CN209056464U - A kind of after-treatment system for wafer production - Google Patents
A kind of after-treatment system for wafer production Download PDFInfo
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- CN209056464U CN209056464U CN201821370239.8U CN201821370239U CN209056464U CN 209056464 U CN209056464 U CN 209056464U CN 201821370239 U CN201821370239 U CN 201821370239U CN 209056464 U CN209056464 U CN 209056464U
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Abstract
The utility model relates to a kind of after-treatment systems for wafer production, including load mechanism, a wiper mechanism, secondary cleaning mechanism and the drying centrifugal mechanism set gradually, the load mechanism and drying centrifugal mechanism include the mobile braced frame of cuboid of inner face opening, and the outer end face of the mobile braced frame of cuboid of the load mechanism is provided centrally with feed inlet, the outer end face of the mobile braced frame of cuboid of the drying centrifugal mechanism is provided centrally with discharge port；Wiper mechanism and secondary cleaning mechanism include the mobile braced frame of cuboid of both ends of the surface opening, and are connected between the adjacent mechanism by fast joint structure.Utility model has the advantages that the utility model adopts a split structure, it is easy to assembly, it is convenient for changing process, and two mechanical arms of manipulator share a cylinder, it saves the energy and reduces occupied space, the after-treatment system can be improved wafer surface treatment effect simultaneously, and can be avoided the other equipment of acid corrosion.
Description
Technical field
The utility model belongs to semiconductor crystal processing technique field, in particular to a kind of rear place for wafer production
Reason system.
Background technique
Currently, in the manufacturing process of wafer, it is well known, it is lost by the manufacturing operation program having been carried out
The unnecessary residual for staying in wafer surface must be cleaned.Manufacturing operation example as this includes plasma etching and change
Learn mechanical polishing method.If unnecessary residuals and particle are retained in the surface of chip during continuous manufacturing operation,
These residuals and particle will will cause such as wafer surface scratch and the unsuitable reciprocation flaw between metallization features
Defect.In some cases, flaw as this, which may cause the device on chip, to be become not operating.It is intended to avoid that there is nothing due to abandoning
The chip of the device of method running and caused extra charge, therefore, when leaving unnecessary residue on a surface of a wafer
After manufacturing operation program, it is necessary to clear up suitably and efficiently wafer surface.
Currently, the surface treatment for wafer, general process are as follows: load, waiting → cleaning (HF), washing → cleaning
(H2O2), washing → drying centrifugation, be now typically all to combine in each process in whole system, which is only used for
The process flow cannot optimize process flow, add other processes；And manipulator used in existing processing system, respectively
Mechanical arm need to be driven by individual cylinder, and the clamping to wafer or blanking is completed；In addition, being used for pickling in system
Device, generally uncovered structure be easy to cause the spilling of acid, damages other settings, meanwhile, wafer washing, is by silicon wafer
Be put into cleaning solution and impregnated, by silicon chip extracting after being soaked for a period of time, silicon wafer and cleaning solution under this cleaning way it
Between be it is opposing stationary motionless, mutual collision friction is considerably less, and then the effect of Wafer Cleaning is not very good.
Utility model content
The technical problem to be solved by the present invention is to provide it is a kind of for wafer production after-treatment system, using point
Body formula structure, it is easy to assembly, while it can be convenient for changing process according to process flow needs, and the manipulator in processing system
Two mechanical arms share a cylinder, save the energy and reduce occupied space, while the after-treatment system can be improved wafer surface
Treatment effect, and can be avoided the other equipment of acid corrosion.
In order to solve the above technical problems, the technical solution of the utility model are as follows: a kind of post-processing for wafer production
System, innovative point are: load mechanism, a wiper mechanism, secondary cleaning mechanism and drying including being sequentially connected setting
Centrifugal mechanism, the load mechanism and drying centrifugal mechanism include the mobile braced frame of cuboid of inner face opening, and described
The outer end face of the mobile braced frame of the cuboid of load mechanism is provided centrally with feed inlet, the cuboid of the drying centrifugal mechanism
The outer end face of mobile braced frame is provided centrally with discharge port；Pickling mechanism and white picking mechanism include both ends of the surface
The mobile braced frame of the cuboid of opening, and connected between the adjacent mechanism by fast joint structure；
The load mechanism, a wiper mechanism, secondary cleaning mechanism and drying centrifugal mechanism are in the mobile support of cuboid
Structure arrangement in frame is consistent, is provided in each mobile braced frame and connects the mobile upper and lower level board of braced frame
First vertical frame, and the vertical plate of the mobile braced frame of the first vertical frame, close first vertical frame and movement
Battery limits are formed between the upper and lower level board of braced frame；
The first vertical frame in the mobile braced frame on top and the mobile braced frame far from the first vertical frame
Vertical plate between be provided with first level frame, and the first vertical frame, the mobile support far from the first vertical frame
Fresh air area is formed between level board and first level frame on the vertical plate of frame, mobile braced frame；
The first vertical frame in the mobile braced frame of lower part and the mobile braced frame far from the first vertical frame
Vertical plate between be provided with the second vertical frame, the height of the second vertical frame is less than first level frame to mobile branch
The distance of support frame frame lower horizontal board is provided with the second horizontal frame between the first vertical frame and the second vertical frame；It is described
First level frame, the second horizontal frame, the second vertical frame and close to the second vertical frame mobile braced frame it is vertical
Robot work area is formed between plate；The first vertical frame, the second vertical frame, the second horizontal frame and mobile support frame
Cassette workspace is formed between the lower horizontal board of frame；
Cassette workspace in the load mechanism is fed to discharging direction certainly is divided into load area and Accreditation Waiting Area, the load
Be provided with support base A in area, the support base A is equipped with silicon wafer rack A, and if silicon wafer rack A be equipped with
The cavity A that can hold silicon wafer placement is formed between the partition A of dry equidistantly distributed, adjacent separator A；
Cassette workspace in wiper mechanism and secondary cleaning mechanism is fed to discharging direction certainly is divided into pickling
Area and water wash zone, and it is provided with acid dip pickle in the acid-washing region of wiper mechanism twice, it is arranged in the water wash zone of wiper mechanism twice
There is water washing device；
The acid dip pickle includes a pickling cabinet, and the side of the pickling cabinet is fixedly connected with cylinder, and cylinder
Upper end is hinged with the top cover with the cooperation of pickling cabinet upper end；The inner bottom center of the pickling cabinet is equipped with support base B, institute
Support base B is stated equipped with silicon wafer rack B, and silicon wafer rack B is equipped with the partition B of several equidistantly distributeds,
The cavity B that can hold silicon wafer placement is formed between adjacent separator B；
The water washing device includes a service sink, and there are two the interior layings of the service sink is arranged in parallel and along cleaning pond length
The spray pipe that direction extends, the spray pipe are provided with the hydro-peening hole of several equidistantly distributeds along the two sides of its center line, and
Water inlet pipe is communicated between two spray pipe；Support base C is provided on the spray pipe, the support base C is equipped with
One arc groove extended along service sink length direction, and the side of arc groove is concordant with the outer side edges of spray pipe is arranged；Institute
The outer end for stating the both ends of arc groove is fixedly connected by support frame with support base C, and if being equipped in the arc groove
The partition C of dry equidistantly distributed makes to form the cavity C that can hold silicon wafer placement between adjacent separator C and arc groove；
Cassette workspace in the drying centrifugal mechanism is divided into drying centrifugation area from feeding to discharging direction and takes section,
Drying centrifugation area is provided with wafer drying centrifuge；
It is provided in the robot work area along guide rail, manipulator and the driving machine fed to discharging direction extension
Structure,
The guide rail for manipulator walking, and adjacent two machine are disposed on the second vertical frame in robot work area
Guide rail in structure is connected by rapid structural；
The driving mechanism include a C font bracket, the C font bracket include upper and lower level board and be connected to,
Vertical plate between lower horizontal board；The sliding block being slidably matched with guide rail is provided on the outer end face of the vertical plate, it is described to be lauched
The inner end of plate is provided centrally with bearing block, and center is equipped with one along the extension of vertical plate length direction in the C font bracket
Screw rod, and the lower end of screw rod passes through bearing block and extends to lower horizontal board outer end；Nut is socketed on the screw rod, and solid on nut
Surely it is connected with connecting plate；Through-hole is respectively equipped on the upper level board and connecting plate of the C font bracket, correspondence is set two through hole up and down
It sets, and is interspersed with the connecting rod being cooperatively connected with through-hole in two through hole；The upper end of the connecting rod is connected with manipulator, the silk
The lower end of bar is connected with lifting motor, is drived screw rod rotation by lifting motor；
It is also fixedly connected with movable motor on the vertical plate of the C font bracket, and solid on the transmission shaft of movable motor
Surely it is connected with gear, edge is there also is provided on the vertical frame of second in robot work area and feeds to discharging direction extension,
And the chain with gear cooperation；
The manipulator includes manipulator support and the mechanical arm that is symmetricly set on manipulator support, the front end machine
Driving lever is symmetrically arranged on tool arm；It is provided with symmetrically arranged two oscillating deck between two driving levers, and has on each oscillating deck
One waist type groove extended along mechanical arm length direction, the end of the driving lever are placed in waist type groove, make driving lever can be along waist type groove
It is mobile；The end that two oscillating deck is located at waist type groove is respectively equipped with through-hole, and connection two is provided in the through-hole of each end and is swung
The first axle of plate and the second axis, and the middle part of the first axle is hingedly on the support, the support is fixed at manipulator branch
On frame；The middle part of second axis is connect with gripper cylinder.
Further, the upper end of the service sink is equipped with overflow port, and the upper surface of two sides overflow port is serrated distribution.
Further, the fast joint structure are as follows: pass through screw and spiral shell between the mobile braced frame of adjacent cuboid
Cap is fixedly connected.
Further, the fast joint structure are as follows: in the mobile braced frame touching position of two adjacent cuboids
Outwardly extending clamp and matched card slot are respectively arranged on two frames, and clamp and card slot are arranged at composition
On the inner sidewall of the square steel of frame, the end face of the clamp is oblique, is additionally provided with retention bead on the medial surface of clamp.
Further, the quick fixation structure are as follows: on the inner sidewall of two guide rails of two adjacent mechanism contact positions respectively
It is provided with outwardly extending clamp and matched card slot, the end face of the clamp is oblique, in the medial surface of clamp
On be additionally provided with retention bead.
Utility model has the advantages that
(1) the utility model is used for the after-treatment system of wafer production, load mechanism, a wiper mechanism, secondary clear
It is flexibly connected between washing machine structure and drying centrifugal mechanism by fast joint structure, facilitates the connection between each mechanism or tear open
It unloading, i.e., the after-treatment system entirely for wafer production adopts a split structure, and it is easy to assembly, meanwhile, it can be according to technique stream
Cheng Gaijin or optimization, are convenient for changing process；
Guide rail in the after-treatment system Zhong Ge mechanism of the utility model is connected by rapid structural, and shape is integral to be led
Rail, meanwhile, it is walked on the guide rail in each mechanism by driving mechanism driving manipulator, in addition, driving mechanism driving manipulator
Lifting, facilitates wafer to shift in each mechanism, guarantees that each process effectively carries out, it is ensured that the treatment effect of wafer；Manipulator
Including manipulator support and the mechanical arm being symmetricly set on manipulator support, two mechanical arms share a cylinder, Ji Keshi
Now to the clamping of wafer or blanking, the energy can either be saved, and greatly reduces the occupied space of equipment；
In addition, the acid dip pickle in wiper mechanism uses movable closure twice, facilitate the disengaging of wafer, and pass through
It is arranged to closing device, acid mist is avoided to overflow outward, the other equipment in anti-corrosion mechanism；Meanwhile the water in wiper mechanism twice
It is laid in service sink in cleaning device there are two being arranged in parallel and along the spray pipe that service sink length direction extends, each spray pipe is along it
The two sides of center line are provided with the hydro-peening hole of several equidistantly distributeds, so that hydro-peening route can be in waveguide in water
Line is capable of the side of effective cleaning silicon chip, meanwhile, by the soak in entire service sink to wafer Integral cleaning, hydro-peening
It is combined with the mode of static soak, further increases cleaning effect, and then can be improved wafer surface treatment effect significantly；
(2) the utility model is used for the after-treatment system of wafer production, wherein is equipped with overflow port in the upper end of service sink
The soak for being mixed with impurity can be made to overflow outside service sink in time, guarantee that soak is clean in service sink；In addition, two sides overflow port
Upper surface is serrated distribution, and the soak that each side can be enable to be mixed with impurity is uniformly discharged；
(3) the utility model is used for the after-treatment system of wafer production, support mobile for two adjacent cuboids
Connection between frame is realized by fast joint structure, can use the cooperation of screw and nut, clamp and card can also be used
Cooperation between slot realizes, specifically can be according to actual condition unrestricted choice；And the setting for clamp and card slot, by clamp with
Card slot is arranged on the inner sidewall of square steel, facilitates the connection between adjacent frame, and avoids occurring between adjacent frame
Gap, and oblique and more convenient clamp is arranged in the end of clamp and is caught in card slot, in addition, passing through retention bead
Setting, then be in order to ensure the stabilization between clamp and card slot.
Detailed description of the invention
Utility model will be further described in detail below with reference to the attached drawings and specific embodiments.
Fig. 1 is front view of the present embodiment for the after-treatment system of wafer production.
Fig. 2 is top view of the present embodiment for the after-treatment system of wafer production.
Fig. 3 is side view of the present embodiment for the after-treatment system of wafer production.
Fig. 4 is structural schematic diagram of the present embodiment for acid dip pickle in the after-treatment system of wafer production.
Fig. 5 is structural schematic diagram of the present embodiment for water washing device in the after-treatment system of wafer production.
Fig. 6 is side view of the present embodiment for water washing device in the after-treatment system of wafer production.
Fig. 7 is schematic diagram of the present embodiment for rapid structural in the after-treatment system of wafer production.
Fig. 8 is side view of the present embodiment for robot work area in the after-treatment system of wafer production.
Fig. 9 is the concrete structure schematic diagram of manipulator in Fig. 8.
Specific embodiment
The following examples can make professional and technical personnel that the utility model be more fully understood, but therefore will not
The utility model is limited among the embodiment described range.
Embodiment
The present embodiment is used for the after-treatment system of wafer production, as illustrated in fig. 1 and 2, including the loader set gradually
1, wiper mechanism 2 of structure, secondary cleaning mechanism 3 and drying centrifugal mechanism 4, load mechanism 1 and drying centrifugal mechanism 4 include interior
The mobile braced frame of the cuboid of end face opening, and the outer end face center setting of the mobile braced frame of cuboid of load mechanism 1
There is feed inlet, the outer end face of the mobile braced frame of the cuboid of drying centrifugal mechanism 4 is provided centrally with discharge port；Cleaning machine
Structure 2 and secondary cleaning mechanism 3 include the mobile braced frame of cuboid of both ends of the surface opening, and by quickly connecting between adjacent mechanism
The connection of binding structure；In the present embodiment, fast joint structure are as follows: pass through screw and spiral shell between the mobile braced frame of adjacent cuboid
Cap is fixedly connected.
In the present embodiment, 1, wiper mechanism 2 of load mechanism, secondary cleaning mechanism 3 and drying centrifugal mechanism 4 are rectangular
Structure arrangement in the mobile braced frame of body is consistent, as shown in figure 3, being provided with the mobile support frame of connection in each mobile braced frame
The vertical frame 7 of the first of the upper and lower level board of frame, and the first vertical frame 7, the mobile braced frame close to the first vertical frame 7
Vertical plate and the mobile upper and lower level board of braced frame between form battery limits.
The mobile support frame of the first vertical frame 7 and separate first vertical frame 7 in the mobile braced frame on top
First level frame 8, and the first vertical frame 7, the mobile support far from the first vertical frame 7 are provided between the vertical plate of frame
Fresh air area is formed between level board and first level frame 8 on the vertical plate of frame, mobile braced frame.
The mobile support frame of the first vertical frame 7 and separate first vertical frame 7 in the mobile braced frame of lower part
The second vertical frame 9 is provided between the vertical plate of frame, the height of the second vertical frame 9 is less than first level frame 8 to movement
The distance of braced frame lower horizontal board is provided with the second horizontal frame between the first vertical frame 7 and the second vertical frame 9
10；First level frame 8, the second horizontal frame 10, the second vertical frame 9 and the mobile support frame close to the second vertical frame 9
Robot work area is formed between the vertical plate of frame；First vertical frame 7, the second vertical frame 9, the second horizontal frame 10 and shifting
Cassette workspace is formed between the lower horizontal board of dynamic braced frame.
As shown in Figure 1, the cassette workspace in load mechanism 1 feeds to discharging direction certainly and is divided into load area 11 and Accreditation Waiting Area
12, support base 111 is provided in load area 11, support base 111 is equipped with silicon wafer rack 112, and silicon wafer is placed
Frame 112 is equipped with the partition A of several equidistantly distributeds, forms the cavity A that can hold silicon wafer placement between adjacent separator A.
Cassette workspace in wiper mechanism 2 and secondary cleaning mechanism 3 is fed to discharging direction certainly is divided into acid-washing region
21(31) and water wash zone 22(32), and be provided with acid dip pickle 5 in the acid-washing region of wiper mechanism twice, twice the water of wiper mechanism
It washes in area and is provided with water washing device 6.
As shown in figure 4, acid dip pickle 5 includes a pickling cabinet 51, the side of pickling cabinet 51 is fixedly connected with cylinder 52,
And the upper end of cylinder 52 is hinged with the top cover 53 with the cooperation of 51 upper end of pickling cabinet；The inner bottom center of pickling cabinet 51 is equipped with
Support base 54, support base 54 is equipped with silicon wafer rack 55, and silicon wafer rack 55 is equipped with several equidistantly
The partition 56 of distribution forms the cavity B that can hold silicon wafer placement between adjacent separator 56；Acid dip pickle 5 is using activity closure dress
It sets, facilitates the disengaging of wafer, and by being arranged to closing device, avoid acid mist from overflowing outward, other in anti-corrosion mechanism are set
It is standby.
As it can be seen in figures 5 and 6, water washing device 6 includes a service sink 61, be laid in the service sink 61 there are two being arranged in parallel and
The spray pipe 62 extended along 61 length direction of service sink, spray pipe 62 are provided with several equidistant point along the two sides of its center line
The hydro-peening hole of cloth, and water inlet pipe 68 is communicated between two spray pipes 62；Support base 63, support base are provided on spray pipe 62
63 are equipped with the arc grooves 64 extended along 61 length direction of service sink, and the side of arc groove 64 and spray pipe 62 is outer
Side is concordantly arranged；The outer end at the both ends of arc groove 64 is fixedly connected by support frame 65 with support base 63, and arc
The partition 66 of several equidistantly distributeds is equipped in groove 64, silicon wafer can be held by making to be formed between adjacent separator 66 and arc groove 64
The cavity C of placement.
In the present embodiment, in order to which the soak for being mixed with impurity can be made to be overflowed outside service sink 61 in time, guarantee leaching in service sink
It is clean to steep liquid, is equipped with overflow port 67 in the upper end of service sink 61；The distribution in addition, upper surface of overflow port 67 is serrated, can make
The soak that each side is mixed with impurity can uniformly be discharged.
Cassette workspace in drying centrifugal mechanism 4 is divided into drying centrifugation area 42 from feeding to discharging direction and takes section
42, drying centrifugation area 41 is provided with wafer drying centrifuge 13.
As shown in Fig. 2, be provided in robot work area along feed to discharging direction extend guide rail 14, manipulator 15 with
And driving mechanism 16, the guide rail 14 for manipulator walking is disposed on the second vertical frame 9 in robot work area, and
Adjacent two guide rail 14 within the organization is connected by rapid structural；Quick fixation structure as shown in Figure 7 are as follows: two adjacent mechanism contact positions
Two guide rails inner sidewall on be respectively arranged with outwardly extending clamp 17 and matched card slot 18, the end of clamp 17
Face is oblique, and retention bead 19 is additionally provided on the medial surface of clamp 17；Setting for clamp 17 and card slot 18, by card
Son 17 is arranged on the inner sidewall of guide rail 14 with card slot 18, facilitates the connection between adjacent guide rail 14, and avoid adjacent
Occur gap between guide rail 14, and oblique and more convenient clamp 17 is arranged in the end of clamp 17 and is caught in card slot 18
It is interior, it is then in order to ensure the stabilization between clamp 17 and card slot 18 in addition, passing through the setting of retention bead 19.
As shown in figure 8, driving mechanism 16 include a C font bracket 161, C font bracket 161 include upper and lower level board with
And it is connected to the vertical plate between upper and lower level board；The sliding block being slidably matched with guide rail 14 is provided on the outer end face of vertical plate
162, the inner end of lower horizontal board is provided centrally with bearing block 163, and center is equipped with one along vertical plate length side in C font bracket
To the screw rod 164 of extension, and the lower end of screw rod 164 passes through bearing block and extends to lower horizontal board outer end；Spiral shell is socketed on screw rod 164
Mother 165, and connecting plate 166 is fixedly connected on nut 165；It is respectively equipped on the upper level board and connecting plate of C font bracket 161
Through-hole, two through hole are correspondingly arranged up and down, and the connecting rod 167 being cooperatively connected with through-hole is interspersed in two through hole；Connecting rod 167
Upper end is connected with manipulator 15, and the lower end of screw rod 164 is connected with lifting motor 168, drives screw rod 164 by lifting motor 168
Rotation；Movable motor 169 is also fixedly connected on the vertical plate of C font bracket 161, and on the transmission shaft of movable motor 169
It is fixedly connected with gear 1691, edge is there also is provided on the vertical frame 9 of second in robot work area and feeds to discharging direction
The chain 1692 for extending, and cooperating with gear 1691；Screw rod 164 is driven to rotate by lifting motor 168, screw rod 164 revolves
The nut 165 turned on drive screw rod 164 moves up and down, and then connecting plate 166 drives connecting rod 167 to move up and down, and then makes machine
Tool hand moves up and down；Meanwhile movable motor 169 drive, drive C font bracket 161 on sliding block 162 along guide rail 14 from charging to
Discharging direction is mobile.
The specific structure of manipulator 15, as shown in figure 9, manipulator 15 includes manipulator support 151 and is symmetricly set on
Mechanical arm 152 on manipulator support 151 is symmetrically arranged with driving lever 153 on front end robot arm 152；It is arranged between two driving levers 153
There is symmetrically arranged two oscillating deck 154, and extend with one along 152 length direction of mechanical arm on each oscillating deck 154
Waist type groove 155, the end of driving lever 153 are placed in waist type groove 155, move driving lever 153 can along waist type groove 155；Two oscillating decks 154
It is respectively equipped with through-hole positioned at the end of waist type groove 155, the first axle of two oscillating decks 154 of connection is provided in the through-hole of each end
156 and second axis 157, and the middle part of first axle 156 is hinged on support 158, support 158 is fixed at manipulator support
On 151；The middle part of second axis 157 is connect with gripper cylinder 159；Gripper cylinder 159 drives the movement of the second axis 157, and then drives
Two oscillating decks 154 are integral by first axle 156, are rotated around support 158, are made driving lever 153 in the waist type groove of oscillating deck 154
It is moved forward and backward in 155, completes the clamping or opening of two mechanical arms 152, to complete clamping or blanking to wafer；The present embodiment
Mechanical arm 152 shares a cylinder, and the clamping or blanking to wafer can be realized, can either save the energy, and greatly reduce
The occupied space of equipment.
The present embodiment is used for the after-treatment system of wafer production, load mechanism 1, wiper mechanism 2, a secondary cleaning machine
It is flexibly connected between structure 3 and drying centrifugal mechanism 4 by fast joint structure, facilitates the connection between each mechanism or tear open
It unloading, i.e., the after-treatment system entirely for wafer production adopts a split structure, and it is easy to assembly, meanwhile, it can be according to technique stream
Cheng Gaijin or optimization, are convenient for changing process.
The advantages of basic principles and main features and the utility model of the utility model have been shown and described above.This
The technical staff of industry is retouched in above embodiments and description it should be appreciated that the present utility model is not limited to the above embodiments
That states only illustrates the principles of the present invention, on the premise of not departing from the spirit and scope of the utility model, the utility model
It will also have various changes and improvements, these various changes and improvements fall within the scope of the claimed invention.This is practical new
Type is claimed range and is defined by the appending claims and its equivalent thereof.
Claims (5)
1. it is a kind of for wafer production after-treatment system, it is characterised in that: including be sequentially connected setting load mechanism, one
Secondary wiper mechanism, secondary cleaning mechanism and drying centrifugal mechanism, the load mechanism and drying centrifugal mechanism include that inner face is opened
Mouthful the mobile braced frame of cuboid, and the outer end face of the mobile braced frame of cuboid of the load mechanism be provided centrally with into
The outer end face of material mouth, the mobile braced frame of cuboid of the drying centrifugal mechanism is provided centrally with discharge port；One hypo acid
Washing machine structure and white picking mechanism include the mobile braced frame of cuboid of both ends of the surface opening, pass through between adjacent mechanism and quickly connect
The connection of binding structure；The load mechanism, a wiper mechanism, secondary cleaning mechanism and drying centrifugal mechanism are in the mobile branch of cuboid
Structure arrangement in support frame frame is consistent, and the mobile upper and lower level board of braced frame of connection is provided in each mobile braced frame
The first vertical frame, and the first vertical frame, close to the first vertical frame mobile braced frame vertical plate and shifting
Battery limits are formed between the dynamic upper and lower level board of braced frame；
The mobile braced frame of the first vertical frame and separate first vertical frame in the mobile braced frame on top is erected
First level frame, and the first vertical frame, the mobile braced frame far from the first vertical frame are provided between straight panel
Vertical plate, fresh air area is formed between level board and first level frame in mobile braced frame；
The mobile braced frame of the first vertical frame and separate first vertical frame in the mobile braced frame of lower part is erected
The second vertical frame is provided between straight panel, the height of the second vertical frame is less than first level frame to mobile support frame
The distance of frame lower horizontal board is provided with the second horizontal frame between the first vertical frame and the second vertical frame；Described first
Horizontal frame, the second horizontal frame, the second vertical frame and close to the second vertical frame mobile braced frame vertical plate it
Between formed robot work area；The first vertical frame, the second vertical frame, the second horizontal frame and mobile braced frame
Cassette workspace is formed between lower horizontal board；
Cassette workspace in the load mechanism is divided into load area and Accreditation Waiting Area from feeding to discharging direction, in the load area
It is provided with support base A, the support base A is equipped with silicon wafer rack A, and silicon wafer rack A is equipped with several
The cavity A that can hold silicon wafer placement is formed between the partition A of equidistantly distributed, adjacent separator A；
Cassette workspace in wiper mechanism and secondary cleaning mechanism be divided into from feeding to discharging direction acid-washing region and
Water wash zone, and it is provided with acid dip pickle in the acid-washing region of wiper mechanism twice, water is provided in the water wash zone of wiper mechanism twice
Cleaning device；
The acid dip pickle includes a pickling cabinet, and the side of the pickling cabinet is fixedly connected with cylinder, and the upper end of cylinder
It is hinged with the top cover with the cooperation of pickling cabinet upper end；The inner bottom center of the pickling cabinet is equipped with support base B, the branch
Support group seat B is equipped with silicon wafer rack B, and silicon wafer rack B is equipped with the partition B of several equidistantly distributeds, adjacent
The cavity B that can hold silicon wafer placement is formed between partition B；
The water washing device includes a service sink, and there are two be arranged in parallel and along service sink length direction for laying in the service sink
The spray pipe of extension, the spray pipe are provided with the hydro-peening hole of several equidistantly distributeds along the two sides of its center line, and described
Water inlet pipe is communicated between two spray pipes；Support base C is provided on the spray pipe, the support base C is equipped with an edge
The arc groove that service sink length direction extends, and the side of arc groove is concordant with the outer side edges of spray pipe is arranged；The arc
The outer end at the both ends of connected in star is fixedly connected by support frame with support base C, and is equipped with several in the arc groove
The partition C of equidistantly distributed makes to form the cavity C that can hold silicon wafer placement between adjacent separator C and arc groove；
Cassette workspace in the drying centrifugal mechanism is divided into drying centrifugation area from feeding to discharging direction and takes section, described
Drying centrifugation area is provided with wafer drying centrifuge；
It is provided in the robot work area along guide rail, manipulator and the driving mechanism fed to discharging direction extension,
The guide rail for manipulator walking is disposed on the second vertical frame in robot work area, and in adjacent two mechanism
Guide rail pass through rapid structural connect；
The driving mechanism includes a C font bracket, and the C font bracket includes upper and lower level board and is connected to upper and lower water
Vertical plate between plate；The sliding block being slidably matched with guide rail, the lower horizontal board are provided on the outer end face of the vertical plate
Inner end be provided centrally with bearing block, in the C font bracket center be equipped with one along vertical plate length direction extend screw rod,
And the lower end of screw rod passes through bearing block and extends to lower horizontal board outer end；Nut is socketed on the screw rod, and fixed company on nut
It is connected to connecting plate；Through-hole is respectively equipped on the upper level board and connecting plate of the C font bracket, two through hole is correspondingly arranged up and down,
And the connecting rod being cooperatively connected with through-hole is interspersed in two through hole；The upper end of the connecting rod is connected with manipulator, the screw rod
Lower end be connected with lifting motor, drived screw rod rotation by lifting motor；
It is also fixedly connected with movable motor on the vertical plate of the C font bracket, and fixed company on the transmission shaft of movable motor
It is connected to gear, edge is there also is provided on the vertical frame of second in robot work area and feeds to discharging direction extension, and with
The chain of gear cooperation；
The manipulator includes manipulator support and the mechanical arm that is symmetricly set on manipulator support, the front end robot arm
On be symmetrically arranged with driving lever；It is provided with symmetrically arranged two oscillating deck between two driving levers, and there is one on each oscillating deck
The waist type groove extended along mechanical arm length direction, the end of the driving lever are placed in waist type groove, move driving lever can along waist type groove；
The end that two oscillating deck is located at waist type groove is respectively equipped with through-hole, and the of two oscillating decks of connection is provided in the through-hole of each end
One axis and the second axis, and the middle part of the first axle is hingedly on the support, the support is fixed on manipulator support；Institute
The middle part for stating the second axis is connect with gripper cylinder.
2. it is according to claim 1 for wafer production after-treatment system, it is characterised in that: the service sink it is upper
End is equipped with overflow port, and the upper surface of two sides overflow port is serrated distribution.
3. the after-treatment system according to claim 1 for wafer production, it is characterised in that: the quick connection knot
Structure are as follows: being fixedly connected by screw and nut between the mobile braced frame of adjacent cuboid.
4. the after-treatment system according to claim 1 for wafer production, it is characterised in that: the quick connection knot
Structure are as follows: be respectively arranged with outwardly extending card on two frames of the mobile braced frame touching position of two adjacent cuboids
Sub and matched card slot, and clamp and card slot are arranged on the inner sidewall for constituting the square steel of frame, the clamp
End face is oblique, is additionally provided with retention bead on the medial surface of clamp.
5. the after-treatment system according to claim 1 for wafer production, it is characterised in that: the quick connection knot
Structure are as follows: outwardly extending clamp and therewith is respectively arranged on the inner sidewall of two guide rails of two adjacent mechanism contact positions
The end face of the card slot of cooperation, the clamp is oblique, is additionally provided with retention bead on the medial surface of clamp.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201821370239.8U CN209056464U (en) | 2018-08-24 | 2018-08-24 | A kind of after-treatment system for wafer production |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201821370239.8U CN209056464U (en) | 2018-08-24 | 2018-08-24 | A kind of after-treatment system for wafer production |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110468396A (en) * | 2019-08-28 | 2019-11-19 | 福建捷思金属科技发展有限公司 | A kind of copper sheet numerical control oxidation machine |
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2018
- 2018-08-24 CN CN201821370239.8U patent/CN209056464U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110468396A (en) * | 2019-08-28 | 2019-11-19 | 福建捷思金属科技发展有限公司 | A kind of copper sheet numerical control oxidation machine |
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Effective date of registration: 20220307 Address after: No. 126, Lane 5469, Hunan highway, hangtou Town, Pudong New Area, Shanghai Patentee after: SHANGHAI JINGFU ELECTROMECHANICAL TECHNOLOGY CO.,LTD. Address before: 226500 No.18, Xunchi Road, Changjiang Town, Rugao City, Nantong City, Jiangsu Province Patentee before: JIANGSU JING RUI PHOTOELECTRIC TECHNOLOGY Co.,Ltd. Patentee before: Li Yizi |