CN209344038U - Semiconductor chip Special storage device - Google Patents

Semiconductor chip Special storage device Download PDF

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Publication number
CN209344038U
CN209344038U CN201822102550.0U CN201822102550U CN209344038U CN 209344038 U CN209344038 U CN 209344038U CN 201822102550 U CN201822102550 U CN 201822102550U CN 209344038 U CN209344038 U CN 209344038U
Authority
CN
China
Prior art keywords
sealing plate
semiconductor chip
chip
placing groove
rotation axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201822102550.0U
Other languages
Chinese (zh)
Inventor
蔡天佑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhangzhou Longwen Jiecheng Electronic Products Manufacturing Co Ltd
Original Assignee
Zhangzhou Longwen Jiecheng Electronic Products Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhangzhou Longwen Jiecheng Electronic Products Manufacturing Co Ltd filed Critical Zhangzhou Longwen Jiecheng Electronic Products Manufacturing Co Ltd
Priority to CN201822102550.0U priority Critical patent/CN209344038U/en
Application granted granted Critical
Publication of CN209344038U publication Critical patent/CN209344038U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses semiconductor chip Special storage devices, including holder, placing groove, desiccant, rotation axis, sealing plate, clump weight, place card slot, the semiconductor chip Special storage device, it is easy to operate, it is powerful, pass through free-standing chip storage design first, it can be realized the use of taking of one chip of single, avoid traditional storing unit, the chip of all storages can be all exposed after opening every time, to easily cause chip to contact extraneous dust etc., the problem of finally being affected to chip storage, secondly by the fiting effect of built-in drier, also it can effectively reduce moist inside placing groove, improve the storage effect of semiconductor chip, eventually by above-mentioned, to improve the shelf life of semiconductor chip, conducive to the popularization and application of industry.

Description

Semiconductor chip Special storage device
Technical field
The utility model relates to storing unit technical field more particularly to semiconductor chip Special storage devices.
Background technique
Semiconductor chip carries out etch on semiconductor sheet material, wiring, the manufactured semiconductor device for being able to achieve certain function Part.More than silicon chip, common further includes the semiconductor materials such as GaAs, germanium.
According to above-mentioned, the common storing unit of semiconductor chip at present, common configuration is simple, has a single function, although can Reach the storage to semiconductor chip, but also suffers from certain drawbacks;1, because using unified storage, when staff need using When single semiconductor chip, the chip of all storages can be all exposed after opening every time, to easily cause the extraneous ash of chip contact Dirt etc. is finally affected to chip storage, and 2, chip is easy then to be influenced chip by moisture effect during storage Service life is unfavorable for storing for a long time, and in view of disadvantages described above, it is really necessary to design semiconductor chip Special storage device.
Utility model content
Technical problem to be solved by the utility model is to provide semiconductor chip Special storage devices, to solve to carry on the back The problem of scape technology proposes.
In order to solve the above technical problems, the technical solution of the utility model is: semiconductor chip Special storage device, including Holder, desiccant, rotation axis, sealing plate, clump weight, places card slot at placing groove, and the placement slot number is several, institute The placing groove stated is uniformly distributed in inside holder, and the placing groove is rectangular recess, and the desiccant is located at placing groove Inner bottom, the desiccant are connected with holder using adhesive, and the rotation axis is described at the top of placing groove Rotation axis is rotatedly connected with placing groove, and the sealing plate is located at rotation axis bottom, and the sealing plate is integrally connected with rotation axis, institute The clump weight stated is located at sealing plate inside left, and the clump weight is connected with sealing plate using adhesive, the placement slot In sealing plate bottom, the placement card slot is integrally connected with sealing plate.
Further, it is additionally provided with handle at left and right sides of the placement outer box wall, the handle is integrally connected with holder.
Further, it is additionally provided with capping at the top of the holder, the capping rear end is rotatedly connected with holder, and institute The capping front end stated is connected with holder using buckle.
Further, foam-rubber cushion is additionally provided with inside the capping, the foam-rubber cushion is connected with capping using adhesive.
Further, limit plate, the limit plate and rotation axis and sealing plate one phase are additionally provided on the left of the rotation axis Even.
Compared with prior art, the semiconductor chip Special storage device, when needing to store semiconductor chip, work people Member need to only press on the right side of sealing plate, i.e., by the effect of pressing force, to realize that sealing plate is rotated by the center of circle of rotation axis, that is, seal On the left of plate upwards, right side is downward, at this time by aforesaid operations, then realizes that the exposing of card slot is placed in sealing plate bottom, proceeds with one's work Semiconductor chip is inserted into and places inside card slot by personnel, the pressing to sealing plate, and spinning reduction sealing plate is then unclamped, because of sealing plate The weight of inside left clump weight acts on, and can realize the spinning reduction of sealing plate well, at this time by aforesaid operations, then Reach the storage to semiconductor chip, because placing groove inner bottom can that is, by the water sorption of desiccant equipped with desiccant Humidity inside placing groove is effectively reduced, the storage effect of semiconductor chip is improved, when staff needs using single half It when conductor chip, need to only press on the right side of sealing plate, that is, realize the Unscrew of sealing plate, then the semiconductor inside card slot is placed in extraction Chip can be realized the opening of one semiconductor chip of single at this time by aforesaid operations, avoid tradition storage dress It sets, can all expose the chip of all storages after opening every time, so that chip easily be caused to contact extraneous dust etc., finally give chip The problem of storage affects, the semiconductor chip Special storage device is easy to operate, powerful, passes through stand alone type first Chip storage design, can be realized the use of taking of one chip of single, avoids traditional storing unit, all can after opening every time The chip of all storages of exposure is finally asked to what chip storage affected so that chip easily be caused to contact extraneous dust etc. Topic can also effectively reduce humidity inside placing groove, improve semiconductor secondly by the fiting effect of built-in drier The storage effect of chip to improve the shelf life of semiconductor chip, is answered conducive to the popularization of industry eventually by above-mentioned With, meanwhile, capping can Unscrew and closure, realize safely carrying for the device, foam-rubber cushion can press a number of Sealing plate, improves the fixed effect of sealing plate, and handle carries out rotary stopper effect to sealing plate convenient for staff's grasping, limit plate.
Detailed description of the invention
Fig. 1 is the perspective view of semiconductor chip Special storage device;
Fig. 2 is the top view of semiconductor chip Special storage device;
Fig. 3 is sealing plate position enlarged drawing;
Fig. 4 is door open structure state enlarged drawing;
Fig. 5 is sealing plate position cutaway view Amplified image.
Holder 1, desiccant 3, rotation axis 4, sealing plate 5, clump weight 6, places card slot 7, handle 101, capping at placing groove 2 102, foam-rubber cushion 103, limit plate 401.
The following detailed description will be further explained with reference to the above drawings.
Specific embodiment
Hereinafter, a variety of specific details are elaborated, in order to provide to the saturating of the concept for constituting described embodiment basis Thorough understanding, however, it will be apparent to those skilled in the art that described embodiment can be in these no specific details In the practice of getting off of some or all situations do not specifically describe well-known processing step in other cases.
As shown in figure 1, figure 2, figure 3, figure 4 and figure 5, semiconductor chip Special storage device, including holder 1, placing groove 2, Desiccant 3, sealing plate 5, clump weight 6, places card slot 7 at rotation axis 4, and 2 quantity of placing groove is several, the placement Slot 2 is uniformly distributed in inside holder 1, and the placing groove 2 is rectangular recess, and the desiccant 3 is located inside placing groove 2 Bottom end, the desiccant 3 are connected with holder 1 using adhesive, and the rotation axis 4 is described through 2 top of placing groove Rotation axis 4 is rotatedly connected with placing groove 2, and the sealing plate 5 is located at 4 bottom of rotation axis, 4 one of the sealing plate 5 and rotation axis It is connected, the clump weight 6 is located at 5 inside left of sealing plate, and the clump weight 6 is connected with sealing plate 5 using adhesive, described It places card slot 7 and is located at 5 bottom of sealing plate, the placement card slot 7 is integrally connected with sealing plate 5, described 1 outer wall of holder or so two Side is additionally provided with handle 101, and the handle 1 is integrally connected with holder 1, is additionally provided with capping 102 at the top of the holder 1, 102 rear end of capping is rotatedly connected with holder 1, and 102 front end of capping is connected with holder 1 using buckle, Foam-rubber cushion 103 is additionally provided with inside the capping 102, the foam-rubber cushion 103 is connected with capping 102 using adhesive, described Rotation axis 4 on the left of be additionally provided with limit plate 401, the limit plate 401 is integrally connected with rotation axis 4 and sealing plate 5.
The semiconductor chip Special storage device, when needing to store semiconductor chip, staff need to only press sealing plate 5 Right side, i.e., by the effect of pressing force, to realize that sealing plate 5 is rotated with rotation axis 4 for the center of circle, i.e. 5 left side of sealing plate is upward, Right side is downward, at this time by aforesaid operations, then realizes that the exposing of card slot 7 is placed in 5 bottom of sealing plate, the personnel of proceeding with one's work will partly lead Body chip, which is inserted into, to be placed inside card slot 7, and the pressing to sealing plate 5, and spinning reduction sealing plate 5 are then unclamped, because 5 inside of sealing plate is left The weight of side clump weight 6 acts on, and can realize the spinning reduction of sealing plate 5 well, at this time by aforesaid operations, then reaches Storage to semiconductor chip passes through the water sorption of desiccant 3 because 2 inner bottom of placing groove is equipped with desiccant 3, can It is moist to effectively reduce 2 inside of placing groove, improves the storage effect of semiconductor chip, when staff needs using single half When conductor chip, 5 right side of sealing plate need to be only pressed, that is, realizes the Unscrew of sealing plate 5, then half inside card slot 7 is placed in extraction Conductor chip can be realized the opening of one semiconductor chip of single, avoid traditional storage at this time by aforesaid operations Device can all expose the chip of all storages after opening every time, so that chip easily be caused to contact extraneous dust etc., finally give core Piece storage the problem of affecting, meanwhile, capping 102 can Unscrew and closure, realize safely carrying for the device, sponge Pad 103 can press a number of sealing plate 5, improve the fixed effect of sealing plate 5, handle 101 is convenient for staff's grasping, limit Position plate 401 carries out rotary stopper effect to sealing plate 5.
The utility model is not limited to above-mentioned specific embodiment, and those skilled in the art visualize from above-mentioned Hair, without creative labor, the various transformation made are all fallen within the protection scope of the utility model.

Claims (5)

1. semiconductor chip Special storage device, it is characterised in that including holder, placing groove, desiccant, rotation axis, sealing plate, Clump weight places card slot, and the placement slot number is several, and the placing groove is uniformly distributed in inside holder, institute The placing groove stated is rectangular recess, and the desiccant is located at placing groove inner bottom, and the desiccant and holder use Adhesive is connected, and the rotation axis is at the top of placing groove, and the rotation axis is rotatedly connected with placing groove, the sealing plate Positioned at rotation axis bottom, the sealing plate is integrally connected with rotation axis, and the clump weight is located at sealing plate inside left, described Clump weight is connected with sealing plate using adhesive, and the placement card slot is located at sealing plate bottom, the placement card slot and sealing plate one Body is connected.
2. semiconductor chip Special storage device as described in claim 1, it is characterised in that described placement outer box wall or so Two sides are additionally provided with handle, and the handle is integrally connected with holder.
3. semiconductor chip Special storage device as claimed in claim 2, it is characterised in that also set at the top of the holder There is capping, the capping rear end is rotatedly connected with holder, and the capping front end is connected with holder using buckle.
4. semiconductor chip Special storage device as claimed in claim 3, it is characterised in that be additionally provided with inside the capping Foam-rubber cushion, the foam-rubber cushion are connected with capping using adhesive.
5. semiconductor chip Special storage device as claimed in claim 4, it is characterised in that also set on the left of the rotation axis There is limit plate, the limit plate is integrally connected with rotation axis and sealing plate.
CN201822102550.0U 2018-12-14 2018-12-14 Semiconductor chip Special storage device Expired - Fee Related CN209344038U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201822102550.0U CN209344038U (en) 2018-12-14 2018-12-14 Semiconductor chip Special storage device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201822102550.0U CN209344038U (en) 2018-12-14 2018-12-14 Semiconductor chip Special storage device

Publications (1)

Publication Number Publication Date
CN209344038U true CN209344038U (en) 2019-09-03

Family

ID=67757168

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201822102550.0U Expired - Fee Related CN209344038U (en) 2018-12-14 2018-12-14 Semiconductor chip Special storage device

Country Status (1)

Country Link
CN (1) CN209344038U (en)

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20190903

Termination date: 20211214