CN209218442U - High-fineness bend-resistance flexible circuit board - Google Patents
High-fineness bend-resistance flexible circuit board Download PDFInfo
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- CN209218442U CN209218442U CN201821335261.9U CN201821335261U CN209218442U CN 209218442 U CN209218442 U CN 209218442U CN 201821335261 U CN201821335261 U CN 201821335261U CN 209218442 U CN209218442 U CN 209218442U
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Abstract
The utility model discloses a kind of high-fineness bend-resistance flexible circuit boards, it include include protective layer, copper clad layers, glass layer, circuits mask layer, conductor layer, characteristic impedance layer, metal core heat dissipating layer, magnetic circuit shielded layer, flame-retardant layer, soft board body layer, copper clad layers are located at below protective layer, glass layer is located at below copper clad layers, circuits mask layer is located at below glass layer, conductor layer is located at below circuits mask layer, characteristic impedance layer is located at below conductor layer, metal core heat dissipating layer is located at below characteristic impedance layer, magnetic circuit shielded layer is located at below metal core heat dissipating layer, flame-retardant layer is located at below magnetic circuit shielded layer, soft board body layer is located at below flame-retardant layer；Magnetic circuit shielded layer is using permalloy raw material, and soft board body layer is mainly using polyimides or polyester film substrate；The utility model has the characteristics that Distribution density is high, light-weight, thickness is thin, bending is good.
Description
Technical field
The utility model relates to a kind of circuit boards, more particularly to a kind of high-fineness bend-resistance flexible circuit board.
Background technique
The country begins approximately even with mid-term at the beginning of the nineties to the research of circuit board, also at the early-stage, is engaged in the section of this respect research
It is also fewer to grind institutes, and because being influenced by various factors, research flexible for circuit board bend-resistance is also stayed at
The level of one relative infancy, structure is complicated, inconvenient for use, high production cost.
Summary of the invention
The technical problem to be solved by the utility model is to provide a kind of high-fineness bend-resistance flexible circuit boards, have
The feature that Distribution density is high, light-weight, thickness is thin, bending is good.
The utility model is to solve above-mentioned technical problem by following technical proposals: a kind of high-fineness bend-resistance is soft
Property circuit board comprising protective layer, copper clad layers, glass layer, circuits mask layer, conductor layer, characteristic impedance layer, metal core dissipate
Thermosphere, magnetic circuit shielded layer, flame-retardant layer, soft board body layer, copper clad layers are located at below protective layer, and glass layer is located at copper clad layers
Below, circuits mask layer is located at glass layer in the following, conductor layer is located at below circuits mask layer, and characteristic impedance layer is located at
Below conductor layer, metal core heat dissipating layer is located at below characteristic impedance layer, and magnetic circuit shielded layer is located under metal core heat dissipating layer
Face, flame-retardant layer are located at below magnetic circuit shielded layer, and soft board body layer is located at below flame-retardant layer, and soft board body layer and protective layer connect
It connects；Protective layer is used using polyethylene soft raw materials for plastics production, copper clad layers using solid copper raw material, glass layer
Be seven kinds of pyrophillite, quartz sand, lime stone, dolomite, bechilite, boromagnesite ore raw material, conductor layer is using silver
Line raw material, characteristic impedance layer is using copper foil raw material, and metal core heat dissipating layer is using graphene raw material, magnetic circuit screen
Layer is covered using permalloy raw material, and flame-retardant layer is mainly adopted using brominated Polystyrene raw material, soft board body layer
It is polyimides or polyester film substrate.
Preferably, the thickness of the protective layer is most thick.
Preferably, the conductor layer is equipped with connecting terminal.
Preferably, the protective layer is rubber slab.
Preferably, the consistency of thickness of the glass layer and soft board body layer.
The positive effect of the utility model is: the utility model have Distribution density is high, light-weight, thickness is thin,
The good feature of bending.
Detailed description of the invention
Fig. 1 is the schematic diagram of the utility model entirety.
Specific embodiment
The utility model preferred embodiment is provided, with reference to the accompanying drawing the technical solution of the utility model is described in detail.
As shown in Figure 1, the utility model includes protective layer 3, copper clad layers 4, glass layer 5, circuits mask layer 6, conducting wire
Layer 7, characteristic impedance layer 8, metal core heat dissipating layer 9, magnetic circuit shielded layer 10, flame-retardant layer 11, soft board body layer 12, copper clad layers 4 are located at
Below protective layer 3, glass layer 5 is located at below copper clad layers 4, and circuits mask layer 6 is located at glass layer 5 in the following, leading
Line layer 7 is located at below circuits mask layer 6, and characteristic impedance layer 8 is located at below conductor layer 7, and metal core heat dissipating layer 9 is located at feature
Below impedance layer 8, magnetic circuit shielded layer 10 is located at below metal core heat dissipating layer 9, and flame-retardant layer 11 is located at magnetic circuit shielded layer 10
In the following, soft board body layer 12 is located at below flame-retardant layer 11, soft board body layer 12 is connect with protective layer 3；Protective layer 3 using
Polyethylene soft raw materials for plastics production, copper clad layers 4 are using solid copper raw material, and glass layer 5 is using pyrophillite, quartz
Seven kinds of sand, lime stone, dolomite, bechilite, boromagnesite ore raw material, conductor layer 7 is using silver wire raw material, feature resistance
Anti- layer 8 is used using copper foil raw material, metal core heat dissipating layer 9 using graphene raw material, magnetic circuit shielded layer 10
Permalloy raw material, flame-retardant layer 11 using brominated Polystyrene raw material, soft board body layer 12 mainly using
Polyimides or polyester film substrate.
The working principle of the utility model is as follows: circuit board is conductive using plate based insulation material isolation cleaved surface copper foil
Layer so that electric current flow in various components along pre-designed route completion such as do work, amplify, decaying, modulate,
Functions, the circuit boards such as demodulation make circuit miniaturization, intuitiveization, and the batch production and optimization electrical appliance for fixed circuit are laid out
Important function；Flexible circuit board is that have height reliability using polyimides or polyester film as one kind made of substrate, excellent
Flexible printed circuit, have the characteristics that Distribution density is high, light-weight, thickness is thin, bending is good, circuit before solving
The problem of plate frangibility, breakage rate is high；It is protective layer used in protecting whole circuit board not by external erosion, copper clad layers are for reducing ground
Line impedence reduces pressure drop, improves power-efficient, and glass layer is used to enhance the intensity of circuit board, improves its corrosivity, lead
Line layer is distributed for influencing electric wave voltage, metal core heat dissipating layer by the heat come is conducted through for dredging electric current, characteristic impedance layer
Into surrounding air, magnetic circuit shielded layer is used to preventing the influence of external magnetic field, and it is fire-retardant that flame-retardant layer by several mechanism plays its
Effect absorbs a part of heat that fire source is released in the shorter time, organizes its burning, and soft board main body is all for covering
Layer, and connect with protective layer.Protective layer is using polyethylene soft raw materials for plastics production, and copper clad layers are using solid copper former material
Material, glass layer using seven kinds of pyrophillite, quartz sand, lime stone, dolomite, bechilite, boromagnesite ore raw material,
Conductor layer is using silver wire raw material, and characteristic impedance layer is using copper foil raw material, and metal core heat dissipating layer is using stone
Black alkene raw material, magnetic circuit shielded layer using permalloy raw material, flame-retardant layer using brominated Polystyrene raw material,
Soft board body layer is mainly using polyimides or polyester film substrate.Each layer is stacked with each other system by the utility model
Made of making, the thickness of protective layer 3 is most thick, convenient for further protection integrated circuit plate.
Conductor layer 7 is equipped with connecting terminal, convenient for the connection of conducting wire.
Protective layer 3 is rubber slab, can will not be damaged with bending.
The consistency of thickness of glass layer 5 and soft board body layer 12 improves the structural stability of circuit board.
In conclusion the utility model has the characteristics that Distribution density is high, light-weight, thickness is thin, bending is good.
Particular embodiments described above, the technical issues of to the solution of the utility model, technical scheme and beneficial effects
It has been further described, it should be understood that the foregoing is merely specific embodiment of the utility model, not
For limiting the utility model, within the spirit and principle of the utility model, any modification for being made, changes equivalent replacement
Into etc., it should be included within the scope of protection of this utility model.
Claims (5)
1. a kind of high-fineness bend-resistance flexible circuit board, which is characterized in that it include protective layer, copper clad layers, glass layer,
Circuits mask layer, conductor layer, characteristic impedance layer, metal core heat dissipating layer, magnetic circuit shielded layer, flame-retardant layer, soft board body layer, copper clad layers
Below protective layer, glass layer is located at below copper clad layers, and circuits mask layer is located at glass layer in the following, conducting wire
Layer is located at below circuits mask layer, and characteristic impedance layer is located at below conductor layer, and metal core heat dissipating layer is located at characteristic impedance layer
Below, magnetic circuit shielded layer is located at below metal core heat dissipating layer, and flame-retardant layer is located at below magnetic circuit shielded layer, soft board body layer
Below flame-retardant layer, soft board body layer is connect with protective layer.
2. high-fineness bend-resistance flexible circuit board as described in claim 1, which is characterized in that the thickness of the protective layer is most
It is thick.
3. high-fineness bend-resistance flexible circuit board as described in claim 1, which is characterized in that the conductor layer is equipped with and connects
Line terminals.
4. high-fineness bend-resistance flexible circuit board as described in claim 1, which is characterized in that the protective layer is rubber
Plate.
5. high-fineness bend-resistance flexible circuit board as described in claim 1, which is characterized in that the glass layer with it is soft
The consistency of thickness of plate body layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821335261.9U CN209218442U (en) | 2018-08-20 | 2018-08-20 | High-fineness bend-resistance flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821335261.9U CN209218442U (en) | 2018-08-20 | 2018-08-20 | High-fineness bend-resistance flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209218442U true CN209218442U (en) | 2019-08-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821335261.9U Active CN209218442U (en) | 2018-08-20 | 2018-08-20 | High-fineness bend-resistance flexible circuit board |
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| Country | Link |
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| CN (1) | CN209218442U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023150363A1 (en) * | 2022-02-04 | 2023-08-10 | Abbott Diabetes Care Inc. | Systems, devices, and methods for an analyte sensor |
-
2018
- 2018-08-20 CN CN201821335261.9U patent/CN209218442U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023150363A1 (en) * | 2022-02-04 | 2023-08-10 | Abbott Diabetes Care Inc. | Systems, devices, and methods for an analyte sensor |
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