CN209119543U - A kind of laser enclosure - Google Patents
A kind of laser enclosure Download PDFInfo
- Publication number
- CN209119543U CN209119543U CN201822248097.4U CN201822248097U CN209119543U CN 209119543 U CN209119543 U CN 209119543U CN 201822248097 U CN201822248097 U CN 201822248097U CN 209119543 U CN209119543 U CN 209119543U
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- fairlead
- shell
- glass ring
- wall
- transition rings
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Abstract
The utility model discloses a kind of laser enclosures, are related to field of laser device technology, and for solving in production installation process, stress caused by shell is transitted directly on glass ring by shell, in following electroplating process, the problem of glass ring cracks.It includes shell, front and back is provided with fairlead on the right side of the shell, and lead is installed in the fairlead, and glass ring is equipped between the fairlead and lead, transition rings are equipped between the glass ring outer wall and fairlead inner wall, the transition rings outer wall is bonded with fairlead inner wall.The technical program on the shell of laser by being arranged transition rings in fairlead, glass ring is formed with by glass head seal between transition rings and lead, the thermal expansion coefficient of transition rings is less than shell and is greater than glass ring, realizes stress grading sustained release, avoids glass ring opening.
Description
Technical field
The utility model relates to field of laser device technology, and in particular to a kind of laser enclosure.
Background technique
Laser is that light is made to amplify or vibrate transmitting laser in certain substances being stimulated using stimulated radiation principle
Device.Due to having many advantages, such as that linear transmission, output beam quality be good, high conversion efficiency, laser is widely used in laser
Telecommunication, industrial shipbuilding, automobile manufacture, laser marking, laser cutting etc. technical field.It can in order to guarantee laser
It by property, improves the service life of laser, the laser module of laser is usually placed in laser enclosure simultaneously encapsulation process, is avoided dirty
Dirty, steam enters in laser housing, damages laser module.But directly pass through glass between current many laser enclosures and lead
Glass sealing, i.e., form glass ring between shell and lead, and in production installation process, stress caused by shell is direct by shell
It is transitioned on glass ring.In the electroplating process of sequent surface processing, since stress is sustained, glass ring is caused to crack.
Utility model content
The utility model aim is intended to provide a kind of laser enclosure, by the shell of laser in fairlead
Transition rings are set, glass ring is formed with by glass head seal between transition rings and lead, the thermal expansion coefficient of transition rings is less than shell
Body and be greater than glass ring, realize stress grading sustained release, avoid glass ring opening.
To realize the above-mentioned technical purpose, the technical solution adopted in the utility model is as follows:
A kind of laser enclosure, including shell, shell right side front and back are provided with fairlead, are installed in the fairlead
Lead is equipped with glass ring between the fairlead and lead, transition rings are equipped between the glass ring outer wall and fairlead inner wall,
The transition rings outer wall is bonded with fairlead inner wall.
Utility model by adopting the above technical scheme, including shell, front and back is provided with fairlead on the right side of shell, in fairlead
It is installed with lead, lead is that the laser diode of enclosure interior transmits electric energy or instruction, and glass ring, glass are equipped between fairlead and lead
Transition rings are equipped between glass ring outer wall and fairlead inner wall, transition rings outer wall is bonded with fairlead inner wall, transition rings are first installed,
Then glass ring is formed by glass head seal between transition rings inner wall and lead, wherein the thermal expansion coefficient of transition rings is less than shell
And it is greater than glass ring, when one timing of external condition, in production installation process, enclosure interior generates stress, transition of stress process
In, the breathing degree of shell is higher than transition rings, and the breathing degree of transition rings is higher than glass ring, and point of stress may be implemented
Grade sustained release, the stress being transitioned on glass ring is very very small, can thus crack in following electroplating process to avoid glass ring.
It further limiting, the shell includes bottom plate, ring frame and conduit, and ring frame bottom surface is welded on plane on bottom plate,
Through-hole is provided on the left of ring frame front end, the conduit is inserted into through-hole, and shell is divided into multi-section and is grouped as, and it is difficult to reduce production
Degree facilitates and controls each size, promotes the qualification rate of shell.
It further limits, chamfering is equipped on the outside of the fairlead, chamfering can remove fairlead inner burr, and in transition
Ring plays the role of guiding when installing, and facilitates installation and guarantees beauty.
It further limits, the transition rings use No. 10 steel, and the thermal expansion coefficient of No. 10 steel is less than shell and is greater than glass
Ring, and plasticity toughness is fine, and easy cold and hot working forming, machinability is good after normalizing or cold working, convenient for buying.
It further limits, the lead passes through fairlead one end and is equipped with flat connector lug, convenient in lead and laser
Portion's element is connected to.
Fairlead is arranged compared with prior art, by the shell in laser in the utility model, between fairlead and lead
Equipped with glass ring, transition rings are equipped between glass ring outer wall and fairlead inner wall, transition rings outer wall is bonded with fairlead inner wall, mistake
The thermal expansion coefficient for crossing ring is less than shell and is greater than glass ring, realizes stress grading sustained release, avoids glass ring opening.
Detailed description of the invention
The utility model can be further illustrated by the nonlimiting examples that attached drawing provides；
Fig. 1 is the overall structure diagram of the utility model laser enclosure；
Main element symbol description is as follows:
1, shell；2, fairlead；3, lead；4, glass ring；5, transition rings；6, bottom plate；7, ring frame；8, conduit；9, wiring
Head.
Specific embodiment
It is right with reference to the accompanying drawings and examples in order to make those skilled in the art that the utility model may be better understood
Technical solutions of the utility model further illustrate.
As shown in Figure 1, a kind of laser enclosure, including shell 1, the 1 right side front and back of shell are provided with fairlead 2, institute
It states and is installed with lead 3 in fairlead 2, glass ring 4,4 outer wall of glass ring and lead are equipped between the fairlead 2 and lead 3
Transition rings 5 are equipped between 2 inner wall of hole, 5 outer wall of transition rings is bonded with 2 inner wall of fairlead；The shell 1 includes bottom plate 6, ring
Frame 7 and conduit 8,7 bottom surface of ring frame are welded on plane on bottom plate 6, are provided with through-hole, the conduit 8 on the left of 7 front end of ring frame
It is inserted into through-hole；Chamfering is equipped on the outside of the fairlead 2；The transition rings 5 use No. 10 steel；The lead 3 passes through fairlead 2
One end is equipped with flat connector lug 9.
In the present embodiment, including shell 1, shell 1 include bottom plate 6, ring frame 7 and conduit 8, and 7 bottom surface of ring frame is welded on bottom plate 6
Upper plane, 7 front end of ring frame left side are provided with through-hole, and conduit 8 is inserted into through-hole, and shell 1 divides to be grouped as multi-section, and it is difficult to reduce production
Degree facilitates and controls each size, promotes the qualification rate of shell 1；The 7 right side front and back of ring frame of shell 1 is provided with fairlead 2, lead
Lead 3 is installed in hole 2, lead 3 is that the laser diode inside shell 1 transmits electric energy or instruction, is set between fairlead 2 and lead 3
There is glass ring 4, transition rings 5 are equipped between 2 inner wall of 4 outer wall of glass ring and fairlead, 5 outer wall of transition rings and 2 inner wall of fairlead paste
It closes, first installs transition rings 5, be equipped with chamfering on the outside of fairlead 2, chamfering can remove 2 inner burr of fairlead, and in transition rings
Play the role of guiding when 5 installation, facilitates installation and guarantee beauty, then pass through glass between 5 inner wall of transition rings and lead 3
Sealing forms glass ring 4, and transition rings 5 use No. 10 steel, and the thermal expansion coefficient of No. 10 steel is less than shell 1 and is greater than glass ring 4, and
And plasticity toughness is fine, easy cold and hot working forming, machinability is good after normalizing or cold working, convenient for buying；Work as outer strip
The timing of part one generates stress during the installation process inside shell 1, during transition of stress, the breathing degree of shell 1 compares transition
Ring 5 wants high, and the breathing degree of transition rings 5 is higher than glass ring 4, and the classification sustained release of stress may be implemented, and is transitioned into glass ring 4
On stress it is very very small, can thus crack in following electroplating process to avoid glass ring 4；Lead 3 passes through fairlead 2 one
End is equipped with flat connector lug 9, is connected to convenient for lead with laser internal element.
The utility model, including shell 1,1 right side front and back of shell are provided with fairlead 2, lead 3 are installed in fairlead 2, is drawn
Line 3 is that the laser diode inside shell 1 transmits electric energy or instruction, and glass ring 4, glass ring 4 are equipped between fairlead 2 and lead 3
Transition rings 5 are equipped between 2 inner wall of outer wall and fairlead, 5 outer wall of transition rings is bonded with 2 inner wall of fairlead, first installs transition rings
5, glass ring 4 is then formed by glass head seal between 5 inner wall of transition rings and lead 3, wherein the thermal expansion coefficient of transition rings 5 is small
In shell 1 and it is greater than glass ring 4, when one timing of external condition generates stress, stress in production installation process inside shell 1
In transient process, the breathing degree of shell 1 is higher than transition rings 5, and the breathing degree of transition rings 5 is higher than glass ring 4, can be with
Realize the classification sustained release of stress, the stress being transitioned on glass ring 4 is very very small, thus can be to avoid glass ring 4 subsequent
It cracks in electroplating process.
The above descriptions are merely preferred embodiments of the present invention, is not intended to limit the utility model, for this
It, without departing from the principle of this utility model, can also be to the utility model for the those of ordinary skill of technical field
Some improvement and modification can also be carried out, and modifications and modifications also fall within the protection scope of the claims of the utility model.
Claims (5)
1. a kind of laser enclosure, including shell (1), shell (1) right side front and back is provided with fairlead (2), the lead
It is installed with lead (3) in hole (2), is equipped with glass ring (4) between the fairlead (2) and lead (3), which is characterized in that the glass
Transition rings (5) are equipped between glass ring (4) outer wall and fairlead (2) inner wall, transition rings (5) outer wall and fairlead (2) inner wall
Fitting.
2. a kind of laser enclosure according to claim 1, it is characterised in that: the shell (1) includes bottom plate (6), ring
Frame (7) and conduit (8), ring frame (7) bottom surface are welded on plane on bottom plate (6), are provided on the left of ring frame (7) front end logical
Hole, the conduit (8) are inserted into through-hole.
3. a kind of laser enclosure according to claim 1, it is characterised in that: be equipped with chamfering on the outside of the fairlead (2).
4. a kind of laser enclosure according to claim 1, it is characterised in that: the transition rings (5) use No. 10 steel.
5. a kind of laser enclosure according to claim 1, it is characterised in that: the lead (3) passes through fairlead (2) one
End is equipped with flat connector lug (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822248097.4U CN209119543U (en) | 2018-12-29 | 2018-12-29 | A kind of laser enclosure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822248097.4U CN209119543U (en) | 2018-12-29 | 2018-12-29 | A kind of laser enclosure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209119543U true CN209119543U (en) | 2019-07-16 |
Family
ID=67208992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822248097.4U Active CN209119543U (en) | 2018-12-29 | 2018-12-29 | A kind of laser enclosure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209119543U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112366183A (en) * | 2020-10-30 | 2021-02-12 | 中国电子科技集团公司第五十五研究所 | Microwave power amplification chip package of integrated metal tube shell and preparation method thereof |
| CN114204384A (en) * | 2021-12-01 | 2022-03-18 | 深圳市宏钢机械设备有限公司 | High-power laser shell packaging clamp and packaging process |
| CN117488386A (en) * | 2024-01-02 | 2024-02-02 | 深圳市星汉激光科技股份有限公司 | Fitting and partial plating method of laser housing |
-
2018
- 2018-12-29 CN CN201822248097.4U patent/CN209119543U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112366183A (en) * | 2020-10-30 | 2021-02-12 | 中国电子科技集团公司第五十五研究所 | Microwave power amplification chip package of integrated metal tube shell and preparation method thereof |
| CN114204384A (en) * | 2021-12-01 | 2022-03-18 | 深圳市宏钢机械设备有限公司 | High-power laser shell packaging clamp and packaging process |
| CN114204384B (en) * | 2021-12-01 | 2022-09-20 | 深圳市宏钢机械设备有限公司 | High-power laser shell packaging clamp and packaging process |
| CN117488386A (en) * | 2024-01-02 | 2024-02-02 | 深圳市星汉激光科技股份有限公司 | Fitting and partial plating method of laser housing |
| CN117488386B (en) * | 2024-01-02 | 2024-05-07 | 深圳市星汉激光科技股份有限公司 | Fitting and partial plating method of laser housing |
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