CN209198649U - A kind of signal transmitting and receiving connection equipment - Google Patents
A kind of signal transmitting and receiving connection equipment Download PDFInfo
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- CN209198649U CN209198649U CN201821524230.8U CN201821524230U CN209198649U CN 209198649 U CN209198649 U CN 209198649U CN 201821524230 U CN201821524230 U CN 201821524230U CN 209198649 U CN209198649 U CN 209198649U
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- signal processing
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Abstract
The utility model discloses a kind of signal transmitting and receivings to connect equipment, the transmitting-receiving amplification chip of silica-base material is used directly to be fed for paster antenna, silicon base chip and microwave board are welded by way of flip chip bonding simultaneously, it avoids and feed and using by the way of Metal Packaging using carrying GaAs or gallium nitride transmitting-receiving amplification chip in signal sending and receiving equipment, to on the basis of the phased array antenna of the signal sending and receiving equipment production using the embodiment of the present application, the whole of phased array antenna can be greatly reduced to expend, phased array antenna production application cost is saved with effective, and reduce the technical effect of phased array antenna production installation complexity.
Description
Technical field
The utility model relates to technical field of electronic communication, connect equipment more particularly to a kind of signal transmitting and receiving.
Background technique
Currently, core component of the phased array antenna as the present age advanced radar-probing system, is widely used in national defence, boat
It, communication etc. fields.And the antenna that the radio architectures of existing phased array antenna are all metallic forms carries GaAs (GaAs)
Or GaN (gallium nitride) transmitting-receiving amplification chip is fed, so that its packaged type can only often use Metal Packaging, due to metal
The antenna size and weight of form are all very big, require height to machining accuracy, and use GaAs (GaAs) or GaN (nitrogen
Change gallium) the transmitting-receiving amplification chip of technological design is at high cost, and it is high so as to cause the overall cost of entire phased array antenna, sternly
The raising of China's national defense Yu space communication level is affected again.
As it can be seen that radio architectures in phased array antenna, which exist in the prior art, usually carries arsenic by the antenna of metallic forms
Gallium or gallium nitride transmitting-receiving amplification chip are fed, and are caused phased array antenna overall applicability cost quite high, are influenced national defence and space flight
The technical problem of communication level fast development.
Utility model content
The application provides a kind of signal transmitting and receiving connection equipment, in the phased array antenna that solves to exist in the prior art
Radio architectures usually carry GaAs by the antenna of metallic forms or gallium nitride transmitting-receiving amplification chip is fed, and cause phased array
Antenna overall applicability cost is quite high, influences national defence and the horizontal fast-developing technical problem of space communication.
On the one hand the application provides a kind of signal transmitting and receiving connection equipment, comprising:
Signal transmitting and receiving module, to transceiving electromagnetic signals；
Medium is fed, the signal transmitting and receiving module and radio frequency feed line are connected, to transmit electromagnetic signal；
Microwave composite plate, it is described including interior signal feed-in access, feed line of power supply access and the silicon substrate signal processing module set
Radio frequency feed line is arranged in the signal feed-in access, and the radio frequency feed line is connect with the silicon substrate signal processing module, institute
It states silicon substrate signal processing module to connect to power supply by the feed line of power supply in the feed line of power supply access, and at the silicon substrate signal
Reason module is to amplify the electromagnetic signal and/or modulation treatment；
Wherein, the feed medium and the signal transmitting and receiving module attach the first surface in the microwave composite plate.
Optionally, the signal feed-in access further include:
Sum-difference network is connect with the radio frequency feed line, to carry out signal processing to the electromagnetic signal of feed-in, is formed and poor
Wave beam；
Optionally, the signal transmitting and receiving module is the paster antenna of E shape.
Optionally, the feed medium is the probe connecting with the E shape intermediate ledge, and the width of the probe
It is narrower than the paster antenna.
Optionally, at least one signal shielding hole, the hole in the signal shielding hole are additionally provided in the microwave composite plate
Axis is parallel with the hole axle of the signal feed-in access and is wound around the signal feed-in access surrounding, the signal shielding hole to
Shielded signal.
Optionally, it is additionally provided with wave control plate on second surface opposite with the first surface in the microwave composite plate,
It is connect by the feed line of power supply access with the silicon substrate signal processing module, to control the silicon substrate signal processing module
Power supply.
Optionally, the wave control plate also passes through signal control circuit and connect with the silicon substrate signal processing module, to defeated
Control signal out to control the magnitude-phase characteristics of the silicon substrate signal processing module.
Optionally, the radio frequency feed line is believed in such a way that tin ball flip chip bonding is in the microwave composite plate with the silicon substrate
The connection of number processing module.
One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:
Technical solution in the embodiment of the present application can be avoided by being directly that paster antenna is powered in signal sending and receiving equipment
It is middle using carry GaAs or gallium nitride transmitting-receiving amplification chip fed by the way of, thus using the embodiment of the present application letter
On the basis of the phased array antenna of number transceiver production, reduces the whole of phased array antenna and expend, therefore have and save phased array
The technical effect of antenna production application cost.
Detailed description of the invention
Fig. 1 is the surface perspective knot of the microwave composite plate in a kind of signal sending and receiving equipment provided by the embodiment of the utility model
Composition；
Fig. 2 is the main view section knot of the microwave composite plate in a kind of signal sending and receiving equipment provided by the embodiment of the utility model
Composition.
Specific embodiment
The application provides a kind of signal transmitting and receiving connection equipment, in the phased array antenna that solves to exist in the prior art
Radio architectures usually carry GaAs by the antenna of metallic forms or gallium nitride transmitting-receiving amplification chip is fed, and cause phased array
Antenna overall applicability cost is quite high, influences national defence and the horizontal fast-developing technical problem of space communication.
Technical solution in the embodiment of the present application is in order to solve the above technical problems, general thought is as follows:
Technical solution in the embodiment of the present application uses the transmitting-receiving amplification chip of silica-base material directly for paster antenna progress
Feed, while being welded silicon base chip and microwave board by way of flip chip bonding, it avoids and is adopted in signal sending and receiving equipment
With carry GaAs or gallium nitride transmitting-receiving amplification chip carry out feed and using Metal Packaging by the way of, thus use the application
On the basis of the phased array antenna of the signal sending and receiving equipment production of embodiment, the whole of phased array antenna can be greatly reduced and expended,
Phased array antenna production application cost is saved with effective, and reduces the technology effect of phased array antenna production installation complexity
Fruit.
Technical scheme is described in detail below by attached drawing and specific embodiment, it should be understood that the application
Specific features in embodiment and embodiment are the detailed description to technical scheme, rather than to present techniques
The restriction of scheme, in the absence of conflict, the technical characteristic in the embodiment of the present application and embodiment can be combined with each other.
The terms "and/or", only a kind of incidence relation for describing affiliated partner, indicates that there may be three kinds of passes
System, for example, A and/or B, can indicate: individualism A exists simultaneously A and B, these three situations of individualism B.In addition, herein
Middle character "/" typicallys represent the relationship that forward-backward correlation object is a kind of "or".
Embodiment one
Fig. 1, Fig. 2 are please referred to, the embodiment of the present application one provides a kind of signal transmitting and receiving connection equipment, comprising:
Signal transmitting and receiving module 101, to transceiving electromagnetic signals；
Medium 102 is fed, the signal transmitting and receiving module and radio frequency feed line are connected, to transmit electromagnetic signal；
Microwave composite plate 103, at interior signal feed-in access 1031, feed line of power supply access 1032 and the silicon substrate signal set
Module 1033 is managed, the radio frequency feed line is arranged in the signal feed-in access 1031, and the radio frequency feed line and the silicon substrate
Signal processing module 1033 connects, and the silicon substrate signal processing module 1033 passes through the power supply in the feed line of power supply access 1032
Feeder line connects to power supply, and the silicon substrate signal processing module 1033 is to amplify and/or modulate to the electromagnetic signal
Processing；
Wherein, the feed medium 102 and the signal transmitting and receiving module 101 are attached the of the microwave composite plate 103
One surface.
Further, the signal feed-in access in the embodiment of the present application further include:
Sum-difference network is connect with the radio frequency feed line, to carry out signal processing to the electromagnetic signal of feed-in, is formed and poor
Wave beam.
Still further, in order to improve the signal transmitting and receiving process performance of signal transmitting and receiving module, the signal transmitting and receiving module is E
The paster antenna of shape.And the feed medium is the probe connecting with the E shape intermediate ledge, and the width of the probe
Degree is narrower than the paster antenna.
Certainly, for the radiation interference for reducing loss of the electromagnetic wave signal in transmittance process, reducing electromagnetic wave signal, institute
It states and is additionally provided at least one signal shielding hole 104 in microwave composite plate, the hole axle in the signal shielding hole and the signal are presented
The hole axle for entering access is parallel and be wound around the signal feed-in access surrounding, and the signal shielding hole 104 is to shielded signal.
Wave control plate 105 is additionally provided in the microwave composite plate on the second surface opposite with the first surface, is passed through
The feed line of power supply access is connect with the silicon substrate signal processing module, can be used to control the confession of the silicon substrate signal processing module
Electricity.Meanwhile the wave control plate also passes through signal control circuit and connect with the silicon substrate signal processing module, to export control letter
Number to control the magnitude-phase characteristics of the silicon substrate signal processing module.
Still further, can guarantee simultaneously for the electric property for improving the being completely embedded property of each module, promoting each module
The dimensional compactness of signal transmitting and receiving connection equipment in the embodiment of the present application, in the embodiment of the present application, the radio frequency feed line is adopted
It is connect with mode of the tin ball flip chip bonding in the microwave composite plate with the silicon substrate signal processing module.
It should be pointed out that the silicon substrate signal processing module in the embodiment of the present application can be common signal processing core
Piece, is also possible to the circuit or module of other achievable signal processings, it is possible thereby to avoid using GaAs or gallium nitride technique
The signal processing chip of design, to play the role of reducing application cost.It further, is by powering in the embodiment of the present application
Feeder line connects to power supply silicon substrate signal processing module, then again through radio frequency feed line, feed medium by signal transmitting and receiving module and silicon
The connection of base signal processing module can in practical operation since feed line of power supply, radio frequency feed line, feed medium are conductive material
To be directly silicon substrate signal processing module (namely in the embodiment of the present application via radio frequency feed line, feed line of power supply and feed medium
Paster antenna) power supply.
It can be seen that
Technical solution in the embodiment of the present application uses the transmitting-receiving amplification chip of silica-base material directly for paster antenna progress
Feed, while being welded silicon base chip and microwave board by way of flip chip bonding, it avoids and is adopted in signal sending and receiving equipment
With carry GaAs or gallium nitride transmitting-receiving amplification chip carry out feed and using Metal Packaging by the way of, thus use the application
On the basis of the phased array antenna of the signal sending and receiving equipment production of embodiment, the whole of phased array antenna can be greatly reduced and expended,
Phased array antenna production application cost is saved with effective, and reduces the technology effect of phased array antenna production installation complexity
Fruit.
Although the preferred embodiment of the application has been described, it is created once a person skilled in the art knows basic
Property concept, then additional changes and modifications may be made to these embodiments.So it includes excellent that the following claims are intended to be interpreted as
It selects embodiment and falls into all change and modification of the application range.
Obviously, those skilled in the art can carry out various modification and variations without departing from the essence of the application to the application
Mind and range.In this way, if these modifications and variations of the application belong to the range of the claim of this application and its equivalent technologies
Within, then the application is also intended to include these modifications and variations.
Claims (8)
1. a kind of signal transmitting and receiving connects equipment characterized by comprising
Signal transmitting and receiving module, to transceiving electromagnetic signals；
Medium is fed, the signal transmitting and receiving module and radio frequency feed line are connected, to transmit electromagnetic signal；
Microwave composite plate, including interior signal feed-in access, feed line of power supply access and the silicon substrate signal processing module set, the radio frequency
Feeder line is arranged in the signal feed-in access, and the radio frequency feed line is connect with the silicon substrate signal processing module, the silicon
Base signal processing module is connected to power supply by the feed line of power supply in the feed line of power supply access, and the silicon substrate signal processing mould
Block is to amplify the electromagnetic signal and/or modulation treatment；
Wherein, the feed medium and the signal transmitting and receiving module attach the first surface in the microwave composite plate.
2. connection equipment as described in claim 1, which is characterized in that the signal feed-in access further include:
Sum-difference network is connect with the radio frequency feed line, to carry out signal processing to the electromagnetic signal of feed-in, is formed and poor wave
Beam.
3. connection equipment as described in claim 1, which is characterized in that the signal transmitting and receiving module is the paster antenna of E shape.
4. connection equipment as claimed in claim 3, which is characterized in that the feed medium is to protrude among the E shape
The probe of portion's connection, and the width of the probe is narrower than the paster antenna.
5. connection equipment as described in claim 1, which is characterized in that be additionally provided at least one letter in the microwave composite plate
Number shield opening, the hole axle in the signal shielding hole is parallel with the hole axle of the signal feed-in access and is wound around the signal feed-in
Access surrounding, the signal shielding hole is to shielded signal.
6. connection equipment as described in claim 1, which is characterized in that opposite with the first surface in the microwave composite plate
Second surface on be additionally provided with wave control plate, connect by the feed line of power supply access with the silicon substrate signal processing module, use
To control the power supply of the silicon substrate signal processing module.
7. as described in claim 1 connection equipment, which is characterized in that the wave control plate also pass through signal control circuit with it is described
Silicon substrate signal processing module connection, to export control signal to control the magnitude-phase characteristics of the silicon substrate signal processing module.
8. connection equipment as described in claim 1, which is characterized in that the radio frequency feed line is using tin ball flip chip bonding described micro-
Mode in wave composite plate is connect with the silicon substrate signal processing module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821524230.8U CN209198649U (en) | 2018-09-18 | 2018-09-18 | A kind of signal transmitting and receiving connection equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821524230.8U CN209198649U (en) | 2018-09-18 | 2018-09-18 | A kind of signal transmitting and receiving connection equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209198649U true CN209198649U (en) | 2019-08-02 |
Family
ID=67406227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821524230.8U Active CN209198649U (en) | 2018-09-18 | 2018-09-18 | A kind of signal transmitting and receiving connection equipment |
Country Status (1)
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| CN (1) | CN209198649U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110739526A (en) * | 2019-10-29 | 2020-01-31 | 中国科学院微电子研究所 | Antenna radio frequency front end package manufacturing method |
| CN112003003A (en) * | 2020-08-27 | 2020-11-27 | 成都天锐星通科技有限公司 | Phased array antenna structure and electronic device |
| EP4311379A4 (en) * | 2021-04-29 | 2024-04-17 | Chengdu T Ray Tech Co Ltd | Multi-beam chip integration module and phased array system |
-
2018
- 2018-09-18 CN CN201821524230.8U patent/CN209198649U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110739526A (en) * | 2019-10-29 | 2020-01-31 | 中国科学院微电子研究所 | Antenna radio frequency front end package manufacturing method |
| CN112003003A (en) * | 2020-08-27 | 2020-11-27 | 成都天锐星通科技有限公司 | Phased array antenna structure and electronic device |
| EP4311379A4 (en) * | 2021-04-29 | 2024-04-17 | Chengdu T Ray Tech Co Ltd | Multi-beam chip integration module and phased array system |
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