CN209071276U

CN209071276U - The integration maker of the COF or COP that are handled using plasma-based

Info

Publication number: CN209071276U
Application number: CN201821681277.5U
Authority: CN
Inventors: 詹启明
Original assignee: Individual
Current assignee: Individual
Priority date: 2018-10-17
Filing date: 2018-10-17
Publication date: 2019-07-05
Anticipated expiration: 2028-10-17

Abstract

A kind of integration maker of the COF handled using plasma-based or COP, for carrying out plasma-based processing to a band-like circuit board in favor of installation passive component and active IC, which includes a circuit board, is wound between a left hand roller and a right hand roller；Wherein the circuit board is driven by a driving device and roller is mobile to the right and is wrapped on the right hand roller and forms a winding by the left hand roller；And a plasma-based injection equipment, position is in place of the circuit board leaves the left hand roller, and the plasma-based injection equipment is for generating plasma-based and being ejected into the circuit board, to achieve the purpose that the circuit board surface deoxidation or metal surface activation.

Description

The integration maker of the COF or COP that are handled using plasma-based

Technical field

The utility model about circuit board package technique more particularly to it is a kind of using plasma-based handle COF or COP it is whole Close maker.

Background technique

In the prior art with the technique of COF (chip on film) or COP (chip on plastic) in a soft board or modeling Passive component and active IC are formed on flitch.As shown in Figures 1 to 5, the passive component winding work of the COF or COP of the prior art In skill and active IC process integration technology, a soft board or plastic plate 10 ' are mainly wound in a left hand roller 21 ' and a right side is rolled Between cylinder 22 '.Wherein the soft board or plastic plate 10 ' are driven by a driving device 23 ' and by the left hand roller 21 ' rollers to the right 22 ' is mobile and be wrapped on the right hand roller 22 ' and form a winding 15 '.

Wherein active IC technique is using the hot pressing of the thermal head 52 ' of an IC installing mechanism 50 ' and by active IC 60 ' And the pin 61 ' (pad, Inner Leads etc.) of lower section is welded on the soft board or plastic plate 10 '.The IC installing mechanism 50 ' also support the soft board or plastic plate 10 ' using a board 51 ' below the soft board or plastic plate 10 '.

Wherein the passive component winding technique divides each basic unit 151 ' in the winding 15 ' with active IC 60 ' (as shown in Figure 2) is not cut, reapplies some cream machines 30 ' point on soft board or plastic plate 10 ' of each basic unit 151 ' Upper tin cream 35 ' (as shown in Figure 3), to be used as setting part in rear section structure.Then a Zhi Jian mechanism 40 ' is reapplied by passive group Part 45 ' sticks in the top (as shown in Figure 4) of the tin cream 35 '.Then the soft board or plastics of each basic unit 151 ' are sticked in Tin cream 35 ' on plate 10 ' can bake and bank up with earth room 100 ' using one and be toasted (as shown in Figure 5).

But the surface of this soft board or plastic plate 10 ' in the prior art usually aoxidizes or contaminated surface, therefore Active IC 60 ' and passive component 45 ' are pasted when on the soft board or plastic plate 10 ', strong metal bonding is often lacked, And make active IC 60 ' and what passive component 45 ' can not consolidate is fixed on the soft board or plastic plate 10 ', and then influence whole The structural strength of circuit board body, virtually by above-mentioned each mechanism reliability and yield cause serious adverse effect.

Therefore the utility model wishes to propose the integration maker of brand-new COF handled using plasma-based or COP a kind of, with Solve the defect in the above-mentioned prior art.

Utility model content

So the purpose of this utility model is to solve the problems, such as in the above-mentioned prior art, propose that one kind is answered in the utility model The integration maker of the COF (chip on film) or COP (chip on plastic) that are handled with plasma-based are banged using plasma-based The circuit board (such as soft board or plastic plate) of a headed wrap is hit, so that the circuit board can form the metal surface of activation, is somebody's turn to do with enabling Circuit board can increase weld strength in subsequent welding other assemblies.After above-mentioned plasma-based bombards program, COF can be carried out again The passive component winding technique or active IC technique of (chip on film) or COP (chip on plastic).Therefore using this The mode of utility model can firmly weld various components on circuit boards, to achieve the purpose that increase overall structural strength.

The integration manufacturing machine of COF handled using plasma-based or COP a kind of is proposed in the utility model in order to achieve the above objectives Structure, for carrying out plasma-based processing to a band-like circuit board in favor of installation passive component and active IC, the integration maker Including a circuit board, it is wound between a left hand roller and a right hand roller；Wherein the circuit board is driven by a driving device, and By the left hand roller, roller is mobile to the right and is wrapped on the right hand roller and forms a winding；And a plasma-based injection equipment, In place of the circuit board leaves the left hand roller, which is used to generate plasma-based and is ejected into the circuit board for position, To achieve the purpose that the circuit board surface deoxidation or metal surface activation.

Preferably, which is soft board.

Preferably, which is plastic plate.

Preferably, further include a point cream machine on the right side of the plasma-based injection equipment, for putting upper tin on the board Cream；And a Zhi Jian mechanism on the right side of this cream machine, for passive component to be sticked in the top of the tin cream.

Preferably, which is hydrogen plasma-based, enables to the surface de-oxidation of the circuit board.

Preferably, which is nitrogen plasma-based, enables to the surface active of the circuit board.

Preferably, which is argon gas plasma-based, enables to the surface active of the circuit board.

It can be further understood that the feature and its advantage of the utility model by following the description, when reading and please refer to attached Figure.

Detailed description of the invention

Fig. 1 shows the active IC scheme of installation of the prior art.

Fig. 2 shows the schematic diagram for cutting basic unit of the prior art.

Fig. 3 shows the schematic diagram of tin cream on the point cream machine point of application in the prior art.

Fig. 4 shows the schematic diagram in the prior art sticked in passive component above tin cream.

Fig. 5 shows the baking schematic diagram of the prior art.

Fig. 6 shows the operation signal for spraying plasma-based in the utility model on soft board or plastic plate using plasma-based injection equipment Figure.

Fig. 7 shows the operation chart for putting upper tin cream in the utility model on soft board or plastic plate using point cream machine.

Fig. 8, which is shown in the utility model, applies Zhi Jian mechanism that passive component is sticked in the operation chart above tin cream.

Fig. 9, which is shown in the utility model, shows the active IC operation being installed on soft board or plastic plate using IC installing mechanism It is intended to.

Figure 10 shows an application schematic diagram of the utility model.

Specific embodiment

Now with regard to the structure composition of the utility model and the effect and advantage of can be generated, cooperate attached drawing, lifts the utility model A preferred embodiment detailed description are as follows.

It please refers to shown in Fig. 6 to Figure 10, shows that the integration of the COF or COP that handle using plasma-based of the utility model manufacture Mechanism, for carrying out plasma-based processing to a band-like circuit board 1 in favor of installation passive component and active IC.The hereinafter circuit Plate 1 is as illustrative purposes with soft board or plastic plate 10.The integration maker includes following assemblies:

One soft board or plastic plate 10 are wound between a left hand roller 21 and a right hand roller 22.The wherein soft board or plastics Plate 10 is driven by a driving device 23 and roller 22 is mobile to the right and is wrapped on the right hand roller 22 by the left hand roller 21 Form a winding 15 (as shown in Figure 10).

Driving device 23 shown in figure is only the structure of a signal, and the driving device 23 is mainly by the soft board or plastics Plate 10 is mobile from the left hand roller 21 to the right hand roller 22, and the driving device 23 of this type is well known in the prior art, institute It is no longer described in detail with its thin portion structure.

One plasma-based injection equipment 80, position leave the place (as shown in Figure 6) of the left hand roller 21 in the soft board or plastic plate 10, The plasma-based injection equipment 80 is for generating plasma-based and being ejected into the soft board or plastic plate 10, to reach circuit board surface deoxidation The purpose of change or metal surface activation.

Wherein the plasma-based can be hydrogen plasma-based, nitrogen plasma-based or argon gas plasma-based, which may make the soft board or modeling The surface de-oxidation of flitch 10.The nitrogen plasma-based and argon gas plasma-based then may make the surface active of the soft board or plastic plate 10, with It enables the soft board or plastic plate 10 that can increase weld strength in subsequent welding other assemblies, and is conducive to passive component or the master of back segment The winding technique of dynamic component.

When the soft board or plastic plate 10 are after the bombardment of the plasma-based of the plasma-based injection equipment 80, COF (chip can be carried out again On film) or COP (chip on plastic) passive component winding technique or active IC technique.

Wherein the passive component winding technique of COF (chip on film) or COP (chip on plastic) by one The point cream machine 30 on 80 right side of plasma-based injection equipment upper tin cream 35 (as shown in Figure 7) of point on the soft board or plastic plate 10, then by Passive component 45 is sticked in the top (as shown in Figure 8) of the tin cream 35 by one Zhi Jian mechanism 40 on 30 right side of this cream machine. Then the passive component 45 for sticking in the top of the tin cream 35 can be toasted to achieve the purpose that strong bonding, baking can To apply traditional oven cooking cycle or laser heated baking.

Wherein active IC technique applies the thermal head of an IC installing mechanism 50 above the soft board or plastic plate 10 52 hot pressing and be intended to the active IC 60 of installation and pin 61 (pad, Inner Leads etc.) below is welded to this On soft board or plastic plate 10 (as shown in Figure 9).Wherein the IC installing mechanism 50 further includes one under the soft board or plastic plate 10 The board 51 of side is used to support the soft board or plastic plate 10.

After above-mentioned technique, the passive component 45 and active IC 60 are by being wrapped in the winding 15 successively.In back segment When processing, then the winding 15 is unfolded, and cut respectively according to each unit including the passive component 45 and active IC 60, To form required circuit.

The circuit board of the above-mentioned soft board or plastic plate 10 or any headed wrap.

The technique of the utility model can be applicable to COF (chip on film) or COP (chip on plastic) technique In.The utility model application plasma-based bombards the circuit board (such as soft board or plastic plate) of a headed wrap, so that the circuit board can shape At the metal surface of activation, to enable the circuit board that can increase weld strength in subsequent welding other assemblies.By above-mentioned electricity After slurry bombardment program, the passive component winding work of COF (chip on film) or COP (chip on plastic) can be carried out again Skill or active IC technique.Therefore various components can firmly be welded on circuit boards using the mode of the utility model, to reach To the purpose for increasing overall structural strength.

Obviously, described embodiment is only a part of the embodiment of the utility model, instead of all the embodiments. Based on the embodiments of the present invention, obtained by those of ordinary skill in the art without making creative efforts Every other embodiment, fall within the protection scope of the utility model.

Claims

1. a kind of integration maker of the COF handled using plasma-based or COP, for being carried out at plasma-based to a band-like circuit board Reason is in favor of installation passive component and active IC, which is characterized in that the integration maker includes:

One circuit board is wound between a left hand roller and a right hand roller；Wherein the circuit board is driven by a driving device, and By the left hand roller, roller is mobile to the right and is wrapped on the right hand roller and forms a winding；And

One plasma-based injection equipment, position is in place of the circuit board leaves the left hand roller, and the plasma-based injection equipment is for generating plasma-based And be ejected on the circuit board, so as to the circuit board surface deoxidation or metal surface activation.

2. as described in claim 1 using the integration maker of the COF or COP of plasma-based processing, which is characterized in that the circuit Plate is soft board.

3. as described in claim 1 using the integration maker of the COF or COP of plasma-based processing, which is characterized in that the circuit Plate is plastic plate.

4. as described in claim 1 using the integration maker of the COF or COP of plasma-based processing, which is characterized in that the integration Maker further includes a point cream machine on the right side of the plasma-based injection equipment, for putting upper tin cream on the board；And one Zhi Jian mechanism of the position on the right side of this cream machine, for passive component to be sticked in the top of the tin cream.

5. as described in claim 1 using the integration maker of the COF or COP of plasma-based processing, which is characterized in that the plasma-based For hydrogen plasma-based, the surface de-oxidation of the circuit board is enabled to.

6. as described in claim 1 using the integration maker of the COF or COP of plasma-based processing, which is characterized in that the plasma-based For nitrogen plasma-based, the surface active of the circuit board is enabled to.

7. as described in claim 1 using the integration maker of the COF or COP of plasma-based processing, which is characterized in that the plasma-based For argon gas plasma-based, the surface active of the circuit board is enabled to.