CN209097765U - A kind of silicon wafer auto plate separation feed device - Google Patents

Abstract

The utility model relates to silicon chip process technology fields, more particularly to a kind of silicon wafer auto plate separation feed device, including silicon chip up-down mechanism, silicon wafer load carrier, send out piece wheel mechanism for rolling and silicon wafer conveying mechanism, silicon chip up-down mechanism is connected with silicon wafer load carrier by sliding block, realize that silicon wafer load carrier can move reciprocatingly in the vertical direction, silicon wafer carries out feed supplement during silicon wafer load carrier rises, setting hair piece wheel mechanism for rolling separates single silicon chip right above silicon wafer load carrier simultaneously, and the silicon wafer after fragment is transmitted in the output end setting silicon wafer conveying mechanism of hair piece wheel mechanism for rolling, realize auto plate separation and the feeding of silicon wafer, full process automatization operation, device structure is compact, operating process links up smooth, stability is good, it solves in the prior art troublesome in poeration, stability is poor, time-consuming, structure is complicated Etc. technical problems.

Description

A kind of silicon wafer auto plate separation feed device

Technical field

The utility model relates to silicon chip process technology field more particularly to a kind of silicon wafer auto plate separation feed devices.

Background technique

Since 21 century, global Energy Consumption sharply rises, and traditional fossil energy is increasingly depleted, and energy problem and environment are asked Topic is increasingly becoming two big Important Problems of global concern.Under the pressure of the pressure of sustainable development, solar photovoltaic industry becomes can be again The emphasis of raw energy exploitation and application.

Crystal silicon solar battery is that current technology is most mature, most widely used photovoltaic product.In crystal silicon and its system It in the production process of product, needs that silicon rod is first cut into silicon wafer, since silicon wafer has corner angle burr chipping by cutting back edge surface Even there are crack or other defects, edge surface is relatively rough, therefore in order to increase silicon slicing edge surface mechanical strength, reduce Particle contamination, by its edge grind in arc-shaped or trapezoidal, which is chamfering.

The silicon wafer obtained after slice is stacked together, need to carry out chamfer angle technique one by one, thus be related to silicon wafer fragment and Conveying currently on the market or manual film releasing or needs to be put into standard film magazine (25/box) in advance at present, have it is artificial with Waste in material resources is unfavorable for industrializing large-scale serial production.

Chinese Patent Application No. is silicon wafer fragment transmission device and silicon wafer transfer approach disclosed in 201510051096.9, Including silicon wafer group transmission device, vertical transmission device and horizontal transition transmission device, vertical transmission device and horizontal transition are transmitted Device shares same conveyer belt, there is through-hole on conveyer belt, and vertical transmission device has stomata on silicon wafer sucking disc there are also silicon wafer sucking disc, Stomata is corresponding with the through-hole on conveyer belt, and stomata is connect with air extractor；Silicon wafer group transmission device end is also equipped with push spray Head pushes spray head injection direction towards vertical transmission device.

In above-mentioned technical proposal, silicon wafer group is formed separately single silicon chip by fragment water knife, and single silicon chip is by push spray head It is pushed on conveyer belt, the through-hole on conveyer belt is adsorbed single silicon chip by negative pressure, completes all transmission by conveyer belt. However in above-mentioned technical proposal, transmission mode from bottom to top is not only troublesome in poeration, but also transmission stability is poor, and entire transmission is logical Road length, leading to transmission, time-consuming, and production efficiency substantially reduces, and device structure is complicated, and higher operating costs is unfavorable for industrializing It produces and uses.

In conclusion above-mentioned technical proposal is there are the technical problems such as troublesome in poeration, stability is poor, time-consuming, structure is complicated, The efficiency of industrialized production can not effectively be promoted.

Utility model content

The purpose of this utility model is in view of the deficiencies of the prior art, to provide a kind of silicon wafer auto plate separation feeding dress It sets, connects silicon chip up-down mechanism by sliding block with silicon wafer load carrier, do silicon wafer load carrier can in the vertical direction past Multiple movement realizes that silicon wafer carries out feed supplement in uphill process, and setting hair piece wheel mechanism for rolling is to silicon right above silicon wafer load carrier Piece carries out monolithic separation, and passes in the output end setting silicon wafer conveying mechanism of hair piece wheel mechanism for rolling to the silicon wafer after fragment It send.Silicon wafer uphill process automatic feeding is simultaneously rotated by roller in time and realizes fragment and feeding, whole process automatic operation, and Device structure is compact, and operating process links up smooth, and stability is good, solve it is in the prior art it is troublesome in poeration, stability is poor, consumption Duration, the technical problems such as structure is complicated.

In order to solve the above technical problems, the utility model provides a kind of silicon wafer auto plate separation feed device, comprising:

Rack, the rack include supporting plate and lifting area, and the lifting area is set to the side of the supporting plate；

Silicon chip up-down mechanism, the silicon chip up-down mechanism is vertically arranged in the lifting area, removable with the supporting plate Connection is unloaded, is provided with and reciprocatingly slides the sliding block of setting along silicon chip up-down mechanism vertical direction；

Silicon wafer load carrier, the silicon wafer load carrier are set to one that the silicon chip up-down mechanism deviates from the rack Side is fixedly connected with the sliding block, and it drives reciprocal lifting setting along the vertical direction, the silicon by the silicon chip up-down mechanism Carrying is provided with the silicon wafer for stacking setting on piece load carrier；

Piece wheel mechanism for rolling is sent out, the hair piece wheel mechanism for rolling installation settings is in the top of the silicon wafer load carrier, with institute It states supporting plate to be detachably connected, and it contradicts with the silicon wafer for stacking setting on the silicon wafer load carrier and is arranged, the hair piece rolling wheel machine Structure drives silicon wafer horizontal fragmentation one by one；And

Silicon wafer conveying mechanism, the silicon wafer conveying mechanism is set to the bottom of the hair piece wheel mechanism for rolling, with the branch Plate is detachably connected, input terminal be set to it is described hair piece wheel mechanism for rolling output, the silicon wafer conveying mechanism driving described in Silicon wafer horizontal feed one by one.

Further, the silicon chip up-down mechanism includes:

Support base, the support base are detachably connected with the supporting plate；

Actuator a, the actuator a are set to the top of the support base, and bottom is fixedly connected with drive shaft, described Drive shaft is arranged through the support base；

Lifting assembly, the lifting assembly extend to the bottom of the support base at the top of the support base, slide thereon It is dynamic to be provided with the sliding block.

Further, the lifting assembly includes:

Ball-screw, the top of the ball-screw and the coaxially connected setting of the drive shaft, lower rotation are set to On the support base；

Support rod, the support rod are symmetrically disposed on the ball-screw two sides parallel with the supporting plate, and itself and institute Support base is stated to be fixedly connected；

The slide block set is set on the ball-screw and the support rod, is driven by ball-screw rotation reciprocal Sliding.

Further, the silicon wafer load carrier includes:

Pedestal, the pedestal side are fixedly connected with the sliding block, the through-hole a being provided with；

Baffle, the baffle are vertically arranged at the side of silicon wafer conveying mechanism described in face on the pedestal, and itself and institute Supporting plate is stated to be vertically arranged；

Silicon box, the silicon box conflict are set on the pedestal, and one side is that opening is arranged and is resisted against described On baffle, silicon wafer rest area is formed, top is provided with the discharge port of the silicon wafer, and the silicon box is parallel to the hair piece volume It takes turns and offers straight trough mouth respectively at the top of the two sides of mechanism transmission direction, the side of baffle described in the face of bottom is provided with U-type groove Mouthful；

Limited block, the limited block is L-type, with the silicon box bottom backwards to the right angle card of the baffle two sides With the through-hole b to match with the through-hole a is provided with, and it is detachably connected with the pedestal by pin, to described Silicon box is fixed.

Preferably, the through-hole a is multiple groups setting, and its sizes different from the silicon box match setting respectively, Each group through-hole a respectively fixes the various sizes of silicon box with limited block cooperation.

Further, the hair piece wheel mechanism for rolling includes:

Connecting plate, the connecting plate are vertically arranged, and one side is connect with the supporting plate vertical removable；

Roll assembly b, the roll assembly b are set to the top of the silicon wafer load carrier, with the connection backboard Side from the supporting plate is detachably connected；

Driving assembly b, the driving component b are horizontally placed on the side of connecting plate described in face on the roll assembly b.

Further, the roll assembly b includes:

Roller b, several roller b are arranged successively along the conveying direction of the hair piece wheel mechanism for rolling and are rotatably dispose in peace It shelves on b, the mounting rack b is detachably connected with the connecting plate, and rubber sleeve is arranged on roller b；

First transmission gear b, several first transmission gear b is fixedly installed on one end of several roller b respectively, It is coaxially disposed with the roller b；And

Second transmission gear b, several second transmission gear b are staggered between the first transmission gear b, It is rotatablely connected with the mounting rack b, and it engages connection with the first transmission gear b.

Further, the driving component b includes:

Actuator b, the actuator b are set on the mounting rack b by bracket b close to the first transmission gear b Side, the first transmission gear b and roller b described in drive shaft b face is arranged in parallel；

Driving gear b, the driving gear b coaxial arrangement is on the drive shaft b；

Driven gear b, the driven gear b are set to below the drive shaft b, are rotatablely connected with the mounting rack b, Connection is engaged with the driving gear b at the top of the driven gear b, connection, institute are engaged with the first transmission gear b in one side It states actuator b and the roller is driven by driving gear b, driven gear b, the first transmission gear b and the second transmission gear b transmission B rotation.

Further, the silicon wafer conveying mechanism includes roll assembly c, and the roll assembly c includes:

Roller c, several roller c are arranged successively along the conveying direction of the hair piece wheel mechanism for rolling and are rotatably dispose in peace It shelves on c；

First transmission gear c, several first transmission gear c is fixedly installed on one end of several roller c respectively, It is coaxially disposed with the roller c；And

Second transmission gear c, several second transmission gear c are staggered between the first transmission gear c, It is rotatablely connected with the mounting rack c, and it engages connection with the first transmission gear c.

Further, the silicon wafer conveying mechanism further includes driving assembly c, and the driving component c includes:

Actuator c, the actuator c are set to the mounting rack c bottom end close to first transmission by bracket c The side of gear c, the first transmission gear c and roller c described in drive shaft c face are arranged in parallel；

Driving gear c, the driving gear c coaxial arrangement is on the drive shaft c；

Driven gear c, the driven gear c are set to above the drive shaft c, are rotatablely connected with the mounting rack c, The bottom the driven gear c engages connection with the driving gear c, and connection, institute are engaged with the first transmission gear c in one side It states actuator c and the roller is driven by driving gear c, driven gear c, the first transmission gear c and the second transmission gear c transmission C rotation.

The utility model has the beneficial effects that

(1) in the present invention, pass through setting silicon chip up-down mechanism, silicon wafer load carrier, hair piece wheel mechanism for rolling and silicon Piece transport mechanism connects silicon chip up-down mechanism by sliding block with silicon wafer load carrier, realizes that silicon wafer load carrier can be vertical It moving reciprocatingly on direction, the silicon wafer stacked gradually along the vertical direction carries out feed supplement during silicon wafer load carrier rises, Setting hair piece wheel mechanism for rolling separates single silicon chip right above silicon wafer load carrier simultaneously, and in hair piece wheel mechanism for rolling Output end setting silicon wafer conveying mechanism is transmitted the silicon wafer after fragment, realizes the automatic feeding, fragment and feeding of silicon wafer, silicon Piece load carrier single can carry the silicon wafer of entire batch, improve operating efficiency, whole process automatic operation, and device structure Compact, operating process links up smooth, and stability is good, solve it is in the prior art it is troublesome in poeration, stability is poor, time-consuming, knot The technical problems such as structure complexity.

(2) in the present invention, by the pedestal of silicon wafer load carrier be arranged multiple groups respectively with silicon box not With the through-hole a that size matches, make itself and limited block mating reaction, various sizes of silicon wafer carrying is installed in realization on pedestal Frame meets the needs for carrying out fragment transmission in industrial processes to various sizes of silicon wafer.

In conclusion a kind of silicon wafer auto plate separation feed device provided by the utility model is, it can be achieved that silicon wafer fragment passes Sending full process automatization operation, process to link up, smooth, stability is good, operating efficiency is high, device structure is compact, suitable for producing process In to silicon wafer carry out batch machining use.

Detailed description of the invention

It, below will be to required in embodiment description for the clearer technical solution for illustrating the utility model embodiment The attached drawing used is briefly described, it should be apparent that, drawings discussed below is only some embodiments of the utility model, For those of ordinary skill in the art, without creative efforts, it can also obtain according to these attached drawings Obtain other accompanying drawings.

Fig. 1 is the utility model overall structure diagram；

Fig. 2 is silicon chip up-down mechanism structure schematic diagram；

Fig. 3 is silicon wafer load carrier structural schematic diagram；

Fig. 4 is silicon wafer load carrier top view；

Fig. 5 is hair piece wheel mechanism for rolling structural schematic diagram；

Fig. 6 is hair piece wheel mechanism for rolling structural schematic diagram；

Fig. 7 is silicon wafer conveying mechanism structural schematic diagram；

Fig. 8 is silicon wafer conveying mechanism rearview；

Fig. 9 is the utility model partial schematic diagram；

Figure 10 is enlarged diagram at A in Fig. 9.

Specific embodiment

The technical scheme in the embodiment of the utility model is clearly and completely illustrated with reference to the accompanying drawing.

Embodiment one

The embodiments of the present invention are described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng The embodiment for examining attached drawing description is exemplary, it is intended to for explaining the utility model, and should not be understood as to the utility model Limitation.

As shown in Fig. 1-2 and Fig. 9-10, a kind of silicon wafer auto plate separation feed device, comprising:

Rack 1, the rack 1 include supporting plate 11 and lifting area 12, and the lifting area 12 is set to the one of the supporting plate 11 Side；

Silicon chip up-down mechanism 2, the silicon chip up-down mechanism 2 is vertically arranged in the lifting area 12, with the supporting plate 11 are detachably connected, and are provided with and reciprocatingly slide the sliding block 20 of setting along 2 vertical direction of silicon chip up-down mechanism；

Silicon wafer load carrier 3, the silicon wafer load carrier 3 are set to the silicon chip up-down mechanism 2 away from the rack 1 Side is fixedly connected with the sliding block 20, and it drives reciprocal lifting along the vertical direction to set by the silicon chip up-down mechanism 2 It sets, carrying is provided with the silicon wafer 30 for stacking setting on the silicon wafer load carrier 3；

Send out piece wheel mechanism for rolling 4, hair 4 installation settings of piece wheel mechanism for rolling in the top of the silicon wafer load carrier 3, with The supporting plate 11 is detachably connected, and it contradicts with the silicon wafer 30 for stacking setting on the silicon wafer load carrier 3 and is arranged, the hair piece Wheel mechanism for rolling 4 drives the silicon wafer 30 horizontal fragmentation one by one；And

Silicon wafer conveying mechanism 5, the silicon wafer conveying mechanism 5 is set to the bottom of the hair piece wheel mechanism for rolling 4, and described Supporting plate 11 is detachably connected, and input terminal is set to the output of the hair piece wheel mechanism for rolling 4, which drives Move the silicon wafer 30 horizontal feed one by one.

In the present invention, by the way that silicon wafer load carrier 3 is arranged in the side of silicon chip up-down mechanism 2, and make silicon wafer liter Descending mechanism 2 and silicon wafer load carrier 3 are slidably connected by sliding block, realize that silicon wafer load carrier 3 is driven by silicon chip up-down mechanism 2 It moves reciprocatingly on vertical direction, the silicon wafer stacked gradually along the vertical direction carries out during silicon wafer load carrier 3 rises Feed supplement, while the setting hair piece wheel mechanism for rolling 4 right above silicon wafer load carrier 3, the rubbing action rotated by rolling wheel is by monolithic Silicon wafer is separated, and is transmitted in the output end setting silicon wafer conveying mechanism of hair piece wheel mechanism for rolling to the silicon wafer after fragment, Realize automatic feeding, fragment and the feeding of silicon wafer.

Further, as shown in Figs. 1-2, the silicon chip up-down mechanism 2 includes:

Support base 21, the support base 21 are detachably connected with the supporting plate 11；

Actuator a22, the actuator a22 are set to the top of the support base 21, and bottom is fixedly connected with driving Axis 221, the drive shaft 221 are arranged through the support base 21；

Lifting assembly 23, the lifting assembly 23 extend to the bottom of the support base 21 from the top of the support base 21 Portion, sliding is provided with the sliding block 20 thereon.

Further, the lifting assembly 23 includes:

Ball-screw 231, the top of the ball-screw 231 and the coaxially connected setting of the drive shaft 221, bottom turn It is dynamic to be set on the support base 21；

Support rod 232, the support rod 232 are symmetrically disposed on two parallel with the supporting plate 11 of the ball-screw 231 Side, and it is fixedly connected with the support base 21；

The sliding block 20 is sheathed on the ball-screw 231 and the support rod 232, by the ball-screw 231 Rotation drives and reciprocatingly slides.

In the present invention, by the way that actuator a22 is arranged, and it is fixed with ball-screw 231 to make it through drive shaft 221 Connection realizes that actuator a22 driving ball-screw 231 rotates, by the way that sliding block 20 is arranged, so that it is sheathed on ball-screw 231, make Sliding block 20 drives the length direction along ball-screw 231 to reciprocatingly slide vertically by the rotation of ball-screw 231, at the same time, passes through Sliding block 20 is set on support rod 232 simultaneously, the movement of sliding block 20 is limited, and increase its stability.

Further, as shown in Fig. 1, Fig. 3-4 and Fig. 9-10, the silicon wafer load carrier 3 includes:

Pedestal 31,31 side of pedestal are fixedly connected with the sliding block 20, the through-hole a311 being provided with；

Baffle 32, the baffle 32 are vertically arranged at the side of silicon wafer conveying mechanism 5 described in face on the pedestal 31, and It is vertically arranged with the supporting plate 11；

Silicon box 33, the silicon box 33 conflict are set on the pedestal 31, one side be opening setting and against On the baffle 32, silicon wafer rest area 331 is formed, top is provided with the discharge port 332 of the silicon wafer 30, and the silicon box 33 are parallel at the top of the two sides of hair 4 transmission direction of piece wheel mechanism for rolling and offer straight trough mouth 333 respectively, described in the face of bottom The side of baffle 32 is provided with U type slot 334；

Limited block 34, the limited block 34 is L-type, with 33 bottom of silicon box backwards to the straight of 32 two sides of baffle At angle card and, be provided with the through-hole b341 to match with the through-hole a311, and it can by pin with the pedestal 31 The silicon box 33 is fixed in dismantling connection.

In the present invention, it is provided with the discharge port 332 of silicon wafer 30 by the top of silicon wafer carrier 33, makes silicon wafer 30 Feed supplement from bottom to top carries out fragment by hair piece wheel mechanism for rolling 4, to realize silicon wafer carrier 33 and hair piece to discharge port 332 Wheel mechanism for rolling 4 cooperates, so that silicon wafer feed supplement, fragment and feeding process are gone on smoothly.

In the present invention, it by the way that baffle 32 is arranged, realizes and the silicon wafer 30 being placed in silicon wafer rest area 331 is carried out Limited support passes due to rubbing action to silicon wafer so that the silicon wafer stacked is unlikely during through hair 4 fragment of piece wheel mechanism for rolling Topple in the direction sent.

In the present invention, by offering straight trough mouth 333 respectively in 33 top two sides of silicon box, so that operator It can hold to carry to take out from pedestal 31 by silicon box 33 at straight trough mouth 333 and carry out the operation such as feed supplement, pass through silicon box 33 1 The opening of side is arranged, convenient for fragmented silicon wafer 30 to be placed into silicon wafer rest area 331, at the same time, by silicon wafer 33 bottom of box is provided with U type slot 334, when silicon wafer placement position is improper to be needed to adjust or needs silicon wafer from silicon box 33 When taking out, adjustment can be supported to silicon wafer from 33 bottom of silicon box by U type slot 334 or taken, it is unlikely because of operation It is inconvenient and damage silicon wafer.

It should be further noted that silicon can be made after the whole fragment feedings of silicon wafer 30 in silicon wafer carrier 33 Piece load carrier 3 is moved to the bottom of silicon chip up-down mechanism 2, at this time takes out silicon wafer carrier 33, batch silicon wafer of reloading 30。

Further, as shown in Figures 1 and 5, the hair piece wheel mechanism for rolling 4 includes:

Connecting plate 41, the connecting plate 41 are vertically arranged, and one side is connect with 11 vertical removable of supporting plate；

Roll assembly b42, the roll assembly b42 are set to the top of the silicon wafer load carrier 3, with the connection Plate 41 is detachably connected away from the side of the supporting plate 11；

Driving assembly b43, the driving component b43 are horizontally placed on connecting plate described in face on the roll assembly b42 41 side.

In the present invention, by the way that driving assembly b43 is arranged on roll assembly b42, so that roll assembly b42 drives Roll assembly b42 rotation is realized and carries out fragment to the silicon wafer 30 that discharge port 332 goes out.

Further, as seen in figs. 5-6, the roll assembly b42 includes:

Roller b421, several roller b421 are arranged successively and rotate along the conveying direction of the hair piece wheel mechanism for rolling 4 It is set on mounting rack b420, the mounting rack b420 is detachably connected with the connecting plate 41, and is arranged on roller b421 Rubber sleeve；

First transmission gear b422, several first transmission gear b422 is fixedly installed on several rollers respectively One end of b421 is coaxially disposed with the roller b421；And

Second transmission gear b423, several second transmission gear b423 are staggered in first transmission gear Between b422, it is rotatablely connected with the mounting rack b420, and it engages connection with the first transmission gear b422.

Further, as seen in figs. 5-6, the driving component b43 includes:

Actuator b431, the actuator b431 are set on the mounting rack b420 by bracket b430 close to described the The side of one transmission gear b422, the first transmission gear b422 described in drive shaft b4311 face are parallel with the roller b421 Setting；

Driving gear b432, the driving gear b432 coaxial arrangement is on the drive shaft b4311；

Driven gear b433, the driven gear b433 is set to below the drive shaft b4311, with the mounting rack B420 rotation connection, the top driven gear b433 engage connection, one side and described first with the driving gear b432 Transmission gear b422 engagement connection, the actuator b431 pass through driving gear b432, driven gear b433, the first transmission gear B422 and the second transmission gear b423 transmission drives the roller b421 rotation.

In the present invention, by being coaxially disposed driving gear b432 on the drive shaft b4311 of actuator b431, Driven gear b433 is set below drive shaft b4311, is rotatablely connected it with mounting rack b420, and make driven gear b433 and master Moving gear b432 engagement connection, simultaneously, by one end of roller b421 be coaxially disposed the first transmission gear b422, and Staggeredly the second transmission gear b423 is engaged between first transmission gear b422, then by making driven gear b433 simultaneously with the One transmission gear b422 engagement connection, thus realize by actuator b431 pass sequentially through driving gear b432, driven gear b433, First transmission gear b422 and the second transmission gear b423 transmission drive roller wheel b421 rotation, carries out fragment to silicon wafer 30.

It should be further noted that frictional force can be increased by the way that rubber sleeve is arranged on roller b421, guarantee roller The frictional force that b421 is generated when rotating can smoothly separate silicon wafer 30 from silicon wafer carrier 33.

Further, as Figure 7-8, the silicon wafer conveying mechanism 5 includes roll assembly c51, the roll assembly c51 Include:

Roller c511, several roller c511 are arranged successively and rotate along the conveying direction of the hair piece wheel mechanism for rolling 4 It is set on mounting rack c510；

First transmission gear c512, several first transmission gear c512 is fixedly installed on several rollers respectively One end of c511 is coaxially disposed with the roller c511；And

Second transmission gear c513, several second transmission gear c513 are staggered in first transmission gear Between c512, it is rotatablely connected with the mounting rack c510, and it engages connection with the first transmission gear c512.

Further, the silicon wafer conveying mechanism 5 further includes driving assembly c52, and the driving component c52 includes:

It is close that actuator c521, the actuator c521 by bracket c520 are set to the mounting rack c510 bottom end The side of the first transmission gear c512, the first transmission gear c512 and the roller described in drive shaft c5211 face C511 is arranged in parallel；

Driving gear c522, the driving gear c522 coaxial arrangement is on the drive shaft c5211；

Driven gear c523, the driven gear c523 is set to above the drive shaft c5211, with the mounting rack C510 rotation connection, the bottom the driven gear c523 engages connection, one side and described first with the driving gear c522 Transmission gear c512 engagement connection, the actuator c521 pass through driving gear c522, driven gear c523, the first transmission gear C512 and the second transmission gear c513 transmission drives the roller c511 rotation.

In the present invention, by being coaxially disposed driving gear c522 on the drive shaft c5211 of actuator c521, Driven gear c523 is set above drive shaft c5211, is rotatablely connected it with mounting rack c510, and make driven gear c523 and master Moving gear c522 engagement connection, simultaneously, by one end of roller c511 be coaxially disposed the first transmission gear c512, and Staggeredly the second transmission gear c513 is engaged between first transmission gear c512, then by making driven gear c523 simultaneously with the One transmission gear c512 engagement connection, thus realize by actuator c521 pass sequentially through driving gear c522, driven gear c523, First transmission gear c512 and the second transmission gear c513 transmission drive roller wheel c511 rotation, passes the silicon wafer 30 after fragment It send.

Embodiment two

Fig. 3-4 is a kind of structural schematic diagram of the embodiment two of silicon wafer auto plate separation feed device of the utility model, wherein It is hereafter only retouched for simplicity with component identical or corresponding in embodiment one using appended drawing reference corresponding with embodiment one State the distinctive points with embodiment one, the embodiment two and embodiment one the difference is that:

As a preferred embodiment, the through-hole a311 be multiple groups setting, and its respectively with the silicon box 33 Different sizes match setting, each group through-hole a311 cooperates with the limited block 34 to the various sizes of silicon wafer respectively Box 33 fixes.

In the present invention, by the pedestal 31 of silicon wafer load carrier be arranged multiple groups respectively with silicon box 33 not It with the through-hole a311 that size matches, is detachably connected it by pin with the through-hole b341 on limited block 34, realizes Various sizes of silicon box 33 is installed on pedestal, so as to carry out fragment transmission processing to various sizes of silicon wafer 30.

In use, power supply is opened, actuator a22 rotation drives ball-screw 231 to rotate, and ball-screw 231 is logical It crosses sliding block 20 and is further driven to silicon wafer load carrier 3 and pump.In operating process, keep silicon wafer load carrier 3 downward The bottom of silicon chip up-down mechanism 2 is moved to, two straight trough mouths 333 in silicon box 33 is held, is drawn off, by batch silicon wafer 30 Disposable loading can be adjusted silicon wafer stacked position by U type slot 334 into silicon box 33, and silicon wafer 30, which loads, to be completed Silicon box 33 is reapposed on pedestal 31 afterwards, company is fixed by pin by the through-hole a311 on limited block 34 and pedestal It connects, silicon box 33 is fixed, after being installed, move up to silicon wafer load carrier 3 and be stacked on top layer Silicon wafer 30 just touches the roller b421 on hair piece wheel mechanism for rolling 4, and actuator b431 is rotated and passed sequentially through driving gear B432, driven gear b433, the first transmission gear b422 and the second transmission gear b423 transmission drive roller wheel b421 rotation, pass through The frictional force that the rubber sleeve being arranged on roller b421 generates separates silicon wafer 30 from monolithic in silicon box 33, and baffle 32 is to heap The position of folded silicon wafer 30 is supported restriction, it is avoided to topple over due to rubbing action to the direction that silicon wafer 30 transmits.By monolithic The silicon wafer 30 separated continues to be sent on the roller c511 of silicon wafer conveying mechanism 5, and actuator c521 passes sequentially through driving tooth C522, driven gear c523, the first transmission gear c512 and the second transmission gear c513 transmission drive roller wheel c511 rotation are taken turns, it is right Silicon wafer 30 after fragment is sent to carry out subsequent processing.

Since the multiple groups through-hole a311 that sizes different from silicon box 33 match respectively being arranged on pedestal 31, in practical life During production, if you need to carry out fragment feeding to various sizes of silicon wafer 30, limited block 34 can be disassembled, install corresponding ruler Very little silicon box 33, then it is fixed by limited block 34 and being detachably connected for through-hole a311, it realizes to different sizes Silicon wafer 30 carry out fragment feeding needs.

In the present invention, it is to be understood that: term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time The orientation or positional relationship of the instructions such as needle ", " counterclockwise " are to be based on the orientation or positional relationship shown in the drawings, merely to just In description the utility model and simplify description, rather than the specific side that the equipment of indication or suggestion meaning or element must have Position is constructed and operated in a specific orientation, therefore should not be understood as limiting the present invention.

In addition, term " first ", " second " are used for description purposes only, it is not understood to indicate or imply opposite important Property or implicitly indicate the quantity of indicated technical characteristic.Therefore, define " first ", the feature of " second " can be expressed or Person implicitly includes one or more of the features.In the description of the utility model, the meaning of " plurality " is two or two More than a, unless otherwise specifically defined.

The preferable specific embodiment of the above, only the utility model, but the protection scope of the utility model is not It is confined to this, the variation that anyone skilled in the art can readily occur under the technical clarification of the utility model Or replacement, such as cooperated by push component and positioning mechanism, realizes the automatic preliminary bending after the orientation transfer of bending steel pipe, knot It closes placing modules and pushes the special construction setting of component, make to carry out amount of feeding adjustment in steel pipe bending process automatically, realize steel The design concept of the high-precision bending production of pipe, should be covered within the scope of the utility model.Therefore, this is practical new The protection scope of type should be subject to the scope of protection of the claims.

Claims (10)

1. a kind of silicon wafer auto plate separation feed device characterized by comprising

Rack (1), the rack (1) include that supporting plate (11) and lifting area (12), the lifting area (12) are set to the supporting plate (11) side；

Silicon chip up-down mechanism (2), the silicon chip up-down mechanism (2) is vertically arranged on the lifting area (12), with the branch Plate (11) is detachably connected, and is provided with and is reciprocatingly slided the sliding block of setting along silicon chip up-down mechanism (2) vertical direction (20)；

Silicon wafer load carrier (3), the silicon wafer load carrier (3) are set to the silicon chip up-down mechanism (2) away from the rack (1) side is fixedly connected with the sliding block (20), and its from the silicon chip up-down mechanism (2) drive along the vertical direction toward Multiple lifting is arranged, and carrying is provided with the silicon wafer (30) for stacking setting on the silicon wafer load carrier (3)；

Send out piece wheel mechanism for rolling (4), hair piece wheel mechanism for rolling (4) installation settings in the top of the silicon wafer load carrier (3), It is detachably connected with the supporting plate (11), and it contradicts with the silicon wafer (30) for stacking setting on the silicon wafer load carrier (3) and sets It sets, which drives the silicon wafer (30) horizontal fragmentation one by one；And

Silicon wafer conveying mechanism (5), the silicon wafer conveying mechanism (5) is set to the bottom of hair piece wheel mechanism for rolling (4), with institute It states supporting plate (11) to be detachably connected, input terminal is set to the output of hair piece wheel mechanism for rolling (4), the silicon wafer conveyer Structure (5) drives the silicon wafer (30) horizontal feed one by one.

2. a kind of silicon wafer auto plate separation feed device according to claim 1, which is characterized in that the silicon chip up-down mechanism (2) include:

Support base (21), the support base (21) are detachably connected with the supporting plate (11)；

Actuator a (22), the actuator a (22) are set to the top of the support base (21), and bottom is fixedly connected with drive Moving axis (221), the drive shaft (221) are arranged through the support base (21)；

Lifting assembly (23), the lifting assembly (23) extend to the support base (21) at the top of the support base (21) Bottom, sliding is provided with the sliding block (20) thereon.

3. a kind of silicon wafer auto plate separation feed device according to claim 2, which is characterized in that the lifting assembly (23) Include:

Ball-screw (231), the top of the ball-screw (231) and the drive shaft (221) coaxially connected setting, bottom It is rotatably dispose on the support base (21)；

Support rod (232), it is parallel with the supporting plate (11) that the support rod (232) is symmetrically disposed on the ball-screw (231) Two sides, and it is fixedly connected with the support base (21)；

The sliding block (20) is sheathed on the ball-screw (231) and the support rod (232), by the ball-screw (231) rotation drives and reciprocatingly slides.

4. a kind of silicon wafer auto plate separation feed device according to claim 1, which is characterized in that the silicon wafer load carrier (3) include:

Pedestal (31), pedestal (31) side are fixedly connected with the sliding block (20), the through-hole a (311) being provided with；

Baffle (32), the baffle (32) are vertically arranged on the pedestal (31) one of silicon wafer conveying mechanism (5) described in face Side, and it is vertically arranged with the supporting plate (11)；

Silicon box (33), the silicon box (33) contradict and are set on the pedestal (31), and one side is that opening is arranged and supports It leaning against on the baffle (32), is formed silicon wafer rest area (331), top is provided with the discharge port (332) of the silicon wafer (30), And the silicon box (33) is parallel at the top of the two sides of described hair piece wheel mechanism for rolling (4) transmission direction and offers straight trough mouth respectively (333), the side of baffle (32) described in the face of bottom is provided with U type slot (334)；

Limited block (34), the limited block (34) is L-type, with the silicon box (33) bottom backwards to the baffle (32) two sides Right angle card and, be provided with the through-hole b (341) to match with the through-hole a (311), and itself and the pedestal (31) It is detachably connected by pin, the silicon box (33) is fixed.

5. a kind of silicon wafer auto plate separation feed device according to claim 4, which is characterized in that the through-hole a (311) is Multiple groups setting, and its setting that matches respectively from the different sizes of the silicon box (33), each group through-hole a (311) respectively with Limited block (34) cooperation fixes the various sizes of silicon box (33).

6. a kind of silicon wafer auto plate separation feed device according to claim 1, which is characterized in that the hair piece wheel mechanism for rolling (4) include:

Connecting plate (41), the connecting plate (41) are vertically arranged, and one side is connect with the supporting plate (11) vertical removable；

Roll assembly b (42), the roll assembly b (42) is set to the top of the silicon wafer load carrier (3), with the company Fishplate bar (41) is detachably connected away from the side of the supporting plate (11)；

Driving assembly b (43), the driving component b (43) are horizontally placed on the roll assembly b (42) described in face and connect The side of plate (41).

7. a kind of silicon wafer auto plate separation feed device according to claim 6, which is characterized in that the roll assembly b (42) include:

Roller b (421), several roller b (421) are arranged successively and turn along the conveying direction of hair piece wheel mechanism for rolling (4) Dynamic to be set on mounting rack b (420), the mounting rack b (420) is detachably connected with the connecting plate (41), and roller b (421) rubber sleeve is set on；

First transmission gear b (422), several first transmission gear b (422) are fixedly installed on several roller b respectively (421) one end is coaxially disposed with the roller b (421)；And

Second transmission gear b (423), several second transmission gear b (423) are staggered in the first transmission gear b (422) it between, is rotatablely connected with the mounting rack b (420), and it engages connection with the first transmission gear b (422).

8. a kind of silicon wafer auto plate separation feed device according to claim 7, which is characterized in that the driving component b (43) include:

Actuator b (431), the actuator b (431) are set on the mounting rack b (420) by bracket b (430) close to institute State the side of the first transmission gear b (422), the first transmission gear b (422) described in drive shaft b (4311) face and the roller Wheel b (421) is arranged in parallel；

Driving gear b (432), driving gear b (432) coaxial arrangement is on the drive shaft b (4311)；

Driven gear b (433), the driven gear b (433) is set to below the drive shaft b (4311), with the installation Frame b (420) rotation connection, engages connection at the top of the driven gear b (433) with the driving gear b (432), one side and First transmission gear b (422) the engagement connection, the actuator b (431) pass through driving gear b (432), driven gear b (433), the first transmission gear b (422) and the second transmission gear b (423) transmission drives roller b (421) rotation.

9. a kind of silicon wafer auto plate separation feed device according to claim 1, which is characterized in that the silicon wafer conveying mechanism It (5) include (51) roll assembly c, the roll assembly c (51) includes:

Roller c (511), several roller c (511) are arranged successively and turn along the conveying direction of hair piece wheel mechanism for rolling (4) It is dynamic to be set on mounting rack c (510)；

First transmission gear c (512), several first transmission gear c (512) are fixedly installed on several roller c respectively (511) one end is coaxially disposed with the roller c (511)；And

Second transmission gear c (513), several second transmission gear c (513) are staggered in the first transmission gear c (512) it between, is rotatablely connected with the mounting rack c (510), and it engages connection with the first transmission gear c (512).

10. a kind of silicon wafer auto plate separation feed device according to claim 9, which is characterized in that the silicon wafer conveyer Structure (5) further includes (52) driving assembly c, and the driving component c (52) includes:

Actuator c (521), the actuator c (521) are set to mounting rack c (510) bottom end by bracket c (520) Close to the side of the first transmission gear c (512), the first transmission gear c (512) described in drive shaft c (5211) face with The roller c (511) is arranged in parallel；

Driving gear c (522), driving gear c (522) coaxial arrangement is on the drive shaft c (5211)；

Driven gear c (523), the driven gear c (523) is set to above the drive shaft c (5211), with the installation Frame c (510) rotation connection, (523) bottom driven gear c engage connection with the driving gear c (522), one side and First transmission gear c (512) the engagement connection, the actuator c (521) pass through driving gear c (522), driven gear c (523), the first transmission gear c (512) and the second transmission gear c (513) transmission drives roller c (511) rotation.