CN209136327U - The film heating board structure of food cooking machine - Google Patents
The film heating board structure of food cooking machine Download PDFInfo
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- CN209136327U CN209136327U CN201821288580.9U CN201821288580U CN209136327U CN 209136327 U CN209136327 U CN 209136327U CN 201821288580 U CN201821288580 U CN 201821288580U CN 209136327 U CN209136327 U CN 209136327U
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- layer
- film heating
- heating board
- food cooking
- conductive resistive
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Abstract
The utility model discloses a kind of film heating board structure of food cooking machine, includes film heating board；The film heating board includes successively compound substrate layer, insulating layer, Conductive Resistive Layer, protective layer；The insulating layer is covered in the lower surface of substrate layer, and the Conductive Resistive Layer is the lower surface that insulating layer is set to through printing, and the protective layer is covered in the lower surface of Conductive Resistive Layer；And tool mounting hole is offered on the substrate layer, aforementioned dielectric layer, Conductive Resistive Layer correspond to the upper and lower surfaces that tool mounting hole is formed with the first relief hole entire film heating board so that tool mounting hole penetrates through on protective layer.Whereby, by carrying out improvement design to film heating board structure, heating efficiency and durability are improved, and, the installation of film heating board positioning becomes simple, suitable for being widely used on a variety of food cooking machines.
Description
Technical field
The utility model relates to food cooking machine field technology, the film fever for referring in particular to a kind of food cooking machine is hardened
Structure.
Background technique
The heating function of food cooking machine, some are heated using thick film heating plate, the thick film heating in traditional technology
Plate is difficult further to be promoted, affects the product quality of food cooking machine there are the defect that heating efficiency, durability etc. are limited to
And service life；In addition, installation of the thick film heating plate in food cooking machine in traditional technology is inconvenient, production is affected
Assemble process efficiency.
Therefore, in the utility model, applicant has studied intensively a kind of new technical solution to solve the above problems.
Utility model content
In view of this, the utility model is in view of the existing deficiencies of the prior art, main purpose is to provide a kind of food material
The film heating board structure of reason machine, by improving heating efficiency and durability to film heating board structure progress improvement design, with
And the installation positioning of film heating board becomes simple, suitable for being widely used on a variety of food cooking machines.
To achieve the above object, the utility model is using following technical solution:
A kind of film heating board structure of food cooking machine, includes film heating board；The film heating board includes successively multiple
Substrate layer, insulating layer, Conductive Resistive Layer, the protective layer of conjunction；The insulating layer is covered in the lower surface of substrate layer, the conductive electricity
Resistance layer is that the lower surface of insulating layer is set to through printing, and the protective layer is covered in the lower surface of Conductive Resistive Layer；And it is described
Offer tool mounting hole on substrate layer, aforementioned dielectric layer, Conductive Resistive Layer correspond to tool mounting hole on protective layer and be formed with
The upper and lower surfaces of first relief hole entire film heating board so that tool mounting hole penetrates through.
As a preferred embodiment, the substrate layer is metal plate, and the upper surface of the substrate layer corresponds to the week of substrate layer
The annular step surface for welding with pot body is recessed at edge.
As a preferred embodiment, the substrate layer is stainless steel plate.
As a preferred embodiment, the protective layer is ceramic protective layer.
As a preferred embodiment, Conductive Resistive Layer is electrically connected there are two reserving on the protective layer connects current potential.
As a preferred embodiment, the lower surface of the film heating board is welded with stud, and the upper end welding of the stud is solid
Due to the lower surface of substrate layer, the stud welding position that insulating layer, Conductive Resistive Layer, protective layer correspond to substrate layer is formed with second
Relief hole.
As a preferred embodiment, the Conductive Resistive Layer has around the arc track area of tool mounting hole arrangement
Domain remains with white space between the both ends in arc track region, and two connect current potential and correspond to white space setting；Aforementioned dielectric
Layer, protective layer have been respectively formed on third relief hole corresponding with current potential is connect.
The utility model has clear advantage and beneficial effect compared with prior art, specifically, by above-mentioned technology
Scheme it is found that its by film heating board structure carry out improvement design, improve heating efficiency and durability, and, film fever
The installation positioning of plate becomes simple, suitable for being widely used on a variety of food cooking machines.
For the structure feature and effect for more clearly illustrating the utility model, come with reference to the accompanying drawing with specific embodiment pair
The utility model is described in detail.
Detailed description of the invention
Fig. 1 is the perspective representation of the embodiment of the utility model；
Fig. 2 is another angle perspective representation of the embodiment of the utility model；
Fig. 3 is the decomposition texture diagram of the embodiment of the utility model；
Fig. 4 is the cross section structure diagram (not showing stud) of the embodiment of the utility model；
Fig. 5 is the substantially diagram that film heating board is installed with temperature sensor structure in the embodiment of the utility model.
Description of drawing identification:
400, film heating board 401, substrate layer
402, insulating layer 403, Conductive Resistive Layer
404, protective layer 405, tool mounting hole
406, contact 407, white space
408, arc track region 409, stud
410, pressing plate 411, temperature controller
412, fuse 413, tabletting
414, the first pressure holding arm 415, second presses arm
416, annular step surface.
Specific embodiment
It please refers to shown in Fig. 1 to Fig. 5, that show the specific structures of the embodiment of the utility model.
A kind of 400 structure of film heating board of food cooking machine includes that film heating board 400(is usually also referred to as thick film heating
Plate)；The film heating board 400 includes successively compound substrate layer 401, insulating layer 402, Conductive Resistive Layer 403, protective layer
404；Preferably, the protective layer 404 is ceramic protective layer.
Wherein, the insulating layer 402 is covered in the lower surface of substrate layer 401, and the Conductive Resistive Layer 403 is set through printing
Be placed in the lower surface of insulating layer 402, Conductive Resistive Layer 403 is the line chart of special construction arrangement, specifically can as shown in connection with fig. 3,
The line chart of Conductive Resistive Layer 403 is formed by connecting by multiple C-shaped lines, and line chart whole region is C-shaped, and wire structures are compact,
It is farthest routed on limited surface to improve calorific capacity；The protective layer 404 covers under Conductive Resistive Layer 403
Surface；Insulating layer 402 is for being isolated electric current.
Tool mounting hole 405, aforementioned dielectric layer 402, Conductive Resistive Layer 403, protective layer are offered on the substrate layer 401
Corresponded on 404 tool mounting hole 405 be formed with the first relief hole so that tool mounting hole 405 penetrates through entire film heating board 400
Upper and lower surfaces.The shape and size of tool mounting hole 405 can be according to needing to be arranged, to install corresponding cutter for processing
Food.
In the present embodiment, the substrate layer 401 is metal plate, it is preferable that the substrate layer 401 is stainless steel plate.It is described
The peripheral region that the upper surface of substrate layer 401 corresponds to substrate layer 401 is recessed with the annular step surface 416 for welding with pot body, this
Sample, pot body are welded in annular step surface 416, and the bottom wall upper surface of pot body keeps flushing with the upper surface of substrate layer 401, film hair
Hot plate 400 serves as most pot body bottom wall portion, it is ensured that the upper surface of the entire bottom wall of pot body flushes, improve pot body with
Firm welding degree between film heating board 400, water-impervious excellent performance, meanwhile, it is also easy to the cleaning operation to pot nside.
Conductive Resistive Layer 403 is electrically connected there are two reserving on the protective layer 404 connects current potential.The conductive resistance
Layer 403 has between the arc track region 408 that tool mounting hole 405 is arranged, the both ends in arc track region 408
White space 407 is remained with, two connect current potential and correspond to the setting of white space 407；Equal shape on aforementioned dielectric layer 402, protective layer 404
Cheng Youyu connects the corresponding third relief hole of current potential.The lower surface of the film heating board 400 is welded with stud 409, the stud 409
Upper end be fixedly welded on the lower surface of substrate layer 401, insulating layer 402, Conductive Resistive Layer 403, protective layer 404 correspond to substrate
The stud welding position of layer 401 is formed with the second relief hole.
And it is shown referring to figure 5., which show film heating boards 400 to be installed with temperature sensor structure substantially situation, generates heat in film
The lower surface of plate 400 is equipped with NTC temperature-sensing probe in assembling, generated heat using positioned at film for sensing the intracorporal temperature of pot
The pressing plate 410(such as ceramic platen of 400 lower section of plate) NTC temperature-sensing probe is pressed in the lower surface of film heating board 400, to ensure to feel
The accuracy of testing temperature, meanwhile, temperature controller 411, fuse 412 are pressed in the surface of 400 lower section of film heating board using tabletting 413
On, to play a protective role；Tabletting 413 is connected to the downside of pressing plate 410, and there is the first pressure holding arm 414, second to press arm for tabletting
415, the first pressure holding arm 414 pushes down fuse 412, and the second pressure holding arm 415 pushes down temperature controller 411.It is aforementioned to connect current potential design
For contact 406, power lead is pressed on two contacts 406 of Conductive Resistive Layer 403 by pressing plate 410, after powering on, so that film
Heating board 400 carries out consistent heat generation.
The design focal point of the utility model is, by carrying out improvement design to film heating board structure, improves fever
Efficiency and durability, and, the installation positioning of film heating board becomes simple, suitable for being widely used on a variety of food cooking machines.
The above descriptions are merely preferred embodiments of the present invention, not makees to the technical scope of the utility model
Any restrictions, therefore any trickle amendment made by the above technical examples according to the technical essence of the present invention, equivalent change
Change and modify, is still within the scope of the technical solutions of the present invention.
Claims (7)
1. a kind of film heating board structure of food cooking machine, it is characterised in that: include film heating board；The film heating board includes
There are successively compound substrate layer, insulating layer, Conductive Resistive Layer, protective layer；The insulating layer is covered in the lower surface of substrate layer, institute
Stating Conductive Resistive Layer is the lower surface that insulating layer is set to through printing, and the protective layer is covered in the lower surface of Conductive Resistive Layer；
And tool mounting hole is offered on the substrate layer, aforementioned dielectric layer, Conductive Resistive Layer correspond to cutter peace on protective layer
Dress hole is formed with the upper and lower surfaces of the first relief hole entire film heating board so that tool mounting hole penetrates through.
2. the film heating board structure of food cooking machine according to claim 1, it is characterised in that: the substrate layer is metal
Plate, the peripheral region that the upper surface of the substrate layer corresponds to substrate layer are recessed with the annular step surface for welding with pot body.
3. the film heating board structure of food cooking machine according to claim 1 or 2, it is characterised in that: the substrate layer is
Stainless steel plate.
4. the film heating board structure of food cooking machine according to claim 1, it is characterised in that: the protective layer is ceramics
Protective layer.
5. the film heating board structure of food cooking machine according to claim 1, it is characterised in that: reserved on the protective layer
There are two be electrically connected Conductive Resistive Layer to connect current potential.
6. the film heating board structure of food cooking machine according to claim 1, it is characterised in that: under the film heating board
Surface is welded with stud, and the upper end of the stud is fixedly welded on the lower surface of substrate layer, insulating layer, Conductive Resistive Layer, protection
The stud welding position that layer corresponds to substrate layer is formed with the second relief hole.
7. the film heating board structure of food cooking machine according to claim 5, it is characterised in that: the Conductive Resistive Layer tool
Have and remain with white space between the arc track region of tool mounting hole arrangement, the both ends in arc track region,
Two connect current potential and correspond to white space setting；Aforementioned dielectric layer, protective layer have been respectively formed on third corresponding with current potential is connect and have stepped down
Hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821288580.9U CN209136327U (en) | 2018-08-10 | 2018-08-10 | The film heating board structure of food cooking machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821288580.9U CN209136327U (en) | 2018-08-10 | 2018-08-10 | The film heating board structure of food cooking machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209136327U true CN209136327U (en) | 2019-07-23 |
Family
ID=67265577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821288580.9U Active CN209136327U (en) | 2018-08-10 | 2018-08-10 | The film heating board structure of food cooking machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209136327U (en) |
-
2018
- 2018-08-10 CN CN201821288580.9U patent/CN209136327U/en active Active
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