CN209161920U - A kind of circuit lead frame electroplating tape - Google Patents
A kind of circuit lead frame electroplating tape Download PDFInfo
- Publication number
- CN209161920U CN209161920U CN201821381179.XU CN201821381179U CN209161920U CN 209161920 U CN209161920 U CN 209161920U CN 201821381179 U CN201821381179 U CN 201821381179U CN 209161920 U CN209161920 U CN 209161920U
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- adhesive tape
- parent roll
- pet film
- lead frame
- thickness
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Abstract
The utility model discloses a kind of circuit lead frame electroplating tapes; belong to tape technology field; including protective shell, adhesive tape parent roll and anti-deformation pipe; the inside of adhesive tape parent roll includes the PET film as substrate, non-silicon mould release and low viscous condensed type organic silicon pressure sensitive adhesive; non-silicon mould release is coated in the back side of PET film; another side of the low viscous condensed type organic silicon pressure-sensitive adhesives in PET film; anti-deformation pipe is mounted on the innermost layer of adhesive tape parent roll; protective shell is mounted on the outermost layer of adhesive tape parent roll, and the inside of protective shell is equipped with rotary column.The utility model passes through the backside coating non-silicon mould release in PET film, front surface coated organic pressure-sensitive gel, not only it had solved the problems, such as that silicone pressure sensitive adhesive tape uncoiling was big, but also has taken full advantage of silicone pressure sensitive adhesive tape acid and alkali-resistance feature resistant to high temperature, and met requirement of the lead frame plating to adhesive tape.
Description
Technical field
The utility model relates to a kind of organosilicons, and masking tape is electroplated, more particularly to a kind of circuit lead frame electricity
Adhesive tape is plated, tape technology field is belonged to.
Background technique
Currently, the gradually attention with country to IC industry, lead frame matched with integrated circuit also will
Fast development is welcome, lead frame electroplating tape is currently to apply 5 μ -10 μ acrylate pressure sensitive adhesives using 25 μ PET films and be made,
Due to there is strong acid and strong base etch in electroplating process, finally also need with 120 DEG C high-temperature baking 5 minutes, current existing acrylic acid
PET film adhesive tape has the case where residue glue, especially autumn and winter to convert the time after often will appear edge leakage electroplate liquid and high temperature, by
It is unstable in tape performance, it often will cause a large amount of copper strips and scrap.For the defect for solving above-mentioned adhesive tape, our company research staff warp
A large number of experiments is crossed, a kind of organic silicon high-temperature electroplating tape is had developed, efficiently solves the problems, such as adhesive tape stability.
Utility model content
The main purpose of the utility model is to provide for a kind of circuit lead frame electroplating tape, in PET film
Backside coating non-silicon mould release, front surface coated organic pressure-sensitive gel, adhesive tape parent molding after, adhesive tape parent inside fill
Anti-deformation pipe, then adhesive tape parent is fitted into protective shell, not only solve the problems, such as that silicone pressure sensitive adhesive tape uncoiling is big, but also sufficiently benefit
With silicone pressure sensitive adhesive tape acid and alkali-resistance feature resistant to high temperature, requirement of the lead frame plating to adhesive tape is met.
The purpose of this utility model can reach by using following technical solution:
A kind of circuit lead frame electroplating tape, including protective shell, adhesive tape parent roll and anti-deformation pipe, the adhesive tape are female
The inside of volume includes that the PET film as substrate, non-silicon mould release and low viscous condensed type organic silicon pressure sensitive adhesive, the non-silicon are release
Agent is coated in the back side of the PET film, and the low viscous condensed type organic silicon pressure-sensitive adhesives are in the another of the PET film
Face, the anti-deformation pipe are mounted on the innermost layer of the adhesive tape parent roll, and the protective shell is mounted on the outermost of the adhesive tape parent roll
The inside of layer, the protective shell is equipped with rotary column.
Preferably, the anti-deformation pipe is mounted on the innermost layer of the adhesive tape parent roll, and the protective shell is mounted on the glue
Outermost layer with parent roll.
Preferably, the PET film with a thickness of 20 μm -25 μm, the thickness of the low viscous condensed type organic silicon pressure sensitive adhesive
It is 5 μm -10 μm.
Preferably, the peeling force of the adhesive tape parent roll is 150g-300g/25mm, and winding width is 1000mm.
Preferably, the PET film with a thickness of 20 μm and the low viscous condensed type organic silicon pressure sensitive adhesive with a thickness of 5 μm
The overall thickness of manufactured adhesive tape parent roll is 25 μm, peeling force 150g-200g/25mm.
Preferably, the PET film with a thickness of 20 μm and the low viscous condensed type organic silicon with a thickness of 10 μm are pressure-sensitive
The overall thickness of adhesive tape parent roll made of glue is 30 μm, peeling force 200g-300g/25mm.
Preferably, the PET film with a thickness of 25 μm and the low viscous condensed type organic silicon with a thickness of 10 μm are pressure-sensitive
The overall thickness of adhesive tape parent roll made of glue is 35 μm, peeling force 200g-300g/25mm.
Preferably, the diameter of the protective shell is greater than the outer diameter of adhesive tape parent roll, and the protective shell is that side has opening
There is lid cylindrical structure.
Preferably, the anti-deformation pipe is hollow cylindrical structure, and the anti-deformation pipe sleeve is in the outside of the rotary column.
The advantageous effects of the utility model: circuit lead frame electroplating tape provided by the utility model leads to
The backside coating non-silicon mould release in PET film is crossed, front surface coated organic pressure-sensitive gel had both solved silicone pressure sensitive adhesive tape and opened
Big problem is rolled up, and takes full advantage of silicone pressure sensitive adhesive tape acid and alkali-resistance feature resistant to high temperature, meets lead frame plating pair
The requirement of adhesive tape.
Detailed description of the invention
Fig. 1 is the adhesive tape parent roll according to a preferred embodiment of the circuit lead frame electroplating tape of the utility model
Sectional view；
Fig. 2 is the top view according to a preferred embodiment of the circuit lead frame electroplating tape of the utility model；
Fig. 3 is the main view according to a preferred embodiment of the circuit lead frame electroplating tape of the utility model；
Fig. 4 is the protective shell according to a preferred embodiment of the circuit lead frame electroplating tape of the utility model
Sectional view；
Fig. 5 is to show according to the protective shell of a preferred embodiment of the circuit lead frame electroplating tape of the utility model
It is intended to.
In figure: 1-PET film, 2- non-silicon mould release, the low viscous condensed type organic silicon pressure sensitive adhesive of 3-, 4- anti-deformation pipe, 5- are protected
Protective case, 6- adhesive tape parent roll, 7- rotary column.
Specific embodiment
To make the more clear and clear the technical solution of the utility model of those skilled in the art, below with reference to embodiment and
Attached drawing is described in further detail the utility model, and however, the embodiments of the present invention are not limited thereto.
As Figure 1-Figure 5, circuit lead frame electroplating tape provided in this embodiment, including protective shell 5, adhesive tape
Parent roll 6 and anti-deformation pipe 4, the inside of adhesive tape parent roll 6 include the PET film 1 as substrate, non-silicon mould release 2 and low viscous condensation
Type organic pressure-sensitive gel 3, non-silicon mould release 2 are coated in the back side of PET film 1, and low viscous condensed type organic silicon pressure sensitive adhesive 3 is coated in
The another side of PET film 1, anti-deformation pipe 4 are mounted on the innermost layer of adhesive tape parent roll 6, and protective shell 5 is mounted on adhesive tape parent roll 6 most
The inside of outer layer, protective shell 5 is equipped with rotary column 7.
In the present embodiment, as shown in Figures 2 and 3, it in order to which adhesive tape parent roll 6 not will receive deformation when in use, is equipped with anti-
Deformation tube 4, anti-deformation pipe 4 are mounted on the innermost layer of adhesive tape parent roll 6, convenient for protective glue band parent roll 6, and in order to which adhesive tape parent roll 6 exists
It will receive damage when not in use, be equipped with protective shell 5, protective shell 5 is mounted on the outermost layer of adhesive tape parent roll 6.
In the present embodiment, as shown in Figure 1, for ease of use, being convenient for adhesive tape uncoiling uniform, 20 μm -25 μm are selected
PET film 1 is substrate, and to reach required purpose, non-silicon mould release 2 is coated in the back side of PET film 1, and low viscous condensed type has
Machine silicon pressure sensitive adhesive 3 is coated in the another side of PET film 1, can reach the peeling force of needs, when to use adhesive tape parent roll 6
Lead frame can be effectively bonded and thickness not interfere with lead frame, PET film 1 with a thickness of 20 μm -25 μm, low viscous contracting
Mould assembly organic pressure-sensitive gel 3 with a thickness of 5 μm -10 μm.
In the present embodiment, as shown in Figure 1, the peeling force of adhesive tape parent roll 6 is 150g-300g/25mm, winding width is
1000mm, while facilitating production also can it is easy to produce after by 6 slitting of adhesive tape parent roll.
In the present embodiment, as shown in Figure 1, the PET film 1 with a thickness of 20 μm and the low viscous condensed type with a thickness of 5 μm have
The overall thickness of adhesive tape parent roll 6 made of machine silicon pressure sensitive adhesive 3 is 25 μm, peeling force 150g-200g/25mm, this adhesive tape parent roll 6
Adhesive tape viscosity it is slightly relatively low, be suitble to use in spring and summer.
In the present embodiment, as shown in Figure 1, the PET film 1 with a thickness of 20 μm and the low viscous condensed type with a thickness of 10 μm have
The overall thickness of adhesive tape parent roll 6 made of machine silicon pressure sensitive adhesive 3 is 30 μm, peeling force 200g-300g/25mm, this adhesive tape parent roll 6
Substrate it is soft, viscosity is moderate, the lead frame for being 15mm or more suitable for single shelter width.
In the present embodiment, as shown in Figure 1, the PET film 1 with a thickness of 25 μm and the low viscous condensed type with a thickness of 10 μm have
The overall thickness of adhesive tape parent roll 6 made of machine silicon pressure sensitive adhesive 3 is 35 μm, peeling force 200g-300g/25mm, this adhesive tape parent roll 6
Substrate it is slightly hard, but viscosity it is moderate, can be used for single shelter width be 15mm lead frame below.
In the present embodiment, as shown in Figures 2 and 3, in order to enable adhesive tape parent roll 6 will not deform when using, anti-deformation pipe 4
It is mounted on the innermost layer of adhesive tape parent roll 6, that is, having reached prevents the indeformable purpose of adhesive tape parent roll 6 from will not influence adhesive tape parent roll again
6 use, and in order to which when not using adhesive tape parent roll 6, adhesive tape parent roll 6 will not be protected by unnecessary damage or destruction
Shell 5 is mounted on the outermost layer of adhesive tape parent roll 6, convenient for protective glue band parent roll 6.
In the present embodiment, as shown in figure 5, being that adhesive tape parent roll 6 is enabled smoothly to put into protective shell 5, protective shell 5 it is straight
Diameter is greater than the outer diameter of adhesive tape parent roll 6, and protective shell 5 be side have an opening have a lid cylindrical structure, from 5 side of protection cap when use
The opening in face takes out adhesive tape parent roll 6.
In the present embodiment, it as shown in figure 5, in order not to deform adhesive tape parent roll 6, sets up defences change in the inside of adhesive tape parent roll 6
Shape pipe 4, anti-deformation pipe 4 are hollow cylindrical structure, and anti-deformation pipe 4 drives adhesive tape parent roll 6 to revolve on rotary column 7 when convenient to use
Turn, and 4 sets of the anti-deformation pipe outsides in rotary column 7,4 sets of the anti-deformation pipe outsides in rotary column 7 are by the lid for opening protective shell 5
It can.
In the present embodiment, as Figure 1-Figure 5, the work of circuit lead frame electroplating tape provided in this embodiment
It is as follows to make process:
Step 1: the PET film 1 for selecting 20 μm -25 μm is substrate, in the backside coating non-silicon mould release 2 of PET film 1,
It is uniform convenient for adhesive tape uncoiling；
Step 2: the low viscous condensed type organic silicon pressure sensitive adhesive 3 for being 5 μm -10 μm in the another side coating thickness of PET film 1,
The peeling force that pressure sensitive adhesive tape is made is about 150g-300g/25mm, and being wound into width is 1000mm, and length is 3000M's or so
Adhesive tape parent roll 6；
Step 3: at width being 40mm-80mm by 6 slitting of adhesive tape parent roll, length is the product volume of 3000M or so, product volume
Length also needs 3000M or so, in order to which automatic film applicator is worked continuously, improves production efficiency；
Step 4: the innermost layer for the adhesive tape parent roll 6 that slitting is terminated installs anti-deformation pipe 4, then by anti-deformation pipe 4 with glue
Outside with 6 sets of parent roll in rotary column 7, and cover tightly the lid of protective shell 5；
Step 5: in use, taking out adhesive tape parent roll 6 from the opening of protection cap 5, anti-deformation pipe 4 drives adhesive tape parent roll 6 to exist
It is rotated on rotary column 7.
In conclusion in the present embodiment, circuit lead frame electroplating tape provided in this embodiment, by
It is big both to have solved silicone pressure sensitive adhesive tape uncoiling for the backside coating non-silicon mould release of PET film, front surface coated organic pressure-sensitive gel
The problem of, and silicone pressure sensitive adhesive tape acid and alkali-resistance feature resistant to high temperature is taken full advantage of, lead frame plating is met to adhesive tape
Requirement while, effective protection adhesive tape itself makes that its is not damaged, is not contaminated.
The above, only the utility model further embodiment, but the protection scope of the utility model is not limited to
In this, anyone skilled in the art is according to the present utility model in range disclosed in the utility model
Technical solution and its design are subject to equivalent substitution or change, belong to the protection scope of the utility model.
Claims (8)
1. a kind of circuit lead frame electroplating tape, including protective shell (5), adhesive tape parent roll (6) and anti-deformation pipe (4),
Be characterized in that: the inside of the adhesive tape parent roll (6) includes the PET film (1) as substrate, non-silicon mould release (2) and low viscous contracting
Mould assembly organic pressure-sensitive gel (3), the non-silicon mould release (2) are coated in the back side of the PET film (1), the low viscous condensation
Type organic pressure-sensitive gel (3) is coated in the another side of the PET film (1), and it is female that the anti-deformation pipe (4) is mounted on the adhesive tape
The innermost layer of (6) is rolled up, the protective shell (5) is mounted on the outermost layer of the adhesive tape parent roll (6), the inside of the protective shell (5)
Equipped with rotary column (7).
2. a kind of circuit lead frame electroplating tape according to claim 1, it is characterised in that: the PET film
(1) with a thickness of 20 μm -25 μm, the low viscous condensed type organic silicon pressure sensitive adhesive (3) with a thickness of 5 μm -10 μm.
3. a kind of circuit lead frame electroplating tape according to claim 1, it is characterised in that: the adhesive tape parent roll
(6) peeling force is 150g-300g/25mm, and winding width is 1000mm.
4. a kind of circuit lead frame electroplating tape according to claim 3, it is characterised in that: with a thickness of 20 μm
Adhesive tape parent roll (6) made of the PET film (1) and the low viscous condensed type organic silicon pressure sensitive adhesive (3) with a thickness of 5 μm it is total
With a thickness of 25 μm, peeling force 150g-200g/25mm.
5. a kind of circuit lead frame electroplating tape according to claim 4, it is characterised in that: with a thickness of 20 μm
Adhesive tape parent roll (6) made of the PET film (1) and the low viscous condensed type organic silicon pressure sensitive adhesive (3) with a thickness of 10 μm
Overall thickness is 30 μm, peeling force 200g-300g/25mm.
6. a kind of circuit lead frame electroplating tape according to claim 5, it is characterised in that: with a thickness of 25 μm
Adhesive tape parent roll (6) made of the PET film (1) and the low viscous condensed type organic silicon pressure sensitive adhesive (3) with a thickness of 10 μm
Overall thickness is 35 μm, peeling force 200g-300g/25mm.
7. a kind of circuit lead frame electroplating tape according to claim 1, it is characterised in that: the protective shell
(5) diameter is greater than the outer diameter of adhesive tape parent roll (6), and the protective shell (5) be side have an opening have lid cylindrical structure.
8. a kind of circuit lead frame electroplating tape according to claim 1, it is characterised in that: the anti-deformation pipe
It (4) is hollow cylindrical structure, and the anti-deformation pipe (4) is covered in the outside of the rotary column (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821381179.XU CN209161920U (en) | 2018-08-27 | 2018-08-27 | A kind of circuit lead frame electroplating tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821381179.XU CN209161920U (en) | 2018-08-27 | 2018-08-27 | A kind of circuit lead frame electroplating tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209161920U true CN209161920U (en) | 2019-07-26 |
Family
ID=67330162
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821381179.XU Active CN209161920U (en) | 2018-08-27 | 2018-08-27 | A kind of circuit lead frame electroplating tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209161920U (en) |
-
2018
- 2018-08-27 CN CN201821381179.XU patent/CN209161920U/en active Active
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