CN209199904U - A kind of substrate holder disk of electron beam sweep measuring set - Google Patents
A kind of substrate holder disk of electron beam sweep measuring set Download PDFInfo
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- CN209199904U CN209199904U CN201920069211.9U CN201920069211U CN209199904U CN 209199904 U CN209199904 U CN 209199904U CN 201920069211 U CN201920069211 U CN 201920069211U CN 209199904 U CN209199904 U CN 209199904U
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- substrate holder
- holder disk
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Abstract
A kind of substrate holder disk of electron beam sweep measuring set, common substrate holder disk is solved due to air pressure change during transport, common substrate holder, which is taken inventory, to be adsorbed loosely, chip is easy the problem of displacement, it includes substrate holder disk ontology, the side of the substrate holder disk ontology is equipped with bottom surface, three countersunk screw holes are equidistantly offered on substrate holder disk ontology, vacuum passage is offered on bottom surface, the side of vacuum passage is equipped with exchange arms swing channel, center cavern part is offered in the middle part of substrate holder disk ontology, the other side of vacuum passage is equipped with round protrusion, substrate holder disk ontology two sides are equipped with inclined-plane, the other side of substrate holder disk ontology is equipped with end face, the side of end face offers the first groove in place, the other side of end face offers the second groove in place, the utility model structure novel, it is skillfully constructed, it is at low cost, structure is simple, absorption is secured , durability is strong, while being reserved with sensor passage, meets more requirement.
Description
Technical field
The utility model relates to substrate holder disk technology fields, more particularly, to a kind of substrate holder of electron beam sweep measuring set
Disk.
Background technique
Electron beam sweep measuring set be it is a kind of in manufacture of semiconductor for measuring pattern and its critical size on chip
Instrument, its working principle is that: the high-power electron beam irradiated from electron gun is irradiated to sample after deflecting and converge by coil
Surface obtains the image of specimen surface, based on clearly surface image, high-precision by detecting the secondary electron inspired
Measurement critical size.
Substrate holder disk is waited for chip to be transported to vacuum environment from atmospheric pressure environment in electron beam sweep measuring set
Arm crawl is exchanged, the common substrate holder disk in electron beam sweep measuring set is due to air pressure change during transport, commonly
The problem of substrate holder, which is taken inventory, to be adsorbed loosely, and chip is easy displacement.
Utility model content
For above situation, to overcome the shortcomings of existing technologies, the utility model provides a kind of electron beam sweep measuring set
Substrate holder disk, the common substrate holder disk of effective solution due to air pressure change during transport, take inventory by common substrate holder
Absorption loosely, chip be easy displacement the problem of the problem of.
To achieve the above object, the utility model provides the following technical solutions: the utility model includes substrate holder disk ontology,
The side of the substrate holder disk ontology is equipped with bottom surface, equidistantly offers three countersunk screw holes on substrate holder disk ontology, opens on bottom surface
Equipped with vacuum passage, the side of vacuum passage is equipped with exchange arms swing channel, offers center in the middle part of substrate holder disk ontology
Cavern part, the other side of vacuum passage are equipped with round protrusion, and substrate holder disk ontology two sides are equipped with inclined-plane, substrate holder disk ontology it is another
Side is equipped with end face, and the side of end face offers the first groove in place, and the other side of end face offers the second groove in place, and first
The side of groove in place offers third groove in place, and wafer notch, the side of the second groove in place are offered in the middle part of end face
Offering the 4th groove in place, the surface of wafer notch is equipped with protective layer, and the side of protective layer is equipped with water absorption layer, and the one of water absorption layer
Side is equipped with metal layer, and the side of metal layer is equipped with anti-corrosion layer, and the side of anti-corrosion layer is equipped with antistatic backing.
Preferably, the protective layer is a kind of component of teflon coatings material.
Preferably, the antistatic backing is a kind of component of polyurethane material.
Preferably, the described first groove in place and the second groove in place are in same level.
Preferably, third groove in place and the 4th groove in place are in same level.
The utility model structure novel, is skillfully constructed, at low cost, and structure is simple, and securely, durability is strong for absorption, while pre-
There are sensor passages, meet more requirement.
Detailed description of the invention
Attached drawing is used to provide a further understanding of the present invention, and constitutes part of specification, practical with this
Novel embodiment is used to explain the utility model together, does not constitute limitations of the present invention.
In the accompanying drawings:
Fig. 1 is the utility model bottom view；
Fig. 2 is the utility model side view；
Fig. 3 is the utility model top view；
Fig. 4 is the utility model wafer notch cross-sectional view；
In the figure, it is marked as 1, substrate holder disk ontology；2, bottom surface；3, countersunk screw holes；4, vacuum passage；5, arms swing is exchanged
Channel；6, center cavern part；7, round protrusion；8, inclined-plane；9, end face；10, the first groove in place；11, the second groove in place；
12, third groove in place；13, wafer notch；14, the 4th groove in place；15, protective layer；16, water absorption layer；17, metal layer；18,
Anti-corrosion layer；19, antistatic backing.
Specific embodiment
1-4 is described in further details specific embodiment of the present utility model with reference to the accompanying drawing.
Embodiment one, is provided by Fig. 1, Fig. 2, Fig. 3 and Fig. 4, and the utility model includes substrate holder disk ontology 1, substrate holder disk
The side of ontology 1 is equipped with bottom surface 2, three countersunk screw holes 3 is equidistantly offered on substrate holder disk ontology 1, countersunk screw holes 3 are for accurate
Fixed substrate holder disk position, and make nut lower than top planes, preventing, which influences chip, places and transfers, and offers on bottom surface 2 true
Empty channel 4, vacuum passage 4 prevent wafer shift during transfer, the side of vacuum passage 4 is equipped with exchange for adsorbing chip
Arms swing channel 5 exchanges arms swing channel 5, guarantees that exchange arm smooth can be rocked to center cavern part 6, substrate holder
The middle part of disk ontology 1 offers center cavern part 6, and the other side of vacuum passage 4 is equipped with round protrusion 7, and round protrusion 7 is for putting
Auxiliary stopper when setting substrate holder disk, 1 two sides of substrate holder disk ontology are equipped with inclined-plane 8, auxiliary limit when inclined-plane 8 is for placing substrate holder disk
Position, the other side of substrate holder disk ontology 1 are equipped with end face 9, and the side of end face 9 offers the first groove 10 in place, end face 9 it is another
Side offers the second groove 11 in place, and the side of the first groove 10 in place offers third groove 12 in place, and the middle part of end face 9 is opened
Equipped with wafer notch 13, the side of the second groove 11 in place offers the 4th groove 14 in place, and the surface of wafer notch 13 is equipped with
Protective layer 15, the side of protective layer 15 are equipped with water absorption layer 16, and the side of water absorption layer 16 is equipped with metal layer 17, the side of metal layer 17
Equipped with anti-corrosion layer 18, the side of anti-corrosion layer 18 is equipped with antistatic backing 19.
Embodiment two, on the basis of example 1, protective layer 15 are a kind of component of teflon coatings material, setting
Teflon coatings can reduce particulate interspaces, improve vacuum suction tightness, prevent wafer shift.
Embodiment three, on the basis of example 1, antistatic backing 19 are a kind of component of polyurethane material, can prevent crystalline substance
Electrostatic Absorption occurs for the bottom surface of piece groove 13, and bottom surface is avoided to assemble more dust.
Example IV is provided by Fig. 1, Fig. 2 and Fig. 3 on the basis of example 1, the first groove in place 10 and second
Position groove 11 is in same level, can detect chip situation in place for optical sensor and provide light-path.
Embodiment five is provided by Fig. 1, Fig. 2 and Fig. 3 on the basis of example 1, third groove in place 12 and the 4th
Position groove 14 is in same level, can detect wafer-level degree for sensor and provide access.
Working principle: when the utility model is used, placing the wafer on wafer notch 13, and the vacuum passage 4 of setting is used
In absorption chip, wafer shift during transfer is prevented, absorption is firm, after the completion of absorption, that is, waits chip from atmosphere pressure ring
Border is transplanted in vacuum environment, is exchanged arm by center cavern part 6 and is lifted chip, so that chip is transplanted in vacuum environment,
First be arranged groove 10 in place and the second groove 11 in place are in same level, can detect chip feelings in place for optical sensor
Condition provides light-path, and the third of setting groove 12 in place and the 4th groove 14 in place are in same level, can examine for sensor
It surveys wafer-level degree and access is provided, protective layer 15 is teflon coatings, can reduce particulate interspaces, improves vacuum suction and fastens journey
Degree prevents wafer shift, and antistatic backing 19 can prevent the bottom surface of wafer notch 13 from Electrostatic Absorption occurs, and avoids bottom surface aggregation ash
Dirt.
The utility model structure novel, is skillfully constructed, at low cost, and structure is simple, and securely, durability is strong for absorption, while pre-
There are sensor passages, meet more requirement.
Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention, it is not limited to this
Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art
For, it is still possible to modify the technical solutions described in the foregoing embodiments, or to part of technical characteristic
It is equivalently replaced.Within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on,
It should be included within the scope of protection of this utility model.
Claims (5)
1. a kind of substrate holder disk of electron beam sweep measuring set, including substrate holder disk ontology (1), which is characterized in that described to hold piece
The side of tray body (1) is equipped with bottom surface (2), equidistantly offers three countersunk screw holes (3), bottom surface on substrate holder disk ontology (1)
(2) it is offered on vacuum passage (4), the side of vacuum passage (4) is equipped with exchange arms swing channel (5), substrate holder disk ontology
(1) it is offered in the middle part of center cavern part (6), the other side of vacuum passage (4) is equipped with round protrusion (7), substrate holder disk ontology
(1) two sides are equipped with inclined-plane (8), and the other side of substrate holder disk ontology (1) is equipped with end face (9), and the side of end face (9) offers first
Groove (10) in place, the other side of end face (9) offer the second groove (11) in place, and the side of the first groove (10) in place opens up
There is third groove in place (12), offered in the middle part of end face (9) wafer notch (13), the side of the second groove (11) in place opens up
There is the 4th groove (14) in place, the surface of wafer notch (13) is equipped with protective layer (15), and the side of protective layer (15) is equipped with water suction
The side of layer (16), water absorption layer (16) is equipped with metal layer (17), and the side of metal layer (17) is equipped with anti-corrosion layer (18), corrosion-resistant
The side of layer (18) is equipped with antistatic backing (19).
2. a kind of substrate holder disk of electron beam sweep measuring set according to claim 1, which is characterized in that the protective layer
It (15) is a kind of component of teflon coatings material.
3. a kind of substrate holder disk of electron beam sweep measuring set according to claim 1, which is characterized in that the antistatic
Layer (19) is a kind of component of polyurethane material.
4. a kind of substrate holder disk of electron beam sweep measuring set according to claim 1, which is characterized in that described first
Position groove (10) and the second groove (11) in place are in same level.
5. a kind of substrate holder disk of electron beam sweep measuring set according to claim 1, which is characterized in that the third exists
Position groove (12) and the 4th groove (14) in place are in same level.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920069211.9U CN209199904U (en) | 2019-01-15 | 2019-01-15 | A kind of substrate holder disk of electron beam sweep measuring set |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920069211.9U CN209199904U (en) | 2019-01-15 | 2019-01-15 | A kind of substrate holder disk of electron beam sweep measuring set |
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| Publication Number | Publication Date |
|---|---|
| CN209199904U true CN209199904U (en) | 2019-08-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920069211.9U Active CN209199904U (en) | 2019-01-15 | 2019-01-15 | A kind of substrate holder disk of electron beam sweep measuring set |
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| Country | Link |
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| CN (1) | CN209199904U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110797273A (en) * | 2019-10-21 | 2020-02-14 | 中国电子科技集团公司第十一研究所 | Tool and method for detecting flatness of chip substrate |
-
2019
- 2019-01-15 CN CN201920069211.9U patent/CN209199904U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110797273A (en) * | 2019-10-21 | 2020-02-14 | 中国电子科技集团公司第十一研究所 | Tool and method for detecting flatness of chip substrate |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 214000 No. 11 Lijiang Road, Xinwu District, Wuxi City, Jiangsu Province Patentee after: Wuxi zhuohai Technology Co.,Ltd. Address before: 214000 6-2407, Tianshan Road, Wuxi City, Jiangsu Province Patentee before: WUXI ZHUOHAI TECHNOLOGY Co.,Ltd. |
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| CP03 | Change of name, title or address |