CN209190607U - A kind of more wafer size rotation clamping devices - Google Patents
A kind of more wafer size rotation clamping devices Download PDFInfo
- Publication number
- CN209190607U CN209190607U CN201822197170.XU CN201822197170U CN209190607U CN 209190607 U CN209190607 U CN 209190607U CN 201822197170 U CN201822197170 U CN 201822197170U CN 209190607 U CN209190607 U CN 209190607U
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- China
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- cascaded surface
- wafer
- chip briquetting
- briquetting
- chip
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Abstract
The utility model discloses a kind of more wafer size rotation clamping devices, and compatible grip block is in hierarchic structure, is divided into high-rise cascaded surface, middle layer cascaded surface, low layer cascaded surface；High-order chip briquetting, middle position chip briquetting and low high-rise cascaded surface, middle layer cascaded surface are separately mounted to by shaft, on low layer cascaded surface for chip briquetting；High-order wafer support column, middle position wafer support column and low level wafer support column are separately mounted to high-rise cascaded surface, middle layer cascaded surface, on low layer cascaded surface, and are located at the side of high-order chip briquetting, middle position chip briquetting and low level chip briquetting；Rotary chuck upper surface is equipped with lightening hole, and compatible grip block is fixed on rotary chuck；Rotary chuck lower end is connect with rotating electric machine；The centrifugal force that high-order chip briquetting, middle position chip briquetting, low level chip briquetting are generated by rotary chuck rotary motion, position of centre of gravity variation, is respectively fixed large-sized wafer, middle wafer size and small size chip by the cooperation of shaft.
Description
Technical field
It is the utility model relates to drive chip to carry out the clamping device of spinning movement in semiconductor equipment, in particular to a kind of
More wafer sizes rotate clamping device.
Background technique
In semiconductor field, often needing to semiconductor equipment has the function of handling sizes chip, this is just needed
Relevant apparatus or mechanism inside equipment have the function of compatible sizes chip, including wafer holder rotating mechanism.
Well known afer rotates clamping device is brilliant to reach compatible different sizes by way of in different location increase wafer holder block
The purpose of piece, this its disadvantage embody in practice are as follows: and structure is cumbersome, and engaged position is big, since space limits, compatible size
Type is less, i.e., compatible performance is poor.
Utility model content
In order to solve the above technical problems, the purpose of the utility model is to provide a kind of more wafer sizes to rotate clamping device,
Specific technical solution is as follows:
A kind of more wafer size rotation clamping devices, including rotary chuck, compatible grip block, high-order chip briquetting, a high position
Wafer support column, middle position chip briquetting, middle position wafer support column, low level chip briquetting, low level wafer support column and rotating electric machine
Component；
The compatible grip block is in hierarchic structure, is divided into high-rise cascaded surface, middle layer cascaded surface, low layer cascaded surface；
The high position chip briquetting, middle position chip briquetting and low level chip briquetting are separately mounted to high-rise ladder by shaft
Face, middle layer cascaded surface, on low layer cascaded surface；
The high position wafer support column, middle position wafer support column and low level wafer support column are separately mounted to high-rise ladder
Face, middle layer cascaded surface, on low layer cascaded surface, and be located at high-order chip briquetting, middle position chip briquetting and it is low be the one of chip briquetting
Side；
The rotary chuck upper surface is equipped with lightening hole, and compatible grip block is fixed on rotary chuck；
The rotary chuck lower end is connect with rotating electric machine；
The high position chip briquetting, middle position chip briquetting, low level chip briquetting are generated by rotary chuck rotary motion
Centrifugal force, position of centre of gravity variation, is respectively consolidated large-sized wafer, middle wafer size and small size chip by the cooperation of shaft
It is fixed.
A kind of more wafer sizes rotate clamping device, and preferred embodiment is that the rotary chuck can be according to practical need
Design several Lightened structures.
A kind of more wafer sizes rotate clamping device, and preferred embodiment is that the compatible grip block can be according to compatibility
The quantity of the number of species setting ladder of chip.
A kind of more wafer sizes rotate clamping device, and preferred embodiment is that the compatible grip block circle distribution exists
On rotary chuck, optimal number is three compatible grip blocks in 120 ° of angle distributions with angle, can set number according to actual needs
Amount and angle.
High-order chip briquetting, middle position chip briquetting and low level chip briquetting are mounted on compatible grip block using shaft, and
And it can be rotated by shaft.Guarantee in rotary chuck stationary state, high-order chip briquetting, middle position chip briquetting and low level chip
The location status of briquetting not with transport mechanism be sent into crystal plate interference, in rotary chuck rotation status, high-order chip briquetting, in
The location status of position chip briquetting and low level chip briquetting changes under the influence of centrifugal force, reaches and pushes down large scale crystalline substance
The effect of piece, middle wafer size and small size chip.
A kind of working principle of more wafer size rotation clamping devices: when equipment needs to handle large-sized wafer, by passing
Send mechanism that large-sized wafer is sent into mechanism of the present invention, high-order wafer support column plays the role of supporting large-sized wafer, to
Large-sized wafer place it is steady after, rotating electric machine component starts to drive rotary chuck rotation, at the same high-order chip briquetting by from
Mental and physical efforts, position of centre of gravity change, and by the effect of shaft, large-sized wafer is fixed, and so on, wafer size in processing
It is also such with processing small size chip.
The utility model has the beneficial effects that the utility model structure is simple, save the cost.By changing compatible grip block
Structure can be compatible with clamping sizes chip according to actual needs, occupy little space, and compatible performance is good.Utilize rotary motion
The centrifugal force of generation, to achieve the purpose that fixed wafer, good clamping effect.Therefore there is great social benefit using this structure
And economic benefit.
Detailed description of the invention
Fig. 1 is a kind of more wafer size rotation clamping structural scheme of mechanism；
Fig. 2 is that transport mechanism is sent into large-sized wafer, and mechanism of the present invention remains static at this time, not to large-sized wafer
Play fixed function schematic diagram；
Fig. 3 is that rotating electric machine drives rotary chuck rotation, and high-order chip briquetting is subject to centrifugal forces, location status hair
Changing plays the role of fixed large-sized wafer schematic diagram；
Fig. 4 is that rotating electric machine drives rotary chuck rotation, and high-order chip briquetting is subject to centrifugal forces, location status hair
Changing plays the role of wafer size schematic diagram in fixed；
Fig. 5 is that rotating electric machine drives rotary chuck rotation, and high-order chip briquetting is subject to centrifugal forces, location status hair
Changing plays the role of fixed small size chip schematic diagram.
In figure, 1 is rotary chuck, and 2 be compatible grip block, and 3 be high-order chip briquetting, and 4 be high-order wafer support column, and 5 are
Middle position chip briquetting, 6 be middle position wafer support column, and 7 be low level chip briquetting, and 8 be low level wafer support column, and 9 be rotating electric machine
Component, 10 be high-rise cascaded surface, and 11 be middle layer cascaded surface, and 12 be low layer cascaded surface, and 13 be shaft, and 14 be large-sized wafer, 15
It is small size chip for middle wafer size, 16.
Specific embodiment
A kind of more wafer sizes rotate clamping device, including rotary chuck 1, compatible grip block 2, a high position as shown in Figs. 1-5
Chip briquetting 3, high-order wafer support column 4, middle position chip briquetting 5, middle position wafer support column 6, low level chip briquetting 7, low level are brilliant
Piece support column 8 and rotating electric machine 9；
The compatible grip block 2 is in hierarchic structure, is divided into high-rise cascaded surface 10, middle layer cascaded surface 11, low layer cascaded surface 12；
The high position chip briquetting 3, middle position chip briquetting 5 and low level chip briquetting 7 are separately mounted to height by shaft 13
Layer cascaded surface 10, middle layer cascaded surface 11, on low layer cascaded surface 12；
The high position wafer support column 4, middle position wafer support column 6 and low level wafer support column 8 are separately mounted to high-rise rank
Tread 10, middle layer cascaded surface 11 on low layer cascaded surface 12, and are located at high-order chip briquetting 3, middle position chip briquetting 5 and low for crystalline substance
The side of piece briquetting 7；
1 upper surface of rotary chuck is equipped with lightening hole, and compatible grip block 2 is fixed on rotary chuck 1；
1 lower end of rotary chuck is connect with rotating electric machine 9；
The high position chip briquetting 3, middle position chip briquetting 5, low level chip briquetting 7 are produced by 1 rotary motion of rotary chuck
Raw centrifugal force, position of centre of gravity variation, by the cooperation of shaft 13 respectively by large-sized wafer 14, middle wafer size 15 and small ruler
Very little chip 16 is fixed.
The rotary chuck 1 can design several Lightened structures according to actual needs.
The compatible grip block 2 can set the quantity of ladder according to the number of species of compatible wafer.
For 2 circle distribution of compatible grip block on rotary chuck 1, optimal number is three compatible grip blocks 2 with angle
It is distributed in 120 ° of angle, quantity and angle can be set according to actual needs.
High-order chip briquetting 3, middle position chip briquetting 5 and low level chip briquetting 7 are mounted on compatible grip block 2 using shaft 13
On, and can be rotated by shaft 13.Guarantee in 1 stationary state of rotary chuck, high-order chip briquetting 3, middle position chip briquetting 5
And the crystal plate interference that the location status of low level chip briquetting 7 is not sent into transport mechanism, it is high in 1 rotation status of rotary chuck
The location status of position chip briquetting 3, middle position chip briquetting 5 and low level chip briquetting 7 changes under the influence of centrifugal force, reaches
To the effect for pushing down large-sized wafer 14, middle wafer size 15 and small size chip 16.
A kind of working principle of more wafer size rotation clamping devices: when equipment needs to handle large-sized wafer 14, by
Large-sized wafer 14 is sent into mechanism of the present invention by transport mechanism, and high-order wafer support column 4 plays support large-sized wafer 14
Effect, after large-sized wafer 14 is placed steadily, rotating electric machine component 9 starts that rotary chuck 1 is driven to rotate, while high-order chip
Briquetting 3 is changed by centrifugal force, position of centre of gravity, by the effect of shaft 13, large-sized wafer 14 is fixed, with such
It pushes away, wafer size 15 and processing small size chip 16 are also such in processing.
Claims (4)
1. a kind of more wafer sizes rotate clamping device, it is characterised in that: including rotary chuck, compatible grip block, high-order chip
Briquetting, high-order wafer support column, middle position chip briquetting, middle position wafer support column, low level chip briquetting, low level wafer support column and
Rotating electric machine component；
The compatible grip block is in hierarchic structure, is divided into high-rise cascaded surface, middle layer cascaded surface, low layer cascaded surface；
The high position chip briquetting, middle position chip briquetting and low level chip briquetting by shaft be separately mounted to high-rise cascaded surface,
On middle layer cascaded surface, low layer cascaded surface；
The high position wafer support column, middle position wafer support column and low level wafer support column be separately mounted to high-rise cascaded surface, in
On layer cascaded surface, low layer cascaded surface, and it is located at high-order chip briquetting, middle position chip briquetting and the low side for chip briquetting；
The rotary chuck upper surface is equipped with lightening hole, and compatible grip block is fixed on rotary chuck；
The rotary chuck lower end is connect with rotating electric machine；
The centrifugation that the high position chip briquetting, middle position chip briquetting, low level chip briquetting are generated by rotary chuck rotary motion
Power, position of centre of gravity variation, is respectively fixed large-sized wafer, middle wafer size and small size chip by the cooperation of shaft.
2. a kind of more wafer sizes as described in claim 1 rotate clamping device, it is characterised in that: the rotary chuck can root
Several Lightened structures are designed according to actual needs.
3. a kind of more wafer sizes as described in claim 1 rotate clamping device, it is characterised in that: the compatible grip block can
The quantity of ladder is set according to the number of species of compatible wafer.
4. a kind of more wafer sizes as described in claim 1 rotate clamping device, it is characterised in that: the compatible grip block circle
Week is distributed on rotary chuck, and optimal number is three compatible grip blocks in 120 ° of angle distributions with angle, can be according to practical need
Set quantity and angle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822197170.XU CN209190607U (en) | 2018-12-26 | 2018-12-26 | A kind of more wafer size rotation clamping devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822197170.XU CN209190607U (en) | 2018-12-26 | 2018-12-26 | A kind of more wafer size rotation clamping devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209190607U true CN209190607U (en) | 2019-08-02 |
Family
ID=67430325
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822197170.XU Active CN209190607U (en) | 2018-12-26 | 2018-12-26 | A kind of more wafer size rotation clamping devices |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209190607U (en) |
-
2018
- 2018-12-26 CN CN201822197170.XU patent/CN209190607U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information |
Inventor after: Wei Meng Inventor before: Zhang Shuang Inventor before: Wei Meng |
|
| CB03 | Change of inventor or designer information |