CN209126330U - A kind of thermal printing structure - Google Patents

A kind of thermal printing structure Download PDF

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Publication number
CN209126330U
CN209126330U CN201821819023.5U CN201821819023U CN209126330U CN 209126330 U CN209126330 U CN 209126330U CN 201821819023 U CN201821819023 U CN 201821819023U CN 209126330 U CN209126330 U CN 209126330U
Authority
CN
China
Prior art keywords
lvds
thermal printing
printing head
printer body
master board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201821819023.5U
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Chinese (zh)
Inventor
崔迎平
王军磊
于俊翔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shandong Hualing Electronics Co Ltd
Original Assignee
Shandong Hualing Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shandong Hualing Electronics Co Ltd filed Critical Shandong Hualing Electronics Co Ltd
Priority to CN201821819023.5U priority Critical patent/CN209126330U/en
Application granted granted Critical
Publication of CN209126330U publication Critical patent/CN209126330U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model proposes a kind of thermal printing structures, the printer body used is matched including thermal printing head and with the thermal printing head, LVDS transmitting line is equipped in printer body master board, LVDS of the LVDS transmitting line through being arranged on the socket and the PCB loop substrate of thermal printing head on LVDS connecting line and thermal printing head receives circuit and is connected, and the LVDS receives circuit and is connected with each control IC on thermal printing head.Its structure of thermal printing structure involved in the utility model is simple, can effectively reduce transmission cable quantity, increases transmission range, improves transmission speed.

Description

A kind of thermal printing structure
Technical field
The utility model relates to thermal printing field more particularly to a kind of thermal printing structures.
Background technique
It is well known that thermal printing head between printer body master board generallys use electricity in existing thermal printer The mode of cable connection realizes the transmission of signal, the corresponding cable of a signal.For small-sized home or office printer For, connecting cable quantity is few, and transmission range is short, and it is small on the quality influence of transmission signal, do not influence print quality.With market Demand to large-scale printer is more and more, and the number of cables for signal transmission increases, and transmission range increases.Original connection Mode becomes complicated, inconvenient, and is affected by the interference that transmission cable introduces to signal quality, makes printing effect by shadow It rings.
Utility model content
In order to solve the problems in the existing technology, it the utility model proposes a kind of thermal printing structure, is based on LVDS transmission technology, structure is simple, can effectively reduce transmission cable quantity, increases transmission range, improves transmission speed.
To achieve the goals above, the utility model proposes a kind of thermal printing structure, including thermal printing head and with The thermal printing head matches the printer body used, and LVDS transmitting line, institute are equipped in printer body master board It states and is set on PCB loop substrate of the LVDS transmitting line through socket and thermal printing head on LVDS connecting line and thermal printing head The LVDS set receives circuit and is connected, and the LVDS receives circuit and is connected with each control IC on thermal printing head.
Preferably, the LVDS transmitting line includes at least one first level translator and at least one LVDS serial The quantity of device, first level translator and LVDS serializer is according to the output signal number of the printer body master board Depending on amount, the printer body master board is connected with the input terminal of the first level translator, first level conversion The output end of device is connected with the input terminal of the LVDS serializer, output end and the LVDS connecting line phase of the LVDS serializer Connection.
Preferably, it includes at least one LVDS deserializer and the conversion of at least one second electrical level that the LVDS, which receives circuit, The quantity of device, the LVDS deserializer and second electrical level converter is according to the output signal number of the printer body master board Depending on amount, the input terminal of the LVDS deserializer is connected to the socket on thermal printing head, passes for receiving through LVDS connecting line The output end of the defeated signal to come, the LVDS deserializer is connected to the input terminal of second electrical level converter, the second electrical level The output end of converter is connected to each control IC on thermal printing head.
The beneficial effect of the program of the utility model is that above-mentioned its structure of thermal printing structure is simple, can effectively subtract Few transmission cable quantity, increases transmission range, improves transmission speed.
Detailed description of the invention
Fig. 1 shows a kind of connection relationship diagram of thermal printing structure involved in the utility model.
Fig. 2 shows the schematic diagrames of LVDS transmitting line involved in the utility model.
Fig. 3 shows the schematic diagram that LVDS involved in the utility model receives circuit.
Appended drawing reference: A- printer body master board, B- thermal printing head, C-LVDS transmitting line, D-LVDS are received Circuit, E-LVDS connecting line, the first level translator of U1-, U2-LVDS serializer, U3-LVDS deserializer, U4- second electrical level turn Parallel operation.
Specific embodiment
Specific embodiment of the present utility model is further described with reference to the accompanying drawing.
As shown in Figure 1, thermal printing structure involved in the utility model includes thermal printing head B and beats with the temperature-sensitive Print head B matches the printer body used, and LVDS transmitting line C, the LVDS hair are equipped on printer body master board A What power transmission road C was arranged on the PCB loop substrate through socket and thermal printing head B on LVDS connecting line E and thermal printing head B LVDS receives circuit D and is connected.Wherein LVDS (Low-Voltage Differential Signaling) refers to that low-voltage is poor Sub-signal.
The LVDS transmitting line C includes at least one first level translator U1 and at least one LVDS serializer U2, The quantity of the first level translator U1 and LVDS serializer U2 is according to the output signal of the printer body master board A Depending on quantity, the printer body master board A is connected with the input terminal of the first level translator U1, first level The output end of converter U1 is connected with the input terminal of the LVDS serializer U2, the output end of the LVDS serializer U2 with LVDS connecting line E is connected.
It includes at least one LVDS deserializer U3 and at least one second electrical level converter U4 that the LVDS, which receives circuit D, The quantity of the LVDS deserializer U3 and second electrical level converter U4 are according to the output signal of the printer body master board A Depending on quantity, the input terminal of the LVDS deserializer U3 is connected to the socket on thermal printing head B, connects for receiving through LVDS The output end of the signal that line E is transmitted, the LVDS deserializer U3 is connected to the input terminal of second electrical level converter U4, described The output end of second electrical level converter U4 is connected to each control IC on thermal printing head B.
In the present embodiment, the output signal of the printer body master board A is eight, the LVDS transmitting line C includes the LVDS of the first level translator U1 and a model DS90CR285 of a model SN74LVC4245A serial Device U2;The LVDS receives the LVDS deserializer U3 and a model that circuit D includes a model DS90CR286 The second electrical level converter U4 of SN74LVC4245A.
The schematic diagram of the specific LVDS transmitting line C is as shown in Fig. 2, the printer body master board A's is defeated Signal is connected to the pin 3~10 of the first level translator U1 of model SN74LVC4245A, first level conversion out 1,2 pins of device U1 are connected to+5V power supply, and 11,12,13,22 pins are connected to the ground, and 23,24 pins are connected to+3.3V electricity Source, pin 14~16 are connected to the pin 2~4 of the LVDS serializer U2 of model DS90CR285, first level conversion The pin 17~19 of device U1 is connected to the pin 54~56 of LVDS serializer U2, and the pin 20 of the first level translator U1~ 21 are connected to the pin 51~52 of LVDS serializer U2, and 1,9,17,26,34,44 pins of the LVDS serializer U2 are connected to+ 3.3V power supply, 5,13,21,29,33,35,36,43,49,53 pins are connected to the ground, and pin 39,40,47,48 and LVDS connect Wiring E is connected.
The LVDS receives the schematic diagram of circuit D as shown in figure 3, the LVDS deserializer U3's of model DS90CR286 draws Foot 9,10,17,18 is connected to the socket on thermal printing head B, for receiving the signal transmitted through LVDS connecting line E, institute 13,23,31,40,48,56 pins for stating LVDS deserializer U3 are connected to+3.3V power supply, 4,8,14,21,22,24,28,36, 44,52 pins are connected to the ground, and pin 27,29~30,32~35,37 is connected to the second electrical level of model SN74LVC4245A The pin 14~21 of converter U4,1 pin of the second electrical level converter U4 are connected to+5V power supply, and 2,11,12,13,22 Pin is connected to the ground, and 23,24 pins are connected to+3.3V power supply, and pin 3~10 is connected to each control on thermal printing head B IC processed.
It in the present embodiment, can be by transmission cable quantity by 8 using thermal printing structure involved in the utility model Root is reduced to 4, while LVDS transmission technology can be realized increase transmission range, improves the purpose of transmission speed.
Its structure of thermal printing structure involved in the utility model is simple, can effectively reduce transmission cable quantity, increases Add transmission range, improves transmission speed.

Claims (3)

1. a kind of thermal printing structure matches the printer body used including thermal printing head and with the thermal printing head, It is characterized by: being equipped with LVDS transmitting line in printer body master board, the LVDS transmitting line is connected through LVDS The LVDS being arranged on socket and the PCB loop substrate of thermal printing head on line and thermal printing head receives circuit and is connected, The LVDS receives circuit and is connected with each control IC on thermal printing head.
2. thermal printing structure according to claim 1, it is characterised in that: the LVDS transmitting line includes at least one The quantity of first level translator and at least one LVDS serializer, first level translator and LVDS serializer is according to institute Depending on the output signal quantity for stating printer body master board, the printer body master board and the first level translator Input terminal be connected, the output end of first level translator is connected with the input terminal of the LVDS serializer, described The output end of LVDS serializer is connected with LVDS connecting line.
3. thermal printing structure according to claim 2, it is characterised in that: it includes at least one that the LVDS, which receives circuit, The quantity of LVDS deserializer and at least one second electrical level converter, the LVDS deserializer and second electrical level converter is according to institute Depending on the output signal quantity for stating printer body master board, the input terminal of the LVDS deserializer is connected to thermal printing head On socket, for receiving the signal transmitted through LVDS connecting line, the output end of the LVDS deserializer is connected to second The input terminal of level translator, the output end of the second electrical level converter are connected to each control IC on thermal printing head.
CN201821819023.5U 2018-11-06 2018-11-06 A kind of thermal printing structure Active CN209126330U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821819023.5U CN209126330U (en) 2018-11-06 2018-11-06 A kind of thermal printing structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821819023.5U CN209126330U (en) 2018-11-06 2018-11-06 A kind of thermal printing structure

Publications (1)

Publication Number Publication Date
CN209126330U true CN209126330U (en) 2019-07-19

Family

ID=67243985

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201821819023.5U Active CN209126330U (en) 2018-11-06 2018-11-06 A kind of thermal printing structure

Country Status (1)

Country Link
CN (1) CN209126330U (en)

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