CN209328874U - Crystal round etching carrier device - Google Patents
Crystal round etching carrier device Download PDFInfo
- Publication number
- CN209328874U CN209328874U CN201822061616.6U CN201822061616U CN209328874U CN 209328874 U CN209328874 U CN 209328874U CN 201822061616 U CN201822061616 U CN 201822061616U CN 209328874 U CN209328874 U CN 209328874U
- Authority
- CN
- China
- Prior art keywords
- fixed plate
- stickers
- crystal round
- carrier device
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses crystal round etching carrier devices, including fixed plate and stickers；Fixed plate is equipped with through-hole, and through-hole diameter is greater than or equal to brilliant diameter of a circle to be etched；Stickers include base and adhesive phase；Described adhesive layer includes the adhesive that Tu is located at base's one side；Stickers are used for bonding wafer to be etched in the through hole of the fixed plate.The utility model proposes crystal round etching carrier device, wafer to be etched is directly fixed on to the through hole of fixed plate by stickers, the fixed process of existing double-sided adhesive is eliminated, reduces artificial and Material Cost, while the caducous situation of wafer can be improved by hot press operation；Existing sheet glass is replaced by fixed plate, having corrosion resistance makes it without long-term replacement, reduces cost, operating personnel is also not easy to be scratched, and uses safer stabilization.
Description
Technical field
The utility model relates to chip etching technical fields, more particularly to a kind of crystal round etching carrier device.
Background technique
Wafer before the etch, needs that transfer is fixed to the wafer cut by carrier, to guarantee fabrication,
Existing way is usually when packaging belt (have glue) being used to be pasted on wafer, to recycle double-sided adhesive by packaging belt another side
(one side of no glue) is pasted on the glass sheet, then sheet glass is placed in etching basket, and etching basket is placed in etching solution and is carried out
Etch operation.And there are following number of drawbacks for existing this way: 1, can be needed by acid corrosion when sheet glass is etched operation
Regularly replace sheet glass；2, packaging belt need to be pasted on glass sheet surface by means of double faced adhesive tape, and operation is relatively complicated；Every subjob
After need cleaning sheet glass, consume a large amount of costs of labor；3, operating personnel holds sheet glass and be easy when operation by glass
Piece scratches；4, common double-sided adhesive not acid and alkali-resistance and high temperature etches volatile vanishing viscosity when operation.
Utility model content
The utility model aims to solve at least one of the technical problems existing in the prior art.For this purpose, the utility model mentions
Crystal round etching carrier device, including fixed plate and stickers are gone out；
The fixed plate is equipped with through-hole, and through-hole diameter is greater than or equal to brilliant diameter of a circle to be etched；
The stickers include base and adhesive phase；Described adhesive layer includes the adhesive that Tu is located at base's one side；
The stickers are used for bonding wafer to be etched in the through hole of the fixed plate.
Further, the fixed plate is made of PVDF material.
Further, at least one plate face of the fixed plate is burnishing surface.
Further, the base is made of high temperature resistant, antiacid and alkali resistant material.
It further, further include etching basket；The etching basket two sides are equipped with multiple for blocking the vertical card slot for setting fixed plate.
Further, the fixed plate with a thickness of 2~3mm.
Further, the stickers are adhesive tape or packaging belt.
The utility model proposes crystal round etching carrier device, wafer to be etched is directly fixed on fixation by stickers
The through hole of plate eliminates the fixed process of existing double-sided adhesive, reduces artificial and Material Cost, while can pass through hot press operation
Improve the caducous situation of wafer；The fixed plate made of PVDF material replaces existing sheet glass, and having corrosion resistance makes
It reduces cost, operating personnel is also not easy to be scratched, and uses safer stabilization without long-term replacement.
Detailed description of the invention
Fig. 1 is the schematic perspective view of the utility model crystal round etching carrier device；
Fig. 2 is the structural schematic diagram of fixed plate in Fig. 1；
Wherein, 1, fixed plate；2, stickers；3, through-hole；4, wafer；5, basket is etched.
Specific embodiment
The embodiments of the present invention are described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and is only used for explaining the utility model, and should not be understood as to the utility model
Limitation.
In the description of the present invention, it should be understood that term " center ", "upper", "lower", "front", "rear",
The orientation or positional relationship of the instructions such as "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside" is based on attached drawing institute
The orientation or positional relationship shown, is merely for convenience of describing the present invention and simplifying the description, rather than indication or suggestion is signified
Device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as to this is practical
Novel limitation.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " is pacified
Dress ", " connected ", " setting " shall be understood in a broad sense, for example, it may be being fixedly linked, being arranged, may be a detachable connection, set
It sets, or is integrally connected, is arranged.For the ordinary skill in the art, it can understand that above-mentioned term exists with concrete condition
Concrete meaning in the utility model.
As shown in Figure 1, 2, crystal round etching carrier device, including fixed plate 1 and stickers 2；
Fixed plate 1 is equipped with through-hole 3, and 3 diameter of through-hole is greater than or equal to the diameter of wafer 4 to be etched；
Stickers 2 include base and adhesive phase；Adhesive phase includes the adhesive that Tu is located at base's one side；Stickers 2
For wafer 4 to be etched to be pasted at the through-hole 3 of fixed plate 1；
It further include etching basket 5；Etching 5 two sides of basket are equipped with multiple for blocking the vertical card slot for setting fixed plate 1.
Fixed plate 1 is made of PVDF material, wherein fixed plate 1 with a thickness of 2~3mm, preferably 2mm.Fixed plate 1
At least one plate face is processed by shot blasting, forms it into burnishing surface.Pass through the glutinous of fixed plate 1 after polishing treatment and stickers 2
Face it is bigger, avoid stickers 2 in etching process from falling off.
The base of stickers 2 is made of high temperature resistant, antiacid and alkali resistant material, and certainly, adhesive should also be as having one
Fixed high temperature resistant, antiacid and alkali resistance guarantee that stickers 2 have effective adherence force in etching process.Stickers 2 can be
Adhesive tape or packaging belt, stickers 2 are preferably packaging belt in the present embodiment.Certainly, the base of stickers 2 is also not limited to plane
Shape, base can be middle part and be equipped with rounded projections, and the diameter of lug boss is more than or equal to the diameter of wafer 4, and be less than etc.
In the diameter of through-hole 3, so that wafer 4 is stuck inside the through-hole for being fixed on fixed plate or another plate face.
In addition, it is necessary to explanation, the through-hole 3 in fixed plate 1 can have it is multiple, to can realize that a fixed plate 1 can
Fixed more wafers 4, reduce the stickup number of stickers 2, improve working efficiency.
When specifically used, wafer 4 to be etched is pasted on packaging belt first, that is, is pasted onto adhesive phase, then will be brilliant
Circle 4 is placed at the through-hole 3 of fixed plate 1 (actually wafer 4 is in through-hole 3), is finally pasted onto the remainder of packaging belt
In fixed plate 1, the application work of wafer 4 to be etched is completed.Wafer 4 i.e. to be etched only takes up the partial region of packaging belt, envelope
The remaining area of dress band is pasted onto fixed plate 1, and guarantees that wafer 4 to be etched is in the through-hole 3 of fixed plate 1.
To be pasted in the card slot of the insertion etching basket 5 of fixed plate 1 of wafer 4 to be etched, due to card slot have it is multiple, can will be more
A fixed plate 1 is inserted into respectively in different card slots, and finally etching basket 5 is placed in etching solution again and is etched operation.Complete erosion
After carving operation, the wafer 4 that etching is completed can be removed by tearing packaging belt.
While there has been shown and described that the embodiments of the present invention, it will be understood by those skilled in the art that:
These embodiments can be carried out with a variety of variations, modification, replacement in the case where not departing from the principles of the present invention and objective
And modification, the scope of the utility model are defined by the claims and their equivalents.
Claims (7)
1. a kind of crystal round etching carrier device, which is characterized in that including fixed plate and stickers；
The fixed plate is equipped with through-hole, and through-hole diameter is greater than or equal to brilliant diameter of a circle to be etched；
The stickers include base and adhesive phase；Described adhesive layer includes the adhesive that Tu is located at base's one side；It is described
Stickers are used for bonding wafer to be etched in the through hole of the fixed plate.
2. crystal round etching carrier device according to claim 1, which is characterized in that the fixed plate is PVDF material system
At.
3. crystal round etching carrier device according to claim 1, which is characterized in that at least one plate face of the fixed plate
For burnishing surface.
4. crystal round etching carrier device according to claim 1, which is characterized in that the base be high temperature resistant, it is antiacid and
The material of alkali resistant is made.
5. crystal round etching carrier device according to any one of claims 1 to 4, which is characterized in that further include etching basket；Institute
Etching basket two sides are stated equipped with multiple for blocking the vertical card slot for setting fixed plate.
6. crystal round etching carrier device according to claim 1, which is characterized in that the fixed plate with a thickness of 2~
3mm。
7. crystal round etching carrier device according to claim 1, which is characterized in that the stickers are adhesive tape or encapsulation
Band.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822061616.6U CN209328874U (en) | 2018-12-10 | 2018-12-10 | Crystal round etching carrier device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822061616.6U CN209328874U (en) | 2018-12-10 | 2018-12-10 | Crystal round etching carrier device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209328874U true CN209328874U (en) | 2019-08-30 |
Family
ID=67725948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822061616.6U Expired - Fee Related CN209328874U (en) | 2018-12-10 | 2018-12-10 | Crystal round etching carrier device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209328874U (en) |
-
2018
- 2018-12-10 CN CN201822061616.6U patent/CN209328874U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190830 Termination date: 20211210 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |