CN209374488U - A kind of display panel and display device - Google Patents
A kind of display panel and display device Download PDFInfo
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- CN209374488U CN209374488U CN201920342946.4U CN201920342946U CN209374488U CN 209374488 U CN209374488 U CN 209374488U CN 201920342946 U CN201920342946 U CN 201920342946U CN 209374488 U CN209374488 U CN 209374488U
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Abstract
The utility model discloses a kind of display panel and display devices.The display panel includes substrate, multiple display units and thin-film packing structure, and multiple display units are set to substrate surface, and thin-film packing structure covers multiple display units；Thin-film packing structure includes at least one layer of barrier layer, at least one layer of stress layer and at least two layers of inorganic layer, and barrier layer is arranged alternately with inorganic layer, and stress layer is set between barrier layer and inorganic layer.Since barrier layer has high transparency and high water oxygen obstructing capacity in thin-film packing structure, the ability of the thin-film packing structure barrier ingredients such as steam and oxygen can be further increased on the basis of at least two layers of inorganic layer barrier ingredient such as steam and oxygen, and stress layer can alleviate the stress of inorganic layer release, reinforce the bonding of barrier layer and inorganic layer simultaneously, so as to preferably avoid display unit from being increased the service life of display panel by the influence of the ingredients such as steam and oxygen.
Description
Technical field
The utility model embodiment is related to thin film encapsulation technology field more particularly to a kind of display panel and display device.
Background technique
Organic Light Emitting Diode (Organic Light Emitting Diode, OLED) display device due to it is thin,
Gently, the advantages that wide viewing angle, low cost, have become a kind of important display device in display field.
The ingredients such as steam and oxygen in air are very big to the aging effects of the display unit in OLED display panel, therefore
The encapsulating structure of covering display unit can be set when forming OLED display panel, entered for obstructing the ingredients such as steam and oxygen
Inside display panel, the ingredients such as steam and oxygen is avoided to damage display unit.
Utility model content
The utility model provides a kind of display panel and display device, to improve thin-film packing structure barrier steam and oxygen
The ability of the ingredients such as gas, to increase the service life of display panel.
In a first aspect, the utility model embodiment provides a kind of display panel, comprising:
Substrate；
Display unit, display unit are set to the substrate surface；
Thin-film packing structure, thin-film packing structure cover multiple display units；
Thin-film packing structure includes barrier layer, stress layer and at least two layers of inorganic layer, and barrier layer replaces with inorganic layer and sets
It sets, stress layer is set between barrier layer and inorganic layer.
Optionally, the top and side of the display unit is completely covered in inorganic layer；
The top and side of the display unit is completely covered in barrier layer.
Optionally, stress layer is adhesive layer.
Optionally, barrier layer is set between at least two layers of inorganic layer.
Optionally, thin-film packing structure further includes organic layer, and organic layer is set between at least two layers of inorganic layer.
Optionally, organic layer includes the first organic layer；
At least two layers of inorganic layer includes the first inorganic layer and the second inorganic layer；
First organic layer is set to that barrier layer closes on the side of the second inorganic layer or the first organic layer is set to barrier layer
Side far from the second inorganic layer.
Optionally, at least two layers of inorganic layer includes the first inorganic layer and the second inorganic layer；
Barrier layer includes the first barrier layer；
First inorganic layer, the first barrier layer and the second inorganic layer are cascading；
Second inorganic layer is set to side of first barrier layer far from substrate.
Optionally, thin-film packing structure further includes the second barrier layer, and it is remote that second barrier layer is set to the second inorganic layer
Side from substrate.
Optionally, stress layer includes the first stress layer and the second stress layer, and barrier layer is set to the first stress layer and second
Between stress layer.
Second aspect, the utility model embodiment additionally provide a kind of display device, including the utility model is arbitrarily implemented
The display panel that example provides.
The technical solution of the utility model, display panel include substrate, display unit and thin-film packing structure, display unit
It is set to substrate surface, thin-film packing structure covers display unit.Thin-film packing structure includes at least one layer of barrier layer, and at least one
Layer stress layer and at least two layers of inorganic layer, and barrier layer is arranged alternately with inorganic layer, stress layer is set to barrier layer and inorganic layer
Between.It, can be at least two layers of inorganic layer since barrier layer has high transparency and high water oxygen obstructing capacity in thin-film packing structure
The ability of the thin-film packing structure barrier ingredients such as steam and oxygen is further increased on the basis of the barrier ingredients such as steam and oxygen,
And stress layer can alleviate the stress of inorganic layer release, while reinforce the bonding of barrier layer and inorganic layer, so as to more preferable
Avoid display unit from being increased the service life of display panel by the influence of the ingredients such as steam and oxygen.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of display panel provided by the embodiment of the utility model；
Fig. 2 is the structural schematic diagram of another display panel provided by the embodiment of the utility model；
Fig. 3 is the structural schematic diagram of another display panel provided by the embodiment of the utility model；
Fig. 4 is the structural schematic diagram of another display panel provided by the embodiment of the utility model；
Fig. 5 is the structural schematic diagram of another display panel provided by the embodiment of the utility model；
Fig. 6 is the structural schematic diagram of another display panel provided by the embodiment of the utility model；
Fig. 7 is the structural schematic diagram of another display panel provided by the embodiment of the utility model；
Fig. 8 is the structural schematic diagram of another display panel provided by the embodiment of the utility model；
Fig. 9 is a kind of structural schematic diagram of display device provided by the embodiment of the utility model.
Specific embodiment
The utility model is described in further detail with reference to the accompanying drawings and examples.It is understood that herein
Described specific embodiment is used only for explaining the utility model, rather than the restriction to the utility model.It further needs exist for
It is bright, part relevant to the utility model is illustrated only for ease of description, in attached drawing rather than entire infrastructure.
In the prior art, the structure that thin-film package (Thin-Film Encapsulation, TFE) structure is widely used is
Inorganic layer+organic layer+inorganic layer structure, or the integrated mode of other inorganic layer+organic layers, wherein inorganic layer is for hindering
Water proof vapour and oxygen, organic layer are used to alleviate the stress of inorganic layer release.But this TFE structural inorganic layer barrier steam and oxygen
The scarce capacity of the ingredients such as gas influences the service life of display panel.
The utility model provides a kind of display panel, which includes substrate, display unit and thin-film package knot
Structure.Display unit is arranged on the surface of the substrate, and thin-film packing structure covers display unit.Thin-film packing structure includes at least one layer
Barrier layer, at least one layer of stress layer and at least two layers of inorganic layer, and barrier layer is arranged alternately with inorganic layer, stress layer is set to resistance
Between interlayer and inorganic layer.By the way that barrier layer is arranged, barrier layer has the function of good barrier steam and oxygen, therefore can be with
Thin-film packing structure is set further to obstruct the entrance of the ingredients such as steam and oxygen on the basis of inorganic layer obstructs steam and oxygen aobvious
Show panel, so that the ability of the thin-film packing structure barrier ingredients such as steam and oxygen further increases, to preferably avoid
Display unit is influenced by ingredients such as steam and oxygen, increases the service life of display panel.In addition, thin-film packing structure also wraps
At least one layer of stress layer is included, stress layer is set between barrier layer and inorganic layer, because stress layer has good elastoplasticity and glues
Knot property, therefore can buffer the stress of inorganic layer release while, reinforces the bonding between barrier layer and inorganic layer, increases thin
The service life of film encapsulating structure further increases the service life of display panel.
In addition, barrier layer is arranged alternately with inorganic layer, it is only for illustrating barrier layer and the alternate positional relationship of inorganic layer,
It can also include other film layers between being arranged alternately of barrier layer and inorganic layer.Illustratively, when thin-film packing structure includes it
When his film layer, such as thin-film packing structure includes stress layer, and the film layer structure of thin-film packing structure can be to be cascading
Inorganic layer-stress layer-barrier layer-inorganic layer, barrier layer therein and inorganic layer are inorganic layer-barrier layer-inorganic layer friendship
For setting.
Illustratively, at least one layer of barrier layer is set between at least two layers of inorganic layer.Fig. 1 is the utility model embodiment
The structural schematic diagram of a kind of display panel provided, as shown in Figure 1, the display panel includes substrate 11, display unit 12 and thin
Film encapsulating structure 13.The surface of substrate 11 is arranged in display unit 12, and thin-film packing structure 13 covers display unit 12.Film envelope
Assembling structure 13 includes 131, one layers of stress layer 133 of barrier layer and two layers of inorganic layer 132.One layer of barrier layer 131 is the first barrier layer
131a, one layer of stress layer are the first stress layer 133a, and two layers of inorganic layer 132 is respectively the first inorganic layer 132a and the second inorganic layer
132b, the second inorganic layer 132b are set to the first side of the barrier layer 131a far from substrate 11.Barrier layer 131 and inorganic layer 132
When setting, at least one layer of barrier layer 131 is set between at least two layers of inorganic layer 132, i.e., thin-film packing structure 13 is outermost
Film layer is inorganic layer 132.Stress layer 133 is set between barrier layer 131 and inorganic layer 132 that (Fig. 1 schematically illustrates
One stress layer 133a is set between the first inorganic layer 132a and the first barrier layer 131a).
Wherein, the display unit 12 in display panel includes multiple display devices, and each of multiple display devices are aobvious
Show that device is made of anode, cathode and the one or more organic layers being disposed there between.Illustratively, cathode and anode it
Between be provided with luminescent layer, luminescent layer may include one or more luminous organic compounds.Display unit 12 further includes that driving is aobvious
Show the luminous driving element of device, corresponding display device is driven to shine.Driving element may include thin film transistor (TFT) and storage
Capacitor.Thin-film packing structure 13 avoids steam and oxygen from entering inside display panel, so that water oxygen be avoided to damage for obstructing water oxygen
Bad display unit 12.
Specifically, barrier layer 131 has certain block water oxygen ability and higher light transmittance, by the way that thin-film package is arranged
Structure 13 includes one layer of barrier layer 131 and two layers of inorganic layer 132, and barrier layer 131 is arranged alternately with inorganic layer 132, film envelope
The outermost of assembling structure 13 is the second inorganic layer 132b, thin on the basis of guarantee display panel light extraction efficiency with higher
It is aobvious that film encapsulating structure 13 further obstructs the entrance of the ingredients such as steam and oxygen on the basis of inorganic layer 132 obstructs steam and oxygen
Show panel, so that the ability that thin-film packing structure 13 obstructs the ingredients such as steam and oxygen further increases, thus preferably
Influence of the display unit 12 by ingredients such as steam and oxygen is avoided, the service life of display panel is increased.In addition, thin-film package
One layer of stress layer 133 that structure 13 includes is set between barrier layer 131 and inorganic layer 132, and stress layer 133 has good bullet
Plasticity, therefore when the stress of inorganic layer 132 extends to stress layer 133, the deformation that stress layer 133 occurs under the action of stress
In the range of elastoplasticity, therefore stress layer 133 preferable in bullet moulding becomes can absorb and buffer what inorganic layer 132 discharged
Stress, the stress for avoiding the release of inorganic layer 132 continue to extend to thin-film packing structure along the direction perpendicular to 11 surface of substrate
13 other film layers.Also, stress layer 133 has cementation, therefore can be enhanced between barrier layer 131 and inorganic layer 132
Bonding, to increase the service life of thin-film packing structure 13, and then increase the service life of display panel.
In addition, Fig. 1, which schematically illustrates thin-film packing structure 13, only includes four-layer structure, guaranteeing thin-film packing structure
13 while have the preferable performance for preventing steam or oxygen, so that thin-film packing structure 13 has relatively thin thickness, meets
The lightening development trend of display panel.
Fig. 1 is only to schematically illustrate the first stress layer 133a to be set to the first inorganic layer 132a and the first barrier layer
Between 131a.First stress layer 133a can also be set between the second inorganic layer 132b and the first barrier layer 131a, herein not
It limits.
It should be noted that when barrier layer 131 and inorganic layer 132 are arranged alternately, inorganic layer that both can be as shown in Figure 1
132 are located at outermost of the thin-film packing structure 13 far from substrate 11, i.e., at least one layer of barrier layer 131 be set at least two layers it is inorganic
Between layer 132.Also the side that at least one layer of barrier layer 131 is set to inorganic layer 132 can be set.Illustratively, Fig. 2 is this reality
With the structural schematic diagram for another display panel that new embodiment provides, as shown in Fig. 2, thin-film packing structure 13 further includes the
Two barrier layer 131b, barrier layer 131 are arranged alternately with inorganic layer 132, and outermost of the thin-film packing structure 13 far from substrate 11
For the second barrier layer 131b, make outermost barrier layer 131 of the thin-film packing structure 13 far from substrate 11.The present embodiment is not done
It is specific to limit.
Specifically, on the basis of Fig. 1, thin-film packing structure 13 can also include the second barrier layer 131b, and at this time second
Barrier layer 131b is set to the second side of the inorganic layer 132b far from substrate 11.First barrier layer 131a and the second barrier layer 131b
High transparency and high water oxygen obstructing capacity are all had, it therefore, can compared to the setting including the first barrier layer 131a in Fig. 1
To further increase the ability that thin-film packing structure 13 obstructs the ingredients such as steam and oxygen.To preferably avoid display unit
12 are influenced by ingredients such as steam and oxygen, increase the service life of display panel.
Optionally, barrier layer 131 can select ethylene-vinyl alcohol copolymer (EVOH), Vingon (PVDC), polyamine
(PA), the mixture of polyethylene terephthalate (PET).Alternatively, barrier layer 131 can be total including ethylene-vinyl alcohol simultaneously
The mixture formation of polymers (EVOH), Vingon (PVDC), polyamine (PA), polyethylene terephthalate (PET)
The evaporated film that film and silicon oxide compound or aluminum oxide are formed can further improve barrier layer 131 and obstruct water oxygen
Ability.When barrier layer 131 includes above two film, one layer of adhesive layer can be set between two kinds of films, for bonding
Two kinds of films of barrier layer 131.Barrier layer 131 have good barrier water oxygen ability, in identical environment (such as temperature with
The environmental parameters such as humidity are identical) when, the parameter of water oxygen ability is obstructed using moisture-vapor transmission WVTR as thin-film packing structure.Tool
The WVTR value for having the thin-film packing structure 13 of barrier layer 131 is the WVTR value for the thin-film packing structure that the prior art provides
75%, i.e., the barrier water oxygen ability of the thin-film packing structure 13 with barrier layer 131 is than thin-film package knot that the prior art provides
The barrier water oxygen ability of structure improves 25%.Therefore, the ability that thin-film packing structure 13 obstructs water oxygen can be improved in barrier layer 131,
Increase the service life of display panel.
Under normal circumstances, barrier layer 131 directly can be bonded to form thin-film packing structure 13 with inorganic layer 132.Barrier layer
131 are set on inorganic layer 132 using the method for fitting, since the method for fitting has the advantages that cost is relatively low, to reduce
The cost of production display panel.
It should be noted that the size that the size of barrier layer 131 can be greater than display panel can be with during fitting
It needs to carry out cutting separation to barrier layer 131 according to display panel.
It should be noted that the material of above-mentioned barrier layer 131 is only a kind of example, rather than limit.At least one layer barrier
Layer 131 can also use other materials with high transparency and high water oxygen obstructing capacity.
Furthermore it is possible to select chemical vapor deposition (Chemical Vapor Deposition, CVD), atomic layer deposition
(Atomic Layer Deposition, ALD) and one of a variety of deposition methods of sputtering come deposit SiON, SiN, SiO or
Al2O3Etc. inorganic material formed inorganic layer 132.
The technical solution of the present embodiment, display panel include substrate, display unit and thin-film packing structure, and display unit is set
It is placed in substrate surface, thin-film packing structure is formed in a manner of the top surface for covering display unit and side surface.Thin-film package knot
Structure includes at least one layer of barrier layer, at least one layer of stress layer and at least two layers of inorganic layer, and barrier layer is arranged alternately with inorganic layer,
Stress layer is set between barrier layer and inorganic layer.Since there is barrier layer high transparency and high water oxygen to hinder in thin-film packing structure
Every ability, thin-film packing structure resistance can be further increased on the basis of at least two layers of inorganic layer barrier ingredient such as steam and oxygen
The ability of the ingredients such as water proof vapour and oxygen, so as to preferably avoid display unit by the shadow of the ingredients such as steam and oxygen
It rings, increases the service life of display panel.In addition, thin-film packing structure further includes at least one layer of stress layer, stress layer is set to resistance
Between interlayer and inorganic layer, reinforce the bonding between barrier layer and inorganic layer while the stress of inorganic layer release can be buffered,
Therefore thin-film packing structure can increase the service life of thin-film packing structure, further increase the service life of display panel.
It should be noted that the number of barrier layer and inorganic layer in thin-film packing structure is not limited, only show herein
Example.
Based on the above technical solution, Fig. 3 is the knot of another display panel provided by the embodiment of the utility model
The top and side of display unit 12 is completely covered as shown in figure 3, barrier layer 131 is contacted with substrate 11 in structure schematic diagram.
Specifically, Fig. 1 and Fig. 2 is only a kind of example, and in other embodiments, barrier layer 131 is contacted with substrate 11, makes to show
Show to include barrier layer 131 around unit 12, barrier layer 131 can further obstruct steam and oxygen around display unit 12
The inside for entering display panel improves the ability of the barrier water oxygen of thin-film packing structure 13.Under normal circumstances, can make to hinder
Interlayer 131 is contacted with substrate 11 around display unit 12 so that have around display unit 12 barrier layer 131 obstruct steam with
Oxygen enters the inside of display panel.In addition, can also include stress layer 133, stress layer 133 around display unit 12
To around display unit 12 barrier layer 131 and inorganic layer 132 bond, the inorganic layer around simultaneous buffering display unit 12
The stress of release increases the service life of thin-film packing structure, to increase the service life of display panel.
On the basis of above-mentioned each technical solution, Fig. 4 is another display panel provided by the embodiment of the utility model
Structural schematic diagram, as shown in figure 4, thin-film packing structure 13 may include two layers of stress layer 133, stress layer 133 is set to barrier
Between layer 131 and inorganic layer 132.
Illustratively, with reference to Fig. 4, thin-film packing structure 13 may include the first inorganic layer 132a being cascading,
First stress layer 133a, the first barrier layer 131a, the second stress layer 133b and the second inorganic layer 132b.Second inorganic layer 132b is set
It is placed in the first side of the barrier layer 131a far from substrate 11.Wherein, the first stress layer 133a and the second stress layer 133b can be more
The stress of good buffering the first inorganic layer 132a and the second inorganic layer 132b release, therefore making for thin-film packing structure can be increased
With the service life, and then increase the service life of display panel.And by using the first inorganic layer 132a, the first stress layer 133a,
The structure of five layer stackup of one barrier layer 131a, the second stress layer 133b and the second inorganic layer 132b, ensure that thin-film packing structure
With relatively thin thickness, meet the lightening development trend of display panel.
Optionally, stress layer 133 can be adhesive layer, and adhesive layer has cementation, therefore can make the first barrier layer
It is preferably bonded between 131a and the first inorganic layer 132a and the second inorganic layer 132b, avoids the first barrier layer in use
Appearance position is mobile between 131a and the first inorganic layer 132a and the second inorganic layer 132b, causes the encapsulation effect of thin-film packing structure 13
Fruit is poor.Meanwhile stress layer 133 has good elastoplasticity.When the stress of inorganic layer 132 extends to stress layer 133, stress layer
133 can occur the deformation in elastic-plastic range under the action of the stress that inorganic layer 132 discharges, and stress layer 133 can both be inhaled
Stress is received, and not will lead to situations such as stress layer 133 is broken under the action of stress, therefore stress layer 133 can be preferable
Buffering the first inorganic layer 132a and the second inorganic layer 132b release stress, avoid inorganic layer 132 release stress along hang down
Other film layers for directly continuing to extend to thin-film packing structure 13 in the direction on 11 surface of substrate, to increase thin-film packing structure
Service life, and then increase the service life of display panel.For example, stress layer 133 can be organic silica gel.In production film envelope
During assembling structure 13, one side and the barrier layer 131 of stress layer 133 are bonded, the another side and inorganic layer 132 of stress layer 133
Bonding realizes the bonding between barrier layer 131 and inorganic layer 132.
It should be noted that the number of plies of the stress layer 133 in Fig. 4 is only a kind of example, rather than limit.Stress layer 133
It can be changed according to the number of plies of barrier layer 131.For example, Fig. 5 is another display panel provided by the embodiment of the utility model
Structural schematic diagram, as shown in figure 5, thin-film packing structure 13 can also include the first inorganic layer 132a being cascading, the
One stress layer 133a, the first barrier layer 131a, the second stress layer 133b, the second inorganic layer 132b, third stress layer 133c and
Two barrier layer 131b.Wherein the second barrier layer 131b is set to the first side of the barrier layer 131a far from substrate 11.Therefore, first
The setting of barrier layer 131a, the first inorganic layer 132a, the second inorganic layer 132b, the first stress layer 133a and the second stress layer 133b
Identical as Fig. 4, unlike Fig. 4, the thin-film packing structure 13 of the present embodiment further includes the second barrier layer 131b, and setting
Third stress layer 133c between the second barrier layer 131b and the second inorganic layer 132b.Second is buffered in the second stress layer 133b
On the basis of the stress of inorganic layer 132b release, third stress layer 133c can further buffer the second inorganic layer 132b release
Stress, the service life of thin-film packing structure 13 is further increased, and by increasing by the second barrier layer 131b, into one
Step improves the ability that thin-film packing structure 13 obstructs water oxygen.
On the basis of above-mentioned each technical solution, thin-film packing structure further includes at least one layer of organic layer, and at least one layer has
Machine layer is set between at least two layers of inorganic layer, and organic layer is arranged alternately with inorganic layer.
Specifically, by the way that at least one layer of organic layer is arranged, organic layer effectively can prevent or reduce defect in inorganic layer
It is formed, so that the ingredients such as steam and oxygen be prevented to go out the phenomenon that spreading in the defect of at least two layers inorganic layer, is further mentioned
The high ability of thin-film packing structure barrier steam and oxygen, to increase the service life of display panel.In addition, inorganic layer is flat
Whole property and poor continuity, and organic layer have good planarization and continuity, therefore by setting organic layer can be improved it is thin
The planarization and continuity of film encapsulating structure.
Illustratively, Fig. 6 is the structural schematic diagram of another display panel provided by the embodiment of the utility model, such as Fig. 6
Shown, thin-film packing structure 13 includes the first inorganic layer 132a, the first stress layer 133a, the first barrier layer 131a being stacked
The first side of the barrier layer 131a far from substrate 11 is set to the second inorganic layer 132b, the second inorganic layer 132b.Thin-film package
Structure 13 further includes that the first organic layer 134a, the first organic layer 134a is set to the first barrier layer 131a and closes on the second inorganic layer
The side of 132b.
Alternatively, Fig. 7 is the structural schematic diagram of another display panel provided by the embodiment of the utility model, as shown in fig. 7,
First organic layer 134a is set to side of the first barrier layer 131a far from the second inorganic layer 132b.
Specifically, the first organic layer 134a can be formed by way of inkjet printing.First organic layer 134a with it is inorganic
Layer 132 is adjacent, and the first organic layer 134 effectively can reduce or prevent the first inorganic layer 132a or the second inorganic layer 132b making
The defect formed during making, so that the ingredients such as steam and oxygen is prevented to go out the phenomenon that spreading in the defect of inorganic layer 132, into
The ability for improving thin-film packing structure 13 and obstructing steam and oxygen of one step, to increase the service life of display panel.
Fig. 8 is the structural schematic diagram of another display panel provided by the embodiment of the utility model, as shown in figure 8, when thin
When film encapsulating structure 13 includes the first stress layer 133a and the second stress layer 133b, the first organic layer 134a be can be set first
Between stress layer 133a and the first inorganic layer 132a.
When thin-film packing structure 13 not only includes organic layer 134, but also when including stress layer 133, wrapped in thin-film packing structure 13
On the basis of including inorganic layer 132 and barrier layer 131, organic layer 134 and stress layer 133 can buffer answering for the release of inorganic layer 132
Power, while organic layer 134 can reduce or prevent the defect of inorganic layer 132, the further thin-film packing structure 13 that improves obstructs
The ability of steam and oxygen increases the service life of thin-film packing structure 13, thus the overall growth service life of display panel.
It should be noted that the position of the first organic layer 134a is only a kind of example in Fig. 8, herein without limitation.Example
Property, the first organic layer 134a also can be set between the second inorganic layer 132b and the second stress layer 133b.
The utility model embodiment additionally provides a kind of display device, and Fig. 9 is one kind provided by the embodiment of the utility model
The structural schematic diagram of display device, as shown in figure 9, the display device 910 includes that any technical solution of the utility model provides
Display panel 911.
Note that above are only the preferred embodiment and institute's application technology principle of the utility model.Those skilled in the art's meeting
Understand, the utility model is not limited to specific embodiment described here, is able to carry out for a person skilled in the art various bright
Aobvious variation, readjustment and substitution is without departing from the protection scope of the utility model.Therefore, although passing through above embodiments
The utility model is described in further detail, but the utility model is not limited only to above embodiments, is not departing from
It can also include more other equivalent embodiments in the case that the utility model is conceived, and the scope of the utility model is by appended
Scope of the claims determine.
Claims (10)
1. a kind of display panel characterized by comprising
Substrate；
Display unit, the display unit are set to the substrate surface；
Thin-film packing structure, the thin-film packing structure cover the display unit；
The thin-film packing structure includes barrier layer, stress layer and at least two layers of inorganic layer, and the barrier layer with it is described inorganic
Layer is arranged alternately, and the stress layer is set between the barrier layer and the inorganic layer.
2. display panel according to claim 1, which is characterized in that the display unit is completely covered in the inorganic layer
Top and side；
The top and side of the display unit is completely covered in the barrier layer.
3. display panel according to claim 1, which is characterized in that the stress layer is adhesive layer.
4. display panel according to claim 1, which is characterized in that the barrier layer be set to described at least two layers it is inorganic
Between layer.
5. display panel according to claim 1-4, which is characterized in that the thin-film packing structure further includes having
Machine layer；
The organic layer is set between at least two layers of inorganic layer.
6. display panel according to claim 5, which is characterized in that the organic layer includes the first organic layer；
At least two layers of inorganic layer includes the first inorganic layer and the second inorganic layer；
First organic layer be set to the barrier layer close on second inorganic layer side or first organic layer
It is set to side of the barrier layer far from second inorganic layer.
7. display panel according to claim 1, which is characterized in that at least two layers of inorganic layer includes the first inorganic layer
With the second inorganic layer；
The barrier layer includes the first barrier layer；
First inorganic layer, first barrier layer and second inorganic layer are cascading；
Second inorganic layer is set to the side of first barrier layer far from the substrate.
8. display panel according to claim 7, which is characterized in that the thin-film packing structure further includes the second barrier
Layer, second barrier layer are set to the side of second inorganic layer far from the substrate.
9. display panel according to claim 1, which is characterized in that the stress layer include the first stress layer and second by
Power layer, the barrier layer are set between first stress layer and second stress layer.
10. a kind of display device, which is characterized in that including any display panel of claim 1-9.
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| CN201920342946.4U CN209374488U (en) | 2019-03-18 | 2019-03-18 | A kind of display panel and display device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201920342946.4U CN209374488U (en) | 2019-03-18 | 2019-03-18 | A kind of display panel and display device |
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| CN209374488U true CN209374488U (en) | 2019-09-10 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112578605A (en) * | 2020-11-23 | 2021-03-30 | 义乌清越光电科技有限公司 | Electronic paper packaging structure, packaging method and electronic device |
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2019
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112578605A (en) * | 2020-11-23 | 2021-03-30 | 义乌清越光电科技有限公司 | Electronic paper packaging structure, packaging method and electronic device |
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