CN209418529U - A kind of adopting surface mounted LED lamp bead and its supporting structure - Google Patents
A kind of adopting surface mounted LED lamp bead and its supporting structure Download PDFInfo
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- CN209418529U CN209418529U CN201822170180.4U CN201822170180U CN209418529U CN 209418529 U CN209418529 U CN 209418529U CN 201822170180 U CN201822170180 U CN 201822170180U CN 209418529 U CN209418529 U CN 209418529U
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- solder
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- solder channel
- sheet metal
- supporting structure
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Abstract
This application involves a kind of adopting surface mounted LED lamp bead and its supporting structure, the latter includes pedestal, the glass shell above the pedestal, and is set to the pin of the two sides of base；The pin includes sheet metal and at least one solder channel for being opened on the sheet metal, and the solder channel runs through the sheet metal in a thickness direction.In pin welding process, due to being provided at least one solder channel, scolding tin can be flowed into and is filled in solder channel, to under conditions of not increasing pin area, by the way that solder channel is arranged on pin, it is obviously improved the contact area of pin and scolding tin, in the case where pin limited area, the welding thrust of adopting surface mounted LED lamp bead is improved, ensure that soldering reliability.
Description
Technical field
This application involves LED technology field more particularly to a kind of supporting structures for adopting surface mounted LED lamp bead.The application
Further relate to a kind of adopting surface mounted LED lamp bead including the supporting structure.
Background technique
LED, that is, light emitting diode (Light Emitting Diode, abbreviation LED), is a kind of semiconductor subassembly, in recent years
It is widely used in indicator light, display light-emitting diode panel, LCD backlight and normal lighting.Adopting surface mounted LED lamp bead is
One kind of LED, its principle of luminosity are exactly that electric current is passed through the combination of electronics and hole, part energy by compound semiconductor
Amount will release in the form of light, achieve the effect that luminous.Adopting surface mounted LED lamp bead is affixed on PCB surface, and suitable SMT adds
The problems such as work, which solve brightness, visual angle, flatness, reliability, consistency, relative to other packagings, it has antivibration
The advantages that ability is strong, welding point defect rate is low, high frequency characteristics is good, can encapsulate more LED chips on smaller area, because
This is especially widely applied.
The pin that adopting surface mounted LED lamp bead is used to be welded on PCB surface is sheet-like plane formula structure, due to by terminal
The influence of market thinning tendency, adopting surface mounted LED lamp bead are intended to micromation, slimming, lead to the pin of adopting surface mounted LED lamp bead
Area becomes smaller, and in welding since pin and scolding tin contact area are insufficient, welding thrust is not up to standard when causing LED lamp bead patch
The problem of, the problems such as reducing LED lamp bead soldering reliability, LED lamp bead easily caused to fall off.
Utility model content
In order to solve the above-mentioned technical problem or it at least is partially solved above-mentioned technical problem, this application provides a kind of patches
Sheet-shaped LED lamp bead and its supporting structure.
In a first aspect, this application provides a kind of supporting structure, be used for adopting surface mounted LED lamp bead, including pedestal, be located at it is described
Glass shell above pedestal, and it is set to the pin of the two sides of base；
The pin includes sheet metal and at least one solder channel for being opened on the sheet metal, the solder channel
Run through the sheet metal in a thickness direction.
Further, the solder channel is multiple, and each solder channel is spaced apart from each other and is independently opened in described
On sheet metal.
Further, the solder channel is two groups, and every group includes three solder channels；
Passway central point line with each solder channel in group forms straight line, two groups of institutes on the sheet metal
The straight line for stating the passway central point line formation of solder channel is parallel；
Between each solder channel between group correspondingly in same level.
Further, the solder channel is three groups, wherein in two groups every group include three solder channels, in another set
Including two solder channels；
Passway central point line with each solder channel in group forms straight line, each group institute on the sheet metal
The straight line for stating the passway central point line formation of solder channel is parallel.
Further, the solder channel is five, wherein the passway central point line of four solder channels surrounds just
Rectangular, the passway central point of another solder channel is located at the diagonal line point of intersection of the square.
Further, the solder channel is three groups, wherein in two groups every group include two solder channels, in another set
Including three solder channels；
Passway central point line with each solder channel in group forms straight line, each group institute on the sheet metal
The straight line for stating the passway central point line formation of solder channel is parallel.
Further, the extension path of each solder channel is straight line, curve or broken line.
Further, the extension path of each solder channel is parallel.
Further, the shape of the pin is T shape, L shape or rectangle, wherein the L-shaped transverse slat is to close to the base
The direction of the central axes of seat extends or the transverse slat of the L-type extends to the direction of the central axes far from the pedestal.
Second aspect this application provides a kind of adopting surface mounted LED lamp bead, including supporting structure and is installed on the bracket knot
Chip on structure, the supporting structure are supporting structure as described above.
Above-mentioned technical proposal provided by the embodiments of the present application has the advantages that compared with prior art
Supporting structure provided by the embodiments of the present application, in pin welding process, due to being arranged on the sheet metal of pin
At least one solder channel, scolding tin can be flowed into and is filled in solder channel, thus under conditions of not increasing pin area,
By the way that solder channel is arranged on pin, it is obviously improved the contact area of pin and scolding tin, the pin limited area the case where
Under, the welding thrust of adopting surface mounted LED lamp bead is improved, ensure that soldering reliability.
Detailed description of the invention
The drawings herein are incorporated into the specification and forms part of this specification, and shows and meets the utility model
Embodiment, and be used to explain the principles of the present invention together with specification.
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, for ordinary skill people
For member, without any creative labor, it is also possible to obtain other drawings based on these drawings.
Fig. 1-Fig. 3 is a kind of structural schematic diagram of specific embodiment of supporting structure provided by the utility model；
Fig. 4-Fig. 7 is the schematic diagram of the arrangement of solder channel provided by the utility model；
Fig. 8 and Fig. 9 is a kind of structural representation of specific embodiment of adopting surface mounted LED lamp bead provided by the utility model
Figure.
Description of symbols:
The isolation strip 1- pedestal 2- glass shell 3- pin 31- sheet metal 32- solder channel 4-
100- chip 200- encapsulates glue 300- bonding line 400- conductive material
Specific embodiment
To keep the purposes, technical schemes and advantages of the embodiment of the present application clearer, below in conjunction with the embodiment of the present application
In attached drawing, the technical scheme in the embodiment of the application is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the application, instead of all the embodiments.Based on the embodiment in the application, ordinary skill people
Member's every other embodiment obtained without making creative work, shall fall in the protection scope of this application.
Referring to FIG. 1, Fig. 1 is a kind of structural representation of specific embodiment of supporting structure provided by the utility model
Figure.
In a specific embodiment, a kind of supporting structure provided by the utility model is used for adopting surface mounted LED lamp bead,
The supporting structure includes pedestal 1, the glass shell 2 above the pedestal 1, and is set to two of 1 same side of pedestal
Pin 3.It is apparent that the supporting structure further includes other the necessary components for realizing it using function, for example, as in Fig. 6 and Fig. 7
Shown in the structures such as isolation strip 4, these necessary structures are identical as prior art construction, and the realization for present techniques effect
There is no substantial effects, and therefore not to repeat here.
Specifically, which includes sheet metal 31 and at least one solder channel 32 being opened on the sheet metal 31,
The solder channel 32 runs through the sheet metal 31 in a thickness direction, and solder channel 32 can be by punching on sheet metal 31
Mode obtain, can also be integrally formed to obtain with technological means such as injection molding, 3D printings in the process of sheet metal 31.Weldering
At least one should be arranged in material channel 32, when solder channel 32 is multiple, the shape of each solder channel 32 can it is identical can not also
Together, in order to reduce difficulty of processing, while guaranteeing uniformity when scolding tin flows through, the shape and specification of preferably each solder channel 32
It is identical, each solder channel 32 be located at the passway on the outside of sheet metal shape can for regular shape hole, such as: circular hole, square hole or
Person's delthyrium, or other irregular shape through-holes.
In 3 welding process of pin, due to being provided at least one solder channel 32, scolding tin can flow into and be filled in solder
In channel 32, to, by the way that solder channel 32 is arranged on pin 3, be obviously improved under conditions of not increasing by 3 area of pin
The contact area of pin 3 and scolding tin improves the welding thrust of adopting surface mounted LED lamp bead in the case where 3 limited area of pin,
It ensure that soldering reliability.
In supporting structure provided by the utility model, as shown in Figure 6 and Figure 7, glass shell 2, pedestal 1 and isolation strip 4 are equal
Thermoplastic is projected by the insulating materials of same material to be formed, and can be PPA PCT material；Pin 3 is the sheet knot of metal material
Structure, sheet metal 31 can be one of Cu, Ag, Ni, Zn, Fe, Al or a variety of with a thickness of 0.05mm~0.20mm, metal material
Or alloy.The shape of the sheet metal 31 of the pin 3 can be T shape (as shown in Figure 3), L shape (as shown in Figure 2 and Figure 5) or square
Shape (as shown in Figure 4) also or is other rules or irregular shape.Wherein, when the shape of sheet metal 31 is L shape, the L
The transverse slat of shape can extend to the direction of the central axes close to the pedestal, form the structure to extend internally, as shown in Figure 4；This
When, the transverse slat of the L-type can also extend to the direction of the central axes far from the pedestal, form outwardly extending structure, such as
Shown in Fig. 7.
Contact area between scolding tin and pin 3 in order to further increase, solder channel 32 are preferably arranged to multiple, each institute
Solder channel 32 is stated to be spaced apart from each other and be independently opened on the sheet metal 31.In theory, the number of solder channel 32
Amount opens up more, then the contact area between corresponding solder and pin 3 is bigger.
But in actual use, while being contemplated that channel is opened up on pin 3 certainly will influence whether pin
3 intensity.Therefore, suitable solder channel 32 should be selected to open up quantity, and these solder channels 32 are reasonably arranged,
To increase the contact area between solder and pin 3 as far as possible while guaranteeing 3 intensity of pin as far as possible, solder channel 32
Particular number and arrangement can be following any.
As shown in Fig. 2, solder channel 32 is two groups, every group includes three solder channels 32, i.e. solder channel 32 shares six
A, three are divided into two groups for one group；Passway central point line with each solder channel 32 in group is in the sheet metal
Straight line is formed on 31, the straight line that the passway central point line of solder channel 32 described in two groups is formed is parallel.
In the embodiment of the present application, passway central point refers to passway view field in 31 place plane of sheet metal
Center.If the shape of passway can be regular shape hole, such as: circular hole, square hole or delthyrium, correspondingly, central point
Position be regular shape hole center.If the shape of passway is irregular shape through-hole, correspondingly, the position of central point can
Think the center location of the maximum circumscribed circle of irregular shape.
The tilt angle of the straight line can be horizontal by 45 ° or so, in the embodiment of the present application, horizontal plane and pedestal 1
Bottom surface is parallel；Between each solder channel 32 between group correspondingly in same level, i.e., in height in first group
First solder channel 32 in first solder channel 32 on direction and second group in the height direction is in same level
Second solder on face, in second solder channel 32 in first group in the height direction and second group in the height direction
Channel 32 is in same level, in height in third solder channel 32 in first group in the height direction and second group
Third solder channel 32 on direction is in same level.
As shown in figure 3, the solder channel 32 be three groups, wherein in two groups every group include three solder channels 32, in addition
Include two solder channels 32 in one group, that is, shares eight solder channels 32；With the channel of each solder channel 32 in group
Mouth central point line forms straight line on the sheet metal 31, and the passway central point line of solder channel 32 described in each group is formed
Straight line it is parallel, the tilt angle of the straight line can be horizontal by 45 ° or so.Similarly, there are three solder channels 32 for tool
Two groups in, between each solder channel 32 between group correspondingly in the same level, i.e., in height side in first group
First solder channel 32 in first upward solder channel 32 and second group in the height direction is in same level
On, and so on, it is identical as the arrangement in a upper embodiment.
As shown in figure 4, the solder channel 32 is five, wherein the passway central point line of four solder channels 32 encloses
At square, the passway central point of another solder channel 32 is located at the diagonal line point of intersection of the square.
As shown in figure 5, the solder channel 32 be three groups, wherein in two groups every group include two solder channels 32, in addition
It include three solder channels 32 in one group, i.e. solder channel 32 shares seven；With the channel of each solder channel 32 in group
Mouth central point line forms straight line on the sheet metal 31, and the passway central point line of solder channel 32 described in each group is formed
Straight line it is parallel.
In this specific embodiment, the extension path of each solder channel 32 provided by the utility model can be
Straight line, curve or broken line can be perpendicular to 3 plate faces of sheet metal when extension path is straight line, can also be with 3 plate of sheet metal
Face being obliquely installed at an angle.Compared with vertically disposed solder channel 32, curve or broken line are obliquely installed or are designed as
Form, length of flow of the solder inside solder channel 32 can be further increased, to further increase solder and pin 3
Contact area.
The extension path of each solder channel 32 can be parallel, can also it is radial or irregular distribution, herein
It does not repeat.
In addition to above-mentioned supporting structure, the utility model also provides a kind of adopting surface mounted LED lamp bead including the supporting structure, such as
Shown in Fig. 6 and Fig. 7, the adopting surface mounted LED lamp bead be side-emitting LED lamp, in addition to above-mentioned supporting structure outside, further including can
Realize that LED light uses other necessary components of function, such as chip 100, bonding line 300 or conductive material 400, packaging plastic
Water 200 etc..Wherein, chip 100 can inspire the visible light that wavelength is 200~500nm, bonding under forward voltage driving
Line 300 is wire conductor structure, and ingredient is mainly based on Au；Conductive material 400 is the conduction materials such as tin cream, elargol, scaling powder
Material 400 it is one or more；Encapsulating glue 200 is heat curing types or the uv-curing type organic matters such as silica gel or epoxy resin, envelope
It fills and contains light-emitting phosphor body in glue 200, which can have the ultraviolet or blue light of 200~500nm to excite, launch wavelength
For the visible light of 500-650nm.
It should be noted that, in this document, the relational terms of such as " first " and " second " or the like are used merely to one
A entity or operation with another entity or operate distinguish, without necessarily requiring or implying these entities or operation it
Between there are any actual relationship or orders.Moreover, the terms "include", "comprise" or its any other variant are intended to
Cover non-exclusive inclusion, so that the process, method, article or equipment for including a series of elements not only includes those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or setting
Standby intrinsic element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that
There is also other identical elements in the process, method, article or apparatus that includes the element.
The above is only specific embodiment of the present utility model, is made skilled artisans appreciate that or realizing this
Utility model.Various modifications to these embodiments will be apparent to one skilled in the art, institute herein
The General Principle of definition can be realized in other embodiments without departing from the spirit or scope of the present utility model.
Therefore, the present invention will not be limited to the embodiments shown herein, and is to fit to and applied original herein
Manage the widest scope consistent with features of novelty.
Claims (10)
1. a kind of supporting structure is used for adopting surface mounted LED lamp bead, which is characterized in that including pedestal (1), be located on the pedestal (1)
The glass shell (2) of side, and it is set to the pin (3) of the pedestal (1) two sides；
The pin (3) includes sheet metal (31) and at least one solder channel (32) being opened on the sheet metal (31),
The solder channel (32) runs through the sheet metal (31) in a thickness direction.
2. supporting structure according to claim 1, which is characterized in that the solder channel (32) is multiple, each weldering
Material channel (32) is spaced apart from each other and is independently opened on the sheet metal (31).
3. supporting structure according to claim 2, which is characterized in that the solder channel (32) is two groups, and every group includes
Three solder channels (32)；
Passway central point line with each solder channel (32) in group forms straight line on the sheet metal (31), respectively
The straight line that the passway central point line of the group solder channel (32) is formed is parallel；
Between each solder channel (32) between group correspondingly in same level.
4. supporting structure according to claim 2, which is characterized in that the solder channel (32) is three groups, wherein two groups
In every group include three solder channels (32), include two solder channels (32) in another set；
Passway central point line with each solder channel (32) in group forms straight line on the sheet metal (31), respectively
The straight line that the passway central point line of the group solder channel (32) is formed is parallel.
5. supporting structure according to claim 2, which is characterized in that the solder channel (32) is five, wherein four
The passway central point line of solder channel (32) surrounds square, the passway center of another solder channel (32)
Point is located at the diagonal line intersection point of the square.
6. supporting structure according to claim 2, which is characterized in that the solder channel (32) is three groups, wherein two groups
In every group include two solder channels (32), include three solder channels (32) in another set；
Passway central point line with each solder channel (32) in group forms straight line on the sheet metal (31), respectively
The straight line that the passway central point line of the group solder channel (32) is formed is parallel.
7. according to the described in any item supporting structures of claim 2-6, which is characterized in that the extension of each solder channel (32)
Path is straight line, curve or broken line；
And/or the passway of each solder channel (32) is circular hole, square hole or irregular shape hole.
8. supporting structure according to claim 7, which is characterized in that the extension path of each solder channel (32) is homogeneous
In parallel.
9. supporting structure according to claim 1-6, which is characterized in that the shape of the sheet metal is T shape, L
Shape or rectangle, wherein the transverse slat of the L-shaped sheet metal to close to the pedestal central axes direction extend or it is L-shaped
The sheet metal transverse slat to far from the pedestal central axes direction extend.
10. a kind of adopting surface mounted LED lamp bead, including supporting structure and the chip (100) being installed on the supporting structure, feature
It is, the supporting structure is such as the described in any item supporting structures of claim 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822170180.4U CN209418529U (en) | 2018-12-21 | 2018-12-21 | A kind of adopting surface mounted LED lamp bead and its supporting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822170180.4U CN209418529U (en) | 2018-12-21 | 2018-12-21 | A kind of adopting surface mounted LED lamp bead and its supporting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209418529U true CN209418529U (en) | 2019-09-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822170180.4U Active CN209418529U (en) | 2018-12-21 | 2018-12-21 | A kind of adopting surface mounted LED lamp bead and its supporting structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209418529U (en) |
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2018
- 2018-12-21 CN CN201822170180.4U patent/CN209418529U/en active Active
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