CN209072783U - A kind of intelligent flexible micropore HDI wiring board - Google Patents
A kind of intelligent flexible micropore HDI wiring board Download PDFInfo
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- CN209072783U CN209072783U CN201821369825.0U CN201821369825U CN209072783U CN 209072783 U CN209072783 U CN 209072783U CN 201821369825 U CN201821369825 U CN 201821369825U CN 209072783 U CN209072783 U CN 209072783U
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- copper foil
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Abstract
A kind of intelligent flexible micropore HDI wiring board involved by the utility model, including PCB substrate, because PCB substrate includes base main body, via hole, the first buried via hole, the first blind hole, the second buried via hole, the second blind hole.Since base main body is spliced to form by identical half substrate of two parts, and half substrate is to be spaced apart from each other stacking by plural layer copper foil layer and PP layers to be stamped to form, so that the processing of the copper foil layer and PP layers of progress segmented, reduce thickness when base main body processing, be conducive to avoid the thickness problem of PCB substrate in the prior art and cause the hole wall quality for reducing processed hole, to reach the function of improving the hole wall quality for being processed hole.At the same time, since segmented is processed so that segmented assembling, is conducive to facilitate processing and assembling.Again due to filling PP layers respectively between the plural layer copper foil layer and copper foil layer, be conducive in time take away heat above copper foil layer, to be conducive to improve the effect of heat dissipation.
Description
[technical field]
The utility model relates to a kind of intelligent flexible micropore HDI wiring boards in circuit board technology field.
[background technique]
Modern electronic equipment industry development is rapid, different with semiconductor transistor manufacturing technology along with silicon integrated circuit plate
It breaks through, electronic chip increasingly tends to densification, densification above printed circuit board, and high power direction is developed.Printed circuit board is
The substrate before electronic component is assembled, which is to be formed by electronic circuit by circuit board, by various electricity
Sub- component links together, to achieve the purpose that relay transmission.The substrate be as provide electronic component and
Main support body when the installation of electronics member device and grafting, is indispensable part in all electronic products.However, existing tradition is more
Laminate is by single force fit plate as semi-finished product, and by drilling, whole interconnection is formed after the techniques such as plated hole and circuit etching.?
In process, since single force fit plate is pressed by multi-layer board, so that the thickness of the single force fit plate is thicker, hold very much
It is easier that some flashes of the multiple-plate hole internal residual described in boring procedure or burr or hole wall inner wall surface generate it is concave-convex
Unequal technical phenomena causes the hole wall quality for being processed hole relatively low.
[utility model content]
In view of this, the technical problem to be solved by the utility model is to provide a kind of with the hole wall for improving processed hole
Quality facilitates processing and assembling, is conducive to the intelligent flexible micropore HDI wiring board for improving heat dissipation.
Above-mentioned technical problem is solved thus, a kind of intelligent flexible micropore HDI line of technical solution institute in the utility model
Road plate comprising plural kind of the electronic component above PCB substrate is respectively welded in PCB substrate；The PCB substrate includes substrate
Main body is set to the via hole of base main body central position, is respectively arranged at the first buried via hole of via hole two sides, is respectively set
The first blind hole in the first buried via hole two sides is respectively arranged at the second buried via hole of the first blind hole two sides, is respectively arranged at the second buried via hole
Second blind hole in outside；The base main body is to be spliced to form by identical half substrate of two parts, and half substrate is by multiple
Several layers of copper foil layer and PP layers are spaced apart from each other stacking and are stamped to form.
It further limiting, half substrate includes the first copper foil layer for being placed in top, and the below the first copper foil layer
One PP layers, set on the first the second copper foil layer below PP layers, the 2nd PP layers below the second copper foil layer are set to the 2nd PP layers
Following third copper foil layer, the 3rd PP layers below third copper foil layer, set on the 3rd the 4th copper foil layer below PP layers, if
The 4th PP layers below the 4th copper foil layer, set on the 4th the 5th copper foil layer below PP layers.
It further limits, first copper foil layer, the second copper foil layer, third copper foil layer, the 4th copper foil layer, the 5th copper foil layer
It is made of heat-dissipating aluminium plate material or copper sheet material respectively.
Further limit, the described first PP layers, the 2nd PP layers, the 3rd PP layers, the 4th PP layers be by heat-conducting silicone grease material respectively
Material is made.
It further limits, first copper foil layer includes first segment copper foil layer and second segment copper foil layer；The first segment
Copper foil layer one end is provided with mutually identical left half upper second blind hole with the second blind hole upper portion；The second segment copper foil
Layer one end is provided with right half upper second blind hole mutually identical with the second blind hole upper portion, and the second segment copper foil layer is another
End is provided with the left half upper via hole mutually identical with via hole upper portion；The first segment copper foil layer and second segment copper foil layer
It mutually pieces together and is composed the first copper foil layer.
It further limits, second copper foil layer includes third section copper foil layer and the 4th section of copper foil layer；The third section
The central position of copper foil layer is provided with the second blind hole, the third section copper on the left side half for wearing the second blind hole the lower section Xia
One end of layers of foil is provided with left half upper second buried via hole mutually identical with the second buried via hole upper portion；The 4th section of copper foil layer
Middle position is separately provided for wearing left half first buried via hole of the first buried via hole upper portion, the first blind hole upper portion,
Left half first blind hole, the 4th section of copper foil layer other end are provided with the Zuo Banzhong via hole for wearing conducting；The third
Section copper foil layer and the 4th section of copper foil layer are mutually pieced together and are composed；The structure of third copper foil layer and the second copper foil layer structure phase
Together.
It further limits, the 4th copper foil layer includes the 5th section of copper foil layer and the 6th section of copper foil layer；The 5th section of copper
It is separately provided for wearing the first blind hole, the first blind hole perforating of the second buried via hole, the second blind hole perforating in layers of foil；It is described
5th section of copper foil layer one end is provided with lower first blind hole in a left side half for wearing the first blind hole the lower section；The 6th section of copper foil layer
One end is provided with the first blind hole right side half for wearing the first blind hole the lower section Xia；The other end of the 6th section of copper foil layer is set
It is equipped with the via hole left side half for wearing via hole the lower section Xia；The 5th section of copper foil layer is mutually spelled with the 6th section of copper foil layer
Connection of gathering is composed.
It further limits, the 5th copper foil layer includes the 7th section of copper foil layer, is arranged above the 7th section of copper foil layer useful
In the first blind hole of bottom for wearing the first blind-hole bottom part, the other end of the 7th section of copper foil layer is provided with for wearing conducting
The half bottom via hole of a left side of hole bottom part.
The advantageous effects of the utility model: because the PCB substrate includes base main body, it is set to base main body center
Via hole at position is respectively arranged at the first buried via hole of via hole two sides, and be respectively arranged at the first buried via hole two sides first is blind
Hole is respectively arranged at the second buried via hole of the first blind hole two sides, the second blind hole being respectively arranged on the outside of the second buried via hole.Due to described
Base main body is to be spliced to form by identical half substrate of two parts, and half substrate is mutual by plural layer copper foil layer and PP layers
Interval stacking is stamped to form, so that the processing of the copper foil layer and PP layers of progress segmented, reduces when base main body is processed
Thickness is conducive to avoid the thickness problem of PCB substrate in the prior art and causes the hole wall quality for reducing processed hole, thus
Reach the function of improving the hole wall quality for being processed hole.At the same time, since segmented is processed so that segmented assembling, is conducive to
Facilitate processing and assembling.Again due to filling PP layers respectively between the plural layer copper foil layer and copper foil layer, be conducive to copper foil layer
Heat is taken away in time above, to be conducive to improve the effect of heat dissipation.
With reference to the accompanying drawings and examples, the technical solution of the utility model is described in further detail.
[Detailed description of the invention]
Fig. 1 is the side schematic view of intelligent flexible micropore HDI wiring board in the utility model.
[specific embodiment]
In order to be clearer and more clear technical problem to be solved in the utility model, technical solution and beneficial effect, with
Under in conjunction with the accompanying drawings and embodiments, the present invention will be further described in detail.It should be appreciated that specific reality described herein
Example is applied only to explain the utility model, is not used to limit the utility model.
It please refers to shown in Fig. 1, illustrates a kind of intelligent flexible micropore HDI wiring board below with reference to embodiment comprising
Plural kind of the electronic component above PCB substrate is respectively welded in PCB substrate.
The PCB substrate includes base main body, is set to the via hole 1 of base main body central position, is respectively arranged at
First buried via hole 2 of 1 two sides of via hole is respectively arranged at the first blind hole 3 of 2 two sides of the first buried via hole, is respectively arranged at the first blind hole 3
Second buried via hole 4 of two sides is respectively arranged at second blind hole 5 in 4 outside of the second buried via hole.
The base main body is to be spliced to form by identical half substrate of two parts, and half substrate is by plural layer copper foil
Layer is spaced apart from each other stacking with PP layers and is stamped to form.Half substrate includes the first copper foil layer 6 for being placed in top, is set to the first copper foil
The first PP layer 7 below layer 6, the second copper foil layer 8 below the first PP layer 7, second below the second copper foil layer 8
PP layer 9, the third copper foil layer 10 below the 2nd PP layer 9, the 3rd PP layer 11 below third copper foil layer 10 are set to
The 4th copper foil layer 12 below 3rd PP layer 11, the 4th PP layer 13 below the 4th copper foil layer 12 are set to the 4th PP layer 13
The 5th following copper foil layer 14.
First copper foil layer 6, the second copper foil layer 8, third copper foil layer 10, the 4th copper foil layer 12, the 5th copper foil layer 14 divide
It is not made of heat-dissipating aluminium plate material or copper sheet material.The first PP layer 7, the 2nd PP layer 9, the 3rd PP layer 11, the 4th PP
Layer 13 is made of heat conductive silicon grease material respectively.
First copper foil layer 6 includes first segment copper foil layer 60 and second segment copper foil layer 61；The first segment copper foil layer
60 one end are provided with mutually identical left half upper second blind hole with 5 upper portion of the second blind hole；The second segment copper foil layer
61 one end are provided with right half upper second blind hole mutually identical with 5 upper portion of the second blind hole, the second segment copper foil layer 61
The other end is provided with the left half upper via hole mutually identical with 1 upper portion of via hole；The first segment copper foil layer 60 and second
Section copper foil layer 61, which is mutually pieced together, is composed the first copper foil layer 6.
Second copper foil layer 8 includes third section copper foil layer 80 and the 4th section of copper foil layer 81；The third section copper foil layer
80 central position is provided with the second blind hole, the third section copper foil on the left side half for wearing 5 the lower section of the second blind hole Xia
One end of layer 80 is provided with left half upper second buried via hole mutually identical with 5 upper portion of the second buried via hole；The 4th section of copper foil layer
81 middle position is separately provided for wearing the Zuo Ban of 2 upper portion of the first buried via hole, 5 upper portion of the first blind hole
One buried via hole, left half first blind hole, the 4th section of 81 other end of copper foil layer are provided with the Zuo Banzhong via hole for wearing conducting；
The third section copper foil layer 80 and the 4th section of copper foil layer 81 are mutually pieced together and are composed；The structure of third copper foil layer 10 and second
8 structure of copper foil layer is identical.
4th copper foil layer 12 includes the 5th section of copper foil layer 120 and the 6th section of copper foil layer 121；The 5th section of copper foil layer
It is separately provided for wearing the first blind hole 2, the first blind hole perforating of the second buried via hole 5, the second blind hole perforating on 12；Institute
It states the 5th section of 120 one end of copper foil layer and is provided with lower first blind hole in a left side half for wearing 2 the lower section of the first blind hole；The 6th section of copper
One end of layers of foil 121 is provided with the first blind hole right side half for wearing 2 the lower section of the first blind hole Xia；The 6th section of copper foil
The other end of layer 121 is provided with the via hole left side half for wearing 1 the lower section of via hole Xia；The 5th section of copper foil layer 120
Connection is mutually pieced together with the 6th section of copper foil layer 121 to be composed.5th copper foil layer 14 includes the 7th section of copper foil layer 140, should
7th section of copper foil layer 140 is provided with the first blind hole of bottom for wearing 2 bottom part of the first blind hole, the 7th section of copper foil above
The other end of layer 140 is provided with the half bottom via hole of a left side for wearing 1 bottom part of via hole.
When installation, every section of copper foil layer and mutual corresponding every section of copper foil layer are mutually first pieced together into connection and are combined into the first bronze medal
6 to the 5th copper foil layer 14 of layers of foil, then, 6 to the 5th copper foil layer 14 of the first copper foil layer are combined into plate half according to structural requirement
Substrate, then by two identical entire HDI wiring boards of half substrate in combination.In this assembling process, since the base main body is
It is spliced to form by identical half substrate of two parts, and half substrate is to be spaced apart from each other stacking by plural layer copper foil layer and PP layers
It is stamped to form, so that the processing of the copper foil layer and PP layers of progress segmented, reduces thickness when base main body processing, favorably
Cause the hole wall quality for reducing processed hole in avoiding the thickness problem of PCB substrate in the prior art, to reach raising quilt
Process the function of the hole wall quality in hole.At the same time, since segmented is processed so that segmented assembles, be conducive to facilitate processing and
Assembling.Again due to filling PP layers respectively between the plural layer copper foil layer and copper foil layer, be conducive to heat above copper foil layer and
When take away, thus be conducive to improve heat dissipation effect.
Above by reference to the preferred embodiment of Detailed description of the invention the utility model, not thereby limit to the right of the utility model
Range.Those skilled in the art do not depart from made any modification, equivalent replacement in the scope of the utility model and essence and change
Into should all be within the interest field of the utility model.
Claims (8)
1. a kind of intelligent flexible micropore HDI wiring board comprising the plural number kind above PCB substrate is respectively welded in PCB substrate
Electronic component；It is characterized by: the PCB substrate includes base main body, it is set to the via hole of base main body central position,
It is respectively arranged at the first buried via hole of via hole two sides, is respectively arranged at the first blind hole of the first buried via hole two sides, is respectively arranged at
Second buried via hole of one blind hole two sides, the second blind hole being respectively arranged on the outside of the second buried via hole；The base main body is by two parts
Identical half substrate is spliced to form, and half substrate is to be spaced apart from each other stacking by plural layer copper foil layer and PP layers to be stamped to form.
2. a kind of intelligent flexible micropore HDI wiring board according to claim 1, it is characterised in that: half substrate includes
It is placed in the first copper foil layer of top, the first PP layers below the first copper foil layer, set on the first the second copper foil below PP layers
Layer, the 2nd PP layer below the second copper foil layer, set on the 2nd third copper foil layer below PP layers, under third copper foil layer
The 3rd PP layers of face, set on the 3rd the 4th copper foil layer below PP layers, the 4th PP layers below the 4th copper foil layer are set to the
The 5th copper foil layer below four PP layers.
3. a kind of intelligent flexible micropore HDI wiring board according to claim 2, it is characterised in that: first copper foil layer,
Second copper foil layer, third copper foil layer, the 4th copper foil layer, the 5th copper foil layer are made of heat-dissipating aluminium plate material or copper sheet material respectively
's.
4. a kind of intelligent flexible micropore HDI wiring board according to claim 2, it is characterised in that: the described first PP layers,
Two PP layers, the 3rd PP layers, the 4th PP layers be made respectively of heat conductive silicon grease material.
5. a kind of intelligent flexible micropore HDI wiring board according to Claims 2 or 3, it is characterised in that: first copper foil
Layer includes first segment copper foil layer and second segment copper foil layer；First segment copper foil layer one end is provided with and the second blind hole upper section portion
Mutually identical left half upper second blind hole divided；Described second segment copper foil layer one end is provided with and the second blind hole upper portion phase
Mutually identical right half upper second blind hole, the second segment copper foil layer other end is provided with mutually to coincide with via hole upper portion
Left half upper via hole；The first segment copper foil layer and second segment copper foil layer, which are mutually pieced together, is composed the first copper foil layer.
6. a kind of intelligent flexible micropore HDI wiring board according to Claims 2 or 3, it is characterised in that: second copper foil
Layer includes third section copper foil layer and the 4th section of copper foil layer；The central position of the third section copper foil layer is provided with for wearing
Lower second blind hole in a left side half for second blind hole the lower section, one end of the third section copper foil layer is provided with and the second buried via hole upper section portion
Left half upper second buried via hole that split-phase is mutually coincide；The middle position of the 4th section of copper foil layer is separately provided for wearing first
Left half first buried via hole of buried via hole upper portion, the first blind hole upper portion, left half first blind hole, the 4th section of copper foil layer are another
End is provided with the Zuo Banzhong via hole for wearing conducting；The third section copper foil layer and the 4th section of copper foil layer mutually piece together group
It closes；The structure of third copper foil layer is identical as the second copper foil layer structure.
7. a kind of intelligent flexible micropore HDI wiring board according to Claims 2 or 3, it is characterised in that: the 4th copper foil
Layer includes the 5th section of copper foil layer and the 6th section of copper foil layer；It is separately provided for wearing first on the 5th section of copper foil layer blind
Hole, the first blind hole perforating of the second buried via hole, the second blind hole perforating；Described 5th section of copper foil layer one end, which is provided with, wears first
Lower first blind hole in a left side half for blind hole the lower section；One end of the 6th section of copper foil layer is provided with for wearing the first blind hole lower section
Lower first blind hole in the partial right side half；The other end of the 6th section of copper foil layer is provided with the left side for wearing via hole the lower section
Half lower via hole；The 5th section of copper foil layer is mutually pieced together connection with the 6th section of copper foil layer and is composed.
8. a kind of intelligent flexible micropore HDI wiring board according to Claims 2 or 3, it is characterised in that: the 5th copper foil
Layer includes the 7th section of copper foil layer, and the bottom first being provided with above the 7th section of copper foil layer for wearing the first blind-hole bottom part is blind
Hole, the other end of the 7th section of copper foil layer are provided with the half bottom via hole of a left side for wearing via hole bottom part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821369825.0U CN209072783U (en) | 2018-08-24 | 2018-08-24 | A kind of intelligent flexible micropore HDI wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821369825.0U CN209072783U (en) | 2018-08-24 | 2018-08-24 | A kind of intelligent flexible micropore HDI wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209072783U true CN209072783U (en) | 2019-07-05 |
Family
ID=67090880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821369825.0U Active CN209072783U (en) | 2018-08-24 | 2018-08-24 | A kind of intelligent flexible micropore HDI wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209072783U (en) |
-
2018
- 2018-08-24 CN CN201821369825.0U patent/CN209072783U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211103 Address after: 223000 Xingsheng Road North, Wangwang 2nd Road East, 235 provincial road south and Wangwang 5th Road West, Lianshui County, Huai'an City, Jiangsu Province Patentee after: Jiangsu Zhongxin Hua Electronic Technology Co.,Ltd. Address before: 518000 Longgang Street, Longgang District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Zhongxinhua Electronics Group Co.,Ltd. |
|
| TR01 | Transfer of patent right |