CN209197904U - A kind of digital infrared temperature sensor - Google Patents
A kind of digital infrared temperature sensor Download PDFInfo
- Publication number
- CN209197904U CN209197904U CN201822047532.7U CN201822047532U CN209197904U CN 209197904 U CN209197904 U CN 209197904U CN 201822047532 U CN201822047532 U CN 201822047532U CN 209197904 U CN209197904 U CN 209197904U
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- China
- Prior art keywords
- envelope
- tube
- pedestal
- temperature sensor
- digital infrared
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Abstract
The utility model provides a kind of digital infrared temperature sensor, including temperature acquisition chip, pedestal, signal processing circuit board, tube-like envelope, cover board, socket, wherein, the pedestal is provided with the through-hole and groove of installation temperature acquisition chip, four pins of temperature acquisition chip are welded in the through-hole for being integrally inserted into pedestal after signal processing circuit board and groove and then constitute temperature measurement component, and the signal processing circuit board is connect by extraction wire with socket；The temperature measurement component and extraction wire are integrally placed at the inside of tube-like envelope, wherein one end of tube-like envelope is connect by the way that internal screw thread is arranged with whorl of base, and the other end of tube-like envelope is fixedly connected by screw with cover board, and the socket installation is on the cover board.The novel designs of the utility model structure, so that entire sensor is simple and practical, craftsmanship is strong, is easy to implement mass production；Simultaneously at present on the market compared with similar product, with good economy.
Description
Technical field
The utility model belongs to sensor design technical field, and in particular to a kind of digital infrared temperature sensor.
Background technique
Infrared measurement of temperature is the temperature that object is determined according to the infrared energy of testee, is not connect with testee
Touching has temperature resolution height, fast response time, temperature-measuring range wide, stable to not interfere with testee thermo parameters method
The features such as property is good, application field is extensive.
Infrared temperature sensor on the market is mostly analog signal output at present, and transmission range is short, is easy to be disturbed, is unfavorable
In the system integration, and sensor structure designs complex, assembly difficulty, and cost of manufacture is high, most product price nearly 1,000 yuan.
Utility model content
The purpose of the utility model is to provide a kind of structures simply, installation is convenient, low in cost, craftsmanship is strong, convenient for real
The digital infrared temperature sensor of existing mass production.
In order to realize above-mentioned purpose of utility model, the utility model provides the following technical solution:
A kind of digital infrared temperature sensor, including outside temperature acquisition chip, pedestal, signal processing circuit board, tubulose
Shell, cover board, socket, wherein the pedestal be provided with installation temperature acquisition chip through-hole and groove, the four of temperature acquisition chip
A pin is welded in the through-hole for being integrally inserted into pedestal after signal processing circuit board and groove and then constitutes temperature measurement component, described
Signal processing circuit board is connect by extraction wire with socket；The temperature measurement component and extraction wire are integrally placed at tube-like envelope
It is internal, wherein one end of tube-like envelope is connect by the way that internal screw thread is arranged with whorl of base a, and the other end of tube-like envelope passes through spiral shell
Nail is fixedly connected with cover board, and the socket installation is on the cover board.
Preferably, the end face of the pedestal is evenly arranged with multiple blind holes, and three-jaw tool is easy to use to be screwed into pedestal
Tube-like envelope.
Preferably, four pins of the temperature acquisition chip in pairs, are respectively welded at signal processing circuit board
Tow sides, to improve the stability of temperature acquisition chip.
Preferably, four pins of the temperature acquisition chip retain its pin length at least 5mm, respectively so as to subsequent
Encapsulating.
Preferably, it is perfused with silicon rubber in the groove of the pedestal, to improve the stability of temperature acquisition chip.
Preferably, the inner space of the tube-like envelope is perfused with silicon rubber, to improve the steady of entire temperature measurement component fixation
It is qualitative.
Preferably, it is provided with long screw thread on the outer surface of the tube-like envelope, nut is installed there are two installations on long screw thread,
Two installation nuts are fixed sensor overall clamping on mounting plate on site, and can be adjusted by changing nut location
The distance between MLX90614 temperature acquisition chip thermometric end and testee.
Preferably, the temperature acquisition chip uses MLX90614.
Preferably, the signal processing circuit board uses STM32 for core processor.
In the utility model, MLX90614 temperature acquisition chip is for non-contactly acquiring the temperature of testee；Signal
Processing circuit plate is for handling the collected temperature signal of MLX90614 chip, and with the form of communication of RS485 after being handled
Send host computer；Tube-like envelope is used for protection circuit plate as main body, and connects remaining parts；Pedestal is for installing fixation
MLX90614 temperature acquisition chip, and connect with one end of tube-like envelope；Cover board is used for fixed socket, and another with tube-like envelope
One end connection；Socket connect it with host computer for the signal on output signal processing circuit plate；Nut and waveform bullet are installed
Property gasket for fixing whole branch sensor.
The utility model beneficial effect achieved is: the utility model be based on STM32 data processing chip and
MLX90614 temperature acquisition chip devises digital infrared temperature sensor, and the high-precision that can be used for 380 DEG C or less thermal fields is surveyed
Amount, 0.02 DEG C of measured value resolution ratio, and by RS485 output digital temperature signal, to extend signal transmission distance, and with it is upper
Machine is easily integrated；The novel designs of sensor assembling structure, so that entire sensor is simple and practical, craftsmanship is strong, is easy to implement
Mass production；Simultaneously at present on the market compared with similar product, with good economy, generally on the market related is produced
Its selling price of product at 700 yuan to 1000 yuan or so, and the sensor cost of the utility model development can control 160 yuan with
Interior, tool has great advantage in price.
Detailed description of the invention
Fig. 1 is the overall structure diagram of the utility model.
Fig. 2 is the structural schematic diagram of temperature measurement component.
Fig. 3 is the structural schematic diagram of pedestal.
Fig. 4 is the left view of Fig. 3.
Fig. 5 is the structural schematic diagram of tube-like envelope.
Fig. 6 is the right view of Fig. 5.
In figure: 1, temperature acquisition chip, 2, pedestal, 3, silicon rubber, 4, signal processing circuit board, 5, tube-like envelope, 6, draw
Conducting wire out, 7, cover board, 8, socket, 9, screw, 10, installation nut, 11, blind hole, 12, threaded hole, a, pedestal external screw thread, b, tubulose
Shell internal screw thread, c, long screw thread.
Specific embodiment
In order to make those skilled in the art more fully understand the technical solution of the utility model, with reference to the accompanying drawing to this
Utility model is further detailed.
As shown in Figure 1, number of the utility model based on STM32 data processing chip and MLX90614 temperature acquisition chip
Formula infrared temperature sensor includes: MLX90614 temperature acquisition chip 1, signal processing circuit board 4, tube-like envelope 5, pedestal 2, lid
Plate 7, socket 8, installation nut 10 and waveform elastic gasket etc..
Temperature acquisition chip 4 is the core devices of entire sensor, and the production of Melexis company is selected in the utility model
A MLX90614 type thermopile IR detector.The detector size is small, at low cost, easy of integration, has been internally integrated low noise
Amplifier, 17 analog-digital converters and powerful DSP processing unit, so that high-precision and high-resolution temperature measurement are able to reality
It is existing.Output data interface is digital two kinds of forms of PWM and SMBus.
Signal processing circuit board 4 is auxiliary using STM32F103T8U6 microprocessor and MAX3485 communication chip as main chip
The devices such as resistance, capacitor, diode with each specification, thus realize data be further processed and the RS485 of signal communication.
Signal processing circuit board 4 is contoured to strip, and width is slightly less than the internal diameter of tube-like envelope.
Four pins of MLX90614 temperature acquisition chip 1 are soldered to signal processing circuit board 4, four pins when welding
The tow sides of signal processing circuit board 4 are respectively welded at, two-by-two to improve the fixed stability of chip.Retain its pin simultaneously
Length at least 5mm, so as to subsequent encapsulating.After the completion of welding, by MLX90614 temperature acquisition chip 1 and signal processing circuit board 4
Assembly be perpendicularly inserted in the groove of pedestal 2, to guarantee that MLX90614 temperature acquisition chip end face (i.e. lens face) is flat
Row is in base end face, as shown in Figure 2.Full silicon rubber is perfused to the groove of pedestal 2 again, and when perfusion should ensure that glue fully fills up
1 bottom surface of MLX90614 temperature acquisition chip to the space between 2 notch of pedestal.It, can be by MLX90614 temperature after glue curing
Degree acquisition chip 1, signal processing circuit board 4,2 three of pedestal are reliably connected, this component is known as temperature measurement component.
Such as Fig. 1, after extraction wire 6 has been welded on signal processing circuit board 4, temperature measurement component is passed through outer on pedestal 2
Internal screw thread b (see Fig. 5 and Fig. 6) on screw thread a (see Fig. 3 and Fig. 4) and tube-like envelope 5 tightens fixation.It, can be in rundown process
It, constantly will be outside temperature measurement component precession tubulose after the firm blind hole 11 of card using three-jaw tooling using three blind holes 11 being arranged on pedestal
Inside shell 5.To prevent from loosening in later period use process, coated thread liquid can be locked on the external screw thread a of pedestal 2.
The other end of extraction wire 6 is connected with 8 pad of socket being fixed on cover board 7, and covers pyrocondensation in weld
Casing, to avoid line short.After welding, silicon rubber is perfused in tube-like envelope 5.Before silicon rubber solidification, by cover board 7 and pipe
Shape shell 5 tightens fixation by screw 9.Three screw holes 12 are arranged in uniform way on the end face of tube-like envelope 5, see Fig. 4.
Sensor provided by the utility model when in use, by tube-like envelope 5 it is screw thread c long on two installation nuts 10
Entire sensor is fixedly clamped with mounting plate.In addition, the long screw thread c arrangement on tube-like envelope 5 facilitates sensor during installation
Adjust the distance of temperature probe to testee surface.
In summary, the components and auxiliary material quantity that entire sensor design uses are few, make every effort to guaranteeing product matter
Amount and realize performance under the premise of reduce Assembly part and installation procedure to the greatest extent, Product Process is strong, thus reduce product at
This, improves the market competitiveness.It compares and the prior art, there is substantive innovation and progress.
Claims (9)
1. a kind of digital infrared temperature sensor, it is characterised in that: at temperature acquisition chip (1), pedestal (2), signal
Manage circuit board (4), tube-like envelope (5), cover board (7), socket (8), wherein the pedestal (2) is provided with installation temperature acquisition core
The through-hole and groove of piece, four pins of temperature acquisition chip, which are welded in after signal processing circuit board, is integrally inserted into pedestal (2)
Through-hole and groove in so that constitute temperature measurement component, the signal processing circuit board by extraction wire (6) and socket (8) even
It connects；The temperature measurement component and extraction wire (6) are integrally placed at the inside of tube-like envelope (5), wherein one end of tube-like envelope (5)
It is connect by setting internal screw thread with pedestal (2) screw thread a, the other end of tube-like envelope (5) is fixed by screw (9) and cover board (7)
Connection, the socket (8) are mounted on cover board (7).
2. a kind of digital infrared temperature sensor as described in claim 1, it is characterised in that: the end face of the pedestal (2)
It is evenly arranged with multiple blind holes (11).
3. a kind of digital infrared temperature sensor as described in claim 1, it is characterised in that: the temperature acquisition chip
(1) four pins in pairs, are respectively welded at the tow sides of signal processing circuit board (4).
4. a kind of digital infrared temperature sensor as claimed in claim 1 or 3, it is characterised in that: the temperature acquisition core
Four pins of piece (1) retain its pin length at least 5mm respectively.
5. a kind of digital infrared temperature sensor as described in claim 1, it is characterised in that: the groove of the pedestal (2)
Inside it is perfused with silicon rubber.
6. a kind of digital infrared temperature sensor as described in claim 1, it is characterised in that: the tube-like envelope (5)
Inner space is perfused with silicon rubber.
7. a kind of digital infrared temperature sensor as described in claim 1, it is characterised in that: the tube-like envelope (5)
Long screw thread c is provided on outer surface, there are two install nut (10) for installation on long screw thread c.
8. a kind of digital infrared temperature sensor as described in claim 1, it is characterised in that: the temperature acquisition chip
(1) MLX90614 is used.
9. a kind of digital infrared temperature sensor as described in claim 1, it is characterised in that: the signal processing circuit board
(4) use STM32 for core processor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822047532.7U CN209197904U (en) | 2018-12-07 | 2018-12-07 | A kind of digital infrared temperature sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822047532.7U CN209197904U (en) | 2018-12-07 | 2018-12-07 | A kind of digital infrared temperature sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209197904U true CN209197904U (en) | 2019-08-02 |
Family
ID=67428115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822047532.7U Active CN209197904U (en) | 2018-12-07 | 2018-12-07 | A kind of digital infrared temperature sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209197904U (en) |
-
2018
- 2018-12-07 CN CN201822047532.7U patent/CN209197904U/en active Active
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