CN209143890U - A kind of electroplating wastewater novel process system - Google Patents
A kind of electroplating wastewater novel process system Download PDFInfo
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- CN209143890U CN209143890U CN201821236769.3U CN201821236769U CN209143890U CN 209143890 U CN209143890 U CN 209143890U CN 201821236769 U CN201821236769 U CN 201821236769U CN 209143890 U CN209143890 U CN 209143890U
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- pipe
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- membrane cisterna
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- pump
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Abstract
The utility model provides a kind of electroplating wastewater novel process system, belong to technical field of wastewater recovery, including membrane cisterna, setting film I and film II inside the membrane cisterna, the setting of film I is in II left side of film, film I and II top of film are connected by pipeline with blast pipe, and the blast pipe left end is stretched out membrane cisterna and is fixedly connected with air blower.The hollow film wire filtering of the hydrophily that metallic colloid via hole diameter in membrane cisterna in electroplating wastewater is 0.1 micron, nickel content in waste water is reduced to 0.05 milligrams per liter or less from 0.2-0.5 milligrams per liter, the metallic colloid content in waste water is greatly reduced, waste water treatment efficiency is improved；Chemical cleaning is carried out to water inlet pipe by cleaning pump and cleaning pipe, guarantees the unimpeded of water inlet pipe, prevents from blocking；Metallic colloid is filtered with sloping plate deposition system in advance by chemical flocculation system, while reducing nickel content, sludge content can also be reduced to 40%-50%.
Description
Technical field
The utility model relates to a kind of waste water reclamation apparatus, specifically a kind of electroplating wastewater novel process system.
Background technique
With the development of industrial technology, the products application containing nickel element is more and more extensive, a wide range of use of these products
Cause to produce a large amount of nickel-containing waste water, these waste water are due to containing element Ni, and be otherwise known as heavy metal wastewater thereby.Heavy metal
Ni element and OH root knot in waste water close, and form basoid substance.In view of the high toxicity of Ni element, nickel-containing waste water is before discharging
Processing is had to pass through, waste water or earth's surface water quality standard are reached.
It is chemical coagulation process that Ni-containing Plating Wastewater commonly uses treatment process at present, is discharged nickel content 0.2-0.5ppm, although going out
Water is transparent but nickel content is higher than the 0.1ppm of environmental requirement, and reason is divided into colloid form in alkaline case lower part for heavy metal, micro-
Grain diameter is 1nm-100nm.
Summary of the invention
In view of the above shortcomings of the prior art, the technical problem to be solved by the present invention is to provide a kind of electroplating wastewater is new
Type processing system.
In order to solve the above technical problems, the utility model provides following technical solution:
A kind of electroplating wastewater novel process system, including membrane cisterna；Inclined plate is connected to by waste water outlet pipe above the membrane cisterna
Settling system；It is fixedly connected by pipeline with chemical flocculation system above the sloping plate deposition system；The chemical flocculation system
Top is connected to waste water inlet pipe；Setting film I and film II inside the membrane cisterna；The setting of film I is on II left side of film, film I and film II
Fang Jun is connected by pipeline with blast pipe；The blast pipe left end is stretched out membrane cisterna and is fixedly connected with air blower；The film I and film
II lower section is connected by pipeline with water inlet pipe；The water inlet pipe left end is stretched out membrane cisterna and is fixedly connected with self priming pump；It is described from
Outlet pipe is fixedly connected on the left of sucking pump；Enters mud pipe is communicated on the left of the membrane cisterna；Enters mud pipe left end bottom is fixedly connected
There is the first sludge pump；The first sludge pipe is fixedly connected with below first sludge pump；It is also communicated on the right side of first sludge pipe
Circulation pipe；The circulation pipe right end protrudes into inside membrane cisterna, is provided with valve on circulation pipe and the first sludge pipe；The membrane cisterna bottom
Portion is connected by pipeline with the second sludge pump；The second sludge pipe is fixedly connected with below second sludge pump；First spoil disposal
Pipe is connected to the second sludge pipe.
As the further improvement project of the utility model: further including cleaning pump, the cleaning pump is arranged under self priming pump
Side.
As the further improvement project of the utility model: being connected to water inlet pipe by cleaning pipe on the right side of the cleaning pump.
As the utility model further improvement project: the film I and film II are that 0.1 micron of hydrophily is hollow
Film wire.
Compared with prior art, the utility model has the beneficial effects that
1. the hollow film wire filtering of the hydrophily that the metallic colloid via hole diameter in membrane cisterna in electroplating wastewater is 0.1 micron, will give up
In water nickel content be reduced to from 0.2-0.5 milligrams per liter 0.05 milligrams per liter hereinafter, greatly reducing the metallic colloid in waste water
Content improves waste water treatment efficiency；
2. injecting air-flow into film I and film II by air blower, air-flow applies pressure appropriate to waste water, to accelerate
Waste water passes through film I and film II；
3. carrying out chemical cleaning to water inlet pipe by cleaning pump and cleaning pipe, guarantees the unimpeded of water inlet pipe, prevent from blocking.
4. being filtered in advance with sloping plate deposition system to metallic colloid by chemical flocculation system, nickel content is reduced
Meanwhile sludge content can also be reduced to 40%-50%.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of electroplating wastewater novel process system；
In figure: 1- membrane cisterna, 2- blower, 3- blast pipe, 4- film I, 5- film II, 6- water inlet pipe, 7- self priming pump, 8- enters mud pipe,
9- outlet pipe, 10- cleaning pipe, 11- cleaning pump, the first sludge pump of 12-, 13- circulation pipe, the first sludge pipe of 14-, 15- second row
Dredge pump, the second sludge pipe of 16-, 17- sloping plate deposition system, 18- waste water outlet pipe, 19- chemical flocculation system, 20- waste water inlet pipe.
Specific embodiment
The technical solution of the patent is explained in further detail With reference to embodiment.
The embodiment of this patent is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, and is only used for explaining this patent, and cannot be understood as a limitation of this patent.
In the description of this patent, it is to be understood that term " center ", "upper", "lower", "front", "rear", " left side ",
The orientation or positional relationship of the instructions such as " right side ", "vertical", "horizontal", "top", "bottom", "inner", "outside" is based on the figure
Orientation or positional relationship, be merely for convenience of description this patent and simplify description, rather than the device of indication or suggestion meaning or
Element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as the limitation to this patent.
In the description of this patent, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection ", " setting " shall be understood in a broad sense, for example, it may be being fixedly linked, being arranged, may be a detachable connection, set
It sets, or is integrally connected, is arranged.For the ordinary skill in the art, above-mentioned art can be understood as the case may be
The concrete meaning of language in this patent.
Embodiment 1
Referring to Fig. 1, present embodiments providing a kind of electroplating wastewater novel process system, including membrane cisterna 1；The membrane cisterna 1
Top is connected to sloping plate deposition system 17 by waste water outlet pipe 18；It is wadded a quilt with cotton above the sloping plate deposition system 17 by pipeline and chemistry
Solidifying system 19 is fixedly connected；Waste water inlet pipe 20 is connected to above the chemical flocculation system 19；I 4 He of film is set inside the membrane cisterna 1
Film II 5；The setting of film I 4 is connected by pipeline with blast pipe 3 in II 5 left side of film, film I 4 and II 5 top of film；It is described into
3 left end of air hose is stretched out membrane cisterna 1 and is fixedly connected with air blower 2；The film I 4 and II 5 lower section of film pass through pipeline and 6 phase of water inlet pipe
Connection；6 left end of water inlet pipe is stretched out membrane cisterna 1 and is fixedly connected with self priming pump 7；Water outlet is fixedly connected on the left of the self priming pump 7
Pipe 9；Enters mud pipe 8 is communicated on the left of the membrane cisterna 1；The 8 left end bottom of enters mud pipe is fixedly connected with the first sludge pump 12；It is described
The first sludge pipe 14 is fixedly connected with below first sludge pump 12；First sludge pipe, 14 right side is also communicated with circulation pipe 13；Institute
It states 13 right end of circulation pipe to protrude into inside membrane cisterna 1, is provided with valve on circulation pipe 13 and the first sludge pipe 14；1 bottom of membrane cisterna
Portion is connected by pipeline with the second sludge pump 15；The second sludge pipe 16 is fixedly connected with below second sludge pump 15；Described
One sludge pipe 14 is connected to the second sludge pipe 16；The film I 4 and film II 5 are 0.1 micron of the hollow film wire of hydrophily, membrane cisterna 1
Metallic colloid in interior electroplating wastewater is filtered through film I 4 and film II 5, and nickel content in waste water is reduced to from 0.2-0.5 milligrams per liter
0.05 milligrams per liter hereinafter, greatly reduce the metallic colloid content in waste water；It is infused by air blower 2 into film I 4 and film II 5
Enter air-flow, air-flow applies pressure appropriate to waste water, so that waste water be accelerated to pass through film I 4 and film II 5, filtered waste water is by certainly
Sucking pump 7 is discharged, and the sludge residue in membrane cisterna 1 is discharged by the first sludge pump 12 and the second sludge pump 15；
Embodiment 2
Referring to Fig. 1, being also additionally arranged cleaning pump 11 on the basis of embodiment 1 in the present embodiment；The cleaning pump 11 is set
It sets below self priming pump 7；Water inlet pipe 6 is connected to by cleaning pipe 10 on the right side of the cleaning pump 11, passes through cleaning pump 11 and cleaning
Pipe 10 carries out chemical cleaning to water inlet pipe 6, guarantees the unimpeded of water inlet pipe 6, prevents from blocking.
The working principle of the utility model is: the metallic colloid in membrane cisterna 1 in electroplating wastewater is filtered through film I 4 and film II 5,
Nickel content in waste water is reduced to from 0.2-0.5 milligrams per liter 0.05 milligrams per liter hereinafter, greatly reducing the metal in waste water
Colloidal content；Air-flow is injected into film I 4 and film II 5 by air blower 2, air-flow applies pressure appropriate to waste water, to accelerate
Waste water passes through film I 4 and film II 5, and filtered waste water is discharged by self priming pump 7, and the sludge residue in membrane cisterna 1 is by the first sludge pump 12
It is discharged with the second sludge pump 15；Chemical cleaning is carried out to water inlet pipe 6 by cleaning pump 11 and cleaning pipe 10, guarantees water inlet pipe 6
It is unimpeded, it prevents from blocking；Metallic colloid is filtered with sloping plate deposition system 17 in advance by chemical flocculation system 19, reduces nickel
While content, sludge content can also be reduced to 40%-50%.
The preferred embodiment of the patent is described in detail above, but this patent is not limited to above-mentioned embodiment party
Formula within the knowledge of one of ordinary skill in the art can also be under the premise of not departing from this patent objective
It makes a variety of changes.
Claims (4)
1. a kind of electroplating wastewater novel process system, characterized in that including membrane cisterna (1)；Gone out above the membrane cisterna (1) by waste water
Pipe (18) is connected to sloping plate deposition system (17)；Pass through pipeline and chemical flocculation system above the sloping plate deposition system (17)
(19) it is fixedly connected；Waste water inlet pipe (20) are connected to above the chemical flocculation system (19)；Film I is set inside the membrane cisterna (1)
(4) and film II (5)；The film I (4) setting on the left of film II (5), above film I (4) and film II (5) by pipeline and
Blast pipe (3) is connected；Blast pipe (3) left end is stretched out membrane cisterna (1) and is fixedly connected with air blower (2)；The film I (4) and
It is connected by pipeline with water inlet pipe (6) below film II (5)；Membrane cisterna (1) and self priming pump are stretched out in water inlet pipe (6) left end
(7) it is fixedly connected；Outlet pipe (9) are fixedly connected on the left of the self priming pump (7)；Enters mud pipe is communicated on the left of the membrane cisterna (1)
(8)；Enters mud pipe (8) the left end bottom is fixedly connected with the first sludge pump (12)；It is fixed below first sludge pump (12)
Connect the first sludge pipe (14)；Circulation pipe (13) are also communicated on the right side of first sludge pipe (14)；The circulation pipe (13) is right
Membrane cisterna (1) inside is protruded at end, is provided with valve on circulation pipe (13) and the first sludge pipe (14)；Membrane cisterna (1) bottom is logical
Piping is connected with the second sludge pump (15)；The second sludge pipe (16) are fixedly connected with below second sludge pump (15)；It is described
First sludge pipe (14) is connected to the second sludge pipe (16).
2. a kind of electroplating wastewater novel process system according to claim 1, characterized in that further include cleaning pump (11)；
Cleaning pump (11) setting is below self priming pump (7).
3. a kind of electroplating wastewater novel process system according to claim 2, characterized in that on the right side of the cleaning pump (11)
Water inlet pipe (6) are connected to by cleaning pipe (10).
4. a kind of electroplating wastewater novel process system according to claim 2, characterized in that on the right side of the cleaning pump (11)
Water inlet pipe (6) are connected to by cleaning pipe (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821236769.3U CN209143890U (en) | 2018-08-02 | 2018-08-02 | A kind of electroplating wastewater novel process system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821236769.3U CN209143890U (en) | 2018-08-02 | 2018-08-02 | A kind of electroplating wastewater novel process system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209143890U true CN209143890U (en) | 2019-07-23 |
Family
ID=67264740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821236769.3U Active CN209143890U (en) | 2018-08-02 | 2018-08-02 | A kind of electroplating wastewater novel process system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209143890U (en) |
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2018
- 2018-08-02 CN CN201821236769.3U patent/CN209143890U/en active Active
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