CN209232822U - A kind of display panel and display device - Google Patents
A kind of display panel and display device Download PDFInfo
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- CN209232822U CN209232822U CN201920155157.XU CN201920155157U CN209232822U CN 209232822 U CN209232822 U CN 209232822U CN 201920155157 U CN201920155157 U CN 201920155157U CN 209232822 U CN209232822 U CN 209232822U
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Abstract
The utility model discloses a kind of display panel and display devices.Display panel includes substrate, a plurality of light-emitting elements and thin-film packing structure, the side of substrate is provided with a plurality of light-emitting elements and encapsulates the thin-film packing structure of a plurality of light-emitting elements, thin-film packing structure includes the first metal layer and the first inorganic layer, the first metal layer is set between light-emitting component and the first inorganic layer, it is reacted by the first metal layer and water oxygen, it can achieve the effect for preferably absorbing steam and oxygen, the steam and oxygen in display panel can be removed simultaneously, the ability for making thin-film packing structure that there is effective barrier steam and oxygen, improve the service life of display panel.
Description
Technical field
The utility model embodiment is related to thin film encapsulation technology field more particularly to a kind of display panel and display device.
Background technique
Organic Light Emitting Diode (Organic Light Emitting Diode, OLED) display device due to it is thin,
Gently, the advantages that wide viewing angle, low cost, have become a kind of important display device in display field.
The ingredients such as steam and oxygen in air are very big to the aging effects of the light-emitting component in OLED display panel, therefore
Encapsulating structure can be formed in the side that underlay substrate forms light-emitting component when forming OLED display panel with covering luminous element,
Enter display panel for obstructing the ingredients such as steam and oxygen, avoids damage of the ingredients such as steam and oxygen to light-emitting component.It is existing
Have in technology, encapsulating structure is usually thin-film package (Thin-Film Encapsulation, TFE), and the TFE being widely used
Structure is inorganic layer+organic layer+inorganic layer structure, or the integrated mode of other inorganic layer+organic layers, wherein inorganic layer
For obstructing steam and oxygen, organic layer is used to alleviate the stress of inorganic layer release.This TFE structure combines single, Er Qiewu
The scarce capacity of the machine layer barrier ingredient such as steam and oxygen.
Utility model content
The utility model provides a kind of display panel and display device, to improve thin-film packing structure barrier steam and oxygen
The ability of equal ingredients, to improve the service life of display panel.
In a first aspect, the utility model embodiment provides a kind of display panel, which includes substrate, Duo Gefa
Optical element and thin-film packing structure；
The side of the substrate is provided with a plurality of light-emitting elements and encapsulates the multiple light-emitting component thin-film packing structure；
The thin-film packing structure includes the first metal layer and the first inorganic layer, and the first metal layer is set to the hair
Between optical element and first inorganic layer.
Optionally, the thin-film packing structure further includes at least one layer of organic layer；
At least one layer organic layer is arranged between the light-emitting component and first inorganic layer.
Optionally, the thin-film packing structure further includes the second inorganic layer and the first organic layer；Second inorganic layer, institute
It states the first metal layer and first inorganic layer is set in turn in side of the light-emitting component far from the substrate；
First organic layer is between second inorganic layer and the first metal layer or first organic layer
Between first inorganic layer and the first metal layer or first organic layer be located at the light-emitting component with it is described
Between second inorganic layer.
Optionally, the thin-film packing structure further includes third inorganic layer and second metal layer；
The second metal layer is located at the side of first inorganic layer far from the first metal layer, and the third is inorganic
Layer is located at side of the second metal layer far from first inorganic layer.
Optionally, the thin-film packing structure further includes the second organic layer；
Second organic layer is between first inorganic layer and the second metal layer or second organic layer
Between the third inorganic layer and the second metal layer.
Optionally, the material of the first metal layer is aluminium, gold, silver, copper, any one in zinc.
Optionally, the thickness of the first metal layer is less than or equal to 20nm.
Optionally, the first metal layer is continuously distributed.
Second aspect, the utility model embodiment additionally provide a kind of display device, including the utility model is arbitrarily implemented
The display panel that example provides.
The technical solution of the utility model, display panel include substrate, a plurality of light-emitting elements and thin-film packing structure, substrate
Side be provided with a plurality of light-emitting elements and encapsulation a plurality of light-emitting elements thin-film packing structure, thin-film packing structure include the first gold medal
Belong to layer and the first inorganic layer, the first metal layer are set between the light-emitting component and first inorganic layer, passes through the first gold medal
Belong to layer to react with water oxygen, can achieve the effect for preferably absorbing steam and oxygen, while can remove in display panel
Steam and oxygen, the ability for making thin-film packing structure have effective barrier steam and oxygen improves the service life of display panel.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of display panel provided by the embodiment of the utility model；
Fig. 2 is the structural schematic diagram of another display panel provided by the embodiment of the utility model；
Fig. 3 is the structural schematic diagram of another display panel provided by the embodiment of the utility model；
Fig. 4 is the structural schematic diagram of another display panel provided by the embodiment of the utility model；
Fig. 5 is the structural schematic diagram of another display panel provided by the embodiment of the utility model；
Fig. 6 is the structural schematic diagram of another display panel provided by the embodiment of the utility model；
Fig. 7 is the structural schematic diagram of another display panel provided by the embodiment of the utility model；
Fig. 8 is the structural schematic diagram of another display panel provided by the embodiment of the utility model；
Fig. 9 is the structural schematic diagram of another display panel provided by the embodiment of the utility model；
Figure 10 is the structural schematic diagram of another display panel provided by the embodiment of the utility model；
Figure 11 is the structural schematic diagram of another display panel provided by the embodiment of the utility model；
Figure 12 is a kind of structural schematic diagram of display device provided by the embodiment of the utility model.
Specific embodiment
The utility model is described in further detail with reference to the accompanying drawings and examples.It is understood that herein
Described specific embodiment is used only for explaining the utility model, rather than the restriction to the utility model.It further needs exist for
It is bright, part relevant to the utility model is illustrated only for ease of description, in attached drawing rather than entire infrastructure.
The utility model provides a kind of display panel, which includes substrate, a plurality of light-emitting elements and film envelope
Assembling structure.The side of substrate is provided with a plurality of light-emitting elements and encapsulates the thin-film packing structure of a plurality of light-emitting elements.Thin-film package
Structure includes the first metal layer and the first inorganic layer, and the first metal layer is set between light-emitting component and the first inorganic layer.
The first metal layer is set between light-emitting component and the first inorganic layer, thin-film packing structure can be made effectively to obstruct
Oxygen and steam enter light-emitting component, and specifically, the first inorganic layer can obstruct extraneous steam and oxygen and enter the member that shines
Part, and the first metal layer is with water oxygen by reacting, therefore the steam and oxygen diffused in thin-film packing structure can be absorbed
Gas can further avoid light-emitting component from being influenced by extraneous steam and oxygen, while can remove the water in display panel
Vapour and oxygen further increase the ability of thin-film packing structure barrier steam and oxygen, so as to preferably protect display surface
A plurality of light-emitting elements further improve the service life of display panel from the influence of steam and oxygen in plate.
Illustratively, Fig. 1 is a kind of structural schematic diagram of display panel provided by the embodiment of the utility model, such as Fig. 1 institute
Show, which includes substrate 11, a plurality of light-emitting elements 12 and thin-film packing structure 13.The side of substrate 11 is provided with multiple
The thin-film packing structure 13 of light-emitting component 12 and encapsulation a plurality of light-emitting elements 12.Thin-film packing structure 13 includes the first metal layer
131 and first inorganic layer 132, the first metal layer 131 be set between light-emitting component 12 and the first inorganic layer 132.
Specifically, when the inorganic layer of thin-film packing structure 13 only includes the first inorganic layer 132, the first inorganic layer 132 can
Enter light-emitting component to obstruct extraneous steam and oxygen, and the first metal layer 131 is with water oxygen by reacting, therefore can be with
The steam and oxygen diffused in thin-film packing structure 13 is absorbed, can further avoid light-emitting component 12 by extraneous steam
It is influenced with oxygen, while steam and oxygen in display panel can be removed, further increased thin-film packing structure 13 and obstruct water
The ability of vapour and oxygen, so as to preferably protect in display panel a plurality of light-emitting elements 12 from the shadow of steam and oxygen
It rings, further improves the service life of display panel.Such as the material of the first metal layer 131 can be aluminium, gold, silver, copper, zinc etc.
Active metal can preferably react with steam and oxygen, therefore can remove steam and oxygen in display panel, together
When can be further improved thin-film packing structure 13 obstruct steam and oxygen ability, so as to preferably protect display panel
Middle a plurality of light-emitting elements 12 improve the service life of display panel from the influence of steam and oxygen.
Alternatively, thin-film packing structure can further include the second inorganic layer, the second inorganic layer is the first metal layer far from first
The side of inorganic layer.Specifically, Fig. 2 is the structural schematic diagram of another display panel provided by the embodiment of the utility model, such as
Shown in Fig. 2, the thin-film packing structure 13 of display panel may include that the first metal layer 131, the first inorganic layer 132 and second are inorganic
Layer 133.The first metal layer 131 is set between the first inorganic layer 132 and the second inorganic layer 133, and the first inorganic layer 132 is set to
Side of the first metal layer 131 far from substrate 11, the second inorganic layer 133 are set between the first metal layer 131 and substrate 11.Its
In, thin-film packing structure 13 can be improved simultaneously for obstructing steam and oxygen in the first inorganic layer 132 and the second inorganic layer 133
Obstruct the ability of steam and oxygen.In addition, the first metal layer 131 can react with water oxygen, therefore it can be absorbed and diffuse to
Steam and oxygen in thin-film packing structure 13 can further avoid light-emitting component 12 by extraneous steam and oxygen shadow
It rings, while steam and oxygen in display panel can be removed, further increase thin-film packing structure 13 and obstruct steam and oxygen
Ability, so as to preferably protect a plurality of light-emitting elements 12 in display panel from the influence of steam and oxygen, further
The service life for improving display panel.In addition, the first metal layer 131 can alleviate the first inorganic layer 132 and the second inorganic layer 133
The stress of release, therefore the service life of thin-film packing structure 13 can be improved.
Fig. 3 is the structural schematic diagram of another display panel provided by the embodiment of the utility model, as shown in figure 3, display
Each light-emitting component 12 in panel is by anode 121, cathode 123 and the one or more organic layer structures being disposed there between
At.More specifically, at least one luminescent layer 122 is set between cathode 123 and anode 121.Luminescent layer 122 may include one
Kind or a variety of luminous organic compounds.It further include that light-emitting component 12 is driven to shine between substrate 11 and a plurality of light-emitting elements 12
Pixel circuit, pixel circuit may include multiple thin film transistor (TFT) arrays and storage capacitance, and thin film transistor (TFT) array can be located at slow
It rushes on layer 101, buffer layer 101 is located on substrate 11, and buffer layer 101 covers the entire upper surface of substrate 11.Buffer layer 101 includes
Inorganic layer or organic layer.Buffer layer 101 stops oxygen and moisture, prevents moisture or impurity from spreading by substrate 11, and in base
Flat surface is provided on the upper surface of plate 11.By taking the thin film transistor (TFT) of top gate type as an example, thin film transistor (TFT) includes being located at buffering
Semiconductor active layer 17 on layer 101, semiconductor active layer 17 include the first semiconductor region 171 and the second semiconductor region 172, this
First semiconductor region 171 of sign polysilicon is arranged on the central part of semiconductor layer 17, is doped with the second of the polysilicon of impurity
Semiconductor region 172 is arranged on the two sides of the first semiconductor region 171.First semiconductor region 171 is used as the channel of thin film transistor (TFT),
Second semiconductor region 172 is used as source region and the drain region of thin film transistor (TFT).The inorganic insulation of the nitride of such as silica and silicon
The gate insulating layer 102 of material is formed on semiconductor layer 17, and scan line (not shown) and grid 175 are formed in gate insulating layer
On 102, grid 175 is connected to scan line.The intermediate insulating layer of the inorganic insulating material of the nitride of such as silica and silicon
103 are formed in grid 175 and scan line, and intermediate insulating layer 103 and gate insulating layer 102 have leak out semiconductor layer 17 the
The semiconductor interface contact hole of two semiconductor regions 172.Source electrode 173, drain electrode 174 and data line are formed on intermediate insulating layer 103.Source electrode
173 are separated from each other with drain electrode 174, are on identical layer with data line, pixel electrode (anode 121 of light-emitting component 12) connection
To drain electrode 174.Source electrode 173 and drain electrode 174 are connected to the second semiconductor region 172, semiconductor layer 17, grid by semiconductor interface contact hole
Pole insulating layer 102, grid 175, intermediate insulating layer 103, source electrode 173 and drain electrode 174 constitute thin film transistor (TFT).In pixel electrode
It, can be by being arranged on planarization layer 104 when (anode 121 of light-emitting component 12) is connected to the drain electrode 174 of thin film transistor (TFT)
Hole is attached.A plurality of light-emitting elements 12 on substrate 11 use thin film encapsulation technology, i.e. light-emitting component 12 is sealed using film
Assembling structure 13 is packaged, and is entered light-emitting component 12 by 13 blocking oxygen of thin-film packing structure and steam, is realized to luminous member
Part 12 is protected, and the service life of display panel is improved.
In display panel, array arrangement is presented in pixel circuit, is corresponded with a plurality of light-emitting elements 12.Multiple luminous members
Part 12 carries out during shining, and multi-strip scanning line exports scanning signal to corresponding pixel circuit one by one, and switching transistor will
First pole of storage capacitance in voltage data signal writing pixel circuit on the corresponding data line of pixel circuit, in pixel circuit
Storage capacitance keep the grid voltage of driving transistor, the driving transistor output driving current driving in pixel circuit is multiple
Light-emitting component 12 shines.Wherein, the corresponding data line of pixel circuit for thin film transistor (TFT) in the pixel circuit 174 companies of drain electrode
The data line connect；The scanning that the corresponding scan line of pixel circuit is connected for the drain electrode 175 of thin film transistor (TFT) in the pixel circuit
Line.For example, every a line pixel circuit is electrically connected with a horizontal scanning line, each column pixel circuit is electrically connected with a column data line.
During preparing thin-film packing structure 13, the first metal layer 131 is continuously distributed, i.e., the first metal layer 131 covers
Entire inorganic layer is covered, to preferably realize the ability that thin-film packing structure 13 obstructs steam and oxygen.The first metal layer 131 can
To select the techniques such as vacuum evaporation or magnetron sputtering to prepare.The thickness of the first metal layer 131 is less than or equal to 20nm, can both make the
One metal layer 131 has good continuity and planarization, in turn ensures the good translucency of the first metal layer 131, leads simultaneously
It electrically reduces, avoids the display for influencing display panel.It, can be to the first metal after the completion of preparing the technique of the first metal layer 131
Layer 131 is made annealing treatment, to improve the optical transmittance of the first metal layer 131.Under normal circumstances, the range of annealing temperature
It is 40-100 DEG C.First inorganic layer 132 and the second inorganic layer 133 can select chemical vapour deposition (Chemical Vapor
Deposition, CVD) inorganic material such as process deposits SiON, SiN or SiO formation inorganic layer.
It should be noted that in the other technologies scheme of the utility model, the first metal layer 131 can be it is continuously distributed,
Guarantee that the thickness of the first metal layer is less than or equal to 20nm simultaneously, hereafter repeats no more.
The technical solution of the present embodiment, display panel include substrate, a plurality of light-emitting elements and thin-film packing structure, substrate
Side is provided with a plurality of light-emitting elements and encapsulation a plurality of light-emitting elements thin-film packing structure, and thin-film packing structure includes the first metal
Layer and the first inorganic layer, the first metal layer are set between light-emitting component and the first inorganic layer, pass through the first metal layer and water oxygen
It reacts, can achieve the effect for preferably absorbing steam and oxygen, while steam and oxygen in display panel can be removed
Gas, the ability for making thin-film packing structure have effective barrier steam and oxygen, improves the service life of display panel.
In the utility model embodiment, thin-film packing structure 13 may also include at least one layer of organic layer.At least one layer has
Machine layer is set between light-emitting component and the first inorganic layer.
Illustratively, Fig. 4 is the structural schematic diagram of another display panel provided by the embodiment of the utility model, such as Fig. 4
It is shown, in a kind of embodiment of the utility model embodiment, thin-film packing structure 13 may include the first metal layer 131,
First inorganic layer 132, the second inorganic layer 133 and the first organic layer 134.First organic layer 134 is set to 133 He of the second inorganic layer
Between the first metal layer 131.Fig. 5 is the structural schematic diagram of another display panel provided by the embodiment of the utility model, such as Fig. 5
Shown, the first organic layer 134 is set between the first inorganic layer 132 and the first metal layer 131.
First organic layer 134 can be formed by way of inkjet printing.By adding in thin-film packing structure 13
One organic layer 134 can alleviate the stress of the first inorganic layer 132 and the release of the second inorganic layer 133, further so as to improve
The service life of thin-film packing structure 13, and then improve the service life of display panel.
The utility model also provides another display panel, and Fig. 6 is provided by the embodiment of the utility model another aobvious
Show the structural schematic diagram of panel, as shown in fig. 6, first inorganic layer 132 is set when display panel only includes the first inorganic layer 132
It is placed in side of the first metal layer 131 far from substrate 11, the first organic layer 134 can be set in the first metal layer 131 and substrate
Between 11.By the first organic layer 134 of setting, the ability of the barrier steam and oxygen of thin-film packing structure 13 can be improved, from
And improve the service life of display panel.Alternatively, Fig. 7 is the structural representation of another display panel provided by the embodiment of the utility model
Figure, as shown in fig. 7, the first organic layer 134 can be set between the first metal layer 131 and the first inorganic layer 132.Pass through setting
First organic layer 134 can alleviate the stress that the first inorganic layer 132 and the first metal layer 131 discharge, to improve display panel
Service life.
Fig. 8 is the structural schematic diagram of another display panel provided by the embodiment of the utility model, as shown in figure 8, film
Encapsulating structure 13 can also include third inorganic layer 135 and second metal layer 136.Second metal layer 136 is located at the first inorganic layer
132 sides far from the first metal layer 131, third inorganic layer 135 are located at second metal layer 136 far from the first inorganic layer 132
Side.
Specifically, thin-film packing structure 13 adds third inorganic layer 135 and second metal layer 136, and second metal layer 136 is same
Sample can react with water oxygen, absorb steam and oxygen in alleviating, therefore can further improve thin-film packing structure
The ability of 13 barrier steam and oxygen, improves the service life of display panel.
It should be noted that Fig. 8 is only a kind of example of display panel structure, rather than limit.In fig. 8, first has
Machine layer 134 is set between the second inorganic layer 133 and the first metal layer 131.Fig. 9 is provided by the embodiment of the utility model another
The structural schematic diagram of kind display panel, as shown in figure 9, the difference with Fig. 8 is that the first organic layer 134 is set to the first inorganic layer
Between 132 and the first metal layer 131.Or thin-film packing structure 13 does not include the first organic layer 134, no longer example herein.
In addition, translucency and low electric conductivity in order to guarantee second metal layer 136, the thickness of second metal layer 136 are likewise provided as
Less than or equal to 20nm.
Figure 10 is the structural schematic diagram of another display panel provided by the embodiment of the utility model, as shown in figure 9, film
Encapsulating structure 13 further includes the second organic layer 137.
Specifically, the second organic layer 137 that thin-film packing structure 13 is added is located at the first inorganic layer 132 and second metal layer
Between 136, the stress of the first inorganic layer 132 release can be alleviated, further so as to improve making for thin-film packing structure 13
With the service life, and then improve the service life of display panel.
In addition, Figure 10 is only a kind of example of display panel structure, the first organic layer 134 is set to the second inorganic layer 133
Between the first metal layer 131.When the first organic layer 134 is set between the first inorganic layer 132 and the first metal layer 131,
It equally may include the second organic layer 137.Alternatively, also may include when thin-film packing structure 13 does not include the first organic layer 134
Second organic layer 137.No longer example herein.
Figure 11 is the structural schematic diagram of another display panel provided by the embodiment of the utility model, as shown in figure 11, the
Two organic layers 137 are between third inorganic layer 135 and second metal layer 136.The second organic layer 137 can be further at this time
Alleviate the stress that third inorganic layer 135 discharges, so as to improve the service life of thin-film packing structure 13, and then improves display
The service life of panel.
Equally, Figure 11 is only a kind of example of display panel structure, and the first organic layer 134 is set to the second inorganic layer 133
Between the first metal layer 131.When the first organic layer 134 is set between the first inorganic layer 132 and the first metal layer 131,
It equally may include the second organic layer 137.Alternatively, also may include when thin-film packing structure 13 does not include the first organic layer 134
Second organic layer 137.No longer example herein.
The utility model embodiment additionally provides a kind of display device, and Figure 12 is one kind provided by the embodiment of the utility model
The structural schematic diagram of display device, as shown in figure 12, the display device 810 include that any technical solution of the utility model provides
Display panel 811.
Note that above are only the preferred embodiment and institute's application technology principle of the utility model.Those skilled in the art's meeting
Understand, the utility model is not limited to specific embodiment described here, is able to carry out for a person skilled in the art various bright
Aobvious variation, readjustment and substitution is without departing from the protection scope of the utility model.Therefore, although passing through above embodiments
The utility model is described in further detail, but the utility model is not limited only to above embodiments, is not departing from
It can also include more other equivalent embodiments in the case that the utility model is conceived, and the scope of the utility model is by appended
Scope of the claims determine.
Claims (9)
1. a kind of display panel, which is characterized in that including substrate, a plurality of light-emitting elements and thin-film packing structure；
The side of the substrate is provided with a plurality of light-emitting elements and encapsulates the thin-film packing structure of the multiple light-emitting component；
The thin-film packing structure includes the first metal layer and the first inorganic layer, and the first metal layer is set to the luminous member
Between part and first inorganic layer.
2. display panel according to claim 1, which is characterized in that the thin-film packing structure further includes that at least one layer has
Machine layer；
At least one layer organic layer is set between the light-emitting component and first inorganic layer.
3. display panel according to claim 1, which is characterized in that the thin-film packing structure further includes the second inorganic layer
With the first organic layer；
Second inorganic layer, the first metal layer and first inorganic layer are set in turn in the light-emitting component far from institute
State the side of substrate；
First organic layer is between second inorganic layer and the first metal layer or first organic layer is located at
Between first inorganic layer and the first metal layer or first organic layer is located at the light-emitting component and described second
Between inorganic layer.
4. display panel according to claim 3, which is characterized in that the thin-film packing structure further includes third inorganic layer
And second metal layer；
The second metal layer is located at the side of first inorganic layer far from the first metal layer, third inorganic layer position
In side of the second metal layer far from first inorganic layer.
5. display panel according to claim 4, which is characterized in that the thin-film packing structure further includes second organic
Layer；
Second organic layer is between first inorganic layer and the second metal layer or second organic layer is located at
Between the third inorganic layer and the second metal layer.
6. display panel according to claim 1, which is characterized in that the material of the first metal layer be aluminium, gold, silver,
Any one in copper, zinc.
7. display panel according to claim 1-6, which is characterized in that the thickness of the first metal layer is less than
Equal to 20nm.
8. display panel according to claim 1-6, which is characterized in that the first metal layer is continuously distributed.
9. a kind of display device, which is characterized in that including any display panel of claim 1-8.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920155157.XU CN209232822U (en) | 2019-01-29 | 2019-01-29 | A kind of display panel and display device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201920155157.XU CN209232822U (en) | 2019-01-29 | 2019-01-29 | A kind of display panel and display device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110620189A (en) * | 2019-09-26 | 2019-12-27 | 昆山工研院新型平板显示技术中心有限公司 | Display panel and display device |
| CN112103384A (en) * | 2020-09-23 | 2020-12-18 | 福建华佳彩有限公司 | Mini LED screen structure and packaging method thereof |
| CN112599696A (en) * | 2020-12-11 | 2021-04-02 | 深圳市华星光电半导体显示技术有限公司 | Display panel's packaging structure and display device |
-
2019
- 2019-01-29 CN CN201920155157.XU patent/CN209232822U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110620189A (en) * | 2019-09-26 | 2019-12-27 | 昆山工研院新型平板显示技术中心有限公司 | Display panel and display device |
| CN112103384A (en) * | 2020-09-23 | 2020-12-18 | 福建华佳彩有限公司 | Mini LED screen structure and packaging method thereof |
| CN112599696A (en) * | 2020-12-11 | 2021-04-02 | 深圳市华星光电半导体显示技术有限公司 | Display panel's packaging structure and display device |
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