CN209402964U - Transfer device - Google Patents
Transfer device Download PDFInfo
- Publication number
- CN209402964U CN209402964U CN201821880919.4U CN201821880919U CN209402964U CN 209402964 U CN209402964 U CN 209402964U CN 201821880919 U CN201821880919 U CN 201821880919U CN 209402964 U CN209402964 U CN 209402964U
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- Prior art keywords
- boss
- substrate
- component
- line
- transfer device
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
Abstract
The utility model belongs to field of display technology, discloses a kind of transfer device, including first substrate, several boss being set on first substrate and the flexible glue-line being detachably arranged on above-mentioned boss.By the way that several boss are arranged on the first substrate, and flexible glue-line is set on each boss, so as to which above-mentioned component correspondence can be bonded on above-mentioned boss by flexible glue-line, component is dismantled from boss finally by illumination, the synchronous transfer realized to multiple components is simple and convenient, furthermore, since the flexibility glue-line can be separated with boss, so that reusable above-mentioned boss realizes the transfer to component, the cost of transfer further reduced.
Description
Technical field
The utility model belongs to field of display technology, is to be related to a kind of transfer device more specifically.
Background technique
Existing Micro LED (Micro Light Emitting Diode, micro-led) technology is gradually
Maturation, and can gradually import display device, although however the chip production comparative maturity of Micro LED, then by chip transfer
It is more time-consuming, become the Pinch technology of limitation LED display technique development.
Currently, existing transfer device is that have choosing by boxing impression combined high precision motion control print head in the market
The pickup minisize component selected, and printed to target base plate, speed of this kind of device by change print head, selectivity
Adjustment boxing impression and the adhesive force being transferred between device, to accurately control the technique of transfer.However it is this transfer at
This is higher, and efficiency is lower, is unfavorable for the extensive transfer in later period.
Utility model content
The purpose of this utility model is to provide a kind of transfer devices, it is intended to solve existing transfer device it is at high cost, effect
The low technical problem of rate.
To achieve the goals above, the technical solution adopted in the utility model is: transfer device, comprising:
First substrate；
Several boss are set on the first substrate；
Flexible glue-line, it is separable to be set on the boss, for bonding component to be transferred, and for passing through illumination
Penetrate realization with the solution of the component stick separate.
In one embodiment, the flexible glue-line is the film layer of ultraviolet light solution sticky glue production.
In one embodiment, each flexible glue-line by bonding, hot pressing, printing or is coated on the boss.
In one embodiment, each boss is in inverted trapezoidal or cylindrical setting, the area of the boss of the inverted trapezoidal
The first substrate is connected compared with big end.
In one embodiment, several boss and the first substrate are integrally formed.
In one embodiment, the transfer device further includes the second substrate, described for carrying component to be transferred
The second substrate is equipped with several installation positions, and the arrangement of the installation position on the second substrate is with the boss described
Arrangement on first substrate is identical.
In one embodiment, the installation position includes for each component to be mounted at described first
Buckle structure on substrate；The buckle structure includes the buckle for connecting described component one end, and is set to described
The button bit for buckling and opening up is corresponded on first substrate, the buckle is mutually clamped with the button bit.
In one embodiment, the guide angle that the button bit is skidded off for the buckle is offered on the button bit.
In one embodiment, the angular range of the guide angle is in 30~45 °.
The purpose of this utility model, which also resides in, provides a kind of transfer device, comprising:
First substrate；
Several boss are integrally connected to the first substrate；
The second substrate, for installing component to be transferred；
Buckle structure is detachably set in the second substrate, for connecting the component in interval；
Flexible glue-line, it is separable to be set on the boss, it is each described for component correspondence to be transferred to be bonded in
On boss, the flexibility glue-line be can be irradiated by light realize with the component solution it is glutinous separate, by cleaning realization with it is described
The glue-line of boss separation；
The width of the flexibility glue-line is equal to or less than the width of each boss.
The beneficial effect of transfer device provided by the utility model is: the transfer device of the utility model passes through first
Several boss are set on substrate, and flexible glue-line is set on each boss, in this way, can be corresponded to component by flexible glue-line
It is bonded on above-mentioned boss, component is dismantled from boss finally by illumination, the synchronous transfer realized to multiple components,
It is simple and convenient, improve production efficiency, and cost is relatively low for flexible glue-line, to be conducive to the extensive transfer of later period component,
Further, since the flexibility glue-line can boss separation, so that reusable above-mentioned boss realizes the transfer to component, further
Reduce the cost of transfer.
Detailed description of the invention
It, below will be to embodiment or the prior art in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
Required practical attached drawing is briefly described in description, it should be apparent that, the accompanying drawings in the following description is only the present embodiment
Some embodiments for those of ordinary skill in the art without creative efforts, can also basis
These attached drawings obtain other attached drawings.
Fig. 1 is the structural schematic diagram before the transfer device component transfer that the utility model embodiment proposes；
Fig. 2 is the structural schematic diagram after the transfer device component transfer that the utility model embodiment proposes；
Fig. 3 is the structural schematic diagram of the first substrate that the utility model embodiment proposes and component；
Fig. 4 is the enlarged drawing of the A in Fig. 3 that the utility model embodiment proposes.
Wherein, each appended drawing reference are as follows:
1- first substrate；
2- component；
3- the second substrate；
4- boss；
5- flexibility glue-line；
6- buckle structure；61- buckle；62- button bit；63- guide angle.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only used to explain
The utility model is not used to limit the utility model.
It should be noted that it can be directly another when element is referred to as " being fixed on " or " being set to " another element
On one element or it may be simultaneously present centering elements.When an element is known as " being connected to " another element, it can be with
It is directly to another element or may be simultaneously present centering elements.
In addition, it should also be noted that, positional terms such as left and right, upper and lower in the utility model embodiment, are only mutual
Be relative concept or with the normal operating condition of product be reference, and should not be regarded as it is restrictive below in conjunction with
The realization of the utility model is described in detail in specific embodiment.
As shown in figures 1-4, the present embodiment proposes a kind of transfer device, which includes first substrate, above-mentioned
It is provided with several boss 4 on first substrate 1, is respectively equipped with flexible glue-line 5 on above-mentioned each boss 4, the flexibility glue-line 5 is separable
It is set on above-mentioned boss 4.In this way, by the way that several boss 4 are arranged on first substrate 1, and flexible glue is set on each boss 4
Layer 5；It, will be first finally by illumination to which the correspondence of component 2 to be transferred is bonded on above-mentioned boss 4 by flexible glue-line 5
Device 2 is dismantled from boss 4, the synchronous transfer realized to multiple components 2, simple and convenient, improve production efficiency, and flexible
Cost is relatively low for glue-line 5, to be conducive to the extensive transfer of later period component 2, further, since above-mentioned flexibility glue-line 5 can with it is upper
It states boss separation and further reduced the cost of transfer so that reusable above-mentioned boss 4 realizes the transfer to component 2.
In one embodiment, above-mentioned flexible glue-line 5 solves sticky glue using UV (Ultraviolet Rays, ultraviolet light)
Prepared by the film layer of production, in this way, stickiness glue-line is solved by setting UV for above-mentioned flexible glue-line 5, so as to pass through UV illumination
So that flexible glue-line 5 crosslinks reaction and is easily removed.Certainly, in the present embodiment, above-mentioned flexible glue-line 5 can also be used
Acrylic resin or the preparation of photoinitiator material, do not limit uniquely herein.
In one embodiment, the rounded setting of above-mentioned flexible glue-line 5, this way it is ensured that flexible glue-line 5 is with biggish
Surface area increases the adhesion strength of flexible glue-line 5 so as to preferably stick in above-mentioned component 2 on above-mentioned boss 4.Certainly,
In the present embodiment, above-mentioned flexible glue-line 5 can also the setting of the other shapes such as rounded rectangle or square, do not make herein unique
It limits.
In one embodiment, above-mentioned flexible glue-line 5 is transparent setting, in this way, the permeability of illumination can be enhanced, so that
Effect is preferable during solution is glutinous, certainly, in the present embodiment, and according to the actual situation and specific requirements, above-mentioned flexibility glue-line 5
It is settable translucent etc., it does not limit uniquely herein.
In one embodiment, the thickness of above-mentioned flexible glue-line 5 is set as 1~2 millimeter, in this way, it is ensured that flexible glue layer 5
With certain viscosity, at the same time, it is too big to be also prevented from flexible 5 thickness of glue-line, increases the cost of production, certainly, in this implementation
In example, it may be set to be other with specific requirements, the thickness of above-mentioned flexibility glue-line 5 according to the actual situation, do not make herein unique
It limits.
In one embodiment, above-mentioned flexible glue-line 5 is covered on above-mentioned boss 4 by way of bonding, passes through bonding
On the one hand mode can be achieved for above-mentioned component 2 to be installed on above-mentioned boss 4, on the other hand, can be by medical fluid by above-mentioned boss
Flexible glue-line 5 on 4 washes, and convenient for the recycling of subsequent above-mentioned boss 4, reduces production cost.Certainly, in this implementation
In example, above-mentioned each flexible glue-line 5 can also be installed on above-mentioned each boss 4 by modes such as hot pressing, printing or coatings, herein not
Make unique limit.
In one embodiment, it please refers to shown in Fig. 2, above-mentioned each boss 4 is arranged in inverted trapezoidal, and the inverted trapezoidal boss 4
Area connected on above-mentioned first substrate 1 compared with big end.In this way, on the one hand making boss 4 and the first base by being set as inverted trapezoidal
The contact surface of plate 1 is larger, increases binding force between the two, and on the other hand, the bottom area of inverted trapezoidal boss 4 is greater than top
Area, the UV light projected from the side of first substrate 1 can be directly over top and project, uniformly after bottom enters boss 4
Be irradiated on flexible glue-line 5, and use bottom area is small, topside area is big boss 4, then can occur on 4 side wall of boss
Reflection and refraction, cause UV luminous intensity uneven, influence the peeling effect of flexible glue-line 5.Certainly, in the present embodiment, above-mentioned
Each boss 4 can also be cylindrical etc. other shapes setting, do not limit uniquely herein.
In one embodiment, it please refers to shown in Fig. 2, above-mentioned several boss 4 are integrally formed with above-mentioned first substrate 1.It is logical
Integrated molding is crossed, to enhance the binding force between boss 4 and first substrate 1, improves making for boss 4 and first substrate 1
Use the service life.Certainly, in the present embodiment, according to the actual situation and specific requirements, above-mentioned several boss 4 can also be by other means
It connect with first substrate 1, does not limit uniquely herein.
In one embodiment, it please refers to shown in Fig. 2, which further includes the second substrate 3, which can
For carrying the component 2 of above-mentioned band transfer, it is equipped with several installation positions in above-mentioned the second substrate 3, the installation position is above-mentioned the
Arrangement on two substrates 3 is identical as the arrangement of above-mentioned boss 4 on first substrate 1.In this way, passing through the second base of setting
Plate 3, so as to for carrying above-mentioned component 2, by the way that installation position is arranged, so as to which above-mentioned component 2 is mounted on above-mentioned the
On two substrates 3, by the way that the arrangement of installation position is identical as the arrangement setting of above-mentioned boss 4, consequently facilitating boss 4 will
Above-mentioned component 2 to be transferred is transferred on first substrate 1 from the second substrate 3, certainly, according to the actual situation and specific requirements,
The arrangement of above-mentioned installation position can also be distributed in other forms, not limited uniquely herein.
In one embodiment, it please refers to shown in Fig. 2, above-mentioned installation position includes buckle structure 6.If in this way, passing through setting
Dry buckle structure 6, so as to which above-mentioned each component 2 to be mounted on above-mentioned first substrate 1.
Optionally, above-mentioned each buckle structure 6 includes buckle 61, which is set to one end of above-mentioned component 2, upper
State and be provided with button bit 62 on first substrate 1, the position setting of the corresponding above-mentioned buckle 61 of the button bit 62, in this way, by buckle 61 with
62 phase of button bit clamping, so as to which above-mentioned several components 2 are installed on above-mentioned first substrate 1.
In one embodiment, it please refers to shown in Fig. 2, Fig. 3 and Fig. 4, offers guide angle 63 on above-mentioned button bit 62.It is logical
Setting guide angle 63 is crossed, so that being conducive to above-mentioned buckle 61 skids off above-mentioned button bit 62, is convenient for subsequent transfer.Optionally, above-mentioned
The angular range of guide angle 63 is in 30~45 °, certainly, according to the actual situation and specific requirements, the angle model of above-mentioned guide angle 63
It encloses and may be alternatively provided as other angles, do not limit uniquely herein.
In the present embodiment, another transfer device is additionally provided, above-mentioned transfer device further includes first substrate 1,
Above-mentioned first substrate 1 is equipped with several boss 4, the boss 4 and 1 integrally connected of first substrate, which further includes being used for
The above-mentioned the second substrate 3 for stating component 2 to be transferred is installed, each component 2 is detachably set to above-mentioned the second substrate 3 in interval
On, which is set in distance in the side of above-mentioned first substrate 1, and above-mentioned transfer device further includes buckle structure 6, should
Above-mentioned component 2 can be mounted in above-mentioned the second substrate 3 by buckle structure 6, in addition, being additionally provided with one on above-mentioned several boss 4
The flexible glue-line 5 of layer, the flexibility glue-line 5 can be used for for above-mentioned component 2 correspondence being bonded on above-mentioned boss 4, which can
It realizes that component 2 sticks to separate and realize by cleaning with above-mentioned each solution of boss 4 by subsequent illumination to separate above-mentioned boss 4,
And the width of above-mentioned several flexible glue-lines 5 is equal to or less than the width of above-mentioned boss 4.In this way, by being arranged on first substrate 1
Several boss 4, and flexible glue-line 5 is set on each boss 4；It can be corresponding viscous by above-mentioned each component 2 by the way that flexible glue-line 5 is arranged
It ties on above-mentioned each boss 4, and is transferred to each component 2 on first substrate 1 from the second substrate 3 by each boss 4, finally lead to
It crosses illumination and component 2 is dismantled from boss 4, the synchronous transfer realized to multiple components 2 is simple and convenient, improve production
Efficiency, and cost is relatively low for flexible glue-line 5, to be conducive to the extensive transfer of later period component 2, further, since above-mentioned flexibility
Glue-line 5 can be realized by cleaning separates above-mentioned flexible glue-line 55 with boss 4, thus the realization pair of reusable above-mentioned boss 4
The transfer of component 2 further reduced the cost of transfer, and by the way that the width of above-mentioned flexible glue-line 5 to be set smaller than
The width of boss 4 is stated, to be conducive to subsequent dismounting process, certainly, and according to the actual situation and specific requirements, above-mentioned flexible glue
The width of layer 5 may be alternatively provided as the width equal to above-mentioned boss 4, not limit uniquely herein.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the utility model within the spirit and principle of utility model
Protection scope within.
Claims (10)
1. transfer device characterized by comprising
First substrate；
Several boss are set on the first substrate；
Flexible glue-line, it is separable to be set on the boss, for bonding component to be transferred, and it is real for being irradiated by light
It now sticks and separates with the solution of the component.
2. transfer device as described in claim 1, which is characterized in that the flexibility glue-line is the production of ultraviolet light solution sticky glue
Film layer.
3. transfer device as described in claim 1, which is characterized in that the flexibility glue-line bonding, is printed or is coated at hot pressing
On the boss.
4. transfer device as described in claim 1, which is characterized in that the boss is described in inverted trapezoidal or cylindrical setting
The area of the boss of inverted trapezoidal connects the first substrate compared with big end.
5. transfer device as described in claim 1, which is characterized in that several boss and first substrate one at
Type.
6. such as transfer device described in any one of claim 1 to 5, which is characterized in that the transfer device further includes the second base
Plate, for carrying component to be transferred, the second substrate is equipped with several installation positions, and the installation position is in second base
Arrangement on plate is identical as the arrangement of the boss on the first substrate.
7. transfer device as claimed in claim 6, which is characterized in that the installation position includes for can by each component
The buckle structure of disassembly being installed on the first substrate；The buckle structure includes for connecting described component one end
Buckle, and be set to and correspond to the button bit for buckling and opening up on the first substrate, the buckle is mutually clamped with the button bit.
8. transfer device as claimed in claim 7, which is characterized in that offered on the button bit skidded off for the buckle it is described
The guide angle of button bit.
9. transfer device as claimed in claim 8, which is characterized in that the angular range of the guide angle is in 30~45 °.
10. transfer device characterized by comprising
First substrate；
Several boss are integrally connected to the first substrate；
The second substrate, for installing component to be transferred；
Buckle structure is detachably set in the second substrate, for connecting the component in interval；
Flexible glue-line, it is separable to be set on the boss, for component correspondence to be transferred to be bonded in each boss
On, the flexibility glue-line is that can realize to stick with the component solution by light irradiation to separate, by cleaning realization and the boss
Isolated glue-line；
The width of the flexibility glue-line is equal to or less than the width of each boss.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821880919.4U CN209402964U (en) | 2018-11-14 | 2018-11-14 | Transfer device |
| PCT/CN2018/121784 WO2020098055A1 (en) | 2018-11-14 | 2018-12-18 | Transfer printing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821880919.4U CN209402964U (en) | 2018-11-14 | 2018-11-14 | Transfer device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209402964U true CN209402964U (en) | 2019-09-17 |
Family
ID=67880110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821880919.4U Active CN209402964U (en) | 2018-11-14 | 2018-11-14 | Transfer device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN209402964U (en) |
| WO (1) | WO2020098055A1 (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005036821A1 (en) * | 2005-08-04 | 2007-03-15 | Siemens Ag | Method for transferring and device for handling electronic components |
| US8425716B2 (en) * | 2009-06-23 | 2013-04-23 | Global Oled Technology Llc | Applying chiplets to substrates |
| CN107333400A (en) * | 2016-04-29 | 2017-11-07 | 深圳市炫硕智造技术有限公司 | Depressed suction nozzle adsorption mechanism |
| CN106596603A (en) * | 2016-11-22 | 2017-04-26 | 中国电子科技集团公司第十研究所 | Sample carrying device for testing X-ray topography image of semiconductor wafer and test method |
| CN107154374B (en) * | 2017-05-23 | 2019-09-10 | 深圳市华星光电技术有限公司 | Micro- transfer method |
-
2018
- 2018-11-14 CN CN201821880919.4U patent/CN209402964U/en active Active
- 2018-12-18 WO PCT/CN2018/121784 patent/WO2020098055A1/en active Application Filing
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| Publication number | Publication date |
|---|---|
| WO2020098055A1 (en) | 2020-05-22 |
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