authority
- CN
- China
- Prior art keywords
- liquid
- cooling
- heat dissipation
- processor
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title claims description 96
- 238000000034 method Methods 0.000 claims abstract description 12
- 239000007788 liquid Substances 0.000 claims description 54
- 239000002184 metal Substances 0.000 claims description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 239000002826 coolant Substances 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims 1
- 230000005855 radiation Effects 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 59
- 238000001514 detection method Methods 0.000 abstract description 23
- 230000000694 effects Effects 0.000 abstract description 8
- 230000020169 heat generation Effects 0.000 abstract 1
- 239000000110 cooling liquid Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
本申请涉及一种散热系统，包括：设备本体，与所述设备本体连接的温度检测装置，处理器，设置于所述设备本体内部的风冷散热装置和液冷散热装置，其中：所述温度检测装置、所述风冷散热装置以及所述液冷散热装置均与所述处理器连接；所述温度检测装置用于检测所述设备本体的温度值；所述处理器用于接收并处理所述温度值，并在所述温度值大于第一预设阈值时控制开启所述风冷散热装置，在所述温度值大于第二预设阈值时控制开启所述液冷散热装置；所述第一预设阈值小于所述第二预设阈值。本申请既能保证设备在产生不同热量情况下的散热效果，也能避免一种散热装置一直工作，保证了散热装置的使用寿命。
The present application relates to a heat dissipation system, including: a device body, a temperature detection device connected to the device body, a processor, an air-cooled heat dissipation device and a liquid-cooled heat dissipation device arranged inside the device body, wherein: the temperature The detection device, the air-cooled heat dissipation device and the liquid-cooled heat dissipation device are all connected to the processor; the temperature detection device is used to detect the temperature value of the device body; the processor is used to receive and process the temperature value, and control to turn on the air-cooled heat dissipation device when the temperature value is greater than a first preset threshold, and control to turn on the liquid-cooled heat dissipation device when the temperature value is greater than a second preset threshold; the first The preset threshold is smaller than the second preset threshold. The application can not only ensure the heat dissipation effect of the equipment under different heat generation conditions, but also prevent one kind of heat dissipation device from working all the time, thereby ensuring the service life of the heat dissipation device.
Description
技术领域technical field
本申请涉及散热技术领域，尤其涉及一种散热系统。The present application relates to the technical field of heat dissipation, in particular to a heat dissipation system.
背景技术Background technique
目前，大功率设备的应用非常广泛，比如，应用于照明领域的大功率照明设备，应用于电力领域的大功率变流器、大功率逆变器等。这些设备由于功率很大，在工作过程中产生的热量很多，如果不及时散热，设备很容易由于温度过高而降低工作效率，甚至损害设备。At present, high-power equipment is widely used, for example, high-power lighting equipment used in the lighting field, high-power converters, high-power inverters used in the electric power field, and the like. Due to the high power of these devices, a lot of heat is generated during the working process. If the heat is not dissipated in time, the equipment is easy to reduce the working efficiency due to excessive temperature, and even damage the equipment.
传统的散热方式一般有风冷散热和液冷散热两种。风冷散热就是在设备内设置散热风扇，通过风扇运作加速设备内部与外界的空气交换，通过空气不断流通带走设备热量，这种散热方式成本较低，但散热效果不理想；液冷散热是指在设备上安装液冷头、流管以及液冷排，液冷头与设备的发热面接触，液冷头通过流管与液冷排连通，通过液冷排向流管中充入冷却液，冷却液温度较低流过液冷头带走设备热量，再通过流管回到液冷排散热，散热后冷却液温度降低再通过流管流入液冷头，如此循环，实现设备散热，这种散热方式成本较高，安装较困难，但散热效果好。现在绝大多数设备都只采用风冷散热，或者，只采用液冷散热的方式，而大功率设备并不是时时刻刻都产生大量热量，如果设备只采用液冷散热方式，无论设备产生多少热量液冷散热装置一直处于工作模式下，无疑会缩短液冷散热装置的使用寿命；如果设备只采用风冷散热方式，当设备产生热量较多时，便会使得大功率设备散热较慢，缩短设备本身的使用寿命。Traditional heat dissipation methods generally include air cooling and liquid cooling. Air-cooled heat dissipation is to install a cooling fan in the device, through the operation of the fan to accelerate the air exchange between the inside of the device and the outside world, and to take away the heat of the device through the continuous circulation of air. This cooling method is low in cost, but the cooling effect is not ideal; liquid cooling is Refers to the installation of liquid cooling head, flow tube and liquid cooling row on the equipment. The liquid cooling head is in contact with the heating surface of the equipment. The liquid cooling head communicates with the liquid cooling row through the flow tube, and the cooling liquid is filled into the flow tube through the liquid cooling row. , the coolant temperature is low, flows through the liquid cooling head to take away the heat of the equipment, and then returns to the liquid cooling through the flow tube to dissipate heat. This heat dissipation method is expensive and difficult to install, but has a good heat dissipation effect. Most of the equipment now only adopts air cooling or liquid cooling, and high-power equipment does not generate a lot of heat all the time. If the equipment only uses liquid cooling, no matter how much heat the equipment generates The liquid cooling device is always in the working mode, which will undoubtedly shorten the service life of the liquid cooling device; if the device only uses air cooling, when the device generates a lot of heat, it will make the heat dissipation of the high-power device slower and shorten the life of the device itself. service life.
实用新型内容Utility model content
为至少在一定程度上克服相关技术中存在的问题，本申请提供一种散热系统。In order to overcome the problems in the related art at least to a certain extent, the present application provides a heat dissipation system.
本申请提供一种散热系统，包括：The application provides a cooling system, comprising:
设备本体，与所述设备本体连接的温度检测装置，处理器，设置于所述设备本体内部的风冷散热装置和液冷散热装置，其中：A device body, a temperature detection device connected to the device body, a processor, an air-cooled heat dissipation device and a liquid-cooled heat dissipation device disposed inside the device body, wherein:
所述温度检测装置、所述风冷散热装置以及所述液冷散热装置均与所述处理器连接；The temperature detection device, the air cooling device and the liquid cooling device are all connected to the processor;
所述温度检测装置用于检测所述设备本体的温度值；The temperature detection device is used to detect the temperature value of the equipment body;
所述处理器用于接收并处理所述温度值，并在所述温度值大于第一预设阈值时控制开启所述风冷散热装置，在所述温度值大于第二预设阈值时控制开启所述液冷散热装置；The processor is configured to receive and process the temperature value, and control to turn on the air-cooled heat dissipation device when the temperature value is greater than a first preset threshold, and control to turn on the air cooling device when the temperature value is greater than a second preset threshold. The liquid cooling device;
所述第一预设阈值小于所述第二预设阈值。The first preset threshold is smaller than the second preset threshold.
可选地，所述风冷散热装置包括：Optionally, the air-cooled heat dissipation device includes:
散热风扇。cooling fan.
可选地，所述散热系统还包括：Optionally, the cooling system also includes:
与所述风冷散热装置连接的第一继电器；a first relay connected to the air-cooled heat sink;
所述第一继电器还与所述处理器连接，以便所述处理器通过所述第一继电器控制开启所述风冷散热装置。The first relay is also connected to the processor, so that the processor controls to turn on the air-cooled heat dissipation device through the first relay.
可选地，所述液冷散热装置包括：Optionally, the liquid cooling device includes:
液冷头、液冷排以及流管；Liquid cooling head, liquid cooling row and flow tube;
所述液冷头通过所述流管与所述液冷排连通。The liquid cooling head communicates with the liquid cooling row through the flow tube.
可选地，所述液冷散热装置还包括：Optionally, the liquid cooling device further includes:
设置于所述流管上的水泵，用于控制流管内的冷却液循环。The water pump arranged on the flow pipe is used to control the cooling liquid circulation in the flow pipe.
可选地，所述液冷散热装置还包括：覆盖于所述流管的内管壁和\或外管壁上的金属层。Optionally, the liquid cooling device further includes: a metal layer covering the inner tube wall and/or the outer tube wall of the flow tube.
可选地，所述散热系统还包括：Optionally, the cooling system also includes:
与所述液冷散热装置连接的第二继电器；a second relay connected to the liquid cooling device;
所述第二继电器还与所述处理器连接，以便所述处理器通过所述第二继电器控制开启所述液冷散热装置。The second relay is also connected to the processor, so that the processor controls to turn on the liquid cooling device through the second relay.
可选地，所述金属层为可挠性金属管。Optionally, the metal layer is a flexible metal tube.
可选地，所述温度检测装置包括：温度传感器。Optionally, the temperature detection device includes: a temperature sensor.
可选地，所述处理器包括：嵌入式微处理器或单片机。Optionally, the processor includes: an embedded microprocessor or a single-chip microcomputer.
本申请提供的技术方案可以包括以下有益效果：The technical solution provided by this application may include the following beneficial effects:
通过设置与设备本体连接的温度检测装置来直接检测设备的温度，且温度检测装置与处理器连接处理器可接受并处理温度检测装置检测到的温度值；设备本体内部设置有风冷散热装置和液冷散热装置，且，风冷散热装置和液冷散热装置均与所述处理器连接，处理器接收并处理温度值，并在所述温度值大于第一预设阈值时控制开启所述风冷散热装置，在所述温度值大于第二预设阈值时控制开启所述液冷散热装置，又因为第一预设阈值小于第二预设阈值，因此，在设备产生热量较少时，风冷散热装置工作，在设备产生热量较多时，夜冷散热装置工作。既能保证设备在产生不同热量情况下的散热效果，也能避免一种散热装置一直工作，保证了散热装置的使用寿命。The temperature of the device is directly detected by setting a temperature detection device connected to the device body, and the temperature detection device is connected to the processor. The processor can accept and process the temperature value detected by the temperature detection device; the device body is equipped with an air-cooled heat dissipation device and A liquid-cooled heat sink, and both the air-cooled heat sink and the liquid-cooled heat sink are connected to the processor, and the processor receives and processes a temperature value, and controls to turn on the fan when the temperature value is greater than a first preset threshold. The cooling device controls to turn on the liquid cooling device when the temperature value is greater than the second preset threshold, and because the first preset threshold is smaller than the second preset threshold, when the device generates less heat, the wind The cooling device works, and when the equipment generates more heat, the night cooling device works. It can not only ensure the heat dissipation effect of the equipment under the condition of generating different heat, but also prevent a kind of heat dissipation device from working all the time, and ensure the service life of the heat dissipation device.
应当理解的是，以上的一般描述和后文的细节描述仅是示例性和解释性的，并不能限制本申请。It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
附图说明Description of drawings
此处的附图被并入说明书中并构成本说明书的一部分，示出了符合本申请的实施例，并与说明书一起用于解释本申请的原理。The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description serve to explain the principles of the application.
图1是根据一示例性实施例示出的一种散热系统的结构示意图。Fig. 1 is a schematic structural diagram of a heat dissipation system according to an exemplary embodiment.
图2是根据另一示例性实施例示出的一种散热系统的结构示意图。Fig. 2 is a schematic structural diagram of a heat dissipation system according to another exemplary embodiment.
附图标记：设备本体-1；设备本体的发热面-11；温度检测装置-2；处理器-3；风冷散热装置-4；散热风扇-41；液冷散热装置-5；液冷头-51；液冷排-52；流管-53；水泵-54；第一继电器-6；第二继电器-7。Reference signs: equipment body-1; heating surface of the equipment body-11; temperature detection device-2; processor-3; air-cooling heat dissipation device-4; cooling fan-41; -51; liquid cooling row-52; flow pipe-53; water pump-54; first relay-6; second relay-7.
具体实施方式Detailed ways
这里将详细地对示例性实施例进行说明，其示例表示在附图中。下面的描述涉及附图时，除非另有表示，不同附图中的相同数字表示相同或相似的要素。以下示例性实施例中所描述的实施方式并不代表与本申请相一致的所有实施方式。相反，它们仅是与如所附权利要求书中所详述的、本申请相一致的装置的例子。Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with this application. Rather, they are merely examples of arrangements consistent with the present application as recited in the appended claims.
图1是根据一示例性实施例示出的一种散热系统的结构示意图。Fig. 1 is a schematic structural diagram of a heat dissipation system according to an exemplary embodiment.
如图1所示，本实施例提供的散热系统包括：As shown in Figure 1, the cooling system provided by this embodiment includes:
设备本体1，与所述设备本体1连接的温度检测装置2，处理器3，设置于所述设备本体1内部的风冷散热装置4和液冷散热装置5，其中：The device body 1, the temperature detection device 2 connected to the device body 1, the processor 3, the air cooling device 4 and the liquid cooling device 5 arranged inside the device body 1, wherein:
所述温度检测装置2、所述风冷散热装置4以及所述液冷散热装置5均与所述处理器3连接；The temperature detection device 2, the air-cooled heat dissipation device 4 and the liquid-cooled heat dissipation device 5 are all connected to the processor 3;
所述温度检测装置2用于检测所述设备本体1的温度值；The temperature detection device 2 is used to detect the temperature value of the equipment body 1;
所述处理器3用于接收并处理所述温度值，并在所述温度值大于第一预设阈值时控制开启所述风冷散热装置4，在所述温度值大于第二预设阈值时控制开启所述液冷散热装置5；The processor 3 is configured to receive and process the temperature value, and control to turn on the air-cooled heat sink 4 when the temperature value is greater than a first preset threshold, and when the temperature value is greater than a second preset threshold Controlling and opening the liquid-cooling heat dissipation device 5;
所述第一预设阈值小于所述第二预设阈值。The first preset threshold is smaller than the second preset threshold.
特别地，该散热系统设置有温度检测装置和处理器，可以通过温度检测装置实时检测设备的温度，且处理器可以根据温度检测装置检测到的温度值控制开启风冷散热装置或液冷散热装置，当温度值大于第一预设阈值时，开启风冷散热装置，当温度大于第二预设阈值时开启液冷散热装置，第一预设阈值小于第二预设阈值，所以，在设备散热较少温度较低时，只启动风冷散热装置进行散热即可，在设备散热较多温度较高时启动液冷散热装置；既能保证设备的散热效果，还能避免风冷散热装置或者液冷散热装置一直工作，延长其使用寿命。In particular, the heat dissipation system is provided with a temperature detection device and a processor, which can detect the temperature of the device in real time through the temperature detection device, and the processor can control the opening of the air-cooled heat sink or liquid-cooled heat sink according to the temperature value detected by the temperature detection device , when the temperature value is greater than the first preset threshold, the air-cooled heat dissipation device is turned on, and when the temperature is greater than the second preset threshold, the liquid-cooled heat dissipation device is turned on, and the first preset threshold is less than the second preset threshold. When the temperature is relatively low, only the air-cooled heat dissipation device can be activated for heat dissipation. When the equipment dissipates more heat and the temperature is higher, the liquid-cooled heat dissipation device can be activated; it can not only ensure the heat dissipation effect of the equipment, but also avoid the air-cooled heat dissipation device or liquid cooling device. The cold radiator works all the time, prolonging its service life.
可以理解的是，当检测到的温度值小于或等于第一预设阈值时，两种散热装置均不启动，设备自然散热即可。It can be understood that, when the detected temperature value is less than or equal to the first preset threshold, neither of the two heat dissipation devices is activated, and the device only needs to dissipate heat naturally.
本实施例中，通过设置与设备本体连接的温度检测装置来直接检测设备的温度，且温度检测装置与处理器连接处理器可接受并处理温度检测装置检测到的温度值；设备本体内部设置有风冷散热装置和液冷散热装置，且，风冷散热装置和液冷散热装置均与所述处理器连接，处理器接收并处理温度值，并在所述温度值大于第一预设阈值时控制开启所述风冷散热装置，在所述温度值大于第二预设阈值时控制开启所述液冷散热装置，又因为第一预设阈值小于第二预设阈值，因此，在设备产生热量较少时，风冷散热装置工作，在设备产生热量较多时，夜冷散热装置工作。既能保证设备在产生不同热量情况下的散热效果，也能避免一种散热装置一直工作，保证了散热装置的使用寿命。In this embodiment, the temperature of the device is directly detected by setting a temperature detection device connected to the device body, and the temperature detection device is connected to the processor. The processor can accept and process the temperature value detected by the temperature detection device; An air-cooled heat sink and a liquid-cooled heat sink, and both the air-cooled heat sink and the liquid-cooled heat sink are connected to the processor, the processor receives and processes a temperature value, and when the temperature value is greater than a first preset threshold Control to turn on the air-cooled heat sink, and control to turn on the liquid-cooled heat sink when the temperature value is greater than a second preset threshold, and because the first preset threshold is less than the second preset threshold, therefore, the device generates heat When it is less, the air-cooled heat dissipation device works, and when the equipment generates more heat, the night-cooled heat dissipation device works. It can not only ensure the heat dissipation effect of the equipment under the condition of generating different heat, but also prevent a kind of heat dissipation device from working all the time, and ensure the service life of the heat dissipation device.
进一步地，参见图2，所述风冷散热装置4包括：Further, referring to FIG. 2, the air-cooled heat dissipation device 4 includes:
散热风扇41。Cooling fan 41.
进一步地，参见图2，该散热系统还包括：Further, referring to Fig. 2, the cooling system also includes:
与所述风冷散热装置4连接的第一继电器6；A first relay 6 connected to the air-cooled heat dissipation device 4;
所述第一继电器6还与所述处理器3连接，以便所述处理器通过所述第一继电器控制开启所述风冷散热装置。The first relay 6 is also connected to the processor 3, so that the processor controls to turn on the air-cooled heat dissipation device through the first relay.
具体的，第一继电器与散热风扇41连接，当处理器接收到温度检测装置检测得到的温度值后，判断该温度值是否大于第一预设阈值，当大于第一预设阈值时，第一继电器导通，散热风扇41开始工作。Specifically, the first relay is connected to the cooling fan 41. When the processor receives the temperature value detected by the temperature detection device, it judges whether the temperature value is greater than the first preset threshold. When it is greater than the first preset threshold, the first The relay is turned on, and the cooling fan 41 starts to work.
进一步地，所述液冷散热装置5包括：Further, the liquid cooling device 5 includes:
液冷头51、液冷排52以及流管53；Liquid cooling head 51, liquid cooling row 52 and flow tube 53;
所述液冷头通过所述流管与所述液冷排连通。The liquid cooling head communicates with the liquid cooling row through the flow tube.
进一步地，所述液冷散热装置5还包括：Further, the liquid cooling heat dissipation device 5 also includes:
设置于所述流管53上的水泵54，用于控制流管内的冷却液循环。The water pump 54 arranged on the flow pipe 53 is used to control the circulation of the cooling liquid in the flow pipe.
水泵工作，使得冷却液通过流管在液冷头和液冷排之间不断循环。The water pump works so that the coolant circulates continuously between the liquid cooling head and the liquid cooling row through the flow tube.
进一步地，该散热系统还包括：Further, the cooling system also includes:
与所述液冷散热装置5连接的第二继电器7；A second relay 7 connected to the liquid cooling device 5;
所述第二继电器7还与所述处理器3连接，以便所述处理器通过所述第二继电器控制开启所述液冷散热装置。The second relay 7 is also connected to the processor 3, so that the processor controls to turn on the liquid cooling device through the second relay.
具体的，当处理器接收到的温度检测装置检测到的设备温度值后，判断温度值是否大于第二预设阈值，当温度值大于第二预设阈值时，第二继电器导通，开启液冷散热装置。冷却液在液冷排52内的冷却液储藏室中，当开始工作后，冷却液通过流管53流入液冷头51，由于液冷头与设备本体的发热面11接触(如图2所示)，因此，冷却液流过液冷头带走设备热量，然后由于水泵的存在，吸热后的冷却液通过流管流入液冷排中，在液冷排中散热后，冷却液温度降低，然后再次流入液冷头，如此循环，不断带走设备热量，达到良好的散热效果。Specifically, after the processor receives the temperature value of the equipment detected by the temperature detection device, it judges whether the temperature value is greater than the second preset threshold value, and when the temperature value is greater than the second preset threshold value, the second relay is turned on, and the liquid Cold radiator. The cooling liquid is in the cooling liquid storage room in the liquid cooling row 52. After starting to work, the cooling liquid flows into the liquid cooling head 51 through the flow pipe 53. Since the liquid cooling head is in contact with the heating surface 11 of the equipment body (as shown in FIG. 2 ), therefore, the cooling liquid flows through the liquid cooling head to take away the heat of the equipment, and then due to the existence of the water pump, the cooling liquid after absorbing heat flows into the liquid cooling row through the flow pipe, and after dissipating heat in the liquid cooling row, the temperature of the cooling liquid decreases. Then it flows into the liquid cooling head again, and this cycle continuously takes away the heat of the equipment to achieve a good heat dissipation effect.
进一步地，所述液冷散热装置5还包括：覆盖于所述流管53的内管壁和\或外管壁上的金属层。Further, the liquid cooling device 5 further includes: a metal layer covering the inner tube wall and/or the outer tube wall of the flow tube 53 .
进一步地，所述金属层为可挠性金属管。Further, the metal layer is a flexible metal tube.
通过在流管内管壁或外管壁覆盖金属层的设计，可降低冷却液通过流管管壁向外蒸散的情形发生，以避免空气置换进入流管而增加流阻，进而可维持液冷散热装置的散热效能。更进一步的，金属层选择可挠性金属管，使得可挠性金属管贴覆于外管壁的总面积占外管壁的面积70％以上，得以大幅降低冷却液向外蒸散的机率。Through the design of covering the inner tube wall or the outer tube wall with a metal layer, the situation that the cooling liquid evaporates outward through the tube wall can be reduced, so as to avoid the air displacement into the flow tube and increase the flow resistance, thereby maintaining liquid cooling and heat dissipation The thermal performance of the device. Furthermore, the flexible metal tube is selected as the metal layer, so that the total area of the flexible metal tube attached to the outer tube wall accounts for more than 70% of the area of the outer tube wall, which can greatly reduce the probability of cooling liquid evaporating outward.
进一步地，所述温度检测装置2包括：温度传感器。Further, the temperature detection device 2 includes: a temperature sensor.
进一步地，所述处理器3包括：嵌入式微处理器或单片机。Further, the processor 3 includes: an embedded microprocessor or a single-chip microcomputer.
本实施例不仅可以保证设备在产生不同热量情况下的散热效果，避免一种散热装置一直工作，保证散热装置的使用寿命。更进一步的，通过设置其他部件优化了散热系统的散热效能。This embodiment can not only ensure the heat dissipation effect of the equipment under the condition of generating different heat, avoid a kind of heat dissipation device from working all the time, and ensure the service life of the heat dissipation device. Furthermore, the heat dissipation performance of the heat dissipation system is optimized by arranging other components.
可以理解的是，虽然上述对各部件的功能进行了简要说明，但各部件的功能不限于上述说明，未做详细说明的功能可以参见相关技术。It can be understood that although the function of each component is briefly described above, the function of each component is not limited to the above description, and for functions not described in detail, reference may be made to related technologies.
可以理解的是，上述各实施例中相同或相似部分可以相互参考，在一些实施例中未详细说明的内容可以参见其他实施例中相同或相似的内容。It can be understood that, the same or similar parts in the above embodiments can be referred to each other, and the content that is not described in detail in some embodiments can be referred to the same or similar content in other embodiments.
需要说明的是，在本申请的描述中，术语“第一”、“第二”等仅用于描述目的，而不能理解为指示或暗示相对重要性。此外，在本申请的描述中，除非另有说明，“多个”的含义是指至少两个。It should be noted that in the description of the present application, terms such as "first" and "second" are used for description purposes only, and should not be understood as indicating or implying relative importance. In addition, in the description of the present application, unless otherwise specified, the meaning of "plurality" means at least two.
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。In the description of this specification, descriptions referring to the terms "one embodiment", "some embodiments", "example", "specific examples", or "some examples" mean that specific features described in connection with the embodiment or example , structure, material or characteristic is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
尽管上面已经示出和描述了本申请的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本申请的限制，本领域的普通技术人员在本申请的范围内可以对上述实施例进行变化、修改、替换和变型。Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limitations on the present application, and those skilled in the art can make the above-mentioned The embodiments are subject to changes, modifications, substitutions and variations.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821962085.1U CN209420222U (en) | 2018-11-26 | 2018-11-26 | cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821962085.1U CN209420222U (en) | 2018-11-26 | 2018-11-26 | cooling system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209420222U true CN209420222U (en) | 2019-09-20 |
Family
ID=67935390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821962085.1U Expired - Fee Related CN209420222U (en) | 2018-11-26 | 2018-11-26 | cooling system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209420222U (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110996614A (en) * | 2019-11-30 | 2020-04-10 | 苏州易换骑网络科技有限公司 | Heat dissipation device and heat dissipation method for battery charging cabinet |
| CN111356339A (en) * | 2020-02-28 | 2020-06-30 | 上海天马微电子有限公司 | Vehicle-mounted heat dissipation system and heat dissipation method |
| CN111613418A (en) * | 2020-05-29 | 2020-09-01 | 南通星宇电气有限公司 | Transformer cooling system and implementation method thereof |
| CN113400082A (en) * | 2021-06-17 | 2021-09-17 | 西安智衍数字科技有限公司 | External cutting fluid control device and method |
| CN113784592A (en) * | 2021-09-13 | 2021-12-10 | 珠海格力电器股份有限公司 | Combined heat dissipation system, electrical equipment, air conditioner and heat dissipation method |
| CN113889302A (en) * | 2021-10-29 | 2022-01-04 | 珠海格力电器股份有限公司 | Cable convenient for heat dissipation, heat dissipation device, air conditioner and cable heat dissipation control method |
| CN114448172A (en) * | 2021-12-03 | 2022-05-06 | 南昌三瑞智能科技有限公司 | Unmanned aerial vehicle motor heat dissipation method and device |
| CN114725737A (en) * | 2022-04-01 | 2022-07-08 | 杭州海康威视数字技术股份有限公司 | Connector system and control method thereof |
| CN116234264A (en) * | 2023-03-29 | 2023-06-06 | 江苏海鼎电气科技有限公司 | Dual-mode operation type frequency converter cooling structure |
| CN117028239A (en) * | 2023-06-19 | 2023-11-10 | 贝德凯利电气(苏州)有限公司 | A water pump housing with stator and PCBA board installed |
| CN118259726A (en) * | 2024-05-31 | 2024-06-28 | 苏州元脑智能科技有限公司 | Server heat dissipation equipment, server heat dissipation control method and device |
-
2018
- 2018-11-26 CN CN201821962085.1U patent/CN209420222U/en not_active Expired - Fee Related
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110996614A (en) * | 2019-11-30 | 2020-04-10 | 苏州易换骑网络科技有限公司 | Heat dissipation device and heat dissipation method for battery charging cabinet |
| US11413934B2 (en) | 2020-02-28 | 2022-08-16 | Shanghai Tianma Micro-electronics Co., Ltd. | Vehicle-mounted heat dissipation system and heat dissipation method |
| CN111356339B (en) * | 2020-02-28 | 2022-02-08 | 上海天马微电子有限公司 | Vehicle-mounted heat dissipation system and heat dissipation method |
| CN111356339A (en) * | 2020-02-28 | 2020-06-30 | 上海天马微电子有限公司 | Vehicle-mounted heat dissipation system and heat dissipation method |
| CN111613418A (en) * | 2020-05-29 | 2020-09-01 | 南通星宇电气有限公司 | Transformer cooling system and implementation method thereof |
| CN113400082A (en) * | 2021-06-17 | 2021-09-17 | 西安智衍数字科技有限公司 | External cutting fluid control device and method |
| CN113784592A (en) * | 2021-09-13 | 2021-12-10 | 珠海格力电器股份有限公司 | Combined heat dissipation system, electrical equipment, air conditioner and heat dissipation method |
| CN113889302A (en) * | 2021-10-29 | 2022-01-04 | 珠海格力电器股份有限公司 | Cable convenient for heat dissipation, heat dissipation device, air conditioner and cable heat dissipation control method |
| CN114448172B (en) * | 2021-12-03 | 2024-06-21 | 南昌三瑞智能科技有限公司 | Unmanned aerial vehicle motor heat dissipation method and device |
| CN114448172A (en) * | 2021-12-03 | 2022-05-06 | 南昌三瑞智能科技有限公司 | Unmanned aerial vehicle motor heat dissipation method and device |
| CN114725737A (en) * | 2022-04-01 | 2022-07-08 | 杭州海康威视数字技术股份有限公司 | Connector system and control method thereof |
| CN116234264A (en) * | 2023-03-29 | 2023-06-06 | 江苏海鼎电气科技有限公司 | Dual-mode operation type frequency converter cooling structure |
| CN117028239A (en) * | 2023-06-19 | 2023-11-10 | 贝德凯利电气(苏州)有限公司 | A water pump housing with stator and PCBA board installed |
| CN117028239B (en) * | 2023-06-19 | 2024-02-06 | 贝德凯利电气(苏州)有限公司 | Water pump shell provided with stator and PCBA (printed circuit board assembly) |
| CN118259726A (en) * | 2024-05-31 | 2024-06-28 | 苏州元脑智能科技有限公司 | Server heat dissipation equipment, server heat dissipation control method and device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107839495B (en) | A charging pile and heat dissipation control method | |
| WO2009140875A1 (en) | Machine cabinet and temperature control system for machine cabinet | |
| CN205385687U (en) | Heat dissipation device | |
| CN106028762B (en) | A kind of double cooling integrated systems for electric vehicle control system | |
| CN104679175A (en) | Dustproof radiating machine case | |
| CN106132177A (en) | A kind of cooling system of inverter | |
| CN110167319A (en) | Radiator, air conditioner and its control method for air conditioner | |
| CN210405488U (en) | Industrial camera with good heat dissipation performance | |
| CN203149473U (en) | Low-noise computer heat radiator | |
| CN205830244U (en) | A dual cooling integrated system for electric vehicle control system | |
| CN205091693U (en) | Heat radiator for can improve router data -handling capacity | |
| CN204390150U (en) | Notebook computer heat dissipation base | |
| CN206757512U (en) | A kind of computer heat sink | |
| CN209084929U (en) | Heat dissipation structure, air conditioner | |
| CN106058386B (en) | A kind of water-cooled battery thermal management system based on semiconductor heat electrical effect | |
| CN108770282A (en) | A kind of water-cooled electric control box | |
| CN109194036A (en) | A kind of engine cooler and its control method for wind-power electricity generation | |
| CN210075904U (en) | Heat abstractor based on circulated air | |
| CN209462266U (en) | Air conditioner and its frequency converter cooling device | |
| CN107201630A (en) | A kind of washing machine radiating mode and heat abstractor | |
| CN205946478U (en) | A cooling system and server room that is arranged in computer lab server | |
| CN212969468U (en) | Water-cooling heat abstractor of rectifier | |
| CN106014882A (en) | Cooling method and cooling system for wind turbine generators | |
| CN221784525U (en) | A heat dissipation device for airborne rectifying and voltage stabilizing equipment | |
| CN220401524U (en) | Motor housing and motor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190920 |