CN209083671U - Compressor impeller based on semiconductor refrigerating technology heat dissipation - Google Patents

Abstract

The utility model discloses a kind of compressor impellers based on semiconductor refrigerating technology heat dissipation, including impeller body, the impeller body includes chassis, shaft connecting hole, rotary table entity and wind blade, the lower end surface of the rotary table entity is connected to the upper surface on the chassis, the inside center of the rotary table entity, which runs through, is equipped with the shaft connecting hole, the opening of the shaft connecting hole is exported from the upper surface of the rotary table entity, the surrounding of the rotary table entity sets the arcuate flanks of indent, several wind blades are connected in the arcuate flanks, the lower end surface on the chassis is recessed inwardly opens up a circle radiating groove, if the opening connection heat dissipation copperhead of the radiating groove, the heat dissipation copperhead includes heat-conducting plate and several heat dissipation thin slices, the heat dissipation thin slice vertical arrangement is connected on the lateral surface of the heat-conducting plate.By the above-mentioned means, the utility model can be effectively reduced the temperature that wheel member in compressor is saved bit by bit heat in long lasting for work and promoted.

Description

Compressor impeller based on semiconductor refrigerating technology heat dissipation

Technical field

The utility model relates to compressor impeller fields, more particularly to a kind of pressure based on semiconductor refrigerating technology heat dissipation Contracting machine impeller.

Background technique

Compressor is a kind of driven fluid machinery that low-pressure gas is promoted to high pressure gas, is the heart of refrigeration system Dirty, it is operated after compressing with piston to it, to row from the refrigerant gas of air intake duct sucking low-temp low-pressure by motor The refrigerant gas of high temperature and pressure is discharged in tracheae, provides power for refrigeration cycle, and the core component of the inside of compressor is impeller, Also known as active wheel, uniquely to the element of air-flow work done in centrifugal compressor, main component on rotor, impeller, which both refers to, to be equipped with The wheel disc of movable vane, is the component part of impulse turbine rotor, and the general name of finger wheel disk and the moving blade being installed on it, leaf It takes turns when carrying out continuous work inside compressor in thousands of rpms of revolving speed, in continuously working condition Under, the blade of impeller is contacted with windage can generate a large amount of heat, and a large amount of accumulation of heat can promote impeller metal master Temperature constantly rise, will affect the metal rigidity structure of impeller under serious situation, cause permanent or semipermanent structure broken It is bad.

Utility model content

The utility model is mainly solving the technical problems that provide a kind of compressor based on semiconductor refrigerating technology heat dissipation Impeller can be effectively reduced the temperature that wheel member in compressor is saved bit by bit heat in long lasting for work and promoted.

In order to solve the above technical problems, the technical solution that the utility model uses is: providing a kind of based on semiconductor The compressor impeller of Refrigeration Technique heat dissipation, including impeller body, the impeller body include chassis, shaft connecting hole, rotary table reality Body and wind blade, the lower end surface of the rotary table entity are connected to the upper surface on the chassis, in the inside of the rotary table entity The heart, which runs through, is equipped with the shaft connecting hole, and the opening of the shaft connecting hole is exported from the upper surface of the rotary table entity, described The surrounding of rotary table entity sets the arcuate flanks of indent, several wind blades, the bottom are connected in the arcuate flanks The lower end surface of disk is recessed inwardly opens up a circle radiating groove, if the opening connection heat dissipation copperhead of the radiating groove, the heat dissipation Copperhead includes heat-conducting plate and several heat dissipation thin slices, and the heat dissipation thin slice vertical arrangement is connected to the lateral surface of the heat-conducting plate On, the medial surface of the heat-conducting plate connects one 90 ° of elbows, and the other end of 90 ° of elbows connects semiconductor chilling plate, and described half Huyashi-chuuka (cold chinese-style noodles) and heating surface are equipped on conductor cooling piece, the chill surface attaching is connected on the outer wall of the shaft connecting hole, described Heating surface is connect with 90 ° of elbows.

In one preferred embodiment of the utility model, 90 ° of elbows are made of solid heat-conducting metal, and described 90 ° Heat-conducting silicone grease is coated on the contact surface of elbow and the heat-conducting plate and the semiconductor chilling plate.

In one preferred embodiment of the utility model, the side of the semiconductor chilling plate exports two power supply lines, institute Power supply line is stated to export from the lower end surface on the chassis.

In one preferred embodiment of the utility model, the outside end of the heat dissipation thin slice is without departing from the radiating groove Opening.

The beneficial effects of the utility model are: a kind of compressor leaf that can independently radiate of the utility model major design Wheel, it is well known that impeller is the unique parts for contacting acting inside compressor with air, the axial connection electric rotating of impeller Machine needs to continue working several hours under the high speed operation state of thousands of revolving speeds, if do not carried out at effective heat dissipation to it Reason, just will affect its working condition, but impeller itself is small in size, and internal structural space is limited, can not be designed wind to it Fan structure radiates, and semiconductor refrigerating technology in recent years can preferably break through this obstacle, passes through semiconductor refrigerating The cold end Refrigeration Technique of piece realizes the neutralization of heat with the heating part of impeller internal, then carries out heat dissipation export to fever end ?.

Detailed description of the invention

It, below will be to required in embodiment description in order to illustrate more clearly of the technical scheme in the embodiment of the utility model Attached drawing to be used is briefly described, it should be apparent that, the accompanying drawings in the following description is only some realities of the utility model Example is applied, it for those of ordinary skill in the art, without creative efforts, can also be according to these attached drawings Obtain other attached drawings, in which:

The structure for one preferred embodiment of compressor impeller that Fig. 1, which is the utility model, to be radiated based on semiconductor refrigerating technology is shown It is intended to；

The components in the drawings are labeled as follows: 1, impeller body；2, chassis；3, shaft connecting hole；4, rotary table entity；5, it leads Air blade；6, arcuate flanks；7, radiating groove；8, radiate copperhead；9, heat-conducting plate；10, radiate thin slice；11,90 ° of elbows；12, it partly leads Body cooling piece；13, chill surface；14, heating surface.

Specific embodiment

Below by the technical scheme in the utility model embodiment is clearly and completely described, it is clear that described Embodiment is only a part of the embodiment of the utility model, instead of all the embodiments.Based on the implementation in the utility model Example, all other embodiment obtained by those of ordinary skill in the art without making creative efforts belong to The range of the utility model protection.

Referring to Fig. 1, the utility model embodiment includes:

A kind of compressor impeller based on semiconductor refrigerating technology heat dissipation, including impeller body 1, the impeller body 1 wrap Chassis 2, shaft connecting hole 3, rotary table entity 4 and wind blade 5 are included, the lower end surface of the rotary table entity 4 is connected to the chassis 2 Upper surface, the inside center of the rotary table entity 4, which runs through, is equipped with the shaft connecting hole 3, the opening of the shaft connecting hole 3 It is exported from the upper surface of the rotary table entity 4, the surrounding of the rotary table entity 4 sets the arcuate flanks 6 of indent, the arcuate flanks Several wind blades 5 are connected on 6, the lower end surface on the chassis 2 is recessed inwardly opens up a circle radiating groove 7, described If the opening connection heat dissipation copperhead 8 of radiating groove 7, the heat dissipation copperhead 8 include heat-conducting plate 9 and several heat dissipation thin slices 10, institute It states the heat dissipation vertical arrangement of thin slice 10 to be connected on the lateral surface of the heat-conducting plate 9, the medial surface of the heat-conducting plate 9 connects one 90 ° Elbow 11, the other end of 90 ° of elbows 11 connect semiconductor chilling plate 12, are equipped with huyashi-chuuka (cold chinese-style noodles) 13 on the semiconductor chilling plate 12 With heating surface 14, the chill surface 13 attaching is connected on the outer wall of the shaft connecting hole 3, the heating surface 14 with it is described 90 ° of elbows 11 connect.

In addition, 90 ° of elbows 11 are made of solid heat-conducting metal, 90 ° of elbows and the heat-conducting plate and described Heat-conducting silicone grease is coated on the contact surface of semiconductor chilling plate.

In addition, the side of the semiconductor chilling plate 12 exports two power supply lines, the power supply line is under the chassis 2 End face export.

In addition, opening of the outside end of the heat dissipation thin slice 10 without departing from the radiating groove 7.

The working principle of the utility model is that impeller body 1 includes chassis 2, shaft connecting hole 3, rotary table entity 4 and wind-guiding Blade 5, the lower end surface of rotary table entity 4 are connected to the upper surface on chassis 2, and the inside center of rotary table entity 4, which runs through, is equipped with shaft company Hole 3 is connect, the opening of shaft connecting hole 3 is exported from the upper surface of rotary table entity 4, and the surrounding of rotary table entity 4 sets the curved side of indent Face 6.

Several wind blades 5 are connected in arcuate flanks 6, the lower end surface on chassis 2 is recessed inwardly opens up circle heat dissipation Slot 7, if the opening connection heat dissipation copperhead 8 of radiating groove 7, heat dissipation copperhead 8 includes heat-conducting plate 9 and several heat dissipation thin slices 10, is dissipated For the outside end of hot thin slice 10 without departing from the opening of radiating groove 7, the thin slice 10 that radiates is arranged vertically the lateral surface for being connected to heat-conducting plate 9 On, the medial surface of heat-conducting plate 9 connects one 90 ° of elbows 11, for converting the direction of internal conductive structure, from the direction on vertical chassis It is changed into the direction structure of vertical rotation axis.

Other end connection 12,90 ° of elbows 11 of semiconductor chilling plate of 90 ° of elbows 11 are made of solid heat-conducting metal, and 90 ° Be coated with heat-conducting silicone grease on the contact surface of elbow and heat-conducting plate and semiconductor chilling plate, heat-conducting silicone grease can fill up contact surface it Between gap, while playing the role of conducting heat, be equipped with huyashi-chuuka (cold chinese-style noodles) 13 and heating surface 14, chill surface 13 on semiconductor chilling plate 12 Attaching is connected on the outer wall of shaft connecting hole 3, and heating surface 14 and 90 ° elbow 11 is connect, and the side of semiconductor chilling plate 12 is led Two power supply lines out, power supply line are exported from the lower end surface on chassis 2, carry out the power supply within 12 width just to semiconductor chilling plate 12 It can make its normal work, semiconductor chilling plate 12 plays the role of transmitting heat in radiator structure, can be effectively by leaf Take turns the heat derives that axial rub generates.

The above description is only the embodiments of the present invention, and therefore it does not limit the scope of the patent of the utility model, all Using equivalent structure or equivalent flow shift made by the utility model description, it is applied directly or indirectly in other phases The technical field of pass, is also included in the patent protection scope of the utility model.

Claims (4)

1. a kind of compressor impeller based on semiconductor refrigerating technology heat dissipation, including impeller body, which is characterized in that the impeller Ontology includes chassis, shaft connecting hole, rotary table entity and wind blade, and the lower end surface of the rotary table entity is connected to the chassis Upper surface, the inside center of the rotary table entity, which runs through, is equipped with the shaft connecting hole, the opening of the shaft connecting hole from The upper surface of the rotary table entity exports, and the surrounding of the rotary table entity sets the arcuate flanks of indent, connects in the arcuate flanks Several wind blades are connected to, the lower end surface on the chassis is recessed inwardly opens up a circle radiating groove, the radiating groove If opening connection heat dissipation copperhead, the heat dissipation copperhead include heat-conducting plate and several heat dissipation thin slices, the heat dissipation thin slice is vertical Arrangement is connected on the lateral surface of the heat-conducting plate, and the medial surface of the heat-conducting plate connects one 90 ° of elbows, 90 ° of elbows The other end connects semiconductor chilling plate, and the semiconductor refrigerating on piece is equipped with huyashi-chuuka (cold chinese-style noodles) and heating surface, and the chill surface attaches connection On the outer wall of the shaft connecting hole, the heating surface is connect with 90 ° of elbows.

2. the compressor impeller according to claim 1 based on semiconductor refrigerating technology heat dissipation, which is characterized in that described 90 ° of elbows are made of solid heat-conducting metal, the contact surface of 90 ° of elbows and the heat-conducting plate and the semiconductor chilling plate On be coated with heat-conducting silicone grease.

3. the compressor impeller according to claim 1 based on semiconductor refrigerating technology heat dissipation, which is characterized in that described half The side of conductor cooling piece exports two power supply lines, and the power supply line is exported from the lower end surface on the chassis.

4. the compressor impeller according to claim 1 based on semiconductor refrigerating technology heat dissipation, which is characterized in that described to dissipate Opening of the outside end of hot thin slice without departing from the radiating groove.