CN209362933U - Back structure and ultrasonic transducer - Google Patents

Abstract

The utility model embodiment discloses a kind of back structure and ultrasonic transducer, the back structure includes heat dissipating layer and conductive structure, thermal dissipating path in heat dissipating layer is made of the multiple through-holes being located in heat dissipating layer preset plane, it is an integral molding structure with heat dissipating layer, after injecting coolant in the thermal dissipating path when heat dissipation, coolant directly contacts heat dissipation layer surface, to improve the heat dissipation performance of heat dissipating layer, and then improves the heat dissipation performance of back structure；And, the first heat dissipation branch of at least one of at least two first included heat dissipation branches is between two neighboring conducting connecting part unit in thermal dissipating path, after the back structure and piezoelectric vibrator composition ultrasonic transducer, the first heat dissipation branch is located at the underface of the piezoelectric vibrator of ultrasonic transducer, to improve back structure to the heat dissipation effect of the piezoelectric vibrator.

Description

Back structure and ultrasonic transducer

Technical field

The utility model relates to ultrasonic transducer technical field more particularly to a kind of back structures and ultrasonic transducer.

Background technique

Ultrasonic transducer is a kind of device by electromagnetic energy for mechanical energy, is usually stretched by piezoelectric ceramics or other mangnetos Compression material is made, and common ultrasonic cleaner, ultrasonic atomizer, Ultrasonic-B probe etc. are all the application examples of ultrasonic transducer.Especially It is in terms of medicine, and medical supersonic transducer (ultrasonic probe) is the important component of medical ultrasonic instrument system, it is new In the development and medical research of type medical instrument, occupy considerable position.But the heat dissipation of current ultrasonic transducer is imitated Fruit is bad.

Utility model content

In order to solve the above technical problems, the utility model embodiment provides a kind of back structure and ultrasonic transducer, To improve the heat dissipation performance of back structure, to improve the heat dissipation effect of ultrasonic transducer.

To solve the above problems, the utility model embodiment provides following technical solution:

A kind of back structure is applied to ultrasonic transducer, comprising:

Heat dissipating layer has along the first through hole of first direction, the second through-hole and multiple third through-holes, institute in the heat dissipating layer Third through-hole is stated along the first direction through the heat dissipating layer；There is thermal dissipating path in the preset plane of the heat dissipating layer, In, one end of the first through hole is connected with one end of the thermal dissipating path, and the other end is for flowing into coolant, and described second One end of through-hole is connected with the other end of the thermal dissipating path, and the other end is for flowing out coolant；

Conductive structure, the conductive structure include multiple conducting connecting parts insulated from each other, the conducting connecting part and institute Third through-hole one-to-one correspondence is stated, is located in the third through-hole, the multiple conducting connecting part is arranged in array, and is divided into multiple The conducting connecting part unit arranged in a second direction, the conducting connecting part unit include multiple conductions along third direction arrangement Connector；

Wherein, the thermal dissipating path is formed by the multiple through-holes being located in the heat dissipating layer preset plane, including at least two It is a along the first heat dissipation branch of third direction and at least one second heat dissipation branch in a second direction, adjacent two described the One heat dissipation branch is connected by the second heat dissipation branch, at least two described first radiate in branches at least one described the One heat dissipation branch is between the two neighboring conducting connecting part unit.

Optionally, the thermal dissipating path includes at least three first heat dissipation branches, the adjacent first heat dissipation branch Between the quantity of the conducting connecting part unit that is spaced it is identical.

Optionally, it is adjacent it is described first heat dissipation branch between be separated with the conducting connecting part unit.

Optionally, the multiple conducting connecting part is divided into N number of conducting connecting part unit, and the thermal dissipating path includes M First heat dissipation branch, wherein M=N+1.

Optionally, the heat dissipating layer has the first surface and second surface being oppositely arranged along first direction, the conduction Connector one end is concordant with the first surface, and the other end stretches out from the second surface；

The distance between the preset plane and the first surface D meet following relationship:

D is not less than (100/A), wherein A indicates the sound attenuating coefficient of the heat dissipating layer, unit db/mm.

A kind of ultrasonic transducer, comprising:

Back structure described in any of the above embodiments；

The piezoelectric structure being fixedly connected with the first surface of the back structure, the piezoelectric structure include multiple piezoelectricity vibrations Son；

Deviate from the matching layer of the back structure side positioned at the piezoelectric structure；

The conducting connecting part and the piezoelectric vibrator correspond, and corresponding piezoelectric vibrator electrical connection.

Compared with prior art, above-mentioned technical proposal has the advantage that

Back structure provided by the utility model embodiment includes heat dissipating layer and conductive structure, dissipating in the heat dissipating layer Heat passage is made of the multiple through-holes being located in the heat dissipating layer preset plane, is an integral molding structure with the heat dissipating layer, After injecting coolant in the thermal dissipating path when heat dissipation, the coolant directly contacts the heat dissipation layer surface, to improve The heat dissipation performance of heat dissipating layer, and then improve the heat dissipation performance of back structure；Moreover, included by the thermal dissipating path at least At least one of two first heat dissipation branches first radiate branch between the two neighboring conducting connecting part unit, make At least one described first heat dissipation branch can be located in conductive structure between adjacent conductive connecting piece unit, and with piezoelectricity After oscillator forms ultrasonic transducer, positioned at the underface of the piezoelectric vibrator of ultrasonic transducer, to improve the back structure To the heat dissipation effect of the piezoelectric vibrator, the heat dissipation performance of the ultrasonic transducer including back structure is further improved.

Detailed description of the invention

In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor Under, it is also possible to obtain other drawings based on these drawings.

Fig. 1 is a kind of schematic diagram of back structure provided by the embodiment of the utility model；

Fig. 2 is a kind of structural schematic diagram of conducting connecting part unit provided by the embodiment of the utility model；

Fig. 3 is a kind of schematic diagram of conductive structure provided by the embodiment of the utility model；

Fig. 4 is a kind of flow diagram of the production method of back structure provided by the embodiment of the utility model；

Fig. 5 is a kind of relative position schematic diagram of pipeline mold and conductive structure provided by the embodiment of the utility model；

Fig. 6 is a kind of structural schematic diagram of pipeline mold provided by the embodiment of the utility model；

Fig. 7 is the structural schematic diagram of another pipeline mold provided by the embodiment of the utility model；

Fig. 8 is in the production method of back structure provided by the embodiment of the utility model, and the back structure is after polishing A certain angle schematic diagram；

Fig. 9 is provided in the production method of back structure for the utility model embodiment, and the back structure is after polishing The schematic diagram of another angle.

Specific embodiment

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work Every other embodiment obtained, fall within the protection scope of the utility model.

Many details are explained in the following description in order to fully understand the utility model, but this is practical new Type can also be implemented using other than the one described here other way, and those skilled in the art can be without prejudice to this reality With doing similar popularization in the case where novel intension, therefore the utility model is not limited by the specific embodiments disclosed below.

Currently, ultrasonic transducer is mainly made of piezoelectric vibrator, matching layer and back sheet, wherein the back sheet has The effect of support, sound absorption (i.e. the useless sound wave in the absorption back side) and heat dissipation, directly affects the thermal diffusivity of the ultrasonic transducer Energy.

The back sheet of existing ultrasonic transducer generally has heat sink material composition, to realize heat sinking function, still, with ultrasound The integrated functionality of energy converter is more and more, and the heat generated is also more and more, the simple side radiated using heat sink material Formula is not able to satisfy the radiating requirements of ultrasonic transducer gradually.Especially in high-energy focus type ultrasonic transducer field, merely The mode to radiate by heat sink material can not meet its heat dissipation and ask.

Inventor in back sheet the study found that be embedded to pipeline, and by the external water-cooling system of the pipeline, by into pipeline The mode for injecting coolant, can be improved the heat dissipation effect of back sheet, still, pipeline is embedded in back sheet, on the one hand, specific Strong reflection can be formed in pipe surface when work, cause echo interference, reduce the performance of ultrasonic transducer, be on the other hand equivalent to Impurity is added in back sheet, especially under certain particular job environment, such as in the intracavitary work of magnetic resonance, the pipeline of embedment is suitable It is bigger that artifact is generated in joined impurity, and under the more magnetic resonance of dopant species, further reduced the performance of ultrasonic transducer.

In view of this, the utility model embodiment provides a kind of back structure, and as shown in Figure 1,2 and 3, the back structure Include:

Heat dissipating layer 1 has in the heat dissipating layer 1 along the first through hole 101 of first direction Y, the second through-hole 102 and multiple Third through-hole, the third through-hole run through the heat dissipating layer 1 along the first direction Y；Tool in the preset plane of the heat dissipating layer 1 There is thermal dissipating path, wherein one end of the first through hole 101 is connected with one end of the thermal dissipating path, and the other end is for flowing Enter coolant, one end of second through-hole 102 is connected with the other end of the thermal dissipating path, and the other end is for flowing out cooling Agent；

Conductive structure 2, the conductive structure 2 include multiple conducting connecting parts 211 insulated from each other, the conducting connecting part 211 correspond with the third through-hole, are located in the third through-hole, and the multiple conducting connecting part 211 is arranged in array, It is divided into the conducting connecting part unit 21 of multiple X in a second direction arrangement, the conducting connecting part unit 21 includes multiple along the The conducting connecting part 211 of three direction Z arrangement；

Wherein, the thermal dissipating path is formed by the multiple through-holes being located in the heat dissipating layer preset plane, including at least two It is a along third direction Z first heat dissipation branch and at least one in a second direction X second heat dissipation branch, described in adjacent two First heat dissipation branch is connected by the second heat dissipation branch, described at least one in at least two first heat dissipation branches First heat dissipation branch is between the two neighboring conducting connecting part unit 21.

It should be noted that the multiple through-holes for being used to form thermal dissipating path are formed in the utility model embodiment Through-hole inside heat dissipating layer is structure as a whole with the heat dissipating layer.

Based on any of the above embodiments, in one embodiment of the utility model, the thermal dissipating path includes At least two along third direction Z first heat dissipation branch and at least one in a second direction X second heat dissipation branch, adjacent two A first heat dissipation branch is connected by the second heat dissipation branch, i.e., the described heat dissipation branch includes at least two along third The fifth hole that the fourth hole of direction Z and at least one second direction X extend, adjacent fourth hole pass through fifth hole phase Connection, wherein the fourth hole constitutes the first heat dissipation branch, and the fifth hole constitutes the second heat dissipation branch.

On the basis of the above embodiments, the heat dissipation in one embodiment of the utility model, in the thermal dissipating path Path is serpentine path, specifically, the heat dissipation branch include it is multiple first heat dissipation branches and it is multiple second heat dissipation branch, In, there is one second heat dissipation branch, specific connection type between two neighboring first heat dissipation branch are as follows: first first dissipates The head end of hot branch is connected with first through hole, the head that tail end passes through one second heat dissipation branch and second first heat dissipation branch End is connected, and the tail end of the last one the first heat dissipation branch is connected with the second through-hole, and head end passes through one second heat dissipation branch It is connected with the tail end of its previous first heat dissipation branch, to form end to end serpentine path.

Specifically, when including M first heat dissipation branch in the thermal dissipating path, it is described when M is the positive integer not less than 3 The head end of first first in thermal dissipating path heat dissipation branch is connected with one end of the first through hole, and tail end passes through one the Two heat dissipation branches are connected with the head end of second first heat dissipation branch, the tail end and described the of the last one the first heat dissipation branch One end of two through-holes is connected, and head end is connected by one second branch that radiates with the tail end of M-1 first heat dissipation branch, Remaining first heat dissipation branch meets: the head end of i-th first heat dissipation branches passes through second thermal dissipating path and (i-1)-th the The tail end of one heat dissipation branch is connected, and the tail end of i-th first heat dissipation branches passes through one second heat dissipation branch and i+1 The head end of first heat dissipation branch is connected, and forms serpentine path, wherein i is the positive integer greater than 1 and less than M.

In another embodiment of the utility model, the heat dissipation path in the thermal dissipating path is fence type path, tool Body, the heat dissipation branch includes multiple first heat dissipation branches and two second heat dissipation branches, wherein one second heat dissipation branch It is connected with first through hole, another the second heat dissipation branch is connected with the second through-hole, and the one of the multiple first heat dissipation branch End is connected with the second heat dissipation branch, and the other end is connected with another the second heat dissipation branch.It needs to illustrate , in the present embodiment, the link position of corresponding the second heat dissipation branch of the first through hole can be located at should Any position of second heat dissipation branch, similarly, the link position of corresponding the second heat dissipation branch of second through-hole Any position of the second heat dissipation branch can be located at, optionally, in the present embodiment, the corresponding institute of the first through hole The link position for stating the second heat dissipation branch is located at the middle position of the second heat dissipation branch, and similarly, second through-hole is right with it Answer it is described second heat dissipation branch link position be located at this second radiate branch middle position, the utility model to this not It limits, specifically depends on the circumstances.Based on any of the above embodiments, in one embodiment of the utility model, institute Stating coolant is water, to reduce cost, in the other embodiments of the utility model, the coolant may be other tools There is the solvent of cooling effect, specifically depends on the circumstances.

From the foregoing, it will be observed that in back structure provided by the utility model embodiment, the thermal dissipating path in the heat dissipating layer is Be made of the multiple through-holes being located in the heat dissipating layer preset plane, be an integral molding structure with the heat dissipating layer, when heat dissipation After injecting coolant in the thermal dissipating path, the coolant directly contacts the heat dissipation layer surface, to improve heat dissipating layer Heat dissipation performance, and then improve the heat dissipation performance of back structure.

Moreover, directly being formed and being dissipated using the through-hole in heat dissipating layer in back structure provided by the utility model embodiment Heat passage on the basis of improving heat dissipation effect, will not also introduce miscellaneous without being additionally embedded to pipeline in the back structure Matter avoids the performance for being embedded to that the impurity effects such as pipeline include the ultrasonic transducer of the back structure in the back structure Phenomenon.

In addition, in the utility model embodiment, at least two first included heat dissipation branches in the thermal dissipating path At least one of the first heat dissipation branch between the two neighboring conducting connecting part unit so that it is described at least one the One heat dissipation branch can be located in conductive structure between adjacent conductive connecting piece unit, and form ultrasonic transduction with piezoelectric vibrator After device, positioned at the underface of the piezoelectric vibrator of ultrasonic transducer, to improve the back structure to the piezoelectric vibrator Heat dissipation effect further improves the heat dissipation performance of the ultrasonic transducer including back structure, can satisfy high-energy focus type The radiating requirements of ultrasonic transducer.

It should be noted that in the utility model embodiment, the first heat dissipation branch for including in the thermal dissipating path Quantity is more, and the heat dissipation effect of the heat dissipating layer is better.The utility model to this and without limitation, specifically depends on the circumstances.It can Choosing, in one embodiment of the utility model, the thermal dissipating path includes at least three first heat dissipation branches, adjacent The quantity for the conducting connecting part unit being spaced between the first heat dissipation branch is identical, to improve the back structure heat dissipation Uniformity, to improve the integral heat sink effect of the back structure.Specifically, between the adjacent first heat dissipation branch Every the quantity of the conducting connecting part unit can be for 1,2,3 ... L etc., L is the positive integer greater than 3；But the utility model pair This and without limitation, specifically regard the aperture size of spacing between two adjacent conducting connecting part units, the first heat dissipation branch And depending on the actual conditions such as flow of coolant.

On the basis of the above embodiments, in one embodiment of the utility model, the adjacent first heat dissipation branch Between between be separated with the conducting connecting part unit, to be all arranged one between any two adjacent conductive connecting piece unit First heat dissipation branch, to further increase the heat dissipation effect of the back structure.

Optionally, the multiple conducting connecting part is divided into N number of conducting connecting part unit, and the thermal dissipating path includes M First heat dissipation branch, wherein M=N+1, so that there is the first heat dissipation branch packet in any one conducting connecting part unit two sides It wraps up in, so that the thermal dissipating path coats the conductive structure completely in a second direction, accelerates dissipating for the heat dissipating layer Heat further increases the heat dissipation effect of the back structure.

Specifically, the first heat dissipation branch projects on third direction Z in one embodiment of the utility model Length be greater than conducting connecting part unit along third direction Z length, and it is described first heat dissipation branch projected on third direction Z Both ends it is 5 mm-10mm longer along the both ends of third direction Z than conducting connecting part unit so that thermal dissipating path is in third party All conducting connecting parts are surrounded upwards, further improve the thermal diffusivity of the back structure.

Specifically, the heat dissipating layer has the first surface and second surface being oppositely arranged along first direction Y, the conduction Connector one end is concordant with the first surface, and for being used as pad, for being electrically connected with piezoelectric vibrator, the other end is from described the It is stretched out at two surfaces, for being electrically connected with cable, to realize being electrically connected for piezoelectric vibrator and cable.

It should be noted that in the above-described embodiments, since the thermal dissipating path is mainly used for producing the piezoelectric vibrator Raw heat radiates, and therefore, the distance between the thermal dissipating path and the piezoelectric vibrator are smaller, the back structure pair The heat dissipation effect for the piezoelectric vibrator being connected electrically is better, and the heat dissipation effect of the ultrasonic transducer including the back structure is better. But if the hypotelorism of the thermal dissipating path and the piezoelectric vibrator, echo interference piezoelectricity can be generated at thermal dissipating path Oscillator reduces the performance of the ultrasonic transducer.

Therefore, on the basis of the above embodiments, in one embodiment of the utility model, the preset plane and institute State the distance between first surface D and meet following relationship: D is not less than (100/A), wherein A indicates that the sound of the heat dissipating layer declines Subtract coefficient, unit db/mm, to reduce interference of the echo generated at the thermal dissipating path to piezoelectric vibrator.

Optionally, on the basis of the above embodiments, in one embodiment of the utility model, the preset plane with The distance between first surface D meets following relationship: D is equal to (100/A), to reduce generation at the thermal dissipating path On the basis of echo is to the interference of piezoelectric vibrator, the thermal dissipating path is improved as far as possible, the heat dissipation of the piezoelectric vibrator is imitated Fruit.

Specifically, in one embodiment of the utility model, the sound attenuating system of the back structure in the utility model Number is 20db/mm, then, the distance between the preset plane and the first surface D are not less than 5mm, optionally, described When the distance between preset plane and the first surface D are 5mm, the thermal dissipating path is not the case where generating echo interference Under, it is nearest apart from piezoelectric vibrator, that is to say, that thermal dissipating path is best to the synthesis heat dissipation effect of piezoelectric vibrator at this location. But the utility model is to this and without limitation, and the thermal dissipating path specifically regards the backing in the specific setting position of heat dissipating layer The sound attenuating coefficient of structure determines.

Based on any of the above embodiments, in one embodiment of the utility model, the system of the back structure It include epoxy resin as material, to realize the support to piezoelectric vibrator, the fixation to the conducting connecting part and guarantee phase On the basis of adjacent conducting connecting part insulation, the heat dissipation effect of back structure is improved.But the utility model is to this and without limitation, In the other embodiments of the utility model, the making material of the back structure can also be other insulating radiation materials, specifically It depends on the circumstances.

On the basis of the above embodiments, in one embodiment of the utility model, the production material of the back structure Material further include: alumina powder or aluminum nitride powder, to further increase the heat dissipation effect of the back structure.Wherein, the nitridation The heat dissipation performance of aluminium powder is higher than alumina powder, but the utility model is to this and without limitation, specifically depends on the circumstances.

Based on any of the above embodiments, in one embodiment of the utility model, the system of the back structure Make material further include: tungsten powder deviates from the piezoelectricity to the back structure to increase the sound attenuating coefficient of the back structure The voice signal of oscillator side is decayed, its interference to the detection signal of the ultrasonic transducer is reduced.

Based on any of the above embodiments, in one embodiment of the utility model, the conducting connecting part list Each conducting connecting part is fixedly connected by fixing piece in member, to keep the phase of each conducting connecting part in the conducting connecting part unit To position, wherein the fixing piece is made of insulating material, with each conducting connecting part in keeping the conducting connecting part unit Relative position on the basis of, avoid adjacent conductive connector sounding short-circuit.

It should be noted that in any of the above-described embodiment, in a second direction on, the conducting connecting part and described first Radiating, the distance between branch is the smaller the better, and the heat dissipation performance of the back structure is better, optionally, the conducting connecting part with Minimum range between the first adjacent heat dissipation branch of the conducting connecting part is not more than preset value, to improve the back structure Heat dissipation effect.

Optionally, the conducting connecting part is copper conductor, the conducting connecting part described in the utility model other embodiments It can be other plain conductors, specifically depend on the circumstances, the utility model is to this and without limitation.On the basis of above-described embodiment On, in one embodiment of the utility model, the conducting connecting part surface is coated with insulating protective layer, to reduce adjacent lead The probability of short circuit occurs for electrical connector.

It should be noted that the making material due to the heat dissipating layer is insulating materials, if the conducting connecting part table Face is provided with insulating protective layer, then in the present embodiment, the preset value can be zero, so that described in coolant directly contacts Conducting connecting part, improves the heat dissipation effect of the back structure to the greatest extent, if worrying that the conducting connecting part side is deposited In exposed region, coolant, which directly contacts the conducting connecting part, can occur short circuit, and the preset value can be set and be greater than zero, with Avoid the generation of short circuit phenomenon, but the utility model is to this and without limitation, specifically depends on the circumstances.

Correspondingly, the utility model additionally provides a kind of ultrasonic transducer, the ultrasonic transducer includes: any of the above-described reality Apply back structure provided by example；

The piezoelectric structure being fixedly connected with the first surface of the back structure, the piezoelectric structure include multiple piezoelectricity vibrations Son；

Deviate from the matching layer of the back structure side positioned at the piezoelectric structure；

The conducting connecting part and the piezoelectric vibrator correspond, and corresponding piezoelectric vibrator electrical connection.

It should be noted that the piezoelectric vibrator is to generate vibration under the aid of alternating current, machinery is converted electrical energy into The device of energy, is the core component of the ultrasonic transducer and the superiority and inferiority for directly affecting ultrasonic transducer performance；The matching layer Effect predominantly increase voice output, reduce acoustic attenuation, to reduce the leakage of ultrasonic transducer detection signal, improve super The performance of sonic transducer；The effect of the back structure is main are as follows: provides a supporting role for the piezoelectric structure, described in electrical connection Piezoelectric structure and external electrical cable, while radiating to the piezoelectric structure, and increase acoustic attenuation, reduce external sound signal Interference.

Specifically, based on any of the above embodiments, in one embodiment of the utility model, the backing knot Structure is fixedly connected by glue with piezoelectric structure；The piezoelectric structure is by glue in conjunction with matching layer.Optionally, described Glue is resin glue, but the utility model is to this and without limitation, specifically depends on the circumstances.

Ultrasonic transducer provided by the utility model embodiment, including any backing knot provided in above-described embodiment Structure, the thermal dissipating path of the back structure is made of the multiple through-holes being located in the heat dissipating layer preset plane, and described Heat dissipating layer is an integral molding structure, and after injecting coolant in the thermal dissipating path when heat dissipation, the coolant directly contacts institute Heat dissipation layer surface is stated, to improve the heat dissipation performance of heat dissipating layer, and then improves the heat dissipation performance of back structure.

Moreover, the back structure is using in heat dissipating layer in ultrasonic transducer provided by the utility model embodiment Through-hole directly forms thermal dissipating path,, will not also be in the back on the basis of improving heat dissipation effect without being additionally embedded to pipeline Impurity is introduced in lining structure, avoids the performance that ultrasonic transducer described in the impurity effects such as pipeline is embedded in the back structure The phenomenon that.

In addition, in the utility model embodiment, at least two first included heat dissipation branches in the thermal dissipating path At least one of the first heat dissipation branch between the two neighboring conducting connecting part unit so that it is described at least one the One heat dissipation branch can be located in conductive structure between adjacent conductive connecting piece unit, and form ultrasonic transduction with piezoelectric vibrator After device, positioned at the underface of the piezoelectric vibrator of ultrasonic transducer, to improve the back structure to the piezoelectric vibrator Heat dissipation effect further improves the heat dissipation performance of the ultrasonic transducer including back structure, can satisfy high-energy focus type The radiating requirements of ultrasonic transducer.

Correspondingly, the utility model additionally provide it is a kind of for making the production of the back structure in any of the above-described embodiment Method, as shown in figure 4, the production method includes:

S10: fixed pipeline mold and conductive structure, the fusing point of the pipeline mold are the first temperature.Wherein, the pipeline Mold includes the first pipeline along first direction Y, the second pipeline and connects the first pipeline and the second pipeline in preset plane Third pipeline；The conductive structure includes multiple conducting connecting parts insulated from each other, and the multiple conducting connecting part is in array Arrangement, is divided into the conducting connecting part unit of multiple X in a second direction arrangement, and the conducting connecting part unit includes multiple along the The conducting connecting part of three directions arrangement；The third pipeline includes at least two forming branch and at least along the first of third direction One the second composition branch in a second direction, the two neighboring first composition branch are connected by the second composition branch Logical, at least one first composition branch is located at the two neighboring conducting connecting part list in at least two first compositions branch Between member.

In one embodiment of the utility model, before fixed pipeline mold and conductive structure, the production method Further include that the pipeline mold and conductive structure are put into fixture, utilizes the fixed pipeline mold of the fixture and described Conductive structure.

Based on any of the above embodiments, in one embodiment of the utility model, as shown in figure 5, described lead Each conducting connecting part 211 is fixedly connected by fixing piece 212 in electrical connector unit 21, to keep the conducting connecting part unit The relative position of each conducting connecting part 211 in 21, wherein the fixing piece is made of insulating material, to keep the conduction even In fitting unit on the basis of the relative position of each conducting connecting part, avoid adjacent conductive connector that short circuit occurs.

Specifically, continuing in one embodiment of the utility model as shown in figure 5, fixed pipeline mold and conductive knot Structure includes:

The multiple conducting connecting parts 211 being fixedly connected in the conducting connecting part unit 21；

X places multiple conducting connecting part units 21 in a second direction；Optionally, the conducting connecting part unit 21 is Be arranged in order, the utility model to the arrangement modes of multiple conducting connecting part units and without limitation, as long as arbitrary neighborhood The distance between two conducting connecting part units it is identical, and the both ends alignment of all conducting connecting parts.It needs to illustrate It is the both ends alignment of all conducting connecting parts, specifically: one end of all conducting connecting parts is respectively positioned in same plane, another End is respectively positioned in another plane.Optionally, the conductive connecting elements are circuit board.

The pipeline mold is placed, at least two form along the first of third direction in the third pipeline 33 of the pipeline mould At least one first composition branch 331 is between the two neighboring conducting connecting part unit 21 in branch 331.Optionally, In one embodiment of the utility model, two neighboring first composition the distance between branch be equal to adjacent two described in lead The distance between electrical connector unit.But the utility model is to this and without limitation, specifically depends on the circumstances.

On the basis of the above embodiments, the third in one embodiment of the utility model, in the pipeline mold The shape of pipeline is snakelike, specifically, the third pipeline includes that multiple first composition branches and multiple second form branch, In, there is one second composition branch, specific connection type are as follows: first first group between two neighboring first composition branch It is connected at the head end of branch with the first pipeline, the head that tail end passes through one second composition branch and second first composition branch End is connected, and the tail end of the last one the first composition branch is connected with the second pipeline, and head end passes through one second composition branch It is connected with the tail end of its previous first composition branch, to be formed end to end snakelike.

Specifically, Fig. 6 shows the structure of pipeline mold 3 provided by the utility model one embodiment with reference to Fig. 6 Schematic diagram, specifically, including M first composition branch 331, M in the utility model embodiment, in the third pipeline 33 When for positive integer not less than 3, the head end and first pipeline of first first composition branch 331 of the third pipeline 33 31 one end is connected, and tail end is connected by the head end that one second composition branch 332 forms branch 331 with second first Logical, the tail end of the last one the first composition branch 331 is connected with one end of second pipeline 32, and head end passes through one second Composition branch 332 is connected with the tail end of M-1 first composition branch 331, and remaining first composition branch 331 meets: i-th The tail end that the head end of a first composition branch 331 passes through one second composition branch 332 and (i-1)-th first composition branch 331 It is connected, the tail end of i-th first composition branches passes through one second composition branch 332 and i+1 the first composition branch 331 Head end be connected, formed serpentine circuit, wherein i be greater than 1 and be less than M positive integer.

In another embodiment of the utility model, as shown in fig. 7, third pipeline 34 in the pipeline mold 3 Shape is rail shape, specifically, the third pipeline 34 includes multiple first composition branches 341 and two second composition branches 342, wherein one second composition branch 332 is connected with the first pipeline 31, another second composition branch 332 and the second pipe Road 32 is connected, and one end of the multiple first composition branch 341 is connected with the second composition branch 342, separately One end is connected with another the second composition branch 342.It should be noted that in the present embodiment, first pipeline 31 The link position of corresponding the second composition branch 342 can be located at any position of the second composition branch 342, together The link position of reason, corresponding the second composition branch 342 of second pipeline 32 can be located at the second composition branch Any position on road 342, optionally, in the present embodiment, corresponding the second composition branch of first pipeline 31 342 link position is located at the middle position of the second composition branch 342, similarly, the corresponding institute of second pipeline 32 State the second composition branch 342 link position be located at this second composition branch 342 middle position, the utility model to this not It limits, specifically depends on the circumstances.

It should be noted that include in the pipeline mold first forms branch in the utility model embodiment Quantity is more, and the quantity of the first heat dissipation branch included by the subsequent thermal dissipating path formed in heat dissipating layer is more, the heat dissipation The heat dissipation effect of layer is better.The utility model to this and without limitation, specifically depends on the circumstances.Optionally, in the utility model One embodiment in, the pipeline mold include at least three first composition branches, it is adjacent first composition branch between away from From identical, so that the quantity identical conducting connecting part unit in interval between the adjacent first composition branch.Specifically, The quantity for the conducting connecting part unit being spaced between the adjacent first composition branch can be 1,2,3 ... L etc., and L is big In 3 positive integer；But the utility model is to this and without limitation, specifically regards two adjacent conducting connecting part units (or first Form branch) between spacing, depending on the aperture size of the first heat dissipation branch and the actual demands such as flow of coolant.

On the basis of the above embodiments, in one embodiment of the utility model, the adjacent first composition branch Between be spaced a conducting connecting part unit, one the to be all arranged between any two adjacent conductive connecting piece unit One forms branch, so that having one between any two adjacent conductive connecting piece unit in the back structure being subsequently formed A first heat dissipation branch, to further increase the heat dissipation effect of the back structure.

Optionally, the multiple conducting connecting part is divided into N number of conducting connecting part unit, and the pipeline mold includes M First composition branch, wherein M=N+1 is wrapped up so that a conducting connecting part unit two sides form branch by described first, So that the pipeline mold coats the conductive structure completely, so that the thermal dissipating path being subsequently formed is in second direction On coat the conductive structure completely, improve the heat dissipation effect for the heat dissipating layer being subsequently formed, further increase the back structure Heat dissipation effect.

Specifically, the first composition branch projects on third direction Z in one embodiment of the utility model Length be greater than conducting connecting part unit along third direction Z length, and it is described first composition branch projected on third direction Z Both ends it is 5mm-10mm longer along the both ends of third direction Z than conducting connecting part unit, thus using the pipeline mold All conducting connecting part units are wrapped in pipeline mold by tripartite upwards, so that the thermal dissipating path being subsequently formed is in third The conducting connecting part unit is surrounded on direction, and then substantially increases the heat dissipation of the back structure made by the production method Property.

It should be noted that in any of the above-described embodiment, in a second direction on, the conducting connecting part and described first Form that the distance between branch is smaller so that between the first heat dissipation branch being subsequently formed and the conducting connecting part away from From smaller, the heat dissipation performance of the back structure is better, and optionally, the conducting connecting part is adjacent with the conducting connecting part The distance between first heat dissipation branch is not more than preset value, to improve the heat dissipation effect of the back structure.

Optionally, in one embodiment of the utility model, the conducting connecting part is copper conductor, in the utility model Conducting connecting part described in other embodiments can be other plain conductors, the utility model to this and without limitation, specific view Depending on situation.On the basis of the above embodiments, in one embodiment of the utility model, the conducting connecting part surface packet It is covered with insulating protective layer, to reduce the probability that short circuit occurs for adjacent conductive connector.

It should be noted that since the making material for the heat dissipating layer being subsequently formed is insulating materials, if the conduction is even Fitting surface is provided with insulating protective layer, then in the present embodiment, the preset value can be zero, so that coolant directly connects The conducting connecting part is touched, improves the heat dissipation effect of the back structure to the greatest extent, if worrying the conducting connecting part There are exposed regions for side, and coolant, which directly contacts the conducting connecting part, can occur short circuit, and it is big that the preset value can be set In zero, to avoid the sounding of short circuit phenomenon, but the utility model is to this and without limitation, specifically depends on the circumstances.

S20: being added packing material in the gap of the pipeline mold and conductive structure, and the packing material includes heat dissipation Material and curing materials.

In one embodiment of the utility model, filling material is added in the gap of the pipeline mold and conductive structure Material includes:

Heat sink material and curing materials are stirred evenly, the packing material is formed；

Packing material is added in the gap of the pipeline mold and conductive structure.

Based on any of the above embodiments, in one embodiment of the utility model, in the packing material Heat sink material includes epoxy resin, after using curing materials solidification, to realize the support to piezoelectric vibrator, connect to the conduction On the basis of the fixation and guarantee adjacent conductive connector insulation of fitting, the heat dissipation effect of back structure is improved.But this is practical It is novel to this and without limitation, in the other embodiments of the utility model, the packing material can also dissipate for other insulation Hot material specifically depends on the circumstances.

In another embodiment of the utility model, filling is added in the gap of the pipeline mold and conductive structure Material includes:

Heat sink material and curing materials are stirred evenly, the first mixture is formed；

Tungsten powder and/or aluminum nitride powder are added into first mixture, forms the packing material；

Packing material is added in the gap of the pipeline mold and conductive structure.

In one embodiment of the utility model, the specific manufacturing process of the packing material are as follows: first extracting epoxy resin It is stirred evenly with curing agent, forms the first mixture, tungsten powder and/or aluminum nitride powder is then added, then be stirred, described in formation Packing material, and the packing material is poured into the fixture for being fixed with pipeline mold and conductive structure；It should also be noted that, When the packing material is poured into the fixture for being fixed with pipeline mold and conductive structure, by the third pipeline of the pipeline mold It is completely covered, and exposes one end of the first pipeline, the second pipeline and the conducting connecting part.

Compared in a upper embodiment, in the utility model embodiment, the packing material further include: alumina powder or Aluminum nitride powder, to further increase the heat dissipation effect of the back structure.Wherein, the heat dissipation performance of the aluminum nitride powder is higher than oxygen Change aluminium powder, the utility model to this and without limitation, specifically depends on the circumstances.

In addition, if filling purchase material further includes tungsten powder, it is right to increase the sound attenuating coefficient of the back structure Voice signal of the back structure away from the piezoelectric vibrator side is decayed, its inspection to the ultrasonic transducer is reduced Survey the interference of signal.

S30: solidifying the packing material, forms heat dissipating layer, one end of the heat dissipating layer and the conductive structure Concordantly, the other end is lower than the conductive structure.

In one embodiment of the utility model, the mode including the use of standing is solidified to the packing material, The packing material is solidified, but the utility model is to this and without limitation, specifically depends on the circumstances.

Based on any of the above embodiments, in one embodiment of the utility model, to the packing material into It after row solidification, is formed before heat dissipating layer, the production method of the back structure further includes carrying out to the packing material after solidification Surrounding polishing, optionally, mode of polishing are grinding machine grinding, specifically, the packing material after solidifying is with opposite along first direction Y The first surface and second surface of setting, as shown in Figure 8, wherein expose the first pipeline 31, the second pipeline 32 and described lead The one side of one end of electrical connector 211 is the second surface B of packing material, is beaten by the second surface B to packing material Mill, so that the second surface B of packing material surrounds the surrounding smooth even of the conducting connecting part 211；As shown in Fig. 9, to filling out The first surface A for filling material polishes, so that 211 one end of the conducting connecting part is concordant with the first surface A of packing material, As the subsequent pad 22 being electrically connected with piezoelectric vibrator；The wherein first surface A of the first surface A of packing material and heat dissipating layer 1 Corresponding, the second surface B of packing material and the second surface B of heat dissipating layer 1 are corresponding.

It should be noted that the shape of heat dissipating layer can be square, the structures such as cuboid and cylinder, with specific reference to reality Depending on the demand of border, the utility model is to this and without limitation.

Specifically, the first surface and second surface of the heat dissipating layer are oppositely arranged along first direction Y, the conduction is even Fitting one end is concordant with the first surface to be used as pad, and for being electrically connected with piezoelectric vibrator, the other end is from the second surface Place is stretched out, and is electrically connected with cable, to realize being electrically connected for piezoelectric vibrator and cable.

S40: cleaning pipeline mold using the solvent of second temperature, the pipeline mold is removed, thus described The position of first pipeline forms first through hole, the second through-hole is formed in the position of second pipeline, in the third pipeline Position forms thermal dissipating path, completes the production of the back structure, wherein the second temperature is greater than first temperature.

In one embodiment of the utility model, pipeline mold is cleaned using the solvent of second temperature, is removed The pipeline mold includes: to carry out repeated flushing to pipeline mold using the water of second temperature, the pipeline mold is removed, in institute State formed inside heat dissipating layer the thermal dissipating path with the third pipeline shape such as pipeline mold and for connect thermal dissipating path and The first through hole of extraneous water-cooling system and the second through-hole expose first through hole for injecting cooling on the second surface of heat dissipating layer One end of agent and the second through-hole are used to flow out one end of coolant.Wherein, described conducting connecting part one end and the heat dissipating layer First surface it is concordant, as pad, for being electrically connected with piezoelectric vibrator, the conducting connecting part other end is from second table It stretches out at face, is directly electrically connected with cable, to realize being electrically connected for piezoelectric vibrator and cable.

It should be noted that the back structure of the utility model embodiment production is in normal work, by water pump in backing Coolant is injected in the thermal dissipating path of structure, the coolant directly contacts the surface of the heat dissipating layer, directly to the heat dissipation Layer cools down, and can significantly improve the heat dissipation performance of back structure.

Optionally, the pipeline mold is ceratuba, low-temperature wax specifically can be selected, in the present embodiment, the first temperature takes Being worth range is 40 DEG C -60 DEG C, including endpoint value, in order to the removal of the pipeline mold；But the utility model does not do this It limits, the pipeline mold can also be other materials in other embodiments, as long as can be removed by cleaning, specifically It depends on the circumstances.

It should be noted that the second temperature of the solvent for detergent line mold should not be too large, it is also unsuitable too small, if The second temperature is excessive, then can make back structure expanded by heating, influences the performance of back structure.If the second temperature It is too small, then back structure can be made by cold events, influence the performance of back structure, while when the second temperature is too small, managed Road mold can not melt completely, therefore, it is impossible to which pipeline mold clean is clean.

Specifically, in one embodiment of the utility model, when the solvent is water, the value of the second temperature Range is 60 DEG C~80 DEG C, including endpoint value, specifically, the value range of the second temperature is 65 DEG C~75 DEG C, including end Point value.It is for fusing point is 60 DEG C, then described when the temperature of the solvent reaches 60 DEG C using the pipeline mold as ceratuba Ceratuba starts to melt and soften, and when the temperature of the solvent reaches 65 DEG C, the bating effect of the ceratuba is more preferable, the flowing after softening Property is also more preferable.Therefore, the ceratuba for being 60 DEG C for fusing point uses second temperature best for 65 DEG C of solvent progress cleaning effect, Back structure will not also be had an impact simultaneously.

Based on any of the above embodiments, in one embodiment of the utility model, the pipe of the pipeline mold It is fixed with cord circuit in road, when cleaning to the pipeline mold, to drop the cord circuit, accelerates clean rate, improves clear Clean effect.It should be noted that the cord circuit is structure as a whole with the pipeline mold before to the pipeline mold clean.

It should be noted that it is main to remove the thermal dissipating path formed after the pipeline mold in any of the above-described embodiment Heat for generating to the piezoelectric vibrator radiates, therefore, between the thermal dissipating path and the piezoelectric vibrator away from From smaller, the back structure is better to the heat dissipation effect for the piezoelectric vibrator being connected electrically, the ultrasound including the back structure The heat dissipation effect of energy converter is better.It, can be logical in heat dissipation but if the hypotelorism of the thermal dissipating path and the piezoelectric vibrator Echo interference piezoelectric vibrator is generated at road, reduces the performance of the ultrasonic transducer.

Therefore, on the basis of the above embodiments, in one embodiment of the utility model, the preset plane and institute It states the distance between first surface D and meets following relationship:

D is not less than (100/A), wherein A indicates the sound attenuating coefficient of the heat dissipating layer, unit db/mm, to reduce Interference of the echo generated at the thermal dissipating path to piezoelectric vibrator.

Optionally, on the basis of the above embodiments, in one embodiment of the utility model, the preset plane with The distance between first surface D meets following relationship: D is equal to (100/A), to reduce generation at the thermal dissipating path On the basis of echo is to the interference of piezoelectric vibrator, the thermal dissipating path is improved as far as possible, the heat dissipation of the piezoelectric vibrator is imitated Fruit.

Specifically, in one embodiment of the utility model, the sound attenuating system of the back structure in the utility model Number is 20db/mm, then, the distance between the preset plane and the first surface D are not less than 5mm, optionally, described When the distance between preset plane and the first surface D are 5mm, the thermal dissipating path is not the case where generating echo interference Under, it is nearest apart from piezoelectric vibrator, that is to say, that thermal dissipating path is best to the synthesis heat dissipation effect of piezoelectric vibrator at this location. But the utility model is to this and without limitation, and the thermal dissipating path specifically regards the backing in the specific setting position of heat dissipating layer The sound attenuating coefficient of structure determines.

In the production method of back structure provided by the utility model embodiment, applied is that pipeline mold is making During back structure can by cleaning be removed, therefore the production method formed heat dissipating layer in thermal dissipating path be by Multiple through-holes in the heat dissipating layer preset plane are constituted, and are an integral molding structure with the heat dissipating layer, in institute when heat dissipation It states after injecting coolant in thermal dissipating path, the coolant directly contacts the heat dissipation layer surface, to improve dissipating for heat dissipating layer Hot property, and then improve the heat dissipation performance of back structure.

Moreover, utilizing the through-hole in heat dissipating layer in the production method of back structure provided by the utility model embodiment Directly forming thermal dissipating path, will not also be in the backing knot on the basis of improving heat dissipation effect without being additionally embedded to pipeline Impurity is introduced in structure, avoids the ultrasonic transduction for being embedded to that the impurity effects such as pipeline include the back structure in the back structure The phenomenon that performance of device.

In addition, in the production method of back structure provided by the utility model embodiment, due in the pipeline mold Including at least two along the one or two of third direction Z composition branch and at least one X in a second direction the second composition branch, At least one first composition branch is located at the two neighboring conducting connecting part unit in at least two first compositions branch Between, therefore in the thermal dissipating path formed after removing the pipeline mold, the thermal dissipating path include at least two first At least one of branch the first heat dissipation branch radiate between the two neighboring conducting connecting part unit so that it is described extremely Few one first heat dissipation branch can be located in conductive structure between adjacent conductive connecting piece unit, super with piezoelectric vibrator composition After sonic transducer, positioned at the underface of the piezoelectric vibrator of ultrasonic transducer, to improve the back structure to the piezoelectricity The heat dissipation effect of oscillator further improves the heat dissipation performance of the ultrasonic transducer including back structure, can enough meet high energy Measure the radiating requirements of focus type ultrasonic transducer.

To sum up, back structure provided by the embodiment of the utility model, the production method of back structure and ultrasonic transducer, Good heat dispersion performance, and thermal dissipating path is directly formed using the through-hole in heat dissipating layer, without being additionally embedded to pipeline, dissipated improving On the basis of thermal effect, also impurity will not be introduced in the back structure, avoid and be embedded to pipeline in the back structure The phenomenon that equal impurity effects include the performance of ultrasonic transducer of the back structure.

Various pieces are described in a progressive manner in this specification, and what each some importance illustrated is and other parts Difference, same and similar part may refer to each other between various pieces.

The foregoing description of the disclosed embodiments can be realized professional and technical personnel in the field or using originally practical new Type.Various modifications to these embodiments will be readily apparent to those skilled in the art, and determine herein The General Principle of justice can be realized in other embodiments without departing from the spirit or scope of the present utility model.Cause This, the utility model is not intended to be limited to embodiment illustrated herein, and is to fit to and principles disclosed herein and new The consistent widest scope of clever feature.

Claims (6)

1. a kind of back structure is applied to ultrasonic transducer characterized by comprising

Heat dissipating layer has in the heat dissipating layer along the first through hole of first direction, the second through-hole and multiple third through-holes, and described the Three through-holes run through the heat dissipating layer along the first direction；There is thermal dissipating path, wherein institute in the preset plane of the heat dissipating layer The one end for stating first through hole is connected with one end of the thermal dissipating path, and the other end is for flowing into coolant, second through-hole One end be connected with the other end of the thermal dissipating path, the other end is for flowing out coolant；

Conductive structure, the conductive structure include multiple conducting connecting parts insulated from each other, the conducting connecting part and described the Three through-holes correspond, and are located in the third through-hole, and the multiple conducting connecting part is arranged in array, and are divided into multiple along the The conducting connecting part unit of two directions arrangement, the conducting connecting part unit include multiple conductive connections along third direction arrangement Part；

Wherein, the thermal dissipating path is formed by the multiple through-holes being located in the heat dissipating layer preset plane, including at least two edges Third direction first heat dissipation branch and at least one in a second direction second heat dissipation branch, adjacent two described first dissipate Hot branch by it is described second heat dissipation branch be connected, at least two it is described first heat dissipation branches at least one described first dissipate Hot branch is between the two neighboring conducting connecting part unit.

2. back structure according to claim 1, which is characterized in that the thermal dissipating path includes at least three described first Radiate branch, and the quantity for the conducting connecting part unit being spaced between the adjacent first heat dissipation branch is identical.

3. back structure according to claim 2, which is characterized in that be separated with one between the adjacent first heat dissipation branch A conducting connecting part unit.

4. back structure according to claim 3, which is characterized in that the multiple conducting connecting part is divided into N number of conduction Connecting piece unit, the thermal dissipating path include M first heat dissipation branch, wherein M=N+1.

5. back structure according to claim 1, which is characterized in that the heat dissipating layer has to be oppositely arranged along first direction First surface and second surface, described conducting connecting part one end is concordant with the first surface, and the other end is from second table It is stretched out at face；

The distance between the preset plane and the first surface D meet following relationship:

D is not less than (100/A), wherein A indicates the sound attenuating coefficient of the heat dissipating layer, unit db/mm.

6. a kind of ultrasonic transducer characterized by comprising

The described in any item back structures of claim 1-5；

The piezoelectric structure being fixedly connected with the first surface of the back structure, the piezoelectric structure include multiple piezoelectric vibrators；

Deviate from the matching layer of the back structure side positioned at the piezoelectric structure；

The conducting connecting part and the piezoelectric vibrator correspond, and corresponding piezoelectric vibrator electrical connection.