CN209095967U - A kind of panel vacuum thin wall structure stock mould - Google Patents
A kind of panel vacuum thin wall structure stock mould Download PDFInfo
- Publication number
- CN209095967U CN209095967U CN201821476962.4U CN201821476962U CN209095967U CN 209095967 U CN209095967 U CN 209095967U CN 201821476962 U CN201821476962 U CN 201821476962U CN 209095967 U CN209095967 U CN 209095967U
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- upper mold
- lower die
- profiling
- water channel
- water
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Abstract
The utility model discloses a kind of panel vacuum thin wall structure stock moulds, several modular units, each modular unit includes upper die and lower die, the lower end surface of the upper mold is disposed with upper mold sizing chamber, several upper mold profiling water channels are disposed with inside the upper mold, working face of the upper mold profiling water channel close to upper mold sizing chamber, several lower die profiling water channels are disposed with inside the lower die, working face of the lower die profiling water channel close to lower die sizing chamber, it further include the first water seepage hole that multiple upper surfaces from upper mold or/and side end face are through to upper mold sizing chamber, the upper mold profiling water channel and lower die profiling water channel are arranged with inlet and outlet.Cooling water penetrates into upper mold by the first water seepage hole and is formed in chamber, comes into full contact with cooling water with product external surfaces, promotes heat-conducting effect, and principle is exactly to take away heat using cooling water and product surface contact area is increased.
Description
Technical field
The utility model relates to one of auto parts and components PRODUCTION TRAITS field stock mould, especially a kind of panel vacuum
Thin-wall construction stock mould.
Background technique
General forming mold structure is to cause brass to wear, production with solid brass, product PP skeleton and the friction of brass inner surface
Product section variation, it is unstable；And the structure advanced optimized is with solid stainless steel structure, wear-resistant, cooling heat-conducting effect is slightly
Weak and brass.On the whole, 1, brass solid construction: it is thermally conductive fast, it is easy fever, is prone to wear, 2, stainless steel solid structure: leads
It is hot slow, it is wear-resistant, it needs to increase multiple groups stock mould, makes up cooling and shaping effect.Therefore, a kind of sizing that thermal conductivity is good is needed
Mould.
Utility model content
The purpose of this utility model is to provide a kind of panel vacuum thin wall structure stock mould, by water flow in vacuum
Flowing inside slot, takes away the heat on thin-wall construction, and thermally conductive apart from short, flow of cooling water is strong, reduces stock mould quantity, improves
Cooling effect.
The solution that the utility model solves its technical problem is: a kind of panel vacuum thin wall structure stock mould, several
A modular unit, each modular unit include upper die and lower die, the lower end surface of the upper mold be disposed with upper mold sizing chamber, it is described on
Be disposed with several upper mold profiling water channels inside mould, the upper mold profiling water channel close to upper mold sizing chamber working face, under described
Several lower die profiling water channels are disposed with inside mould, the lower die profiling water channel further includes close to the working face of lower die sizing chamber
It is multiple from the upper surface of upper mold or/and side end face be through to upper mold sizing chamber the first water seepage holes, the upper mold profiling water channel and
Lower die profiling water channel is arranged with inlet and outlet.
As a further improvement of the above technical scheme, first water seepage hole sequentially passes through upper mold, upper mold profiling water channel
After upper mold sizing chamber, upper mold profiling water channel is connected to upper mold sizing chamber by the first water seepage hole.
It as a further improvement of the above technical scheme, further include that multiple upper surfaces from lower die or/and side end face are run through
To the second water seepage hole of lower die sizing chamber.
As a further improvement of the above technical scheme, second water seepage hole sequentially passes through lower die, lower die profiling water channel
After lower die sizing chamber, lower die profiling water channel is connected to lower die sizing chamber by the second water seepage hole.
As a further improvement of the above technical scheme, corresponding upper mold profiling water channel connects in two neighboring modular unit
It is logical, corresponding lower die profiling water channel connection in two neighboring modular unit.
The beneficial effects of the utility model are: when the utility model is used, cooling water is from upper mold profiling water channel and lower imitation
Shape water channel pours, and since water flow pressure is big, cooling water penetrates into upper mold by the first water seepage hole and is formed in chamber, makes cooling water and produces
Product outer surface comes into full contact with, and promotes heat-conducting effect, and principle is exactly to be taken away using cooling water and product surface contact area is increased
Heat.The utility model is suitable for the extrusion production that panel and interior water are cut.
Detailed description of the invention
It, below will be to required in embodiment description in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
Attached drawing to be used is briefly described.Obviously, described attached drawing is a part of the embodiment of the utility model, rather than complete
Portion's embodiment, those skilled in the art without creative efforts, can also be obtained according to these attached drawings it
His design scheme and attached drawing.
Fig. 1 is the cross-sectional view of the utility model；
Fig. 2 is the top view of upper mold in the utility model.
Specific embodiment
It is carried out below with reference to technical effect of the embodiment and attached drawing to the design of the utility model, specific structure and generation
It clearly and completely describes, to be completely understood by the purpose of this utility model, feature and effect.Obviously, described embodiment
It is a part of the embodiment of the utility model, rather than whole embodiments, it is based on the embodiments of the present invention, the skill of this field
Art personnel other embodiments obtained without creative efforts belong to the model of the utility model protection
It encloses.In addition, all connection/connection relationships being previously mentioned in text, not singly refer to that component directly connects, and referring to can be according to specific reality
Situation is applied, by adding or reducing couple auxiliary, Lai Zucheng more preferably coupling structure.
Referring to Fig.1~Fig. 2, a kind of panel vacuum thin wall structure stock mould, several modular units, each modular unit packet
Upper mold 1 and lower die 2 are included, the lower end surface of the upper mold 1 is disposed with upper mold sizing chamber, is disposed on several inside the upper mold 1
Shape water channel 10 is imitated, for the upper mold profiling water channel 10 close to the working face of upper mold sizing chamber, upper mold profiling water channel 10 and upper mold are fixed
It is separated by between type chamber by thin-walled, when being formed heat dissipation, the water in upper mold profiling water channel 10 can be allowed quickly to take away heat, it is described
Several lower die profiling water channels 20, work of the lower die profiling water channel 20 close to the sizing chamber of lower die 2 are disposed with inside lower die 2
Face is separated by by thin-walled between lower die profiling water channel 20 and the sizing chamber of lower die 2, the water in lower die profiling water channel 20 can be allowed quick
Heat is taken away, further includes the first water seepage hole 11 that multiple upper surfaces from upper mold 1 or/and side end face are through to upper mold sizing chamber,
The upper mold profiling water channel 10 and lower die profiling water channel 20 are arranged with inlet and outlet.It is right in two neighboring modular unit
The upper mold profiling water channel 10 answered is connected to, and corresponding lower die profiling water channel 20 is connected in two neighboring modular unit.That is modular unit
In 10 water outlet of upper mold profiling water channel be connected to 10 water inlet of upper mold profiling water channel corresponding in adjacent modular unit, lower imitation
The mode of communicating of shape water channel 20 is similar.Arrow in Fig. 1 is water (flow) direction.
Cooling water is poured from upper mold profiling water channel 10 and lower die profiling water channel 20, and since water flow pressure is big, cooling water passes through
First water seepage hole 11 penetrates into upper mold sizing chamber, comes into full contact with cooling water with product external surfaces, promotes heat-conducting effect, former
Reason is exactly to take away heat using cooling water and product surface contact area is increased.
It is further used as preferred embodiment, first water seepage hole 11 sequentially passes through upper mold 1, upper mold profiling water channel 10
After upper mold sizing chamber, upper mold profiling water channel 10 is connected to upper mold sizing chamber by the first water seepage hole 11.
It is further used as preferred embodiment, further includes that multiple upper surfaces from lower die 2 or/and side end face are through to down
Second water seepage hole of the sizing chamber of mould 2.
It is further used as preferred embodiment, second water seepage hole sequentially passes through lower die 2,20 and of lower die profiling water channel
Lower die 2 is formed after chamber, and lower die profiling water channel 20 is connected to the sizing chamber of lower die 2 by the second water seepage hole.
Upper mold 1 and lower die 2 are by emptying solid stainless steel stock mould accessory and being made thermally conductive apart from short, support effect
Suitable thin-walled rear support takes away skeleton when flowing water flow from upper mold profiling water channel 10 and lower die profiling water channel 20
The heat on surface, to achieve the effect that continued down；Upper mold 1 vertically bores the first water seepage hole 11 of 5mm, and 2 surface of lower die is vertical
The second water seepage hole of 5mm is bored, in upper mold profiling water channel 10 and lower die profiling water channel 20 while water flowing, from the first water seepage hole 11
Skeleton opening the inside is penetrated into or/and, expects that surface contacts, and takes away skeleton surface temperature, reaches reinforced heat conduction firmly with skeleton
Effect；Along product traffic direction, increase jet water spout before the true modular unit of each seat, forms cooling recirculation system, before
The heat in stock mould vacuum structure is taken away in bath, and the water on sink both sides imports front again, continues to supplement water；Finally cold
But under recycling, continued down achievees the effect that constant temperature is cooling, promotes the stability of section.
It is to be illustrated to the better embodiment of the utility model, but the invention is not limited to institute above
Embodiment is stated, those skilled in the art can also make various be equal without departing from the spirit of the present invention
Variation or replacement, these equivalent variation or replacement are all included in the scope defined by the claims of the present application.
Claims (5)
1. a kind of panel vacuum thin wall structure stock mould, it is characterised in that: several modular units, each modular unit include upper
Mould and lower die, the lower end surface of the upper mold are disposed with upper mold sizing chamber, are disposed with several upper mold profiling water inside the upper mold
Road, the upper mold profiling water channel are disposed with several lower die profiling water inside the lower die close to the working face of upper mold sizing chamber
Road, the lower die profiling water channel further include multiple upper surfaces or/and side end face from upper mold close to the working face of lower die sizing chamber
It is through to the first water seepage hole of upper mold sizing chamber, the upper mold profiling water channel and lower die profiling water channel are arranged with water inlet and go out
The mouth of a river.
2. panel vacuum thin wall structure stock mould according to claim 1, it is characterised in that: first water seepage hole is successively
After upper mold, upper mold profiling water channel and upper mold sizing chamber, upper mold profiling water channel and upper mold sizing chamber pass through the first water seepage hole and connect
It is logical.
3. panel vacuum thin wall structure stock mould according to claim 1 or 2, it is characterised in that: further include multiple under
The upper surface or/and side end face of mould are through to the second water seepage hole of lower die sizing chamber.
4. panel vacuum thin wall structure stock mould according to claim 3, it is characterised in that: second water seepage hole is successively
After lower die, lower die profiling water channel and lower die sizing chamber, lower die profiling water channel and lower die sizing chamber pass through the second water seepage hole and connect
It is logical.
5. panel vacuum thin wall structure stock mould according to claim 1 or 2, it is characterised in that: two neighboring sizing is single
Corresponding upper mold profiling water channel is connected in member, corresponding lower die profiling water channel connection in two neighboring modular unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821476962.4U CN209095967U (en) | 2018-09-10 | 2018-09-10 | A kind of panel vacuum thin wall structure stock mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821476962.4U CN209095967U (en) | 2018-09-10 | 2018-09-10 | A kind of panel vacuum thin wall structure stock mould |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209095967U true CN209095967U (en) | 2019-07-12 |
Family
ID=67152317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821476962.4U Active CN209095967U (en) | 2018-09-10 | 2018-09-10 | A kind of panel vacuum thin wall structure stock mould |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209095967U (en) |
-
2018
- 2018-09-10 CN CN201821476962.4U patent/CN209095967U/en active Active
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