CN209248959U - Slow die set and electronic equipment - Google Patents
Slow die set and electronic equipment Download PDFInfo
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- CN209248959U CN209248959U CN201920071362.8U CN201920071362U CN209248959U CN 209248959 U CN209248959 U CN 209248959U CN 201920071362 U CN201920071362 U CN 201920071362U CN 209248959 U CN209248959 U CN 209248959U
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- buffer layer
- insulating course
- die set
- casting
- electronic device
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Abstract
The disclosure is directed to slow die set and electronic equipments.The slow die set is arranged between screen mould group and casting of electronic device, insulating course including buffer layer and setting on the buffer layer, buffer layer and insulating course are made of elastic material, buffer layer is bonded with screen mould group, insulating course is bonded with casting of electronic device, and insulating course includes at least one partition band.The technical solution can make impact force by least one partition band in insulating course, and more uniformly dispersion applies the biggish part of area with partition band connection on the buffer layer, and then impact force more soft can be absorbed by buffer layer, to avoid the display screen in display screen mould group from breakage occur due to by excessive impact force, ensure that electronic equipment is not in failure, improves user experience.
Description
Technical field
This disclosure relates to field of terminal technology more particularly to slow die set and electronic equipment.
Background technique
In the related technology, in order to guarantee the stability of display screen module in electronic equipment, usually display screen module is fixed
On casting of electronic device.Meanwhile in order to avoid there is breakage because being hit in the display screen in display screen module, Ke Yi
The slow die set being made of elastic material is set between casting of electronic device and display screen module, to avoid casting of electronic device
It is directly contacted with the display screen in display screen module.
Utility model content
To overcome the problems in correlation technique, embodiment of the disclosure provides a kind of slow die set and electronic equipment.
Technical solution is as follows:
It is according to an embodiment of the present disclosure in a first aspect, provide a kind of slow die set, delay die set and be arranged in screen mould group
Between casting of electronic device, including buffer layer and setting insulating course on the buffer layer, buffer layer and insulating course are by bullet
Property material constitute, buffer layer is bonded with screen mould group, and insulating course is bonded with casting of electronic device, insulating course including at least one every
Disconnected band.
In the technical scheme provided by this disclosed embodiment, delay die set setting screen mould group and casting of electronic device it
Between, the insulating course including buffer layer and setting on the buffer layer, buffer layer and insulating course are made of elastic material, wherein delaying
It rushes layer to be bonded with screen mould group, insulating course is bonded with casting of electronic device, and insulating course includes at least one partition band, when electronics is set
For when falling or shaking, casting of electronic device applies impact force to the insulating course being bonded with it first, makes the impact force not
It can be applied directly on buffer layer at certain point, but make impact force by least one partition band in insulating course, more
Even dispersion applies the part with partition band connection on the buffer layer, due on buffer layer with the area of partition band connection compared with
Greatly, the impact force after dispersion more soft can be absorbed by buffer layer, to avoid the display screen in display screen module because meeting with
There is breakage by excessive impact force, it is ensured that electronic equipment is not in failure, improves user experience.
In one embodiment, delay thickness of the die set when not being placed between screen mould group and casting of electronic device to be greater than
The distance between screen mould group and casting of electronic device.
In one embodiment, the ratio on the area and buffer layer of insulating course between the area in the region of not set insulating course
Example meets preset area ratio condition.
In one embodiment, insulating course includes at least two isolation strip being parallel to each other.
In one embodiment, insulating course includes at least two isolation strip for being mutually perpendicular to intersection.
In one embodiment, elastic material includes foam, rubber and silica gel.
In one embodiment, insulating course is Nian Jie with buffer layer by viscose glue.
In one embodiment, insulating course is integrally formed with buffer layer.
Second aspect according to an embodiment of the present disclosure, provides a kind of electronic equipment, and electronic equipment includes the reality of the disclosure
Apply the slow die set of any one of first aspect of example.
It should be understood that above general description and following detailed description be only it is exemplary and explanatory, not
The disclosure can be limited.
Detailed description of the invention
The drawings herein are incorporated into the specification and forms part of this specification, and shows the implementation for meeting the disclosure
Example, and together with specification for explaining the principles of this disclosure.
Fig. 1 a is the side sectional view of slow die set shown according to an exemplary embodiment；
Fig. 1 b is the top view of slow die set shown according to an exemplary embodiment；
Fig. 1 c is the top view of slow die set shown according to an exemplary embodiment；
Fig. 1 d is the top view of slow die set shown according to an exemplary embodiment；
Fig. 2 is the structural schematic diagram of electronic equipment shown according to an exemplary embodiment.
Specific embodiment
Example embodiments are described in detail here, and the example is illustrated in the accompanying drawings.Following description is related to
When attached drawing, unless otherwise indicated, the same numbers in different drawings indicate the same or similar elements.Following exemplary embodiment
Described in embodiment do not represent all implementations consistent with this disclosure.On the contrary, they be only with it is such as appended
The example of the consistent device and method of some aspects be described in detail in claims, the disclosure.
With the high speed development and continuous improvement of people's living standards of science and technology, electronic equipment is for example intelligent in recent years
Communication terminal, tablet computer etc. are more common in people's lives.Display screen module is generally comprised in electronic equipment,
In, in order to guarantee the stability of display screen module in electronic equipment, usually display screen module is fixed on casting of electronic device.
Meanwhile in order to make the display screen in display screen module not occur breakage, Ke Yi due to the shock by casting of electronic device
The slow die set being made of elastic material is set between casting of electronic device and display screen module, to avoid casting of electronic device
It is directly contacted with the display screen in display screen module.
Although above scheme can make the display screen in display screen module will not be due to the shock by casting of electronic device
Occur it is damaged big, but in a practical situation, due to display screen module surface and casting of electronic device surface exist it is certain
It rises and falls, the gap between display screen module surface and casting of electronic device is in the state of uneven distribution, and slow die set can not be equal
Gap between even filling display screen module and electronic equipment, when electronic equipment falls or shakes, and electronic equipment
Be applied to certain point in slow die set impact force it is excessive when, impact force possibly can not be dissipated by buffering mould splits, so as to cause aobvious
There is breakage due to by excessive impact force in display screen in display screen mould group, so as to cause electronic equipment failure, damage
User experience.
To solve the above-mentioned problems, in the technical scheme provided by this disclosed embodiment, delay die set and be arranged in screen mould
Between group and casting of electronic device, including buffer layer and setting insulating course on the buffer layer, buffer layer and insulating course by
Elastic material is constituted, and wherein buffer layer is bonded with screen mould group, and insulating course is bonded with casting of electronic device, and insulating course includes at least
One partition band, when electronic equipment falls or shakes, casting of electronic device applies to the insulating course being bonded with it first
Impact force be applied directly to the impact force will not on buffer layer at certain point, but pass through impact force in insulating course extremely
A few partition band, more uniform dispersion apply the part with partition band connection on the buffer layer, due on buffer layer and every
The area of disconnected band connection is larger, and the impact force after dispersion more soft can be absorbed by buffer layer, to avoid display screen
There is breakage due to by excessive impact force in display screen in mould group, it is ensured that electronic equipment is not in failure, improves use
Family experience.
Embodiment of the disclosure provides a kind of slow die set, and as shown in Fig. 1 a and Fig. 1 b, the slow setting of die set 100 is being shielded
Between curtain mould group 101 and casting of electronic device 102, including buffer layer 103 and the insulating course being arranged on buffer layer 103 104,
Buffer layer 103 is made of with insulating course 104 elastic material, and buffer layer 103 is bonded with screen mould group 101, insulating course 104 and electricity
Sub- apparatus casing 102 is bonded, and insulating course 104 includes at least one partition band 1041.
Illustratively, buffer layer and insulating course are made of elastic material, it can be understood as elastic material includes bubble face, rubber
Glue and silica gel etc. can pass through the material of generation deformation disperses impact forces when being impacted.Insulating course and buffer layer can be with
It is integrally formed, insulating course may be to be separately formed, and insulating course is connect with buffer layer, such as make insulating course with buffer layer
It is Nian Jie with buffer layer by viscose glue.
It should be noted that a plurality of isolation strip can be parallel to each other when insulating course includes a plurality of isolation strip, it can also phase
Mutually intersect at a certain angle.For example, can as illustrated in figure 1 c, insulating course 104 includes at least two isolation strip being parallel to each other
1041；Can also be as shown in Figure 1 d, insulating course 104 includes at least two and is mutually perpendicular to the isolation strip 1042 intersected.
It should be noted that the ability to bear in order to ensure the impact force after insulating course disperses without departing from buffer layer,
The ratio on the area and buffer layer of insulating course between the area in the region of not set insulating course can be made to meet preset area ratio
Example condition, such as the ratio on the area and buffer layer of insulating course between the area in the region of not set insulating course is made to be greater than or wait
In preset area proportion threshold value.
In the technical scheme provided by this disclosed embodiment, delay die set setting screen mould group and casting of electronic device it
Between, the insulating course including buffer layer and setting on the buffer layer, buffer layer and insulating course are made of elastic material, wherein delaying
It rushes layer to be bonded with screen mould group, insulating course is bonded with casting of electronic device, and insulating course includes at least one partition band, when electronics is set
For when falling or shaking, casting of electronic device applies impact force to the insulating course being bonded with it first, makes the impact force not
It can be applied directly on buffer layer at certain point, but make impact force by least one partition band in insulating course, more
Even dispersion applies the part with partition band connection on the buffer layer, due on buffer layer with the area of partition band connection compared with
Greatly, the impact force after dispersion more soft can be absorbed by buffer layer, thus avoid display screen in display screen mould group because by
Excessive impact force and there is breakage, it is ensured that electronic equipment is not in failure, improves user experience.
In one embodiment, delay thickness of the die set when not being placed between screen mould group and casting of electronic device to be greater than
The distance between screen mould group and casting of electronic device.
Illustratively, it is made of due to delaying buffer layer in die set and insulating course elastic material, mould will be buffered
When between group merging screen mould group and casting of electronic device, buffer layer and insulating course in slow die set can generate deformation, make to delay
The thickness of die set is less than or equal to the distance between screen mould group and casting of electronic device, while making slow die set to screen mould
Group and casting of electronic device apply certain pressure, it is ensured that were between slow die set and screen mould group and casting of electronic device
Be full of cooperation, screen mould group can be divided at least two exclusion regions by the partition band in insulating course, fall when electronic equipment or
When shaking, whole vibration will not occur for the screen in screen mould group, but vibration is limited in each lesser exclusion region
In domain, from the amplitude reduction for shaking screen, avoid screen mould group from occurring damaged, simultaneously because in slow die set with electronic equipment
The part of shell contact is partition band, and compared with slow die set entirety contacting electronic equipments shell, partition band is set with electronics
Frictional force between standby shell is lower, to reduce to slow die set, screen mould group and the casting of electronic device in electronic equipment
Difficulty when being assembled, therefore above scheme reduces electronics under the premise of avoiding improving electronic equipment assembly difficulty as far as possible
There is damaged probability in screen when equipment is fallen or shaken, so as to improve user experience.
Second aspect according to an embodiment of the present disclosure, provides a kind of electronic equipment, as shown in Fig. 2, electronic equipment 200 wraps
Include the corresponding slow die set of any one of Fig. 1 a to Fig. 1 d.
In the technical scheme provided by this disclosed embodiment, electronic equipment include screen mould group, casting of electronic device and
Slow die set, wherein slow die set is arranged between screen mould group and casting of electronic device, including buffer layer and setting are slow
The insulating course on layer is rushed, buffer layer and insulating course are made of elastic material, and wherein buffer layer is bonded with screen mould group, insulating course
It is bonded with casting of electronic device, insulating course includes at least one partition band, and when electronic equipment falls or shakes, electronics is set
Standby shell applies impact force to the insulating course being bonded with it first, and the impact force is made not to be applied directly to certain point on buffer layer
Place, but more uniformly dispersion applies on the buffer layer by least one partition band in insulating course, and then after making dispersion
Impact force more soft can be absorbed by buffer layer, to avoid the display screen in display screen mould group because by excessive impact
Power and there is breakage, it is ensured that electronic equipment is not in failure, improves user experience.
Those skilled in the art will readily occur to its of the disclosure after considering specification and practicing disclosure disclosed herein
Its embodiment.This application is intended to cover any variations, uses, or adaptations of the disclosure, these modifications, purposes or
Person's adaptive change follows the general principles of this disclosure and including the undocumented common knowledge in the art of the disclosure
Or conventional techniques.The description and examples are only to be considered as illustrative, and the true scope and spirit of the disclosure are by following
Claim is pointed out.
It should be understood that the present disclosure is not limited to the precise structures that have been described above and shown in the drawings, and
And various modifications and changes may be made without departing from the scope thereof.The scope of the present disclosure is only limited by the accompanying claims.
Claims (9)
1. a kind of slow die set, which is characterized in that the slow die set is arranged between screen mould group and casting of electronic device, packet
The insulating course for including buffer layer and being arranged on the buffer layer, the buffer layer and the insulating course are by elastic material structure
At the buffer layer is bonded with the screen mould group, and the insulating course is bonded with the casting of electronic device, the insulating course packet
Include at least one partition band.
2. slow die set according to claim 1, which is characterized in that the slow die set be not placed in the screen mould group
Thickness when between the casting of electronic device is greater than the distance between the screen mould group and the casting of electronic device.
3. slow die set according to claim 1, which is characterized in that on the area of the insulating course and the buffer layer not
The ratio being arranged between the area in the region of the insulating course meets preset area ratio condition.
4. slow die set according to any one of claim 1-3, which is characterized in that the insulating course includes at least two
The isolation strip being parallel to each other.
5. slow die set according to any one of claim 1-3, which is characterized in that the insulating course includes at least two
It is mutually perpendicular to the isolation strip intersected.
6. slow die set according to any one of claim 1-3, which is characterized in that the elastic material include foam,
Rubber and silica gel.
7. slow die set according to any one of claim 1-3, which is characterized in that the insulating course passes through viscose glue and institute
State buffer layer bonding.
8. slow die set according to any one of claim 1-3, which is characterized in that the insulating course and the buffer layer
It is integrally formed.
9. a kind of electronic equipment, which is characterized in that the electronic equipment includes buffering mould of any of claims 1-8
Group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920071362.8U CN209248959U (en) | 2019-01-16 | 2019-01-16 | Slow die set and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920071362.8U CN209248959U (en) | 2019-01-16 | 2019-01-16 | Slow die set and electronic equipment |
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| Publication Number | Publication Date |
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| CN209248959U true CN209248959U (en) | 2019-08-13 |
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| CN201920071362.8U Active CN209248959U (en) | 2019-01-16 | 2019-01-16 | Slow die set and electronic equipment |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112820201A (en) * | 2021-02-23 | 2021-05-18 | 维沃移动通信有限公司 | Display screen, rear cover and electronic equipment |
| CN113138625A (en) * | 2020-01-17 | 2021-07-20 | 北京小米移动软件有限公司 | Laminating device and assembling method of display module |
-
2019
- 2019-01-16 CN CN201920071362.8U patent/CN209248959U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113138625A (en) * | 2020-01-17 | 2021-07-20 | 北京小米移动软件有限公司 | Laminating device and assembling method of display module |
| CN112820201A (en) * | 2021-02-23 | 2021-05-18 | 维沃移动通信有限公司 | Display screen, rear cover and electronic equipment |
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